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Circuit Board (PCB) Analysis

GPU voltage is a 11-phase design, managed by a Monolithic Power Systems MP2857 controller.


Monolithic MP87997 DrMOS components are used for GPU voltage; they are rated for 70 A of current each.


Memory voltage is a two-phase design, managed by a Monolithic Power Systems MP2856 controller.


For memory, Monolithic MP87997 DrMOS with a 70 A rating are used again.


A third voltage controller is responsible for managing VDDCR_SOC and VDDC_USR (which is responsible for the die-to-die communication).


The GDDR6 memory chips are made by Hynix and carry the model number H56G42AS8DX-014. They are specified to run at 2500 MHz (20 Gbps effective) but are running at 2565 MHz.


AMD's Navi 32 graphics processor uses a chiplet architecture. Note the large die in the center, called "GCD," graphics compute die, which houses the compute units, it is surrounded by four smaller "MCD," memory cache dies, that contain one memory controller interface and one slice of cache each. While they look similar, the MCDs are not HBM chips. The MCDs are fabricated on a 6 nm process at TSMC Taiwan with a die size of 37.5 mm² each, the GCD is fabricated using TSMC's 5 nanometer node, with a die size of 200 mm². The combined transistor count of the GPU is 28.1 billion (26.1 billion for the 7700 XT, which has one fewer MCD).