Avalue Technology introduces the HPM-GNRDE high-performance server motherboard, powered by the latest Intel Xeon 6 Processors (P-Core) 6500P & 6700P.

Designed to deliver quality computing performance, ultra-fast memory bandwidth, and advanced PCIe 5.0 expansion, the HPM-GNRDE is the ideal solution for AI workloads, high-performance computing (HPC), Cloud data centers, and enterprise applications. The HPM-GNRDE will make its debut at embedded world 2025, showcasing Avalue's innovation in high-performance computing.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

ASUS today announced an all-new series of servers powered by the latest Intel Xeon 6 processors, including the Xeon 6900-series, 6500P/6700P-series and 6300-series processors. These powerhouse processors deliver exceptional performance, efficiency and scalability, featuring up to 128 Performance-cores (P-cores) or 288 Efficient-cores (E-cores) per socket, along with native support for PCI Express (PCIe 5.0) and DDR5 6400 MT/s memory speeds. The latest ASUS server solutions also incorporate the updated BMC module within the ASPEED 2600 chipset, providing improved manageability, security and compatibility with a wide range of remote management software - and coincide with the unveiling of the latest Intel Xeon 6 processors.

Redefining efficiency and scalability
Intel Xeon 6 processors are engineered to meet the needs of modern data centers, AI-driven workloads and enterprise computing. Offering a choice between P-core and E-core architectures, these processors provide flexibility for businesses to optimize performance and energy efficiency based on specific workloads.

AEWIN is excited to launch the MIS-5131-2U2, a cutting-edge 2U2N High Availability Storage Server powered by Intel's latest Xeon 6 processors. The horizontal placement enables optimized thermal dissipation to allow CPU running with high TDP of 350 W. Each node is equipped with a single Intel Xeon 6700/6500-series processor with P-cores (R1S), offering up to 80 performance cores, 136 PCIe 5.0 lanes, and 8x high-speed DDR5 RDIMMs with speeds of up to 6400 MT/s. Featuring rich I/O and 24x hot-swap dual port NVMe SSD bays, MIS-5131-2U2 is a high-performance and reliable storage solution for mission-critical applications.

The dual node architecture within a single chassis allows for seamless failover through with the NTB (Non-Transparent Bridge) interconnectivity, two BMC communication, and dual-port NVMe drives. The two nodes of MIS-5131 are linked via NTB running at PCIe Gen 5 speeds (32 GT/s) to enable high speed, redundant storage failover. With NTB, dual port NVMe drives, and sufficient PCIe lanes of Intel Xeon 6 R1S CPU, the system eliminates the need for an additional switch, delivering an optimized HA server solution with the best TCO for continuous operation.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new GIGABYTE rack servers that are optimized for Intel Xeon 6700/6500-series processors with up to 136 PCIe 5.0 lanes. Additionally, GIGABYTE enterprise products support new Intel Xeon 6700/6500-series with P-cores and 6300-series.

New Servers Supporting Platform with Up to 136 PCIe Lanes
The new Intel Xeon 6700 and 6500-series have processor SKUs that are designed to support either up to 136 PCIe 5.0 lanes (referred to as R1S) or 88 PCIe lanes. Optimized for R1S processors, the new GIGABYTE rack servers (R264-SG2, R264-SG3, R264-SG5, R164-SG5, R164-SG6) make use of the additional PCIe lanes for diverse storage options, dual-slot GPUs, and additional expansion slots including support for OCP NIC 3.0. These servers will be deployed in applications such as storage, telecom, edge, and more. The new servers support Intel Xeon 6 processors using LGA 4710; however, they are further optimized to take advantage of the additional PCIe lanes when compared to other Intel Xeon 6 processors. A new server that exemplifies this advantage, the R264-SG5 supports up to twenty-eight E3.S Gen 5 NVMe drives, yet it has support for a dual-slot (Gen 5 x16) GPU.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

Advantech, a global leader in industrial and embedded computing, today announced the launch of seven new server platforms built on Intel Xeon 6 processors, optimized for industrial, transportation and communications applications. Designed to meet the increasing demands of complex AI storage and networking workloads, these innovative edge servers and network appliances provide superior performance, reliability, and scalability for system integrators, solutions, and service provider customers.

Intel Xeon 6 - Exceptional Performance for the Widest Range of Workloads
Intel Xeon 6 processors feature advanced performance and efficiency cores, delivering up to 86 cores per CPU, DDR5 memory support with speeds up to 6400 MT/s, and PCIe Gen 5 lanes for high-speed connectivity. Designed to optimize both compute-intensive and scale-out workloads, these processors ensure seamless integration across a wide array of applications.

