BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the BIELK-PAT industrial motherboard and MS-J6412 applications system, tailored to meet the rising demands of modern industries. The BIELK-PAT mainboard is an embodiment of versatility and innovation. Designed to support a broad range of temperature -40 °C ~ 85 °C and 9-24 V operational voltage, the BIELK-PAT mainboard thrives in diverse environments seamlessly integrating into workspaces like outdoor devices, EV charging stations, kiosks, and refrigerated factories. Under its robust framework, it houses an Intel Elkhart Lake SOC Processor and offers display outputs via LVDS, HDMI, and VGA. It supports 2x SO-DIMM DDR4 RAM up to 32 GB 3200 MHz and 2.5 GbE LAN powered by Intel.

Diving deeper into the specifications, the BIELK-PAT features a SATA III and an M.2 slot for storage, along with multiple USB 2.0 and USB 3.0 ports. It is a top choice for SI businesses seeking robust system integration builds with great hardware synergy with Windows 10 and Linux Ubuntu operating systems. The MS-J6412 applications system from BIOSTAR is ideal for fanless embedded system. Compact yet powerful, it is adept at driving POS systems, interactive kiosks, and interconnected IoT devices across many industries supported by its DC-IN design. It boasts a sleek, thin design and ensures quiet computing thanks to its groundbreaking, slim barebone fanless design.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial computing solutions, unveils the SI-624-AI industrial AI computer, which won the Embedded Computing Design's Embedded World 2023 Best in Show Award in Germany. This recognition highlights the exceptional performance and innovation of the rugged system in the field of AI deep learning.

The SI-624-AI is designed to meet the demands of high-speed multiple tasks for artificial neural network applications. Powered by the 12th Gen Intel Core CPU and incorporating the NVIDIA Ampere Architecture MXM GPU, this cutting-edge system delivers image processing capabilities that enable real-time analysis of visual data, enhancing automation, quality control, and overall production efficiency for AIoT applications in smart factory, retail, transportation or medical fields. It is suitable for use as a digital signage control system in mission-critical control rooms in transportation networks, smart retail, healthcare, or AI education where remote AI data analysis capabilities are required.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

The leading memory brand Team Group has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48 GB module, as well as a lower 24 GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.

Current industrial DDR5 memory on the market has a maximum capacity of about 32 GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, Team Group has made capacity upgrades across its industrial DDR5 memory products, offering new 24 GB and 48 GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.

In keeping with Framework's philosophy, the Framework Laptop 16 has socketed memory and storage, making it easy for you to choose what you need on day one and upgrade to more any time later. Our pre-built configurations have set combinations of memory and storage, while on DIY Edition, you can choose any of the modules we offer in the Marketplace or bring your own if you prefer. We've taken both memory and storage to the next level on Framework Laptop 16. For memory, we've created new semi-custom Framework-branded DDR5-5600 modules. For storage, we have two M.2 slots, as well as the ability to add two more in the Expansion Bay for colossal storage capacity.

One core challenge we aimed to solve for memory on the Framework Laptop 16 was being able to offer the same modules for pre-built systems, DIY Edition, and the Framework Marketplace. Historically, we needed to source separate "OEM" modules from Samsung, SK Hynix, and Micron for use in our factory, and "Retail" modules from Crucial to offer in DIY Edition and the Marketplace. Instead, we worked with memory maker ADATA to create custom-label modules that we can use across all areas. Currently, we're leveraging SK Hynix DDR5-5600 memory chips for these modules, but may use other chips that meet the performance bar in the future as well.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

Details of ASUS' upcoming Prime N100I-D D4 Mini-ITX motherboard has made an appearance in official pictures posted over at Fanlesstech, although the board was apparently shown at Computex. The interesting part here is that it's under ASUS' Prime branding, which suggests that this will be a retail product, rather than something that would only be available to OEM partners. The Intel Processor N100 is a quad core 3.4 GHz chip based on Intel's Alder Lake-N and it has a 6 W TDP, which means it can be passively cooled.

