Power Consumption and Temperatures

The BIOSTAR X670E VALKYRIE has two heatsinks for the VRM that are connected via a heatpipe. The backplate of the motherboard also has thermal pads right behind the VRM, to provide extra thermal dissipation. Unfortunately, while the backplate is metal, the thermal pads are placed on a plastic backer, negating all benefits this could provide.





For the BIOSTAR X670E VALKYRIE thermal testing, one probe is placed along each bank of power stages. A probe is left out to log the ambient temperature. For temperature measurement, a Reed SD-947 4 channel Data Logging Thermometer is used, paired with four Omega Engineering SA1 self adhesive thermal couple probes. All temperatures are presented as Delta-T, which is the recorded temperature minus the ambient temperature as a base. The end result accounts for variation in ambient temperature, including changes over the course of a test.

Tests are conducted over a 30 minute period. For testing, the AMD Ryzen 9 7950X is used in a stock configuration. For the first 5-8 minutes, a fan is placed on the VRM heatsinks to simulate case airflow. If the heatsink has a internal fan, it is not disabled for these tests.


These VRM tests are split into multiple charts to give a wider understanding of the cooling prowess of the BIOSTAR X670E VALKYRIE, without changing any BIOS settings from a stock configuration. After the fan is removed around the 5 minute mark, VRM temps steadily increased until the end of the 30 minute test. By visually plotting the graph further, VRM temps seemly will settle in the low 80s °C for a extended period of time, only going up as the room temperature increases. Though not ideal, it is still in an acceptable operational range.


The second test was to see how the VRM heatsink may fare in games. Temperatures quickly shot up after removing the fan, but started to slow down around the 15 minute mark. Overall, not the coolest VRM setup tested so far, but it isn't worrisome at all either.