Today, MLCommons released its latest MLPerf Inference v5.0 benchmarks, showcasing Intel Xeon 6 with Performance-cores (P-cores) across six key benchmarks. The results reveal a remarkable 1.9x boost in AI performance over the previous generation of processors, affirming Xeon 6 as a top solution for modern AI systems.

"The latest MLPerf results demonstrate Intel Xeon 6 as the ideal CPU for AI workloads, offering a perfect balance of performance and energy efficiency. Intel Xeon remains the leading CPU for AI systems, with consistent gen-over-gen performance improvements across a variety of AI benchmarks." - Karin Eibschitz Segal, Intel corporate vice president and interim general manager of the Data Center and AI Group

Today, MLCommons announced new results for its industry-standard MLPerf Inference v5.0 benchmark suite, which delivers machine learning (ML) system performance benchmarking in an architecture-neutral, representative, and reproducible manner. The results highlight that the AI community is focusing much of its attention and efforts on generative AI scenarios, and that the combination of recent hardware and software advances optimized for generative AI have led to dramatic performance improvements over the past year.

The MLPerf Inference benchmark suite, which encompasses both datacenter and edge systems, is designed to measure how quickly systems can run AI and ML models across a variety of workloads. The open-source and peer-reviewed benchmark suite creates a level playing field for competition that drives innovation, performance, and energy efficiency for the entire industry. It also provides critical technical information for customers who are procuring and tuning AI systems. This round of MLPerf Inference results also includes tests for four new benchmarks: Llama 3.1 405B, Llama 2 70B Interactive for low-latency applications, RGAT, and Automotive PointPainting for 3D object detection.

Super Micro Computer, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is announcing the availability of new single-socket servers capable of supporting applications that required dual-socket servers for a range of data center workloads. By leveraging a single-socket architecture, enterprises and data center operators can reduce initial acquisition costs, ongoing operational costs such as power and cooling, and reduce the physical footprint of server racks compared to previous generations of systems based on older processors.

"We are entering a new era of compute where energy-efficient and thermally optimized single-socket architectures are becoming a viable alternative to traditional dual-processor servers," said Charles Liang, president and CEO of Supermicro. "Our new single-socket servers support 100% more cores per system than previous generations and have been designed to maximize acceleration, networking, and storage flexibility. Supporting up to 500-watt TDP processors, these new systems can be configured to fulfill a wide range of workload requirements."

MSI, a leading global provider of high-performance server solutions, unveiled its next-generation server platforms—ORv3 Servers, DC-MHS Servers, and NVIDIA MGX AI Servers—at CloudFest 2025, held from March 18-20 at booth H02. The ORv3 Servers focus on modularity and standardization to enable seamless integration and rapid scalability for hyperscale growth. Complementing this, the DC-MHS Servers emphasize modular flexibility, allowing quick reconfiguration to adapt to diverse data center requirements while maximizing rack density for sustainable operations. Together with NVIDIA MGX AI Servers, which deliver exceptional performance for AI and HPC workloads, MSI's comprehensive solutions empower enterprises and hyperscalers to redefine cloud infrastructure with unmatched flexibility and performance.

"We're excited to present MSI's vision for the future of cloud infrastructure." said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our next-generation server platforms address the critical needs of scalability, efficiency, and sustainability. By offering modular flexibility, seamless integration, and exceptional performance, we empower businesses, hyperscalers, and enterprise data centers to innovate, scale, and lead in this cloud-powered era."

Giga Computing, a subsidiary of GIGABYTE, a global leader in IT technology solutions, is thrilled to announce its participation at CloudFest 2025, the world's premier cloud, hosting, and internet infrastructure event. As a key exhibitor, Giga Computing will highlight its latest innovations in AI, cloud computing, and edge solutions at the GIGABYTE booth. In line with its commitment to shaping the future of AI development and deployment, the GIGABYTE booth will showcase its industry-leading hardware and platforms optimized for AI workloads, cloud applications, and edge computing. As cloud adoption continues to accelerate, Giga Computing solutions are designed to empower businesses with unparalleled performance, scalability, and efficiency.

At CloudFest 2025, Giga Computing invites attendees to visit booth #E03 to experience firsthand its cutting-edge cloud computing solutions. From state-of-the-art hardware to innovative total solutions, a comprehensive suite of products and services designed to meet the evolving needs of the cloud industry are being showcased.

