BIOSTAR, a leading manufacturer of motherboards, graphics cards, and IPC solutions, is excited to introduce the new MS-X7433RE industrial computer designed to cater to a wide range of industrial applications.

The MS-X7433RE fanless embedded computer addresses the diverse demands of industrial professionals with precision and adaptability. It provides robust solutions for system integrators to manage customer data and business operations. AIOT developers can utilize its advanced slots and connectors to integrate communication modules and devices smoothly while leveraging its M.2 Key M interface to support accelerators for enhanced AI processing. Automation specialists benefit from its compatibility with powerful processors, enabling real-time control and efficient data processing. At the same time, edge computing professionals rely on its high-speed communication interfaces and flexible storage options for seamless local data handling.

GEEKOM, a Taiwanese tech company also known as the Green Mini PC Global Leader, just released its first model powered by an Intel Alder Lake-N series SoC. The GEEKOM Mini Air12 Lite is a tiny desktop PC with an Intel N100 quad-core processor, DDR4-3200 RAM, a PCIe Gen 3 SSD, and support for dual displays. The mini PC is now available on Amazon and GEEKOM's official website.

The Mini Air12 Lite measures 135.5 x 115.5 x 34.5 mm (0.5L) and weighs about 1 kilogram. It features a single SO-DIMM slot which supports up to 16 GB of DDR4-3200 MHz memory, and an M.2 2280 slot that can accommodate a PCIe 3.0 or SATA SSD of up to 1 TB. The mini PC runs on a licensed copy of Windows 11 Pro out of the box.

Team Group Industrial has officially introduced the industry's first industrial-grade DDR5 6400 MHz CU-DIMM/CSO-DIMM memory modules. The innovative product addresses challenges posed by high-frequency operation on signal stability by incorporating a specialized component known as the Client Clock Driver (CKD), which effectively buffers and drives clock signals, ensuring the signals remain stable and complete even under high-frequency conditions. This advancement sets a new benchmark in industrial storage technology, enhancing reliability and performance for demanding applications.

Team Group utilizes DDR5 Clocked Unbuffered Dual Inline Memory Module technology, which enables frequency and voltage adjustments based on system load and operating conditions, facilitating exceptional data transmission speeds and optimized power consumption performance, fully supporting the dynamic load requirements prevalent in industrial applications, and delivering solutions with outstanding performance and reliability.

KLEVV, the leading consumer memory and storage brand introduced by Essencore, today announces its first-ever CU-DIMM & CSO-DIMM memory modules, which work seamlessly with the latest Intel Core Ultra (Series 2) "Arrow Lake-S" Processors/ Z890 platform to unleash the true DDR5 performance. KLEVV's next-generation DDR5 memory lineup receives a substantial performance boost with the integration of advanced Client Clock Driver (CKD) technology. Incorporated via a small integrated circuit (IC) directly on the DIMM, CKD IC enhances the module's speed and efficiency for both desktop and laptop applications. By regenerating the memory chips' clock signal, it improves stability, supports higher operating frequencies, and minimizes electrical interference and signal degradation—pushing the boundaries of memory performance.

Designed for both performance desktop and laptop systems, KLEVV's new Standard CU-DIMM and CSO-DIMM memory modules combine the brand's renowned quality with cutting-edge DDR5 technology, making them ideal for both casual and professional users. Leveraging the innovative CKD architecture, these modules deliver exceptional stability and reliability, even at high speeds, effectively mitigating electrical interference that could otherwise hinder performance. With this advanced design, users can count on smooth, efficient operation, even under heavy workloads.

IBASE Technology Inc., a leading innovator of embedded computing solutions, announces the launch of the MI1002 Mini-ITX motherboard powered by the latest Intel Core Ultra processors Series 1 (Meteor Lake-PS platform) with an LGA1851 socket. The new platform provides advanced AI capabilities, enhanced graphics, and remarkable energy efficiency, enabling the MI1002 to handle complex tasks effortlessly, whether deploying AI applications, managing edge computing, or driving IoT solutions.

