ASRock Inc., a global leader in motherboards, graphics cards, mini PCs, and gaming monitors, is once again expanding its product lineup with the launch of power supply units (PSUs) for the DIY market. The new PSU product lineup is available under the well-regarded Taichi, Phantom Gaming, Steel Legend, and Challenger series, designed to meet a wide range of user needs.

ASRock's PSUs are fully compliant with the latest Intel ATX 3.1 and PCIe 5.1 standards, supporting the instantaneous peak power loads of 200% to 235%. This ensures users receive stable power solutions for future technologies. Featuring native 12V-2x6 cables, the single-line output can deliver up to 600 W, designed to meet the high-power requirements of next-gen premium graphics cards. The dual-color 16-pin connector design enables quick identification, ensuring proper insertion into the GPU's power socket. Furthermore, the Taichi and Phantom Gaming models feature an exclusive embedded NTC sensor that monitors connector temperatures in real-time, activating protection mode if temperatures exceed safe limits, thereby ensuring system safety and stability.

Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung's new SF2Z 2 nm gate-all-around manufacturing technology. SF2Z includes advanced technology that moves the power distribution network to the backside of the chip — saving space, lowering costs, and improving performance. Ansys solutions enable early adopters of Samsung's technology to design leading-edge semiconductor products for HPC, smartphones, AI, data center communication, and graphics processors.

The certification includes RedHawk-SC, which provides predictively accurate signoff verification for electromigration and voltage drop (IR drop) on power distribution networks for digital designs. In addition, the Totem power integrity platform provides comprehensive evaluation for analog and mixed-signal designs. Both RedHawk-SC and Totem signoff capabilities can reduce project risk, improve reliability, and extend the longevity of chips.

Thanks for the detailed information obtained by The Verge, today we confirm previously leaked details as Sony gears up to unveil the highly anticipated PlayStation 5 Pro, codenamed "Trinity." According to insider reports, Sony is urging developers to optimize their games for the PS5 Pro, with a primary focus on enhancing ray tracing capabilities. The console is expected to feature an RDNA 3 GPU with 30 WGP running BVH8, capable of 33.5 TeraFLOPS of FP32 single-precision computing power, and a slightly quicker CPU running at 3.85 GHz, enabling it to render games with ray tracing enabled or achieve higher resolutions and frame rates in select titles. Sony anticipates GPU rendering on the PS5 Pro to be approximately 45 percent faster than the standard PlayStation 5. The PS5 Pro GPU will be larger and utilize faster system memory to bolster ray tracing performance, boasting up to three times the speed of the regular PS5.

Additionally, the console will employ a more powerful ray tracing architecture, backed by PlayStation Spectral Super Resolution (PSSR), allowing developers to leverage graphics features like ray tracing more extensively. To support this endeavor, Sony is providing developers with test kits, and all games submitted for certification from August onward must be compatible with the PS5 Pro. Insider Gaming, the first to report the full PS5 Pro specs, suggests a potential release during the 2024 holiday period. The PS5 Pro will also feature modifications for developers regarding system memory, with Sony increasing the memory bandwidth from 448 GB/s to 576 GB/s, enhancing efficiency for an even more immersive gaming experience. To do AI processing, there is an custom AI accelerator capable of 300 8-bit INT8 TOPS and 67 16-bit FP16 TeraFLOPS, in addition to ACV audio codec running up to 35% faster.

"The Earth is Blue," said Yuri Gagarin, the first human to journey into space. With two-thirds of its surface covered in water, Earth is a planet that exuberates its blue radiance in the dark space. However, today, the scarcity of water is a challenge that planet Earth is confronted with. For some, this may be hard to understand. What happened to our blue planet Earth? To put in numbers, more than 97% of the water on Earth consists of seawater, with another 2% locked in ice caps. That only leaves a mere 1% of water available for our daily use. The problem lies in the fact that this 1% of water is gradually becoming scarcer due to reasons such as climate change, environmental pollution, and population growth, leading to increased water stress. 'Water stress' is quantified by the proportion of water demand to the available water resources on an annual basis, indicating the severity of water scarcity as the stress index rises. Higher stress indexes signify experiencing severe water scarcity.

