A Closer Look

The XPG Lancer modules are black with a brushed aluminium finish. The heatspreader covers the entire PCB for full coverage.


The XPG logo has also been placed in the corner of each DIMM, in direct contrast to the black-brushed aluminium.


On one side of each DIMM module is the identification sticker listing the SKU, rated XMP operating frequency, corresponding voltage of 1.35, and XMP timings.


Laying the DIMMs on the side, you can see "XPG" in bold black lettering in the center on the RGB lighting diffuser.


The XPG Lancer RGB DDR5-6000 weighs in at 71 grams on my scale. For Z-height, it is 43 mm rounding up with my calipers. At first, these seemed unnecessarily tall; however, closer inspection reveals a double purpose. The larger light diffuser mitigates the issue of being able to distinguish individual LEDs. XPG's approach to this common problem is now solved. A larger heatspreader also brings with it the advantage of dissipating more excess heat.


After taking the heatspreader off, we see that these are single-sided DIMMs with eight 2 GB ICs. This is as expected for a DDR5 32 GB kit since densities increased with DDR5. The thermal pad covers all the memory ICs. This particular kit does not have any coverage for the PMIC and surrounding components.


Getting a close look at the ICs, XPG is using SK Hynix (H5CG48MEBDX014J). Currently, Micron, Samsung, and SK Hynix are the three suppliers of DDR5 ICs. As the months have passed by, SK Hynix M-Die has emerged as the current leader for low-latency DDR5 kits.


With DDR5, one of the major changes is how the motherboard directly provides 5 V to the memory module's PMIC, which is then stepped down and split accordingly. No longer is the motherboard responsible for regulating the voltages seen with DDR4. The PMIC has the part number "APW8502C." A quick search has APENC come up as the manufacturer.