The MI1002 is available in two variants, MI1002AF and MI1002AF-1, both equipped with two DDR5 memory sockets, multiple M.2 slots for ultra-fast storage and 5G connectivity, and dual 2.5G LAN ports for high-speed networking. The MI1002AF includes support for Intel iAMT 18.0 and dTPM 2.0, which are essential for enhanced security and remote management capabilities. The MI1002AF-1, on the other hand, is equipped with fTPM 2.0, providing a more cost-effective solution for applications where Intel iAMT is not required.

MSI proudly announces the launch of the PRO DP21 14MQ series, the latest addition to its esteemed business desktops. This new model features a compact 2.3-liter chassis, designed to excel in confined workspaces without sacrificing performance. The PRO DP21 14MQ supports Intel vPro technology and DDR5 memory, delivering robust security, efficient remote management, reliable materials, and high-speed data processing. The Intel vPro platform stands out with its essential features, including hardware-based security, remote manageability, and reliable performance, making it the ultimate solution for businesses prioritizing IT security and productivity. Moreover, the PRO DP21 14MQ boasts a rear USB 10 Gbps Type C, a new front USB 5 Gbps Type C port, and a total of 6 USB type A ports, leading to faster data transfer speeds.

The PRO DP21 14MQ is designed with versatility in mind and is VESA mountable, enabling users to effortlessly attach it to a monitor or wall. It also supports MSI Power Link, enabling the PRO DP21 14MQ series desktop to be powered on by an MSI-selected monitor. This ensures a seamless user experience, efficient power management, and enhanced connectivity, especially when mounted behind a monitor.

TrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling. Following establishing a significant AI training server infrastructure in 2024, these CSPs are expected to actively expand into edge AI in 2025. This expansion will include the development of smaller LLM models and setting up edge AI servers to facilitate AI applications across various sectors, such as manufacturing, finance, healthcare, and business.

Moreover, AI PCs or notebooks share a similar architecture to AI servers, offering substantial computational power and the ability to run smaller LLM and generative AI applications. These devices are anticipated to serve as the final bridge between cloud AI infrastructure and edge AI for small-scale training or inference applications.

Minisforum consistently impressed us with its bold small footprint computing solutions over the years, and they've taken things a level up this Computex. Imagine a docking station on which you installed a graphics card like you'd slot in an NES cartridge. That's the Minisforum DEG1 OCulink graphics docking station. The dock resembles an 8-bit era Atari. You install a graphics card vertically on its PCI-Express 4.0 x16 slot (electrical Gen 4 x4), and connect 12 V power from the dock to the card (12V-2x6 and 3x 8-pin supported). The dock connects to the host machine over Oculink (Gen 4 x4).

The R3GAF is a pre-built external GPU based on the AMD Radeon RX 7600M XT. It connects to the host over Oculink, and uses an internap power supply to drive the card, with a configured power limit of 120 W. Besides the GPU's connectivity, the dock puts out a trio pf 5 Gbps USB 3.2 Gen 1 ports. Next up, is a Thunderbolt 4 (40 Gbps) dock that puts out two downstream Thunderbolt ports, a handful USB-C ports, an internal M.2 slot, card reader, and DisplayPort output demuxed from the Thunderbolt uplink.

Acemagic, a German mini-PC developer, has an interesting product booth at Computex 2024. We stopped by to take a look and found the exciting world of mini-PC solutions. Among the first products, we looked at the Z1A dual-screen laptop solution. Featuring two 14.1-inch 1080p IPS displays sitting side by side, the Z1A laptop is powered by Intel's Alder Lake Core i7-1265U or i7-1255U CPUs with Intel Iris Xe graphics. Weighting 1.8 kg, the laptop has a 4000 mAh battery and accommodates two M.2 2280 NVMe drives in combination with LPDDR4 memory left empty for users to install. The computer features WiFi 6 and BlueTooth 5.2 connectivity options and has an IO port selection that includes a USB 3.0, HDMI 2.0, and two USB Type-C connectors (one for data and one for charging and data).