The semiconductor ecosystem, unsustainable without water
Because water stress issues transcend national boundaries, various stakeholders including international organizations and governments work to negotiate water resource management strategies and promote collaboration. UN designates March 22nd as an annual "World Water Day" to raise awareness about the severity of water scarcity running various campaigns. Now, it's imperative for companies to also take responsibility for the water resources given and pursue sustainable management.

CORSAIR today launched a white color variant of the revolutionary RMx SHIFT Series of ATX 3.0 power supplies. RMx SHIFT, the world's first PSU with the DC connector panel on the side of the unit, quickly became a sensation among DIY PC enthusiasts after its launch last year thanks to cleaner and easier cabling than traditional power supplies. Available in 750, 850, 1000, and 1200 wattages, the RMx SHIFT Series exemplifies CORSAIR's commitment to addressing the evolving needs of its customers. With its repositioned side panel, builders have unobstructed access to all of its Type 5 Gen 1 micro-fit connections, making installation and maintenance painless. It also means less bending and twisting of the cables, removing unnecessary strain on the cables and connectors.

White models of RMx SHIFT address the overwhelming demand from the PC building community for more customization options to match a wider range of builds. The new white units retain all the features that have made the RMx SHIFT a market standout, including fully modular cabling, 80 Plus Gold-rated efficiency, premium 105°C-rated Japanese capacitors, and a 140 mm fluid dynamic bearing fan, while matching the clean aesthetic of white system builds.

Hello everyone, Expeditions: A MudRunner Game has officially been out for a couple of days, and we'd like to extend a huge thanks to all of you for the feedback received so far. Everyone in the team is on deck, watching streams, videos, and reading your comments and reviews. We're happy to see many of you enjoying Expeditions and what it's trying to achieve, although we also are aware and understand that some of you aren't satisfied with the game's current state.

Our current priorities
Some of your most recurrent feedback is about UI/UX. We cannot overhaul it in one night, but this is a big focal point for the team right now, and it will be improved through several updates. Our first update releases with this message, to bring some immediate improvements. We're also hard at work on bug reports, and the March 7 patch brings a lot of fixes based on your feedback. Be assured that we'll continue to squash as many technical issues as we can in the coming updates. We've also noticed many requests for a photo mode in Expeditions, and we're glad to add it with today's update. It only needed a few extra days of cooking!

NVIDIA is offering a new professional certification in generative AI to enable developers to establish technical credibility in this important domain. Generative AI is revolutionizing industries worldwide, yet there's a critical skills gap and need to uplevel employees to more fully harness the technology. Available for the first time from NVIDIA, this new professional certification enables developers, career professionals, and others to validate and showcase their generative AI skills and expertise. Our new professional certification program introduces two associate-level generative AI certifications, focusing on proficiency in large language models and multimodal workflow skills.

"Generative AI has moved to center stage as governments, industries and organizations everywhere look to harness its transformative capabilities," NVIDIA founder and CEO Jensen Huang recently said. The certification will become available starting at GTC, where in-person attendees can also access recommended training to prepare for a certification exam. "Organizations in every industry need to increase their expertise in this transformative technology," said Greg Estes, VP of developer programs at NVIDIA. "Our goals are to assist in upskilling workforces, sharpen the skills of qualified professionals, and enable individuals to demonstrate their proficiency in order to gain a competitive advantage in the job market."

South Korean tech insiders believe that SK Hynix has sent "12-layer DRAM stacked HBM3E (5th generation HBM)" prototype samples to NVIDIA—according a ZDNET.co.kr article, initial examples were shipped out last month. Reports from mid-2023 suggested that Team Green had sampled 8-layer HBM3E (4th gen) units around summer time—with SK Hynix receiving approval notices soon after. Another South Korean media outlet, DealSite, reckons that NVIDIA's memory qualification process has exposed HBM yield problems across a number of manufacturers. SK Hynix, Samsung and Micron are competing fiercely on the HBM3E front—with hopes of getting their respective products attached to NVIDIA's H200 AI GPU. DigiTimes Asia proposed that SK Hynix is ready to "commence mass production of fifth-generation HBM3E" at some point this month.