MSI introduces new server platforms powered by the latest Intel Xeon 6 family of processors with the Performance Cores (P-Cores). Engineered for high-density performance, seamless scalability, and energy-efficient operations, these servers deliver exceptional throughput, dynamic workload flexibility, and optimized power efficiency. Optimized for AI-driven applications, modern data centers, and cloud-native workloads, MSI's new platforms help lower total cost of ownership (TCO) while maximizing infrastructure efficiency and resource optimization.

"As data-driven transformation accelerates across industries, businesses require solutions that not only deliver performance but also enable sustainable growth and operational agility," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our Intel Xeon 6 processor-based servers are designed to support this shift by offering high-core scalability, energy-efficient performance, and dynamic workload optimization. These capabilities empower organizations to maximize compute density, streamline their digital ecosystems, and respond to evolving market demands with greater speed and efficiency."

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

Intel today launched two new Ethernet product lines - the Intel Ethernet E830 Controllers and Network Adapters, and the Intel Ethernet E610 Controllers and Network Adapters - designed to meet the growing demands of enterprise, telecommunications, cloud, edge, high performance computing (HPC) and artificial intelligence (AI) applications. These next-generation solutions provide robust, high-performance connectivity while enhancing energy efficiency and security, and lowering total cost of ownership (TCO).

"In today's interconnected world, networking is essential to the success of business and technology transformation. With the launch of the Intel Ethernet E830 and E610 products, we are helping customers meet the growing demand for high-performance, energy-efficient solutions that optimize network infrastructures, lower operational costs and enhance TCO." -Bob Ghaffari, Intel vice president, Network and Edge Group

As enterprises modernize infrastructure to meet the demands of next-gen workloads like AI, high-performing and efficient compute is essential across the full spectrum - from data centers to networks, edge and even the PC. To address these challenges, Intel today launched its Xeon 6 processors with Performance-cores (P-cores), providing industry-leading performance for the broadest set of data center and network infrastructure workloads and best-in-class efficiency to create an unmatched server consolidation opportunity.

"We are intensely focused on bringing cutting-edge leadership products to market that solve our customers' greatest challenges and help drive the growth of their business," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "The Xeon 6 family delivers the industry's best CPU for AI and groundbreaking features for networking, while simultaneously driving efficiency and bringing down the total cost of ownership."

MiTAC Computing Technology Corporation, a leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation, today announced the launch of its latest server systems and motherboards powered by the latest Intel Xeon 6 with P-core processors. These industry-leading processors are designed for compute-intensive workloads, providing up to twice the performance for the widest range of workloads including AI and HPC.

Driving Innovation in AI and High-Performance Computing
"For over a decade, MiTAC Computing has collaborated with Intel to push the boundaries of server technology, delivering cutting-edge solutions optimized for AI and high-performance computing (HPC)," said Rick Hwang, President of MiTAC Computing Technology Corporation. "With the integration of the latest Intel Xeon 6 P-core processors our servers now unlock groundbreaking AI acceleration, boost computational efficiency, and scale cloud operations to new heights. These innovations provide our customers with a competitive edge, empowering them to tackle demanding workloads with superior empower our customers with a competitive edge through superior performance and an optimized total cost of ownership."

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Hewlett Packard Enterprise today announced eight new HPE ProLiant Compute Gen12 servers, the latest additions to a new generation of enterprise servers that introduce industry-first security capabilities, optimize performance for complex workloads and boost productivity with management features enhanced by artificial intelligence (AI). The new servers will feature upcoming Intel Xeon 6 processors for data center and edge environments.

"Our customers are tackling workloads that are overwhelmingly data-intensive and growing ever-more demanding," said Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "The new HPE ProLiant Compute Gen12 servers give organizations - spanning public sector, enterprise and vertical industries like finance, healthcare and more - the horsepower and management insights they need to thrive while balancing their sustainability goals and managing costs. This is a modern enterprise platform engineered for the hybrid world, designed with innovative security and control capabilities to help companies prevail over the evolving threat landscape and performance challenges that their legacy hardware cannot address."

Intel Corporation today reported fourth-quarter and full-year 2024 financial results. "The fourth quarter was a positive step forward as we delivered revenue, gross margin and EPS above our guidance," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "Our renewed focus on strengthening and simplifying our product portfolio, combined with continued progress on our process roadmap, is positioning us to better serve the needs of our customers. Dave and I are taking actions to enhance our competitive position and create shareholder value."

"The cost reduction plan we announced last year to improve the trajectory of the company is having an impact," said David Zinsner, interim co-CEO and chief financial officer of Intel. "We are fostering a culture of efficiency across the business while driving toward greater returns on our invested capital and improved profitability. Our Q1 outlook reflects seasonal weakness magnified by macro uncertainties, further inventory digestion and competitive dynamics. We will remain highly focused on execution to build on our progress and unlock value."

