Thermaltake, a leading PC DIY brand for premium hardware solutions, is proud to launch the Toughpower TF3 1300 W - TT Premium Edition, the 80 Plus Titanium certified and full modular PSU that is designed to power up high-performance and overclocking systems. The Toughpower TF3 1300 W is built to comply with the ATX 3.1 specification and comes with PCIe Gen 5.1 connectors, it ensures superior reliability and future-ready compatibility for high-end hardware including the latest RTX50 series graphics cards.

The Toughpower TF3 1300 W meets ATX 3.1 standards, supporting up to 200% total power excursion, 300% GPU power excursion, and reaches 60% efficiency at low load. Its two native PCIe 12 V-2X6 modular interfaces are compatible with advanced PCIe 12+4pin connectors, providing up to 600 W for the next-gen PCIe 5.1 graphics cards. To reduce installation errors, the 12+4pin cable comes with a dual-color design in matcha green and black, allowing users can easily verify proper connections.

Details of ASUS' next generation BTF 2.0 (BTF stands for Back to the Future) platform have appeared online, courtesy of Andreas Schilling from HardwareLuxx. The editor posted pictures from an ASUS presentation over at Bluesky that details one major change to the power connector design, which will make the BTF 2.0 graphics cards compatible with non BTF systems. This suggests that ASUS might consider offering more graphics cards with BTF 2.0 support, since they can be used in any system with the proposed changes.

As you may or may not know, the first generation BTF graphics cards ended up with a power connector at the rear, bottom edge of the graphics cards, placed somewhat behind the PCIe gold fingers. The cards also lacked any other power connectors, which made them exclusive for BTF builds. To solve this conundrum, ASUS moved its GC-HPWR PCB power connector up on the PCB, making sure it clears any motherboard components. However, instead of increasing the height of the motherboard BTF 2.0 connector, the company provides a small adapter that plugs in between the motherboard and graphics card, to make its new BTF 2.0 cards compatible with any system.

UGREEN introduced new products at CES 2024 including a high-wattage charger, and a Thunderbolt 5 dock. The company revealed its Nexode 500 W desktop charger, which can power six devices (about five average laptops) simultaneously. Its highest-capacity port delivers 240 W through USB Power Delivery 3.1, enough to charge demanding devices including e-bikes. The charger uses GaN technology to achieve its power output while maintaining a desktop-friendly size.

At CES 2025, Lenovo unveiled a bold lineup of AI-powered business solutions designed to redefine the modern workplace. Highlights include the boldly redesigned Lenovo ThinkPad X9 Aura Editions, the innovative and unique ThinkBook Plus Gen 6 with rollable display, and the latest commercial desktops, including the high performance ThinkCentre M90a Pro Gen 6, and the groundbreaking ThinkCentre neo 50q QC powered by Snapdragon. Lenovo also introduces its next-generation ThinkVision P Series monitors and a comprehensive ecosystem of smart accessories, all engineered to elevate productivity and connectivity. Rounding out the announcements, Lenovo showcases cutting-edge proof-of-concept innovations that push the boundaries of technology, offering a glimpse into the future of intelligent, adaptable business solutions.

Lenovo Unveils ThinkPad X9 Series: Revolutionary Design Meets Pro-Level Performance
Lenovo introduces the ThinkPad X9 14 and X9 15 Aura Editions, its latest premium business laptops designed for innovative thinkers from prosumers to small and medium businesses to large corporations. These Copilot+ PCs powered by Intel Core Ultra processors are cutting-edge, AI-enhanced devices for creative professionals that combine powerful and efficient Intel and Windows 11 platforms, personalized AI-enabled experiences, in an all-new progressive design. ThinkPad X9 offers the ideal toolkit for today's hybrid users who demand high performance, proven reliability, and seamless productivity.

MSI is announcing two breaking power supply units - the MEG Ai1600T PCIE5 and MPG A1250GS PCIE5 - redefining high-performance power delivery with cutting-edge technology and innovative design for gamers and creators, embodying the pinnacle of performance and innovation. Both are certified by 80 Plus, Cybenetics, and PPLP and fully compliant with ATX 3.1 and PCIe (CEM) 5.1 standards, ready the power of your performance. Featuring two native 12V-2x6 connectors and dual color cables enable seamless compatibility with dual PCIe 5.1 GPUs. This ensures these PSUs can effortlessly handle the high-power demands of next-gen GPUs, manage surges in instantaneous current, and support machine learning workloads requiring dual GPU setups.