SK Hynix is believed to be leading the pack—insiders believe that yield rates are good enough to pass early NVIDIA certification, and advanced 12-layer samples are expected to be approved in the near future. ZDNET reckons that SK Hynix's forward momentum has placed it an advantageous position: "(They) supplied 8-layer HBM3E samples in the second half of last year and passed recent testing. Although the official schedule has not been revealed, mass production is expected to begin as early as this month. Furthermore, SK Hynix supplied 12-layer HBM3E samples to NVIDIA last month. This sample is an extremely early version and is mainly used to establish standards and characteristics of new products. SK Hynix calls it UTV (Universal Test Vehicle)... Since Hynix has already completed the performance verification of the 8-layer HBM3E, it is expected that the 12-layer HBM3E test will not take much time." SK Hynix's Vice President recently revealed that his company's 2024 HBM production volumes for were already sold out, and leadership is already preparing innovations for 2025 and beyond.

The highly anticipated AORUS 16X, a brand-new 16-inch AI gaming laptop unveiled by the world's leading computer brand, GIGABYTE, is now available. Powered by the latest Intel Core 14th gen HX processor and NVIDIA GeForce RTX 40 series laptop GPU, AORUS 16X sets a new standard for performance. Equipped with GIGABYTE AI Nexus technology, it optimizes power management and gaming performance while enhancing generative AI applications. Boasting patented innovations like the 4-sided Super-slim Bezel design and supporting Dolby Atmos and Dolby Vision, it creates a cinematic audiovisual experience unparalleled in its class. It holds the TÜV Rheinland Eye Comfort Certification and Pantone Validated color accuracy certification, which provide high comfort and confidence for extended use.

The AORUS 16X is powered by the latest Intel Core i9 processor 14900HX and NVIDIA GeForce RTX 4070 dedicated graphics card. With a maximum graphic power of up to 140 W, it provides unmatched performance for gaming and creative tasks. The inclusion of NVIDIA Advanced Optimus technology (DDS) ensures seamless switching between integrated and dedicated graphics for optimal performance. Additionally, the WINDFORCE Infinity Cooling technology features the Icy Touch design and 0dB Cooling, enabling efficient heat dissipat ion during heavy loads, or maintaining a noise-free environment during low loads.

Samsung Electronics today at Integrated Systems Europe (ISE) 2024 in Barcelona is showcasing how SmartThings will bolster its B2B displays to shape the future of business connectivity. Samsung's "SmartThings for Business" exhibition emphasizes the new advancements that the cutting-edge internet-of-things (IoT) platform will offer, as well as Samsung's commitment to providing more connected, easy-to-control digital signage across industries. "In a commercial display sector where operational efficiency is key, Samsung digital signage is leveraging SmartThings to deliver next-gen connectivity and features to organizations of all sizes," said SW Yong, President and Head of Visual Display Business at Samsung Electronics. "This further expansion of the SmartThings ecosystem will serve to elevate experiences for customers and partners from a wide variety of industries."

How Businesses Can Leverage Connected Tech Through SmartThings—From the Smart Store to Smart Office
At the event, Samsung is showcasing how SmartThings enables business owners to leverage their digital signage to connect and gain more control of their smart devices across various landscapes. By offering the SmartThings connectivity feature to commercial display products such as Smart Signage and Hotel TVs, users can experience the convenience of hyper-connectivity in their business environments. These changes will include Samsung smart devices, as well as other devices that support the industry's latest IoT specifications, Matter and the Home Connectivity Alliance (HCA). Through the application of SmartThings to various business environments, Samsung contributes to the more efficient management of space and energy by transforming places of business into interconnected smart spaces. These connectivity improvements have been designed to benefit all types of business customers, from small and mid-sized business owners to enterprises. Examples of the smart spaces—including a smart store, smart office and smart hotel—are on display at Samsung's booth at ISE 2024.