AEWIN is excited to unveil the SCB-1953 Series, 2U/1U performant network appliances powered by Intel's latest Xeon 6 processors built upon Intel 3. Equipped with a single Intel Xeon 6700/6500-series processor, it is a series of flagship products supporting up to 144 E-cores or 86 P-cores for high density and compute-intensive workloads pursued in the market. SCB-1953 series has multiple SKU with various PCIe slots options for exceptional scalability to fulfill customers' diverse solution requirements.

SCB-1953-2U is a 2U network computing platform with 8x DDR5 RDIMM up to 6400 MT/s or MRDIMM up to 8000 MT/s. The series of SCB-1953-2U has 4x 8038 fans with BMC control for optimized thermal management. One is SCB-1953A featuring 8x PCIe 5.0 expansion slots for AEWIN wide coverage NIC cards with 1G/10/25/40/100G/200G copper/fiber interfaces or other Accelerators & NVMe SSDs for flexible functionality enhancement. The other is SCB-1953C supporting 1x PCIe x16 slot by switching two PCIe slots to one standard PCIe form factor which can install off-the-shelf add-on card for expanded function required.

ASUS today announced its showcase of comprehensive AI infrastructure solutions at CloudFest 2025, bringing together cutting-edge hardware powered by Intel Xeon 6 processors, NVIDIA GPUs and AMD EPYC processors. The company will also highlight its integrated software platforms, reinforcing its position as a total AI solution provider for enterprises seeking seamless AI deployments from edge to cloud.

Intel Xeon 6-based AI solutions and Gaudi 3 Acceleration for generative AI inferencing and fine tuning training
ASUS Intel Xeon 6-based servers leverage the Data Center Modular Hardware System (DC-MHS) architecture, providing unparalleled scalability, cost-efficiency and simplified maintenance. ASUS will showcase a comprehensive Intel Xeon 6 family of processors at CloudFest 2025, including the RS700-E12, RS720Q-E12. and ESC8000-E12P-series servers. The ESC800-E12P-series servers will debut the Intel Gaudi 3 AI accelerator PCIe card. This lineup underscores the ASUS commitment to delivering comprehensive AI solutions that integrate cutting-edge hardware with enterprise-grade software platforms for seamless, scalable AI deployments, highlighting Intel's latest innovations for high-performance AI training, inference, and cloud-native workloads.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries.

"As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN."

Avalue Technology introduces the HPM-GNRDE high-performance server motherboard, powered by the latest Intel Xeon 6 Processors (P-Core) 6500P & 6700P.

Designed to deliver quality computing performance, ultra-fast memory bandwidth, and advanced PCIe 5.0 expansion, the HPM-GNRDE is the ideal solution for AI workloads, high-performance computing (HPC), Cloud data centers, and enterprise applications. The HPM-GNRDE will make its debut at embedded world 2025, showcasing Avalue's innovation in high-performance computing.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

ASUS today announced an all-new series of servers powered by the latest Intel Xeon 6 processors, including the Xeon 6900-series, 6500P/6700P-series and 6300-series processors. These powerhouse processors deliver exceptional performance, efficiency and scalability, featuring up to 128 Performance-cores (P-cores) or 288 Efficient-cores (E-cores) per socket, along with native support for PCI Express (PCIe 5.0) and DDR5 6400 MT/s memory speeds. The latest ASUS server solutions also incorporate the updated BMC module within the ASPEED 2600 chipset, providing improved manageability, security and compatibility with a wide range of remote management software - and coincide with the unveiling of the latest Intel Xeon 6 processors.

Redefining efficiency and scalability
Intel Xeon 6 processors are engineered to meet the needs of modern data centers, AI-driven workloads and enterprise computing. Offering a choice between P-core and E-core architectures, these processors provide flexibility for businesses to optimize performance and energy efficiency based on specific workloads.

AEWIN is excited to launch the MIS-5131-2U2, a cutting-edge 2U2N High Availability Storage Server powered by Intel's latest Xeon 6 processors. The horizontal placement enables optimized thermal dissipation to allow CPU running with high TDP of 350 W. Each node is equipped with a single Intel Xeon 6700/6500-series processor with P-cores (R1S), offering up to 80 performance cores, 136 PCIe 5.0 lanes, and 8x high-speed DDR5 RDIMMs with speeds of up to 6400 MT/s. Featuring rich I/O and 24x hot-swap dual port NVMe SSD bays, MIS-5131-2U2 is a high-performance and reliable storage solution for mission-critical applications.

