Himax Technologies, Inc. ("Himax" or "Company"), an industry leader in fabless display driver ICs and other semiconductors, today announced it will present its next-generation, proprietary ultra luminous 400K nit Color Sequential Front-lit LCoS Microdisplay solution at CES 2025, the largest consumer electronics show in Las Vegas, U.S.A. from January 7 - 10, 2025. The unparalleled brightness of the LCoS solution reaffirms Himax's market leadership in LCoS and its steadfast commitment to advancing AR applications, catering to the critical demands of leading tech innovators in AR technology.

Himax's proprietary Color Sequential Front-lit LCoS Microdisplay sets a new benchmark in brightness performance for microdisplays. With an industry-leading 400K nits of brightness and typical power consumption of just 300 milliwatts, this breakthrough ensures superior eye-level brightness even in high ambient light environments, making it a perfect fit for outdoor usability. The integration of 2D waveguides further enhances its ability to deliver clear, vibrant visuals, making it ideal for next-generation see-through goggles. In addition to its brightness, the microdisplay boasts a lightweight, ultra-compact form factor of less than 0.5 c.c., exceptional vibrant color performance, and low power consumption, all essential factors for all-day wearable devices. This makes the Color Sequential Front-lit LCoS Microdisplay a perfect solution for the evolving needs of AR goggle devices.

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

At Computex 2023 InWin showcased a chassis concept that has been something of a holy grail in case design for the last couple decades: a fully modular case. By fully modular InWin means that each compartment of the chassis is its own accessory module that can be attached at any 90 degree intersection with tool free interlocks. This allows somebody to effectively build an infinite computer case if they so desired. The case is broken up into three base modules: Mod-I is the motherboard tray with nine expansion slots, some front I/O, and a couple 120/140 mm fan mounts at the front and top. Mod-II has the mount for the PSU, and Mod-III can host 3.5 inch storage bays, a full size GPU, or fans with three more 120/140 mm fan mounts. The rest of the case, being the outer panels, face plates, and covers, are sized to fit around the outer dimensions of these modules so no matter what configuration you assemble there is a combination of glass and steel panels that fit and can enclose the case.

InWin offers two default configurations for buyers to choose from: ModFree - Base Edition and ModFree - Deluxe Edition. The Base Edition includes one Mod-I and Mod-II frame pieces with glass and steel side panels for a relatively basic mid-tower setup, while the Deluxe Edition adds a Mod-III fan housing to both the front and top with accompanying side panels. The third option is to simply configure whatever you like from the available modules. InWin is also working on a unique concept for the Mod-II chassis piece that adds a motherboard tray, vented wooden side and wood-color accent plates to create a very stylish ITX chassis called the ModFree mini.

In Win launches its Foldable POC Mini-ITX Tower - the latest iBuildiShare series case you can shape yourself! In Win Development Inc. (In Win), a leading innovator in PC enthusiast gaming hardware, has introduced its POC Mini-ITX tower PC chassis. POC is the latest addition to In Win's iBuildiShare series. Encouraging the development of dexterity skills both inside and out of a PC.

DIY PC builders of all ages can assemble a Mini-ITX enclosure from this vibrant modular kit by actually bending and shaping each panel. Similar to the art of origami, but using 0.8 mm foldable SECC steel panels instead of paper. This durable, lightweight material can withstand multiple bends. Delivered flat-packed, POC minimizes packaging materials and weight, reducing environmental impact.