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation at InfoComm 2024, Las Vegas Convention Center, NV. Exhibits June 12-14, 2024, at Booth #C8942. ECSIPC will be showcasing the latest LIVA mini PCs and fanless box PC for vertical market applications including digital signage, and a new motherboard for industrial and commercial use. ECSIPC is demonstrating its new LIVA X3A ARM-based digital signage player integrated with ContentSync exclusive software for flexible digital signage including for retail stores, shopping malls, restaurants, banks, hotels, and airports.

The LIVA X3A features the Rockchip RK3588 processor, 8 GB LPDDR5 memory and 64 GB eMMC storage plus four HDMI ports to provide three video outputs up to 4K UHD and one HD video output simultaneously. ContentSync provides users with intuitive operations including splicing mode to merge screens for captivating dynamic displays and customized scheduling.

ASUS today introduced the NUC 14 Performance, which as its name suggests, is geared for performance. This is essentially a twin of the ROG NUC, but without the flashy ROG styling, and a broader range of hardware options. The top-spec NUC 14 Performance combines an Intel Core Ultra 9 185H "Meteor Lake" processor, and NVIDIA GeForce RTX 4070 desktop GPU, however other processor and graphics options include the Core Ultra 7 155H processor, and RTX 4060 desktop GPU. You can't opt out of a discrete GPU, for that you'll need to opt for the NUC 14 Pro+, which only packs a Core Ultra 185H, and presents its Arc iGPU, but the I/O of that NUC will be significantly different.

Back to the ASUS NUC 14 Performance, and the box measures 270 mm X 180 mm X 50 mm (WxDxH), weighing just 800 g. You're supposed to add your own memory and storage, the NUC features two DDR5 SO-DIMM slots supporting up to 64 GB of DDR5 memory; and an M.2-2280 slot with PCIe Gen 4 x4 wiring. Network connectivity includes Wi-Fi 6E + Bluetooth 5.3; 2.5 GbE wired LAN. The main high-bandwidth I/O connection is Thunderbolt 4 (40 Gbps), which doubles up as USB4 40 Gbps, with a USB-C port that also supports DisplayPort 1.4 passthrough from the discrete GPU; a couple of 10 Gbps USB 3.2 Gen 2 ports, USB 2.0 ports for input devices, additional DP 1.4 ports from the GPU, and an HDMI 2.1. The NUC 14 Performance comes with a 330 W power brick. The company didn't reveal pricing, but pricing is expected in the USD $2,200 to $2,500 range.

The CAMM2 and LPCAMM2 form-factors were originally designed for thin-and-light notebooks, to provide them with memory replacements/upgrades without compromising on the Z-Height tolerances of the device's design. It looks like MSI sees a future for the CAMM2 form-factor on desktops, specifically the ones without cables sticking out. The company's next round of motherboards under its Project Zero banner will replace the conventional DDR5 DIMM slots with DDR5 CAMM2 slots. The company is joining forces with Kingston Technology for the effort.

Kingston is readying a new line of performance-segment CAMM2 modules under its FURY Impact brand that it originally uses for performance SO-DIMMs meant for gaming notebooks. MSI's next-gen Project Zero motherboard features contact points for a DDR5 CAMM2 module. A single CAMM2 module utilizes the entire 160-bit memory bus width of the Socket LGA1700 processor (that's both channels and their sub-channels). Kingston may release CAMM2 modules for most common memory sizes (such as 32 GB, 48 GB, 64 GB, and 96 GB), and most common DDR5 OC speeds for the platform (ranging between DDR5-6000 and DDR5-8000).