Although the SoC supports DDR4 and DDR5 memory, at least for this specific SKU, ASUS went with DDR4 support in the shape of a single SO-DIMM slot which accepts up to 3200 MHz memory. The board also sports a single PCIe 3.0 x2 M.2 slot, an M.2 slot for an optional WiFi module, a PCIe 3.0 x1 slot and a single SATA connector and a USB 3.0 header. The odd thing here is that the SoC supports a total of nine PCIe lanes, but ASUS only appears to have made use of four of them. Around the back is a pair of 10 Gbps USB Type-A ports, a pair of 5 Gbps USB Type-A ports and two USB 2.0 ports, a PS/2 port, a serial port, a D-Sub VGA connector, a DisplayPort and an HDMI port of unknown version—although the SoC supports DP 1.4 and HDMI 2.1—a Gigabit Ethernet jack and three audio jacks.

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

IBASE Technology Inc., a leading global provider of industrial-grade digital signage players, is pleased to unveil the SI-111-N, a palm-sized fanless 4K digital signage player system based on the Intel Atom x6211E and Celeron N6210 processors. Equipped with an HDMI 2.0b port that supports 3840 x 2160 @60Hz resolution, the industrial-grade system enables businesses to easily connect to a 4K display and create immersive visual experiences that attract attention and effectively promote their products or services.

IBASE values sustainable development and ESG practices. The SI-111-N incorporates various energy-saving features, including IBASE's proprietary iSMART green technology that enables power on/off scheduling with power resume capabilities, and the Observer utility that remotely monitors system voltages and temperature to ensure the system is operating efficiently while minimizing energy consumption. The SI-111-N's extensive I/O connectivity offers a rich array of expansion options, reliable data handling, and wireless operation, which includes 1x 2.5GbE LAN, 1x COM (RS-232) port, 1x M.2 M-Key (2280) and 1x M.2 E-Key (2230) sockets.

T-FORCE, the gaming sub-brand of Team Group, has launched the blazing-fast VULCAN SO-DIMM DDR5 Memory for laptop gamers looking to upgrade to next-generation DDR5 memory. The VULCAN Memory delivers incredible performance with a simple installation and comes in a range of large capacities, making it the perfect choice for boosting one's gaming experience as well as productivity. Thanks to its ultra-thin graphene heatspreader that enhances cooling; it keeps laptops stable during intensive gaming and allows players to seize victory at the most critical moments.

Following the release of DDR5 desktop memory, the new generation of extremely-fast RAM from T-FORCE has swept the PC hardware world. Today, T-FORCE is launching its first VULCAN SO-DIMM DDR5 Memory designed specifically for gaming laptops. Offering a max clock rate of DDR5-5200 and featuring an ultra-thin graphene heatspreader, gamers will experience shorter load times and faster boot-up speeds while still maintaining low laptop temperatures. With up to 64 GB of capacity, players will enjoy unimpeded gaming and use work applications simultaneously. The new release of VULCAN SO-DIMM brings a whole new level of performance and user experience.

It's almost cherry-blossom season in Japan, and MINISFORUM released a special edition mini PC to mark it. The UM773 SE has a pastel pink body color along with a cherry-blossom print. Under the hood, it rocks an AMD Ryzen 7 7735HS processor (6 nm, Zen 3+, "Rembrandt Refresh" silicon), with an 8-core/16-thread CPU, and a 12-CU RDNA2 iGPU (Radeon 680M). You get two DDR5 SO-DIMM slots to drop in your own memory, and an M.2-2280 NVMe SSD slot with PCI-Express 4.0 x4 wiring, to use your own SSD, and a 2.5-inch drive bay with SATA 6 Gbps.

Networking connectivity on the MINISFORUM UM773 SE include 2.5 GbE, WiFi 6E, and Bluetooth 5.2. USB connectivity includes USB4, for a type-C port that supports DisplayPort passthrough from the iGPU. There are a couple of 10 Gbps USB 3.2 Gen 2 type-C ports, a couple of such type-A ports, and a couple of USB 2.0 type-A. A couple of HDMI ports, and HD audio make for the rest of it. The box measures 127 mm x 128 mm x 47 mm (WxDxH). The UM773 SE is sold either as a barebones that lacks memory and SSDs; or as prebuilts with 1x 16 GB, 2x 8 GB, and 2x 16 GB memory; each with a 512 GB NVMe SSD.

Update Mar 10th: MINISFORUM confirmed the US price of the UM773 SE to be $429 for the barebones, $579 for the prebuilt with 16 GB memory and 512 GB SSD, $639 for the one with 32 GB memory and 512 GB SSD, and $679 for the top model with 32 GB memory and 1 TB SSD storage.