Razer, the leading global lifestyle brand for gamers, has announced another major milestone in their commitment towards a sustainable future, with the inclusion of recycled materials in new PC products launching throughout 2024 and beyond. Focusing on its core PC peripherals, this new initiative covers three key categories: mice, keyboards, and headsets. Initially, only the models produced in Razer's signature black base colorway will feature recycled materials, with more product categories to be added over time.

Razer has been experimenting with the use of recycled materials in product manufacture, with two products already available. The Razer DeathAdder V2 X HyperSpeed gaming mouse contains 40% recycled materials, and the Razer Ornata V3 ergonomic clicky gaming keyboard has at least 20%. With these successful integrations of recycled materials, both products met the strict criteria to achieve the UL 2809 ECOLOGO label, an independently verified ecolabel certification from the world's leading testing, inspection and certification company, UL Solutions. Razer is now pushing the program out to encompass an even wider range of products, for all its core PC peripheral launches from the start of 2024 and onwards.

MaxLinear, Inc., a global leader in broadband access and gateway solutions, today announced its Wi-Fi 7 chipsets and Tri-band Access Point were certified by Wi-Fi Alliance and selected as one of the Wi-Fi CERTIFIED 7 test bed devices. Wi-Fi Alliance's Wi-Fi 7 certification helps verify that upcoming Wi-Fi 7 devices can seamlessly interoperate and deliver the high-performance promises of the new standard. The inclusion of MaxLinear's innovative, single-chip Wi-Fi 7 solution in the verification process exemplifies its continuing commitment to pushing the boundaries of in-home communications and reshaping the way service providers build access and connectivity networks.

"At MaxLinear, we're not just leading the pack with Wi-Fi 7 technology; we're redefining it. Our single-chip tri-band device is an industry first, symbolizing a giant leap in wireless communication," said Will Torgerson, VP/GM Broadband Group. "With our focus on power efficiency and peak performance, we're at the forefront of the Wi-Fi 7 revolution, offering blazing-fast speeds, reduced latency, and robust connectivity. As part of the Wi-Fi Alliance, we celebrate 25 years of Wi-Fi innovation and remain committed to advancing a connected world where our groundbreaking solutions enable seamless, multi-gigabit broadband access."

Intel today updated its ARK listings with two new networking chipsets: Wi-Fi 7 BE200 and Wi-Fi 7 BE202. The company unveiled IEEE 802.11be (Wi-Fi 7) specification-based chipsets despite the standard still needing final ratification. The Wi-Fi 7 standard promises data rates as high as 40 Gbit/s, with Intel's BE200 chipset using 2x2 TX/RX streams with 2.4 GHz, 5 GHz, and 6 GHz bands. However, as demonstrated by the adapter's maximum speed of 5 Gbit/s, real-world implementations might not initially reach the theoretical maximum speed. Various motherboards, like the upcoming Gigabyte Aorus Z790 Master X, are already planning to integrate this technology, showing that the industry is getting ready for a Wi-Fi 7 world.

What makes Wi-Fi 7 especially interesting is its raw speed and underlying technology designed to improve efficiency and capacity. Features like Multi-User Multiple-Input Multiple-Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA), which were introduced in Wi-Fi 6 and 6E, are mandatory in Wi-Fi 7. These technologies aim to optimize the overall performance of wireless networks, making them more suitable for bandwidth-intensive tasks like AR and VR. While full certification for Wi-Fi 7 is not expected until 2024, with widespread adoption to follow, the technology looks poised to become a significant aspect of our wireless future.