ASUS today announced the official release of ASUS NUC 14 Pro, one of several mini PCs unveiled at CES 2024. ASUS NUC 14 Pro delivers best-in-class performance thanks to its Intel Core Ultra 7 or 5 processor powered by three AI engines—a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), and a Central Processing Unit (CPU). Offering high throughput, low power consumption, and fast response, ASUS NUC 14 Pro delivers robust computing capabilities. It also features WiFi sensing for intelligent energy efficiency, along with exceptional security, manageability and stability enabled by Intel vPro Enterprise.

Featuring a 4 x 4 matte black textured chassis constructed of recycled plastic, a replaceable lid, and a VESA mounting plate, this ultra-small-form-factor (uSFF) desktop PC integrates into any workspace, offering maximum functionality without compromising style. Each device comes individually packaged and includes a three-year limited warranty.

TECNO, a global innovative technology brand once again participated in the Mobile World Congress (MWC) 2024 Barcelona, unveiled its two Mini PC products and awarded by "BEST OF MWC" from high technology media-- the"world-first" MEGA MINI Gaming G1 with water-cooling in the smallest gaming Mini PC size, and the MEGA MINI M1 for Pocket-Sized Desktops Solution. In collaboration with TECNO's latest release of AR glasses, the MiniPC can achieve a larger screen for enhanced productivity and a more immersive gaming experience.

Seizing the Edge: Cervoz Adapts to Shifting Data Landscape—The rapid emergence of technologies like AIoT and 5G and their demand for high-speed data processing has accelerated the data transition from the cloud to the edge. This shift exposes data to unpredictable environments with extreme temperature variations, vibrations, and space constraints, making it critical for edge devices to thrive in these settings. Cervoz strategically targets the blooming edge computing sector by introducing an extensive array of compact product lines, enhancing its existing SSDs, DRAM, and Modular Expansion Cards to meet the unique needs of edge computing.

Cervoz Reveals NVMe M.2 SSDs and Connectivity Solutions to Power the Edge
Cervoz introduces its latest compact PCIe Gen. 3x2 SSD offerings, the T421 M.2 2242 (B+M key) and T425 M.2 2230 (A+E key). These space-efficient design and low power consumption feature offer exceptional performance, catering to the storage needs of fanless embedded PCs and motherboards for purpose-built edge applications. Cervoz is also leading the way in developing connectivity solutions, including Ethernet, Wi-Fi, Serial, USB, and CAN Bus all available in M.2 2230 (A+E key) and M.2 2242/2260/2280 (B+M) form factors. The M.2 (B+M key) 2242/2260/2280 card is a versatile three-in-one solution designed for maximum adaptability. While it initially comes in a 2280 form factor, it can be easily adjusted to fit 2260 or 2242 sizes. It offers an effortless upgrade of existing systems without sacrificing connection capability, especially in edge devices.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

During the CES 2024 show, the ASUS booth had a wide variety of products on display. Among the more interesting solutions was the highly-anticipated ROG NUC. Initially, Intel sold the NUC design and manufacturing license to ASUS, and we were left wondering how ASUS would adapt its compact design. We had a booth tour and took pictures of the new design in person. The ASUS ROG NUC can be configured with Intel's flagship Meteor Lake-H Core Ultra 9 185H processor, a 16-core/22-thread CPU with a 115 W maximum turbo TDP that boosts up to 5.1 GHz. It features six performance cores, eight efficiency cores, and two low-power performance cores. The system can be equipped with up to an NVIDIA GeForce RTX 4070 Laptop GPU for graphics.

A more affordable option pairs the Core Ultra 7 155H processor with an RTX 4060 Laptop GPU. Other key specifications include support for up to 32 GB of DDR5 memory across two SO-DIMM slots, three M.2 PCIe Gen 4 x4 SSD slots, Intel Killer WiFi 6E and Bluetooth 5.3, 2.5G LAN, Thunderbolt 4, as much as six USB ports, HDMI and DisplayPort outputs, and a choice of Windows 11 Home 64-bit, Ubuntu 22.04 LTS, or no pre-installed OS. The 2.5-liter chassis shows that miniature size can equal big performance and can easily provide great gaming and productivity results.

