A Look Inside & Component Analysis
Before reading this page, we strongly suggest a look at
this article, which will help you understand the internal components of a PSU much better. Our main tool for the disassembly of the PSU is a Thermaltronics
TMT-9000S soldering and rework station. It is of extreme quality and is equipped with a matching
de-soldering gun. With such equipment in hand, breaking apart every PSU is like a walk in the park!
Like its smaller brother, the G2-1000, this PSU is also made by Super Flower. It is based on a Gold version of the normally Platinum Leadex platform. EVGA did well in picking the lower efficiency certification because it allows for a really good price. The resonant converters utilized in the primary side points to a modern design. Active component in the secondary side rectify the +12V rail feeding two DC-DC converters.
The transient filtering stage starts at the AC receptacle with a single X cap. Its other components are on the main PCB: two CM chokes, two X xaps, two pairs of Y caps, and an MOV. We also found a Transient Voltage Suppression (TVS) diode, which completes the unit's protections against spikes.
Two parallel bridge rectifiers feed the APFC circuit.
Three Infineon
IPP50R140CP fets and two
C3D08060A boost diodes are used in the APFC. The two parallel hold-up caps are located right in front of the transient filter and are provided by Nippon Chemi-Con (400 V, 680 μF and 560 μF, 105°C, KMR series). Their combined capacity looks to be sufficient, but the hold-up tests will confirm whether it is so. We found an NTC thermistor protecting against large inrush currents in the same area of the PCB. A close-by electromagnetic relay isolates it from the circuit once it finishes its job.
This small, sealed PCB houses the APFC controller, an
NCP1653A IC.
The hidden standby PWM controller is an
ICE3B0565 IC.
This proprietary IC with markings AA9013 is probably the LLC resonant controller.
Four Infineon
IPP50R199CP fets are used as main switches. Right next to them is the main transformer with EVGA's logo.
The secondary side features three small heatsinks. Two of them host eight fets in total (4x
IPP041N04N and 4x
IPP023N04N). Among these heatsinks are six polymer and several electrolytic caps by Chemi-Con. They are used for ripple-filtering purposes.
The two DC-DC converters that generate the minor rails. The polymer caps on them are provided by Chemi-Con.
We again secured the fan control board with lots of glue, since detaching the fan controller can snap it off its base easily. Like in the G2-1000 unit, the 5VSB rail is rectified by a
Mospec S10C60C SBR (Schottky Barrier Rectifier). The fan control board is installed right next to it, and on it is an LM324ADC.
At the front of the modular PCB are many Capxon polymer caps and several small electrolytic ones. Caps in this area are not stressed heavily, which makes their quality less of a factor, but EVGA does speak of 100% Japanese caps used and Capxons surely don't fall into that category, which is why they should correct said statement on their package.
Soldering quality is good enough but will still have to improve to reach Delta, Flextronics, and Seasonic quality.
The cooling fan is equipped with double ball-bearings and is made by Hong Hua. Its model number is HA1425H12B-Z, and it is rated for 0.5 A at 12 V. This fan is a stronger version of the HA1425M12B-Z (0.36 A) fan used in the G2-1000 unit, so it achieves higher rotational speeds and pushes more air, which produces more noise. The fan controller circuit does keep its speed as low as possible, but the G2-1300 is still significantly noisier than its smaller brother. So, irregardless of the minimal price difference, get the 1 kW model if you want the quietest unit of the two.