Shahram Mokhtari and Elizabeth Chamberlain—members of the iFixit Teardown Team—spent hands-on time with Framework's freshly introduced 4.5 liter Mini-ITX "Desktop" PC system. Official press material revealed cooling solution partnerships with Cooler Master and Noctua, but only a minority of "2nd Gen event" attendees were allowed to handle these pre-release modular parts. iFixit employees did not perform a full evaluation of Framework's new desktop model, since they were dealing with a prototype unit. A "repairability score" will be awarded once finalized hardware is delivered to iFixit's base of operations. In the meantime, their video team was hosted at Framework's Northern California office.

According to a follow-up report, Mokhtari and Chamberlain enjoyed their visit: "it's teardown time. Framework has been a beacon of repairability in the laptop space, and now they're bringing that ethos to desktops...Taking this thing apart was exactly as easy as we've come to expect from Framework. They brought us to their HQ to rip into it, and from the very first step, it was clear: this desktop was designed to be opened." Potential buyers—of Framework Desktop—are faced with many configurations, but a crucial choice will focus on available APU options. The highest-end builds will feature AMD's 16-core Ryzen AI Max+ 395 "Strix Halo" processor—iFixit's teardown did not reveal any major revelations in terms of the APU's physical appearance. Even Framework's own press release contains an exposed shot—hardcore processor design enthusiasts are better catered to with a more in-depth analysis of "Strix Halo."

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

AI PC capabilities have evolved rapidly in the two years since AMD introduced the first x86 AI PC CPUs at CES 2023. New neural processing units have debuted, pushing available performance from a peak of 10 AI TOPS at the launch of the AMD Ryzen 7 7840U processor to peak 50+ TOPS on the latest AMD Ryzen AI Max PRO 300 Series processors. A wide range of software and hardware companies have announced various AI development plans or brought AI-infused products to market, while major operating system vendors like Microsoft are actively working to integrate AI into the operating system via its Copilot+ PC capabilities. AMD is on the forefront of those efforts and is working closely with Microsoft to deliver Copilot+ for Ryzen AI and Ryzen AI PRO PCs.

In the report "The Year of the AI PC is 2025," Forrester lays out its argument for why this year is likely to bring significant changes for AI PCs. Forrester defines the term "AI PC" to mean any system "embedded with an AI chip and algorithms specifically designed to improve the experience of AI workloads across the computer processing unit (CPU), graphics processing unit (GPU), and neural processing unit (NPU)." This includes AMD products, as well as competing products made by both x86 and non-x86 CPU manufacturers. 2025 represents a turning point for these efforts, both in terms of hardware and software, and this Forrester report is an excellent deep dive into why AI PCs represent the future for enterprise computing.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

AMD has just published its "How to Sell" Ryzen AI MAX series guide—several news outlets have pored over the "claimed" gaming performance charts contained within this two-page document. Team Red appears to be in a boastful mood—their 1080p benchmark results reveal compelling numbers, as produced by their flagship Zen 5 "Strix Halo" processor (baseline 55 W TDP). According to Team Red's marketing guidelines, the Ryzen AI Max+ 395 APU: "competes with a GeForce RTX 4070 Mobile GPU at similar TDP and form factor." The first-party produced comparison points to their Radeon 8060S integrated graphics solution being up to 68% faster—in modern gaming environments at 1080p settings—than the competing Team Green dedicated laptop-oriented GPU, limited to 65 W TGP due to form factor restrictions. Overall, the AMD test unit does better by 23.2% on average (referring to Wccftech's calculations).

According to the document, AMD's reference system was lined up against an ASUS ROG Flow Z13 (2023) gaming laptop specced with an Intel Core i9-13900H processor, and a GeForce RTX 4070 mobile graphics card. The Ryzen AI Max+ 395's "massive iGPU" can unleash the full force of forty RDNA 3.5 compute units, paired with up to 96 GB of unified on-board memory (from a total pool of 128 GB). Non-gaming benchmarks place the flagship Team Red processor above Intel Core Ultra 9 288V and Apple M4 Pro (12-core) CPUs—as always, it is best to wait for verification from independent evaluators. Saying that, the "Strix Halo" APU family has generated a lot of excitement—even going back to early leaks—and the latest marketed performance could drum up further interest.

Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.

This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.