The dual node architecture within a single chassis allows for seamless failover through with the NTB (Non-Transparent Bridge) interconnectivity, two BMC communication, and dual-port NVMe drives. The two nodes of MIS-5131 are linked via NTB running at PCIe Gen 5 speeds (32 GT/s) to enable high speed, redundant storage failover. With NTB, dual port NVMe drives, and sufficient PCIe lanes of Intel Xeon 6 R1S CPU, the system eliminates the need for an additional switch, delivering an optimized HA server solution with the best TCO for continuous operation.

Giga Computing, a subsidiary of GIGABYTE and an industry leader in generative AI servers and advanced cooling technologies, today announced new GIGABYTE rack servers that are optimized for Intel Xeon 6700/6500-series processors with up to 136 PCIe 5.0 lanes. Additionally, GIGABYTE enterprise products support new Intel Xeon 6700/6500-series with P-cores and 6300-series.

New Servers Supporting Platform with Up to 136 PCIe Lanes
The new Intel Xeon 6700 and 6500-series have processor SKUs that are designed to support either up to 136 PCIe 5.0 lanes (referred to as R1S) or 88 PCIe lanes. Optimized for R1S processors, the new GIGABYTE rack servers (R264-SG2, R264-SG3, R264-SG5, R164-SG5, R164-SG6) make use of the additional PCIe lanes for diverse storage options, dual-slot GPUs, and additional expansion slots including support for OCP NIC 3.0. These servers will be deployed in applications such as storage, telecom, edge, and more. The new servers support Intel Xeon 6 processors using LGA 4710; however, they are further optimized to take advantage of the additional PCIe lanes when compared to other Intel Xeon 6 processors. A new server that exemplifies this advantage, the R264-SG5 supports up to twenty-eight E3.S Gen 5 NVMe drives, yet it has support for a dual-slot (Gen 5 x16) GPU.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

Advantech, a global leader in industrial and embedded computing, today announced the launch of seven new server platforms built on Intel Xeon 6 processors, optimized for industrial, transportation and communications applications. Designed to meet the increasing demands of complex AI storage and networking workloads, these innovative edge servers and network appliances provide superior performance, reliability, and scalability for system integrators, solutions, and service provider customers.

Intel Xeon 6 - Exceptional Performance for the Widest Range of Workloads
Intel Xeon 6 processors feature advanced performance and efficiency cores, delivering up to 86 cores per CPU, DDR5 memory support with speeds up to 6400 MT/s, and PCIe Gen 5 lanes for high-speed connectivity. Designed to optimize both compute-intensive and scale-out workloads, these processors ensure seamless integration across a wide array of applications.

MSI introduces new server platforms powered by the latest Intel Xeon 6 family of processors with the Performance Cores (P-Cores). Engineered for high-density performance, seamless scalability, and energy-efficient operations, these servers deliver exceptional throughput, dynamic workload flexibility, and optimized power efficiency. Optimized for AI-driven applications, modern data centers, and cloud-native workloads, MSI's new platforms help lower total cost of ownership (TCO) while maximizing infrastructure efficiency and resource optimization.

"As data-driven transformation accelerates across industries, businesses require solutions that not only deliver performance but also enable sustainable growth and operational agility," said Danny Hsu, General Manager of MSI's Enterprise Platform Solutions. "Our Intel Xeon 6 processor-based servers are designed to support this shift by offering high-core scalability, energy-efficient performance, and dynamic workload optimization. These capabilities empower organizations to maximize compute density, streamline their digital ecosystems, and respond to evolving market demands with greater speed and efficiency."

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

Intel today launched two new Ethernet product lines - the Intel Ethernet E830 Controllers and Network Adapters, and the Intel Ethernet E610 Controllers and Network Adapters - designed to meet the growing demands of enterprise, telecommunications, cloud, edge, high performance computing (HPC) and artificial intelligence (AI) applications. These next-generation solutions provide robust, high-performance connectivity while enhancing energy efficiency and security, and lowering total cost of ownership (TCO).

"In today's interconnected world, networking is essential to the success of business and technology transformation. With the launch of the Intel Ethernet E830 and E610 products, we are helping customers meet the growing demand for high-performance, energy-efficient solutions that optimize network infrastructures, lower operational costs and enhance TCO." -Bob Ghaffari, Intel vice president, Network and Edge Group

As enterprises modernize infrastructure to meet the demands of next-gen workloads like AI, high-performing and efficient compute is essential across the full spectrum - from data centers to networks, edge and even the PC. To address these challenges, Intel today launched its Xeon 6 processors with Performance-cores (P-cores), providing industry-leading performance for the broadest set of data center and network infrastructure workloads and best-in-class efficiency to create an unmatched server consolidation opportunity.