Laptop memory has been a controversial topic for many years. Its proprietary standard, SO-DIMM, has shown signs of aging as the decades-old JEDEC standard didn't adapt to other expanding capacities and speed trends. Today, JEDEC and Dell think that the future of laptop memory is in the new CAMM standard that both companies are working on. The introduction of CAMM comes from Dell, whose Senior Distinguished Engineer Tom Schnell is working on it. "We have unanimous approval of the 0.5 spec," said Mr. Schnell for PCWorld. One of the problems that SO-DIMM is facing is the capacity and speed issue, where the current DDR5 SO-DIMM memory stops at around 6400 MT/s. CAMM, on the other hand, starts from that speed and works its way up to offer higher capacities as well.

With Dell introducing CAMM in its laptops, it had no intentions of creating a proprietary solution but rather an expandable and upgradable memory platform with various benefits. With JEDEC's involvement in finalizing this, the CAMM standard is slowly on its way to becoming a viable option for different laptop manufacturers. Dell's Tom Schnell didn't reveal what companies are in the process of creating the final specification; however, we know that 32 of them are present, including Apple. If others join, the standard could take over future laptop designs and offer higher speeds and higher capacities, especially in the mobile workstation space where it matters. Below is an example of a CAMM memory module with a patent showing the SO-DIMM (upper left) versus CAMM (lower right) and CAMM's smaller trace path. With smaller tracing, the latency is also going down, so the new standard will bring additional efficiency. Additionally, devices that are based on LPDDR memory could have an upgrade path with the installment of CAMM.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the iNA200, a DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32 GB of system memory. For demanding rugged environments, this fanless IIoT edge gateway comes with a wide operating temperature range of -40°C to 70°C and supports wide power input of 9 to 36 VDC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage, and high expandability for various industrial application needs.

"OT cybersecurity is essential for Industry 4.0. Axiomtek's iNA200 is designed to safeguard your OT assets and avoid network threats for critical infrastructure," said Kevin Hsiao, a product manager of Network Computing Platform Division at Axiomtek. "Additionally, our iNA200 features an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks."

The Minisforum Neptune HX90G all-AMD high-performance mini-PC went on sale at introductory prices. The lunchbox-sized mini-PC packs some serious kit, which includes an AMD Ryzen 9 5900HX "Zen 3" 8-core/16-thread processor, Radeon RX 6600M RDNA2 graphics with 8 GB VRAM, memory options that include dual-channel DDR4 16 GB, 32 GB, and 64 GB; and storage options that include a M.2 NVMe Gen 4 SSD with up to 512 GB capacity. You can also buy it as a barebones, and drop in your own SSD and DDR4 SO-DIMM memory.

What's new here are the introductory prices. The barebones (which gives you the processor and GPU, but not memory or SSD), is priced at $799, down from its $940 regular price. The model with 2x 8 GB memory and 512 GB SSD, is priced at $909, compared to its $1,069 regular price. The 2x 16 GB memory + 512 GB SSD model is going for $969, compared to $1,129 regular price. The top model with 2x 32 GB RAM + 512 GB SSD, can be had at $1,079, compared to its $1,269 regular price.

World-leading memory manufacturer, Team Group is embracing the new DDR5 generation in full force by offering products that meet a wide range of user demands. In this case, T-CREATE, Team Group's label targeting content creators, is launching the EXPERT Desktop DDR5 RAM and CLASSIC SO-DIMM Laptop DDR5 RAM to serve the booming digital content market and join hands with digital content creators around the world to usher in the next generation.

T-CREATE's EXPERT Desktop DDR5 RAM, unlike its DDR4 iteration, uses a dedicated DDR5 cooling module and all-new cooling fin design to strengthen cooling under high-intensity applications and ensure digital content creators can continue to experience high-speed performances at the ideal operating temperature. Digital content creators require strong performances and large capacities. The EXPERT DDR5 has the specs to achieve speeds of up to 5600 MHz and dual-channel options available in 16 GB x2 or 32 GB x2, which can fulfill any multi-tasking needs and drastically enhances the creative experience.