ASUS Republic of Gamers (ROG) today announced the arrival of the 2025 ROG Flow Z13, a powerful gaming tablet. This versatile 2-in-1 gaming machine now features the brand new ultra-powerful AMD Ryzen AI Max+ 395 with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

AMD today vastly fleshed out its mobile processor lineup with the introduction of two new processor lines besides the Ryzen AI Max 300 series. This includes the introduction of more processor models in the Ryzen AI 300 series that are powered by the "Strix Point" silicon, and the introduction of the Ryzen 200 series mobile processors, which are based on the older "Hawk Point" silicon. In 2024, AMD had debuted the Ryzen AI 300 series "Strix Point," but with just the top-end Ryzen AI 9 370 and 365, which came with maxed out 12-core/24-thread (4x Zen 5 + 8x Zen 5c) core configuration, and a maxed out iGPU with 16 CU. Today the company is introducing the Ryzen AI 7 350, the Ryzen AI 5 340, and their AMD PRO variants for commercial notebooks. Both the consumer and commercial parts have identical specs, except for the latter featuring the AMD PRO feature-set.

The Ryzen AI 7 350 comes with a CPU configuration of 8-core/16-thread (4x Zen 5 + 4x Zen 5c). All cores have a base frequency of 2.00 GHz, the Zen 5 cores boost up to 5.00 GHz. The iGPU on offer is the Radeon 860M, with 12 CU and an engine clock of up to 3.00 GHz. TDP is configurable between 15 W to 55 W. The Ryzen AI 5 340 comes with a 6-core/12-thread configuration (3x Zen 5 + 3x Zen 5c), and CPU clock speeds of 2.00 GHz base with 4.80 GHz boost achievable on the Zen 5 cores. The iGPU is heavily cut down, with just 4 CU available, and an iGPU engine clock of 2.90 GHz. Notebook designers can configure this chip with a wide power range from 15 W to 55 W. All four processor models mentioned above come with a Ryzen AI XDNA 2 NPU that's capable of 50 AI TOPS, which means they're all Microsoft Copilot+ AI PC logo eligible.

AMD fans are undoubtedly on their toes to witness the performance improvements that Strix Halo is ready to bring forth. Unlike Strix Point, which utilizes a combination of Zen 5c and full-fat Zen 5 cores, Strix Halo will do away with the small cores for a Zen 5 "only" setup, allowing for substantially better multicore performance. Moreover, it is also widely expected that Strix Halo will boast chunky iGPUs that will bring the heat to entry-level and even some mid-range mobile GPUs, allowing Strix Halo systems to not require discrete graphics at all, with a prime example being the upcoming ROG Flow Z13 tablet.

As per recent reports, the upcoming Ryzen AI Max+ Pro 395 APU will sport an RDNA 3.5-based iGPU with a whopping 40 CUs, and will likely be branded as the Radeon 8060S. In a leaked Geekbench Vulkan benchmark, the Radeon 8060S managed to outpace the RTX 4060 Laptop dGPU in performance. However, according to yet another leaked benchmark, Passmark, the Radeon 8060S and the 32-CU 8050S scored 16,454 and 16,663 respectively - and no, that is not a typo. The 8060S with 40 CUs is marginally slower than the 8050S with 32 CUs, clearly indicating that the numbers are far from final. That said, performance in this range puts the Strix Halo APUs well below the RTX 4070 laptop GPU, and roughly the same as the RTX 3080 Laptop. Not bad for an iGPU, although it is almost certain that actual performance of the retail units will be higher, judging by the abnormally small delta between the 8050S and the 8060S.

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 "Strix Halo" APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill's latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

In case you missed it, AMD's new madcap enthusiast silicon engineering effort, the "Strix Halo," is real, and comes with the Ryzen AI Max 300 series branding. These are chiplet-based mobile processors with one or two "Zen 5" CCDs—same ones found in "Granite Ridge" desktop processors—paired with a large SoC die that has an oversized iGPU. This arrangement lets AMD give the processor up to 16 full-sized "Zen 5" CPU cores, and an iGPU with as many as 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5/x memory interface for UMA.

"Strix Halo" is designed for ultraportable gaming notebooks or mobile workstations where low PCB footprint is of the essence, and discrete GPU is not an option. For enthusiast gaming notebooks with discrete GPUs, AMD is designing the "Fire Range" processor, which is essentially a mobile BGA version of "Granite Ridge," and a successor to the Ryzen 7045 series "Dragon Range." The Ryzen AI Max series has three models based on CPU and iGPU CU counts—the Ryzen AI Max 395+ (16-core/32-thread with 40 CU), the Ryzen AI Max 390 (12-core/24-thread with 40 CU), and the Ryzen AI Max 385 (8-core/16-thread, 32 CU). An alleged Ryzen AI Max 390 engineering sample surfaced on the Geekbench AI benchmark online database.