"We are intensely focused on bringing cutting-edge leadership products to market that solve our customers' greatest challenges and help drive the growth of their business," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "The Xeon 6 family delivers the industry's best CPU for AI and groundbreaking features for networking, while simultaneously driving efficiency and bringing down the total cost of ownership."

MiTAC Computing Technology Corporation, a leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation, today announced the launch of its latest server systems and motherboards powered by the latest Intel Xeon 6 with P-core processors. These industry-leading processors are designed for compute-intensive workloads, providing up to twice the performance for the widest range of workloads including AI and HPC.

Driving Innovation in AI and High-Performance Computing
"For over a decade, MiTAC Computing has collaborated with Intel to push the boundaries of server technology, delivering cutting-edge solutions optimized for AI and high-performance computing (HPC)," said Rick Hwang, President of MiTAC Computing Technology Corporation. "With the integration of the latest Intel Xeon 6 P-core processors our servers now unlock groundbreaking AI acceleration, boost computational efficiency, and scale cloud operations to new heights. These innovations provide our customers with a competitive edge, empowering them to tackle demanding workloads with superior empower our customers with a competitive edge through superior performance and an optimized total cost of ownership."

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Hewlett Packard Enterprise today announced eight new HPE ProLiant Compute Gen12 servers, the latest additions to a new generation of enterprise servers that introduce industry-first security capabilities, optimize performance for complex workloads and boost productivity with management features enhanced by artificial intelligence (AI). The new servers will feature upcoming Intel Xeon 6 processors for data center and edge environments.

"Our customers are tackling workloads that are overwhelmingly data-intensive and growing ever-more demanding," said Krista Satterthwaite, senior vice president and general manager, Compute at HPE. "The new HPE ProLiant Compute Gen12 servers give organizations - spanning public sector, enterprise and vertical industries like finance, healthcare and more - the horsepower and management insights they need to thrive while balancing their sustainability goals and managing costs. This is a modern enterprise platform engineered for the hybrid world, designed with innovative security and control capabilities to help companies prevail over the evolving threat landscape and performance challenges that their legacy hardware cannot address."

Intel Corporation today reported fourth-quarter and full-year 2024 financial results. "The fourth quarter was a positive step forward as we delivered revenue, gross margin and EPS above our guidance," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "Our renewed focus on strengthening and simplifying our product portfolio, combined with continued progress on our process roadmap, is positioning us to better serve the needs of our customers. Dave and I are taking actions to enhance our competitive position and create shareholder value."

"The cost reduction plan we announced last year to improve the trajectory of the company is having an impact," said David Zinsner, interim co-CEO and chief financial officer of Intel. "We are fostering a culture of efficiency across the business while driving toward greater returns on our invested capital and improved profitability. Our Q1 outlook reflects seasonal weakness magnified by macro uncertainties, further inventory digestion and competitive dynamics. We will remain highly focused on execution to build on our progress and unlock value."

Intel has implemented substantial price cuts across its Xeon 6 "Granite Rapids" server processor lineup, marking a significant shift in its data center strategy. The reductions, quietly introduced and reflected in Intel's ARK database, come just four months after the processors' September launch. The most dramatic cut affects Intel's flagship 128-core Xeon 6980P, which saw its price drop from $17,800 by 30% to $12,460. This aggressive pricing positions the processor below AMD's competing EPYC "Turin" 9755 128-core CPU both absolute and per-core pricing, intensifying the rivalry between the two semiconductor giants. AMD's SKU at 128 cores is now pricier at $12,984, with higher core count SKUs reaching up to $14,813 for 192-core EPYC 9965 CPU based on Zen 5c core. Intel is expected to release 288-core "Sierra Forest" Xeon SKUs this quarter, so we can get an updated pricing structure and compare it to AMD.

Additionally, Intel's price adjustments extend beyond the flagship model, with three of the five Granite Rapids processors receiving substantial reductions. The 96-core Xeon 6972P and 6952P models have been marked down by 13% and 20% respectively. These cuts make Intel's offerings particularly attractive to cloud providers who prioritize core density and cost efficiency. However, Intel's competitive pricing comes with trade-offs. The higher power consumption of Intel's processors—exemplified by the 96-core Xeon 6972P's 500 W requirement, which exceeds AMD's comparable model by 100 W—could offset the initial savings through increased operational costs. Ultimately, most of the data center buildout will be won by whoever can serve the most CPU volume shipped (read wafer production capacity) and the best TCO/ROI balance, including power consumption and performance.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."