The MEG Ai1600T PCIE5 is the world's first PSU to incorporate server-grade Infineon SiC MOSFETs, which offer superior suitability for power supplies, improving efficiency by lowering operating temperature and optimizing heat dissipation. This innovation achieves a perfect balance of stability and energy savings. The digitally controlled power design also ensures precise power output, maximizing performance per watt and achieving the highest 80 Plus Titanium efficiency certification.

Dell is once again raising the bar with innovative new PC monitors that debut world's first technology. Our latest flagship trio showcases industry-leading advancements in color accuracy, eye comfort and audio experience, offering an ideal canvas for creative professionals, engineers, tech enthusiasts or anyone in search of cutting-edge monitors.

With world's first enhanced IPS Black, QD-OLED panel technology, best eye comfort features, AI-enhanced 3D Spatial Sound and more, Dell continues to lead with innovation in the PC monitors space for more than a decade.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

ViewSonic Corp., a leading global provider of visual and edtech solutions, introduces new display products at the Pepcom Digital Experience, Jan. 6th, 2025, in Las Vegas. The company will debut and showcase the latest line-up of desktop monitors that will be available in the first half of 2025. The new monitors include the ViewSonic VG2748N, a 1080p, 27-inch monitor with wireless casting, and the XG275D-4K, a 4K gaming monitor that offers switchable refresh rates and resolutions settings allowing gamers to play with a variety of gaming devices with a single monitor.

Along with the new VG2748N and XG275D-4K desktop monitors, which offer exceptional functionality and performance, the company will highlight its award-winning line of portable monitors, as well as its latest portable projector. "ViewSonic is excited about its new line of product offerings in 2025," said Jeff Muto, Business Line Director at ViewSonic. "Our new desktop monitors, along with our current slate of portable display devices, showcase how ViewSonic continues to expand its display solutions to offer more choices, features, and functionality to any type of work or play lifestyle."

Belkin, a leading consumer electronics brand for 40 years, today introduced several new products across its Mobile Power, Audio and Future Ventures portfolios, underscoring Belkin design excellence, dedication to quality, and commitment to building products more responsibly. Belkin is showcasing its newly announced products at CES Unveiled Las Vegas - the official media event of CES 2025.

Built more responsibly with up to 90% recycled materials
Two years since introducing its transition to using 72-75% post-consumer recycled (PCR) materials in its products, Belkin has transitioned over 359 products and has replaced 432 metric tons of virgin plastics with PCR materials.

Fresh details have surfaced about NVIDIA's upcoming flagship "Blackwell" graphics card, the GeForce RTX 5090, suggesting power delivery and board design changes compared to its predecessors. According to Benchlife, the new Blackwell-based GPU will feature a new 16+6+7 power stage design, departing from the RTX 4090's 20+3 phase configuration. The report confirms earlier speculation about the card's power requirements, indicating a TGP of 600 watts. This specification refers to the complete power allocation for the graphics subsystem, though the actual TDP of the GB202 chip might be lower. The RTX 5090 will ship with 32 GB of next-generation GDDR7 memory and utilize a 14-layer PCB, possibly due to the increased complexity of GDDR7 memory modules and power delivery. Usually, GPUs max out at 12 layers for high-end overclocking designs.

The upcoming GPU will fully embrace modern connectivity standards, featuring PCI Express 5.0 x16 interface compatibility and implementing a 12V-2×6 power connector design. We spotted an early PNY RTX 5090 model with 40 capacitors but an unclear power delivery setup. With additional power phases and more PCB layers, NVIDIA is pushing the power delivery and signal integrity boundaries for its next-generation flagship. While these specifications paint a picture of a powerful gaming and professional graphics solution, questions remain about the broader RTX 50 series lineup. The implementation of the 12V-2×6 connector across different models, particularly those below 200 W, remains unclear, so we have to wait for the CES-rumored launch.