AMD today announced the Radeon PRO W7600 and W7500 graphics cards for the professional-visualization (pro-vis) market segment. These cards target the mid-range of the pro-vis segment, with segment price-band ranging between $350-950. The two are hence positioned below the W7800 and W7900 that the company launched in April. The W7600 and W7500 are based on the same RDNA3 graphics architecture as those two, and the client-segment RX 7000 series. AMD is pricing the the two new cards aggressively compared to NVIDIA. Both the W7500 and W7600 are based on the 6 nm "Navi 33" silicon.

The Radeon PRO W7600 leads today's launch, maxing out the silicon it is based on—you get 32 RDNA3 compute units, or 2,048 stream processors; 64 AI Accelerators, 32 Ray Accelerators; 128 TMUs, and 64 ROPs. The card comes with 8 GB of 18 Gbps GDDR6 memory across a 128-bit wide memory bus. The memory does not feature ECC. The card comes with a 130 W typical power draw, with a single 6-pin PCIe power connector. It uses a slick single-slot lateral-airflow cooling solution. AMD claims 20 TFLOPs peak FP32 performance.

Pixelworks, Inc., a leading provider of innovative visual processing solutions, today announced the official launch of its new IRX gaming experience brand. As a brand targeted at smartphone users, IRX is grounded on Pixelworks' mobile visual processing solutions and coupled with in-depth game tuning services. This combination leverages Pixelworks' expertise to achieve ultra-smooth gaming experience and the highest picture quality for different types of games on mobile devices. In addition, it exercises effective control of power consumption, latency and other performance variables to ensure stable and long-lasting gaming with optimal visual performance, providing end users with unparalleled mobile gaming experiences.

The IRX gaming experience is enabled by a portfolio of technology advantages and product application experiences based on the Company's innovative distributed rendering architecture. More specifically, Pixelworks' ultra-low latency MotionEngine technology, low power super-resolution technology, AI Always-on HDR and other technologies bring optimized rendering capabilities to smartphones that exceed what can be achieved by a traditional chipset. Together with Pixelworks' profound tuning experience for different games on various mobile devices the result is a meaningfully enriched visual experience for smartphone users, which is the core foundation for the IRX gaming experience.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution optimized for in-vehicle infotainment (IVI) systems. The new solution offers the industry's lowest energy consumption, enabling car manufacturers to provide the best mobility experience for consumers.

The UFS 3.1 lineup will come in 128, 256 and 512-gigabyte (GB) variants to meet different needs of customers. The enhanced lineup allows more efficient battery life management to future automotive applications such as electric or autonomous vehicles. The 256 GB model, for instance, has reduced its energy consumption by about 33% compared to the previous generation product. The 256 GB model also provides a sequential write speed of 700-megabytes-per-second (MB/s) and a sequential read speed of 2,000 MB/s.

Keen-eyed hardware tipster momomo_us this week spotted that an upcoming AMD data center "Siena Dense" CPU has received verification, in the general sense, for SATA and PCI support - courtesy of the Serial ATA International Organization (SATA-IO). The information dump was uploaded to SATA-IO's online database on April 6 of this year - under the heading: "AMD EPYC 8004 Series Processors." As covered by TPU mid-way through this month the family of enterprise-grade processors, bearing codename Siena, is expected to be an entry-level alternative to the EPYC Genoa-X range, set for launch later in 2023.

The EPYC Siena series is reported to arrive with a new socket type - SP6 (LGA 4844) - which is said to be similar in size to the older Socket SP3. The upcoming large "Genoa-X" and "Bergamo" processors will sit in the already existing Socket SP5 (LGA 6096) - 2022's EPYC Genoa lineup makes use of it already. AMD has not made its SP6 socket official to the public, but industry figures have been informed that it can run up to 64 "Zen 4" cores. This new standard has been designed with more power efficient tasks in mind - targeting intelligent edge and telecommunication sectors. The smaller SP6 socket will play host to CPUs optimized for as low as 70 W operation, with hungrier variants accommodated up to 225 W. This single platform solution is said to offer 6-channel memory, 96 PCIe Gen 5.0 lanes, 48 lanes for CXL V1.1+, and 8 PCIe Gen 3.0 lanes.

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.