Intel has implemented substantial price cuts across its Xeon 6 "Granite Rapids" server processor lineup, marking a significant shift in its data center strategy. The reductions, quietly introduced and reflected in Intel's ARK database, come just four months after the processors' September launch. The most dramatic cut affects Intel's flagship 128-core Xeon 6980P, which saw its price drop from $17,800 by 30% to $12,460. This aggressive pricing positions the processor below AMD's competing EPYC "Turin" 9755 128-core CPU both absolute and per-core pricing, intensifying the rivalry between the two semiconductor giants. AMD's SKU at 128 cores is now pricier at $12,984, with higher core count SKUs reaching up to $14,813 for 192-core EPYC 9965 CPU based on Zen 5c core. Intel is expected to release 288-core "Sierra Forest" Xeon SKUs this quarter, so we can get an updated pricing structure and compare it to AMD.

Additionally, Intel's price adjustments extend beyond the flagship model, with three of the five Granite Rapids processors receiving substantial reductions. The 96-core Xeon 6972P and 6952P models have been marked down by 13% and 20% respectively. These cuts make Intel's offerings particularly attractive to cloud providers who prioritize core density and cost efficiency. However, Intel's competitive pricing comes with trade-offs. The higher power consumption of Intel's processors—exemplified by the 96-core Xeon 6972P's 500 W requirement, which exceeds AMD's comparable model by 100 W—could offset the initial savings through increased operational costs. Ultimately, most of the data center buildout will be won by whoever can serve the most CPU volume shipped (read wafer production capacity) and the best TCO/ROI balance, including power consumption and performance.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

Intel Corporation and the Biden-Harris Administration announced today that the U.S. Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act. The award will support Intel's previously announced plans to advance critical semiconductor manufacturing and advanced packaging projects at its sites in Arizona, New Mexico, Ohio and Oregon. Intel also plans to claim the U.S. Treasury Department's Investment Tax Credit, which is expected to be up to 25% of qualified investments of more than $100 billion.

"With Intel 3 already in high-volume production and Intel 18A set to follow next year, leading-edge semiconductors are once again being made on American soil," said Pat Gelsinger, CEO of Intel. "Strong bipartisan support for restoring American technology and manufacturing leadership is driving historic investments that are critical to the country's long-term economic growth and national security. Intel is deeply committed to advancing these shared priorities as we further expand our U.S. operations over the next several years."

Aetina, a subsidiary of the Innodisk Group and an expert in edge AI solutions, is pleased to announce its debut at Supercomputing (SC24) in Atlanta, Georgia, showcasing the innovative SuperEdge NVIDIA MGX short-depth edge AI server, AEX-2UA1. By integrating an enterprise-class on-premises large language model (LLM) with the advanced retrieval-augmented generation (RAG) technique, Aetina NVIDIA MGX short-depth server demonstrates exceptional enterprise edge AI performance, setting a new benchmark in Edge AI innovation. The server is powered by the latest Intel Xeon 6 processor and dual high-end double-width NVIDIA GPUs, delivering ultimate AI computing power in a compact 2U form factor, accelerating Gen AI at the edge.

The SuperEdge NVIDIA MGX server expands Aetina's product portfolio from specialized edge devices to comprehensive AI server solutions, propelling a key milestone in Innodisk Group's AI roadmap, from sensors and storage to AI software, computing platforms, and now AI edge servers.

MiTAC Computing Technology Corporation, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), is unveiling its new server lineup at SC24, booth #2543, in Atlanta, Georgia. MiTAC Computing's servers integrate the latest AMD EPYC 9005 Series CPUs, AMD Instinct MI325X GPU accelerators, Intel Xeon 6 processors, and professional GPUs to deliver enhanced performance optimized for HPC and AI workloads.

Leading Performance and Density for AI-Driven Data Center Workloads
MiTAC Computing's new servers, powered by AMD EPYC 9005 Series CPUs, are optimized for high-performance AI workloads. At SC24, MiTAC highlights two standout AI/HPC products: the 8U dual-socket MiTAC G8825Z5, featuring AMD Instinct MI325X GPU accelerators, up to 6 TB of DDR5 6000 memory, and eight hot-swap U.2 drive trays, ideal for large-scale AI/HPC setups; and the 2U dual-socket MiTAC TYAN TN85-B8261, designed for HPC and deep learning applications with support for up to four dual-slot GPUs, twenty-four DDR5 RDIMM slots, and eight hot-swap NVMe U.2 drives. For mainstream cloud applications, MiTAC offers the 1U single-socket MiTAC TYAN GC68C-B8056, with twenty-four DDR5 DIMM slots and twelve tool-less 2.5-inch NVMe U.2 hot-swap bays. Also featured is the 2U single-socket MiTAC TYAN TS70A-B8056, designed for high-IOPS NVMe storage, and the 2U 4-node single-socket MiTAC M2810Z5, supporting up to 3,072 GB of DDR5 6000 RDIMM memory and four easy-swap E1.S drives per node.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive Lineup for AI and HPC Success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that are powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing the highest-performing SuperCluster, an end-to-end AI data center solution featuring the NVIDIA Blackwell platform for the era of trillion-parameter-scale generative AI. The new SuperCluster will significantly increase the number of NVIDIA HGX B200 8-GPU systems in a liquid-cooled rack, resulting in a large increase in GPU compute density compared to Supermicro's current industry-leading liquid-cooled NVIDIA HGX H100 and H200-based SuperClusters. In addition, Supermicro is enhancing the portfolio of its NVIDIA Hopper systems to address the rapid adoption of accelerated computing for HPC applications and mainstream enterprise AI.