NVIDIA's GeForce RTX 5090 graphics card printed circuit board has allegedly been shown in the flesh, showing the memory layout and some interesting engineering choices. The custom PCB variant (non-Founders Edition) houses more than 40 capacitors, which is perhaps not standard on the FE reference board, and 16 GDDR7 memory modules. The leaked PCB, which extends beyond standard dimensions and traditional display connector configurations, is reportedly based on NVIDIA's PG145 reference design. The memory modules are distributed systematically: five on the left, two below, five on the right, and four above the GPU die. The interface is PCIe 5.0 x16.

As NVIDIA has reportedly designated 32 GB GDDR7 memory capacity for these cards, this roughly translates into 16 x 2 GB GDDR7 memory modules. At the heart of the card lies what sources claim to be the GB202 GPU, measuring 24×31 mm within a 63×56 mm package. Power delivery uses a 16-pin 12V-6x2 power connector, as expected. The entire PCB features only a single power connector, so the 16-pin 12V-2x6, but with an updated PCIe 6.0 CEM specification, is the logical choice.

Razer, the leading global lifestyle brand for gamers, further expands its line-up and affirms its foothold in PC accessories with the announcement of the new Razer USB 4 Dock. Engineered for superior performance, this dock represents a leap into the future of connectivity, combining high-speed data transfer and dual-display functionality to meet the demands of high-stakes gaming and intensive productivity.

"With the Razer USB 4 Dock, we're unleashing the next level of high-performance docking," Travis Furst, Head of Notebooks and Accessories at Razer. "This powerhouse is engineered to deliver blazing-fast data transfer and stunning dual-monitor 4K display output, all through a single cable solution to the laptop, making it the ultimate tool for gamers and professionals alike."

Cervoz, a global leader in industrial-grade modules, proudly introduces its latest PCIe low-profile USB 3.2 expansion series—the MEC-USB-PL. Purpose-built to meet the rapidly growing demands for industrial connectivity, the MEC-USB-PL series is designed to offer unmatched flexibility and scalability, supporting up to 8 ports per card with both USB Type-A and Type-C connectors. The series delivers a robust and future-proof solution for a wide range of industrial applications, enabling seamless integration into modern, data-intensive operations.

Engineered for Industrial Performance and Reliability
The MEC-USB-PL series combines high port density with versatile configurations. Available in both 4-port and 8-port configurations, it allows industrial users to optimize connectivity setups based on specific needs. The 4-port model (MEC-USB-PL004) is ideal for applications needing focused, high-speed data transfer across devices, while the 8-port models (MEC-USB-PL008 and MEC-USB-PL008C) offer extensive connectivity. The MEC-USB-PL008C's mixed supporting of USB Type-A and Type-C enables compatibility across both legacy and modern devices.

MSI is proud to announce the launch of the PRO MP275QPDG, a docking monitor designed to revolutionize office setups and boost productivity. This all-in-one monitor simplifies workspace configurations, providing professionals with seamless connectivity and advanced features that deliver both efficiency and convenience.

One cable, Multiple solutions
The PRO MP275QPDG is a true docking monitor, featuring the Type-C port that handles power delivery, data transmission, and display functions, making it the ideal solution for users who want a clutter-free, organized workspace. With 98 W Power Delivery, it can charge devices while driving a display, offering maximum functionality with minimal cables. For users who need multiple screens, support for daisy-chaining makes it easy to expand your workspace. Simply connect a second monitor via the DisplayPort to the PRO MP275QPDG, solving the problem of the PC's lack of IO ports or cables that are too short.

LG Electronics (LG) is launching its business monitor lineup, introducing 20 brand-new models designed to enhance productivity and ergonomic comfort in the workplace. Well known for its premium consumer monitors, LG is now expanding into the B2B sector with monitors tailored to the needs of diverse professional environments, from corporate and government to education, healthcare and the creative industries. The impressive lineup presents customers with a wealth of choices, including a variety of different aspect ratios and screen resolutions ranging from QHD to Full HD.

LG UltraWide Displays: Spacious, High-resolution Screens
Available in the 21:9 aspect ratio, LG's UltraWide business monitors are outstanding multitasking solutions with high-resolution screens. The 34BA85QE-B and 34BA75QE-B feature 34-inch curved QHD+ (3,440 x 1,440) resolution IPS displays that deliver sharp, detailed visuals and accurate color reproduction. They also provide excellent color consistency across a wide viewing angle, ensuring distortion-free images from practically any vantage point.