Back at the Schenker booth, we also spied the Tuxedo Computers Sirius 16. Schenker is the OEM/SI for this brand, which specializes in notebooks, mobile workstations, mini-PCs, commercial desktops, and large workstations; with the singular design goal of making them 100% compatible with and optimized for popular PC Linux distributions, hence the name. These Linux-friendly PCs are designed and assembled in Germany. The Tuxedo Sirius 16, as its name suggests, features a 16-inch 16:9 1440p display; and an illuminated keyboard. All its ports, connectors, audio, and networking interfaces have been tested for 100% compatibility and performance on Linux.

Under the hood is an AMD Ryzen 7 7840HS "Phoenix" processor, with its 8-core/16-thread "Zen 4" CPU, and a cTDP set by Tuxedo at 54 W. This is paired with dual-channel DDR5 SO-DIMM slots, with options going all the way up to 96 GB. Graphics is care of a discrete AMD Radeon RX 7600M XT with 8 GB of memory, and 130 W configured power limit. The notebook features an all-metal chassis, and since the cooling solution isn't as elaborate on the XMG Neo 17 with its bulky 150 W CPU and 175 W GPU; Schenker used the space to cram in an 80 Wh battery (whereas the XMG Neo 17 has a 99 Wh pack). The 40 Gbps USB4 port from the "Phoenix" SoC is wired out. Neato.

During its "Transcendence Virtual Launch Live Event at CES 2024, ASUS has finally revealed a bit more details about its new ASUS Republic of Gamers NUC, codenamed Scorpion Canyon. The ROG NUC will be powered by up to Intel's Core Ultra 9 CPU and up to NVIDIA GeForce RTX 4070 Laptop GPU, all packed in a 2.5-liter chassis.

The flagship CPU choice is the Intel Meteor Lake-H Core Ultra 9 185H CPU, a 16-core/22-thread CPU (6 P-cores, 8 E-cores, and 2 low-power P-cores) which has a 115 W maximum Turbo TDP and Boosts up to 5.1 GHz. The ASUS ROG NUC can also be equipped with up to NVIDIA GeForce RTX 4070 Laptop GPU. The less expensive SKU pairs up the Core Ultra 7 155H with NVIDIA GeForce RTX 4060 Laptop GPU. The rest of the specifications include two DDR5 SO-DIMM slots with support for 32 GB of memory, three M.2 2280 PCIe Gen 4 x4 slots, Intel Killer WiFi 6E and Bluetooth 5.3, 2.5G Intel LAN, single Thunderbolt 4 port and plenty of other USB ports, HDMI and DisplayPort 1.4a outputs, and choice between Windows 11 Home 64-bit, Ubuntu 22.04 LTS, or no OS.

Intel today announced the release of its 14th Gen Core HX series "Raptor Lake Refresh" mobile processors. Processor models from this series are supposed to cap off the upper end of Intel's mobile processor portfolio. Although Intel released the Core Ultra "Meteor Lake" mobile processors late last year, those chips cover the U-segment, and H-segment (ultraportable, thin-and-light, and mainstream); with the fastest model being the Core Ultra 165H, which caps out at 6P+8E+2LP. The HX segment, which started out as enthusiast-class, broadened in scope over the years to cover the bulky gaming notebooks and portable workstations. These chips typically have a power rating of 55 W. All chips have maximum turbo power rating of 157 W. Intel is tapping into its "Raptor Lake Refresh" silicon to carve out these processors. This is a monolithic chip built on the Intel 7 process, and its package is a multi-chip module with an on-package PCH.