"Supermicro has the expertise, delivery speed, and capacity to deploy the largest liquid-cooled AI data center projects in the world, containing 100,000 GPUs, which Supermicro and NVIDIA contributed to and recently deployed," said Charles Liang, president and CEO of Supermicro. "These Supermicro SuperClusters reduce power needs due to DLC efficiencies. We now have solutions that use the NVIDIA Blackwell platform. Using our Building Block approach allows us to quickly design servers with NVIDIA HGX B200 8-GPU, which can be either liquid-cooled or air-cooled. Our SuperClusters provide unprecedented density, performance, and efficiency, and pave the way toward even more dense AI computing solutions in the future. The Supermicro clusters use direct liquid cooling, resulting in higher performance, lower power consumption for the entire data center, and reduced operational expenses."

ASRock Rack Inc., a leading innovative server company, today announces its presence at SC24, held at the Georgia World Congress Center in Atlanta from November 18-21. At booth #3609, ASRock Rack will showcase a comprehensive high-performance portfolio of server boards, systems, and rack solutions with NVIDIA accelerated computing platforms, helping address the needs of enterprises, organizations, and data centers.

Artificial intelligence (AI) and high-performance computing (HPC) continue to reshape technology. ASRock Rack is presenting a complete suite of solutions spanning edge, on-premise, and cloud environments, engineered to meet the demand of AI and HPC. The 2U short-depth MECAI, incorporating the NVIDIA GH200 Grace Hopper Superchip, is developed to supercharge accelerated computing and generative AI in space-constrained environments. The 4U10G-TURIN2 and 4UXGM-GNR2, supporting ten and eight NVIDIA H200 NVL PCIe GPUs respectively, are aiming to help enterprises and researchers tackle every AI and HPC challenge with enhanced performance and greater energy efficiency. NVIDIA H200 NVL is ideal for lower-power, air-cooled enterprise rack designs that require flexible configurations, delivering acceleration for AI and HPC workloads regardless of size.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, shows off at SC24 how the GIGABYTE enterprise portfolio provides solutions for all applications, from cloud computing to AI to enterprise IT, including energy-efficient liquid-cooling technologies. This portfolio is made more complete by long-term collaborations with leading technology companies and emerging industry leaders, which will be showcased at GIGABYTE booth #3123 at SC24 (Nov. 19-21) in Atlanta. The booth is sectioned to put the spotlight on strategic technology collaborations, as well as direct liquid cooling partners.

The GIGABYTE booth will showcase an array of NVIDIA platforms built to keep up with the diversity of workloads and degrees of demands in applications of AI & HPC hardware. For a rack-scale AI solution using the NVIDIA GB200 NVL72 design, GIGABYTE displays how seventy-two GPUs can be in one rack with eighteen GIGABYTE servers each housing two NVIDIA Grace CPUs and four NVIDIA Blackwell GPUs. Another platform at the GIGABYTE booth is the NVIDIA HGX H200 platform. GIGABYTE exhibits both its liquid-cooling G4L3-SD1 server and an air-cooled version, G593-SD1.

MSI, a leading global provider of high-performance server solutions, unveiled its AI server based on the NVIDIA MGX architecture at Supercomputing 2024 (SC24) from November 19-21 at booth 3655. Purpose-built to maximize compute density, energy efficiency, and modular flexibility, MSI's MGX-based AI server is designed to handle the intensive demands of AI, HPC, and data-heavy applications, offering the scalable performance and resilience that data centers need to stay ahead in today's high-performance computing landscape.

According to Danny Hsu, General Manager of MSI's Enterprise Platform Solutions, "MSI's latest innovations mark a significant leap in computational power and efficiency, enabling organizations to maximize performance, adapt seamlessly to evolving needs, and drive efficiency, building a robust foundation for future growth in high-performance computing."