ASUS Republic of Gamers (ROG) today announced the Thor III series of power supplies, which includes the ROG Thor 1600 W Titanium III, ROG Thor 1200 W Platinum III and ROG Thor 1000 W Platinum III. Featuring gallium nitride (GaN) MOSFETs, GPU-FIRST voltage sensing, high-performance copper pins, upgraded PCIe connectors, a detachable magnetic OLED display, etched modular cables, ATX 3.1 compatibility and much more, an ROG Thor power supply is an excellent backbone to your next gaming rig. ASUS is so sure of that fact that it includes a 10-year warranty with these PSUs, so users know they are set for incredible, long-lasting performance.

ROG Thor III Series: next-gen premium PSU components
The GaN MOSFETs inside the ROG Thor III series can deliver up to 30% more power efficiency than standard MOSFETs. Since these MOSFETs offer the same performance in a smaller size, Thor III PSUs benefit from an optimized internal layout that keeps units cool, no matter the load.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Back in August, Intel started shipping its 0x129 microcode update for 13/14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This update fixed incorrect voltage requests to the processor that are causing elevated operating voltage. Intel's analysis showed that the root cause of stability problems is voltage levels that are too high during the operation of the processors. These increases in voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin." Today, the company discovered the root cause of this instability issue and informed users that a new microcode patch is underway. As explained by Intel, the Vmin Shift instability problem stems from a clock tree circuit in the IA core. When exposed to high voltage and temperature conditions, this circuit is vulnerable to reliability degradation. Intel's research has shown that these factors can cause a shift in the duty cycle of the clocks, resulting in system instability.

There are four scenarios that can cause Vmin Shift: increased motherboard power delivery, eTVB microcode algorithm running at higher performance operating states even at higher temperatures, microcode SVID algorithm requesting higher voltages at higher frequencies and longer durations, and finally microcode and BIOS requesting elevated core voltages. For motherboard power settings, mitigation is switching back to default settings. For the eTVB issue, the fix is a 0x125 microcode update. The 0x129 patch fixes the SVID algorithm, and the fourth condition, where microcode and BIOS request elevated core voltage, is fixed by the upcoming 0x12B microcode update. Intel is reportedly working with OEMs to start rolling out the 0x12B update with no apparent performance degradation. While the timeframe for shipping this update is unknown, we expect to see it soon. Additionally, Intel once again confirmed that the upcoming "Arrow Lake" CPUs don't have these issues.

ViewSonic Corp., a leading global provider of visual solutions, launches the ColorPro VP2776T-4K, the company's first Thunderbolt 4 monitor. This monitor enables creative professionals to accelerate workflows with rapid data transfer and offers complete connectivity through its docking station. In addition to Thunderbolt 4, the VP2776T-4K delivers exceptional color precision with 98% DCI-P3, 100% sRGB color coverage, and Delta E < 2 accuracy, while offering stunning clarity with 4K UHD resolution and HDR 400.

Oscar Lin, General Manager of the Monitor Business Unit at ViewSonic, stated, "ColorPro monitors are renowned for delivering industry-leading color accuracy and visual performance, making it the preferred choice for creative professionals. Building on the success of the VP2776, we've taken the VP2776T-4K to the next level by incorporating Thunderbolt 4 technology, providing the speed and versatility that today's videographers, animators, and 3D designers need to elevate their craft
effectively without interruption."

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

UGREEN, a leading innovator in consumer electronics, is set to showcase its latest Ugreen Uno Series at IFA 2024 in Berlin, Germany, from September 6-10, highlighting a lineup of innovative fast-charging products designed to deliver a fun and fast charging experience for iPhone users under the theme "Activate You".

The UGREEN Uno series offers fast and fun accessories designed specifically for iPhone users, including wired PD chargers that provide high-wattage fast charging, as well as the latest Qi2 magnetic wireless charging devices compatible with Apple's MagSafe, along with hubs and cables. The Ugreen Uno Series flagship products include the UGREEN Uno Charger 100 W, UGREEN Uno Magnetic Wireless Power Bank 10000mAh 15 W, and UGREEN Uno 2-in-1 Magnetic Wireless Charger 15 W. These innovative chargers and power banks are designed with "Fast and Fun Charging" in mind. The Groovy, unique robot appearance can be cool and cute. During the charging process, the TFT Screen could support the display of more cute emojis, offering a more interesting experience to the users.