In response to the evolution of industrial DDR5 memory platform specifications, global memory brand TEAMGROUP has utilized its outstanding R&D capabilities to develop the first industrial U-DIMM, SO-DIMM, ECC-DIMM, and R-DIMM DDR5 memory modules at 5,600MHz clock speeds and run at 1.1V. They are expected to meet the diverse needs of next-generation platforms, Intel Raptor Lake and AMD Raphael-X, with high-performance specifications in line with JEDEC standards, accelerating the development of high-end industrial applications.

TEAMGROUP has been making strides in the industrial market for years and is focused on DDR5 memory applications. The company previously developed a complete range of DDR5 4,800 MHz modules, and now thanks to its industry-leading R&D, TEAMGROUP has successfully increased the frequencies of its DDR5 product line to 5,600 MHz. For added security in industrial applications, an SPD Write Protection feature was also adopted, which prevents SPD parameter changes caused by abnormal interference. With these enhancements, the risk of shutdown is greatly reduced and the memory is able to operate with substantially improved performance and stability.

It seems like DDR4 has ruled the roost forever. Finally, new motherboards and architectures have allowed memory to grow wings with the advent of DDR5. Improved clock speeds promise up to twice the bandwidth of DDR4, all with lower voltage for better efficiency. To further help with that last bit, DDR5 has on-board power management to reduce motherboard cost and complexity. This is particularly nice for all-new, powerful laptops and embedded devices.

Reliability has also been improved by the introduction of on-die error-correction technology. Memory availability is improved by splitting the internal 64-bit (72-bit with ECC) channel into two independent, 32-bit channels (40-bit with ECC) and the addition of the same bank refresh. Combined with other features, including those that allow for up to four times the module capacity with consumer DRAM, DDR5 ensures your multi-core CPU won't be memory starved. You can pack more memory than ever into your portable machine and take it on the go.

To meet the demand for all types of multi-tasking, high-clock-speed experiences, and high-performance computing as well as to provide users with a full range of DDR5 upgrade options, TEAMGROUP, a global memory leader, has announced the release of its newly-updated ELITE SO-DIMM DDR5 and ELITE U-DIMM DDR5 5600 MHz high-speed memory modules. Both models will be available on Amazon in North America in early July, 2022. The high clock speed allows for higher-performance DDR5 memory for both desktop and laptop computers, enhancing user productivity and improving overall operational efficiency and storage performance. Consumers worldwide can also enjoy a more stable and efficient experience with lower power consumption provided by TEAMGROUP's ELITE memory.

In response to the growing demand for high-speed computing and digital technology, TEAMGROUP has introduced the upgraded ELITE SO-DIMM DDR5 5600 MHz and ELITE U-DIMM DDR5 5600 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of business, learning, and entertainment applications on desktop and laptop computers. With a low operating voltage of 1.1 V, the power consumption of the memory is significantly reduced, extending the life of computers it is installed on. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process double the amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.

The portable and lightweight Flow family has a new member. ROG is proud to introduce the Flow X16, a convertible thin and light laptop with gaming horsepower that belies its size. Paired with the stunning Nebula HDR Display and fully compatible with the XG Mobile ecosystem, the Flow X16 is ready to redefine how you look at ultraportable gaming laptops.

The Flow X16 is the culmination of a relentless drive to pair cutting-edge components with a thin and light chassis. This 16-inch convertible laptop is powered by up to an AMD Ryzen 9 6900HS processor and up to an NVIDIA GeForce RTX 3070 Ti Laptop GPU, all while weighing just 2.1 kilograms. With a maximum TGP of up to 125 W on the RTX 3070 Ti thanks to Dynamic Boost, this machine is able to go pound for pound with much larger and heavier competition.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the launch of Ripjaws DDR5 SO-DIMM memory kits for laptops and small form factor PC systems, with available memory speeds up to DDR5-5200 or kit capacity up to 64 GB (32 GB x2).

Built with specially screened IC chips and hand-tested with G.SKILL's rigorous and highly selective binning process, each Ripjaws DDR5 SO-DIMM memory kit is constructed for high performance and reliability. Shaping the industry standard for memory performance, G.SKILL is launching low-latency specifications with the Ripjaws DDR5 SO-DIMM memory series, including DDR5-4800 CL34-34-34-76 and DDR5-5200 CL38-38-38-83. For a list of specifications at launch, please see the chart below.