Packaging
The Card
As mentioned earlier, the highlight with the RTX 3070 Ti GameRock OC is its crushed ice design that dominates the top of the cooler shroud. It lights up in any color and looks really groovy, particularly when mounted vertically in your case. The PCB is barely 60% of the length of the card, so a significant amount of airflow goes right through cutouts on the backplate.
Dimensions of the card are 30 x 13.5 cm, and it weighs 1410 g.
Installation requires three slots in your system.
Display connectivity options include three standard DisplayPort 1.4a and one HDMI 2.1. The DisplayPort 1.4a outputs support Display Stream Compression (DSC) 1.2a, which lets you connect 4K displays at 120 Hz and 8K displays at 60 Hz. Ampere can drive two 8K displays at 60 Hz with just one cable per display.
Ampere is the first GPU to support HDMI 2.1, which increases bandwidth to 48 Gbps to support higher resolutions, like 4K144 and 8K30, with a single cable. With DSC, this goes up to 4K240 and 8K120. NVIDIA's new NVENC/NVDEC video engine is optimized to handle video tasks with minimal CPU load. The highlight here is added support for AV1 decode. Just like on Turing, you may also decode MPEG-2, VC1, VP8, VP9, H.264, and H.265 natively, at up to 8K@12-bit.
The encoder is identical to Turing. It supports H.264, H.265, and lossless at up to 8K@10-bit.
This BIOS switch lets you toggle between the default "Performance" BIOS and a secondary "Silent" BIOS.
Using this RGB header, you can connect external RGB circuitry to the graphics card.
Power is drawn from two 8-pin PCIe power connectors. Along with slot power, this configuration supplies up to 375 W.
The GeForce RTX 3070 Ti does not support SLI.
Teardown
The RTX 3070 Ti GameRock OC is very easy to disassemble. Simply undo a bunch of screws from the backplate, and the cooler assembly comes out in one clean piece. The thermal pads for memory are 1.0 mm thick, as are those on the VRM.
The cooler uses a nickel-plated copper base to pull heat form the GPU, while an aluminium base plate pulls heat form the memory and VRM. Six 6-mm-thick heat pipes running through the aluminium fin-stack make indirect contact with the base.
The backplate is made out of metal and lacks any thermal pads, letting it participate in the cooling.