The lineup begins with the Core i9-14900HX, which maxes out the "Raptor Lake Refresh" silicon, with an 8P+16E core-count, with 2 MB of L2 cache per P-core, 4 MB of L2 cache per E-core cluster, and a shared 36 MB L3 cache. The processor's full I/O is wired out, including support for dual-channel DDR5 (SO-DIMMs only), a PCI-Express 5.0 x16 connection for discrete GPUs, a PCI-Express 4.0 x4 connection for a CPU-attached M.2 NVMe SSD, and DMI 4.0 x8 link between the processor die and the PCH die. This PCH puts out up to 16 PCIe Gen 4 lanes, besides up to 12 Gen 3 lanes, which notebook designers can combine with discrete Thunderbolt 4 controllers, and the likes. You can expect Wi-Fi 7 to be prevalent in this crop of premium gaming notebooks. The i9-14900HX features a P-core maximum boost frequency of 5.80 GHz, and an E-core boost frequency of 4.10 GHz.

ASRock Industrial releases the NUC Ultra 100 Motherboard Series with breakthrough powered by Intel Core Ultra processors (Meteor Lake-H). Presenting a 3D performance hybrid architecture that supports up to 14 cores and 20 threads, complemented by the latest integrated Intel ARC Graphics and the pioneering Intel NPU AI engine. The NUC Ultra 100 Motherboard Series are designed in NUC form factor, providing two DDR5-5600 MHz memory up to 96 GB, triple storages, 4K quad displays, 2.5G dual LAN, one USB4/Thunderbolt, and four USB 3.2 Gen 2. This advancement expands into enhanced creativity, efficiency, and collaboration using AI across diverse areas such as entertainment, corporate functions, smart retail, kiosks, digital signage, smart cities, embedded industries, Edge AIoT applications, and more.

The NUC Ultra 100 Motherboard Series encompass NUC-155H and NUC-125H models, powered by Intel Core Ultra 7/5 processors 155H/125H (Meteor Lake-H). The Series feature the upgraded dual-channel SO-DIMM DDR5 5600 MHz up to 96 GB memory, plus support for up to 4K quad displays with one DP 2.1 (from USB4), one DP 1.4a (from Type-C), and two HDMI 2.0b with Intel ARC Graphics, providing immersive experience. Notable upgrades extend to the triple storages of one M.2 Key M (2242/2280), one M.2 Key M (2242) with PCIe Gen4x4 for SSD, and one SATA 3.0. Moreover, rich I/O connectivity and expansion include one USB4/Thunderbolt 4, four USB 3.2 Gen 2 (Type-C/Type-A), 2.5G dual LAN, and one M.2 Key E (2230) with PCIe x1, USB 2.0 and CNVi for wireless. The Series also provide 12-24 V DC-in jack for flexible power input, -20°C ~ 70°C wide operating temperature, plus TPM support with Intel Platform Trust Technology (PTT) for enhanced security.

MINISFORUM released the AR900i, an MoDT (mobile on desktop) motherboard in the Mini-ITX form factor that comes with a hardwired Intel Core i9-13900HX mobile processor and a pre-installed cooling solution. The board is priced at $560 on Amazon, with a limited-period $70-off coupon. This is good value, considering that the i9-13900HX is a maxed-out "Raptor Lake" based mobile processor that features all 8 P-cores, all 16 E-cores, and all 36 MB of shared L3 cache physically present on the "Raptor Lake" silicon. The P-cores boost up to 5.40 GHz, and the E-cores up to 3.90 GHz. The only catch with this processor compared to something like a desktop i9-13900, is its power specs that were originally designed for the power constraints of notebooks, with 55 W base power, and 157 W of maximum turbo power, compared to 225 W of the socketed i9-13900.

Since the Core i9-13900HX is a mobile BGA1964 package that remains hardwired to the board, it is not upgradable. MINISFORUM has designed a cooling solution specific to the processor, which uses a large aluminium fin-stack heatsink that relies on an 80 mm case fan for ventilation. There's a secondary fan-heatsink that provides cooling to two M.2-2280 slots north of the processor. Each of these two M.2 slots has a PCI-Express 5.0 x4 wiring, and using either of them subtracts 8 PCIe lanes from the board's sole expansion slot, a PCI-Express 5.0 x16. The board features an M.2 E-key slot that you can pair with your own WLAN card, it comes with provision for dual-MIMO ready antennas. The processor is wired to two DDR5 SO-DIMM slots supporting up to 96 GB of memory. The board draws power from a 24-pin ATX and a single 8-pin EPS, which should prove sufficient for this processor.