Intel has announced the cancellation of its 20A node for Foundry customers, as well as shifting majority of Arrow Lake production to external foundries. The tech giant will instead focus its resources on the more advanced 18A node while relying on external partners for Arrow Lake production, likely tapping TSMC or Samsung for their 2 nm nodes. The decision follows Intel's successful release of the 18A Process Design Kit (PDK) 1.0 in July, which garnered positive feedback from the ecosystem, according to the company. Intel reports that the 18A node is already operational, booting operating systems and yielding well, keeping the company on track for a 2025 launch. This early success has enabled Intel to reallocate engineering resources from 20A to 18A sooner than anticipated. As a result, the "Arrow Lake processor family will be built primarily using external partners and packaged by Intel Foundry".

The 20A node, while now cancelled for Arrow Lake, has played a crucial role in Intel's journey towards 18A. It served as a testbed for new techniques, materials, and transistor architectures essential for advancing Moore's Law. The 20A node successfully integrated both RibbonFET gate-all-around transistor architecture and PowerVia backside power delivery for the first time, providing valuable insights that directly informed the development of 18A. Intel's decision to focus on 18A is also driven by economic factors. With the current 18A defect density already at D0 <0.40, the company sees an opportunity to optimize its engineering investments by transitioning now. However, challenges remain, as evidenced by recent reports of Broadcom's disappointment in the 18A node. Despite these hurdles, Intel remains optimistic about the future of its foundry services and the potential of its advanced manufacturing processes. The coming months will be crucial as the company works to demonstrate the capabilities of its 18A node and secure more partners for its foundry business.

Intel's 13th and 14th generation processors, codenamed "Raptor Lake" and "Raptor Lake Refresh," have been notoriously riddled with stability issues over the past few months, up until Intel shipped the 0x129 microcode update on August 10 to fix these issues. However, the upcoming Intel Core Ultra 200 "Arrow Lake" and 200V series "Lunar Lake" processors will not have these issues as the company confirmed that an all-new design is used, even for the segment of power regulation. The official company note states: "Intel confirms that its next generation of processors, codenamed Arrow Lake and Lunar Lake, are not affected by the Vmin Shift Instability issue due to the new architectures powering both product families. Intel will ensure future product families are protected against the Vmin Shift Instability issue as well."

Originally, Intel's analysis for 13th—and 14th-generation processors indicated that stability issues stemmed from excessive voltage during processor operation. These voltage increases led to degradation, raising the minimum voltage necessary for stable performance, which Intel refers to as "Vmin shift." Given that the design phase of new architectures lasts for years, Intel has surely anticipated that the old power delivery could yield problems, and the upcoming CPU generations are now exempt from these issues, bringing stability once again to Intel's platforms. When these new products launch, all eyes will be on the platform's performance, but with a massive interest in stability testing from enthusiasts.

Intel has officially started shipping the "0x129" microcode update for its 13th and 14th generation "Raptor Lake" and "Raptor Lake Refresh" processors. This critical update is currently being pushed to all OEM/ODM partners to address the stability issues that Intel's processors have been facing. According to Intel, this microcode update fixes "incorrect voltage requests to the processor that are causing elevated operating voltage." Intel's analysis shows that the root cause of stability problems is caused by too high voltage during operation of the processor. These increases to voltage cause degradation that increases the minimum voltage required for stable operation. Intel calls this "Vmin"—it's a theoretical construct, not an actual voltage, think "speed for an airplane required to fly". The latest 0x129 microcode patch will limit the processor's voltage to no higher than 1.55 V, which should avoid further degradation. Overclocking is still supported, enthusiasts will have to disable the eTVB setting in their BIOS to push the processor beyond the 1.55 V threshold. The company's internal testing shows that the new default settings with limited voltages with standard run-to-run variations show minimal performance impact, with only a single game (Hitman 3: Dartmoor) showing degradation. For a full statement from Intel, see the quote below.

Intel today announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems. These milestones were achieved less than two quarters after tape-out, with both products on track to start production in 2025. The company also announced that the first external customer is expected to tape out on Intel 18A in the first half of next year.

"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers. We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025." -Kevin O'Buckley, Intel senior vice president and general manager of Foundry Services