According to reports from last year, Xiaomi was expected to unveil an oft-rumored proprietary mobile chipset design at some point in 2025. By October 2024, the Chinese technology giant allegedly reached the tape-out phase of its first 3 nm SoC—at the time, insiders posited that Xiaomi was seeking a manufacturing partner. Months earlier, a prototype design was linked to TSMC's 4 nm "N4P" node process—this rumor raised many smartphone watchdog eyebrows. Unlike many other Chinese firms, Xiaomi was reportedly allowed to select a fairly advanced manufacturing process at Taiwan's premier foundry service. In a past weekend news article, Wccftech outlined interesting circumstances: "(US) export controls have yet to affect Xiaomi, which is supposedly on track to launch its first in-house chipset later this year. However, while we reported last year that the company was scheduled to unveil its custom 3 nm SoC in 2025, we were disappointed to learn just the specifications of this version that will utilize TSMC's 'N4P' process. According to more details, this silicon will not sport any homegrown cores like Qualcomm has adopted for the Snapdragon 8 Elite."

Late last week, Jukanlosreve highlighted another leaker's prediction—regarding the technological foundations of Xiaomi's mystery flagship mobile processor. Fixed Focus Digital's Weibo post mentioned the "N4P" node, as well the utilization of current generation Arm Cortex-X925, Cortex-A725 and Cortex-A520 units. A speculated Imagination Technologies "IMG DXT 72-2304" integrated graphics solution is touted to outperform Qualcomm's Adreno 740 iGPU; as featured in their Snapdragon 8 Gen 2 (2022) SoC. As highlighted by Wccftech's report, one of the publication's associates has deemed Fixed Focus Digital to be an unreliable source of inside track info. In response to Jukanlosreve's tweeted question, Mochamad Farido Fanani opined: "that's right, how does Xiaomi use N4P in its new chipset? But this guy always guesses blindly." Older leaks—based on "N4P" rumors—projected performance levels roughly on par with Qualcomm's first generation Snapdragon 8 chip. This model was introduced at the tail end of 2021.

Qualcomm Technologies, Inc. announced that its flagship Snapdragon 8 Gen 2 Mobile Platform for Galaxy is powering Samsung Electronics Co., Ltd.'s new cutting-edge foldable smartphones, the Samsung Galaxy Z Fold5 and Galaxy Z Flip5, and its latest Galaxy Tab S9 Series. Snapdragon 8 Gen 2 for Galaxy defines a new standard for connected computing, including groundbreaking AI experiences, desktop-level gaming features, professional grade photography, and more, for consumers around the world.

"Samsung is important to our mission to deliver the world's best mobile experiences to consumers. They continue to set the pace for innovation and we couldn't be more thrilled to have Snapdragon 8 Gen 2 for Galaxy power the newest flagship Galaxy device lineup—the Galaxy Z Flip5, Galaxy Z Fold5, and Galaxy Tab S9 series," said Alex Katouzian, senior vice president and general manager, mobile, compute, & XR businesses, Qualcomm Technologies, Inc.

Samsung Electronics Co., Ltd. announces its new Galaxy Tab S9 series, a premium product portfolio that redefines the tablet landscape and sets new standards for immersive viewing and creative freedom. Across all three models, Galaxy Tab S9, S9+ and S9 Ultra, Dynamic AMOLED 2X displays ensure epic viewing and entertainment experiences with the power of Qualcomm Snapdragon 8 Gen 2 for Galaxy. An in-box, IP68-rated S Pen helps users bring their ideas to life. And as the first Galaxy Tab S series to earn an IP68 rating, Galaxy Tab S9 series enables users to follow their inspiration, both indoors and out.

"There are no devices like the Galaxy Tab S9 series on the market today. A true disrupter in its category, it is the first of its kind to deliver experiences that users love most about tablets in one complete premium design," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The Galaxy Tab S9 series empowers users to take their big ideas and bring them to life, completely effortlessly."

Samsung Electronics Co., Ltd. today announced its fifth generation of Galaxy foldables: Galaxy Z Flip5 and Galaxy Z Fold5. The industry-leading form factors offer unique experiences for every user with sleek and compact designs, countless customization options, and powerful performance. The new Flex Hinge makes the foldable experience possible, while offering an aesthetically balanced and solid design. These unrivalled foldable devices unlock extraordinary camera capabilities such as FlexCam to take photos from creative angles. With strong performance and an optimized battery powered by the latest processor, the Samsung Galaxy Z series transforms what is possible with a smartphone - open or closed.

"Samsung is revolutionizing the mobile industry with foldables by setting the standard and continually refining the experience," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Every day, more people choose our foldables because they offer an experience people want that they can't get on any other device. Galaxy Z Flip5 and Galaxy Z Fold5 are the latest devices that prove our commitment to meeting the needs of our customers through innovative technology."

An online tipster, posting on the Chinese blog site Weibo, has let slip that Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset is touted to pack some hefty graphical capabilities. The suggested Adreno "750" smartphone and tablet GPU is touted to offer a 50% increase over the present generation Adreno 740 - as featured on the recently released and cutting-edge Snapdragon 8 Gen 2 chipset. The current generation top-of-the-range Snapdragon is no slouch when it comes to graphics benchmarks, where it outperforms Apple's prime contender - the Bionic A16 SoC.

The Snapdragon 8 Gen 3 SoC is expected to launch in the last quarter of 2023, but details of the flagship devices that it will power are non-existent at the time of writing. The tipster suggests that Qualcomm has decided to remain on TSMC's 4 nm process for its next generation mobile chipset - perhaps an all too safe decision when you consider that Apple has upped the stakes with the approach of its Bionic A17 SoC. It has been reported that the Cupertino, California-based company has chosen to fabricate via TSMC's 3 nm process, although the Taiwanese foundry is said to be struggling with its N3 production line. The engineers at Qualcomm's San Diego headquarters are alleged to be experimenting with increased clock speeds running on the next gen Adreno GPU - as high as 1.0 GHz - in order to eke out as much performance as possible, in anticipation of besting the Bionic A17 in graphics benchmarks. The tipster theorizes that Qualcomm will still have a hard time matching Apple in terms of pure CPU throughput, so the consolation prize will lie with a superior GPU getting rigged onto the Snapdragon 8 Gen 3.