IBASE Technology Inc. (TPEx: 8050), a pioneering force in embedded computing solutions, proudly presents the IB961 3.5" Single Board Computer (SBC) engineered for peak performance, extensive connectivity, and unmatched versatility. Harnessing the prowess of 13th Gen Intel Core processors, including the i7-1370PE, i5-1340PE, i5-1335UE, and i3-1320PE, the IB961 delivers exceptional computing capabilities across diverse applications. These processors advance performance hybrid architecture with up to 6 Performance-cores (P-core) and up to 8 Efficient-cores (E-core), ensuring unparalleled power for memory-intensive tasks.

This compact SBC offers a rich array of connectivity options, including M.2 (M-Key, E-Key, B-Key) mini type slots, and USB 3.2 ports, enabling 5G communications and ensuring seamless integration with peripherals. Dual Intel LAN support guarantees reliable, high-speed network connectivity. Integrated graphics from 13th Gen Intel Core mobile processors provide stunning visuals through 2x DisplayPort (1.2), eDP, and LVDS outputs. The IB961 signifies a leap forward in embedded computing technology, empowering businesses to enhance efficiency and adaptability across diverse industrial applications.

Intel is confirmed to be bringing the 14th Gen Core series to the mobile segment, with the Core i7-14700HX surfacing on leaked PugetBench online database. This would be a repeat of how Intel handled its 10th Gen Core series, with the technologically older "Comet Lake" silicon with its higher core count being confined to the mainstream -H, and enthusiast -HX market segments, with the then contemporary "Ice Lake" silicon handling the thin and light -U and -P segments. Intel is close to launching its "Meteor Lake" silicon, which it will likely address the -U, -P, and some tiers of the -H segments with. These could feature a newer Core and Core Ultra product branding, while "Raptor Lake Refresh" retains the more recognizable 14th Gen Core processor model numbering scheme similar to that of its desktop cousin.

Besides the Core i7-14700HX that now surfaced on PugetBench database, there have been leaks about at least two other models from the "Raptor Lake Refresh" mobile pedigree—Core i5-14650HX, and the i9-14900HX. It's very likely that the flagship "i9-14980HK" part is based on "Raptor Lake Refresh," featuring an unlocked multiplier, and power limits rivaling the desktop i9-14900, for notebooks that are really just desktop replacements. The Intel prototype notebook from the i7-14700HX leak features a discrete Arc A570M GPU, and 64 GB of DDR5-4800 SO-DIMM memory. If the power limit convention is carried over from the 13th Gen, you're looking at 55 W processor base power, and 157 W of maximum turbo power (or burst power). What we don't yet know about the i7-14700HX is its core-configuration. The current i7-13700HX features an 8P+8E configuration, and it remains to be seen if the i7-14700HX gets an 8P+12E config similar to its desktop counterpart.

IBASE Technology Inc. (TPEx: 8050), a renowned provider in the design and manufacturing of embedded computing solutions, rolls out the low-power IB838 3.5" single board computer powered by Intel Core i3 N-series (formerly Alder Lake-N) processor. Combining robust computing performance with advanced features, it is positioned to meet diverse needs across multiple industries, including industrial automation and control, retail displays, transportation, and automotive applications.

Fortified with intelligent power handling and a 9 V~36 V DC input range, the IB838 ensures reliability and consistent operations in transportation applications that may encounter variable power conditions. Versatile connectivity makes it ideal for automation processes and data acquisition systems. The SBC offers Type-C, DP++, and eDP or LVDS display options, along with a rich set of I/O interfaces, including two Intel PCI-E 2.5G LAN ports, two USB 2.0 ports, and four USB 3.2 ports (1x Type-C + 3x Type-A).