btarunrAPI support includes DirectX 12 (feature-level 12_1), OpenGL 4.5, and Vulkan. Display outputs include three DisplayPort 1.4 connectors, one HDMI 2.0b, and one dual-link DVI. The reference-design card is 10.5-inch long, and double-slot. It draws power from a single 8-pin PCIe power connector, and its typical board power is rated at 180W. With the GeForce "Pascal" family, instead of caving in to DirectX 12 native multi-GPU, NVIDIA developed its SLI technology further, with the new SLI HB (high-bandwidth) bridge standard. It's essentially a 2-way bridge in which both SLI fingers of the card are used. This doubles bandwidth between the two cards, allowing higher display resolutions, and multi-display setups between high-resolution monitors. The GeForce GTX 1080 will be available from May 27, 2016, starting at US $599. The $379 GTX 1070 specifications will be revealed closer to its June 10, 2016 market availability.

Nvidia 1080 Specs page1 - 7680x4320 at 60 Hz RGB 8-bit with dual DisplayPort connectors or 7680x4320 at 60 Hz YUV420 8-bit with on DisplayPort 1.3 connector.
2 - DisplayPort 1.2 Certified, DisplayPort 1.3/1.4 Ready.
3 - Recommendation is made based on PC configured with an Intel Core i7 3.2 GHz processor. Pre-built system may require less power depending on system configuration.

XzibitOn the bright side its has HDMI 2.0b. It should be able to take advantage of HDMI version of DisplayPorts adaptive-sync (dynamic-sync) if Nvidia chooses to do so.

XzibitIf you read the fine print. Its not DP 1.4 connectors they are DP 1.2 with DP 1.3 & 1.4 ready. They don't support some features I'm guessing

AnandtechOfficially the cards are being called “DisplayPort 1.2 Certified, DisplayPort 1.3/1.4 Ready,” the distinction being that the latter is not currently certified, though I suspect the DP 1.3/1.4 certification process may itself not be ready yet.

MxPhenom 216Fuck me I need a job. I want that 1080.

walker15130Officially the cards are being called “DisplayPort 1.2 Certified, DisplayPort 1.3/1.4 Ready,” the distinction being that the latter is not currently certified, though I suspect the DP 1.3/1.4 certification process may itself not be ready yet.

XzibitThat's believable for DP 1.4 that was released this March but for DP 1.3 that was released in 2014.

TheGuruStudHolding on to gsync are they?

arbiterNot-so-Freesync is Optional part of the spec not required.

arbiterNot-so-Freesync is Optional part of the spec not required.

TheGuruStudExcept that nvidia uses adaptive sync on mobile, so they're full of shit.

XzibitIf your going to be certified for DP 1.4 you have to be backwards compatible.

XzibitThat's believable for DP 1.4 that was released this March but for DP 1.3 that was released in 2014.

arbiterFirst off you don't know its that and not g-sync still, module and all circuits could be with the gpu.

medi01Even 970 at its $379 is in "way too expensive" category for me.
I can afford it, but can't justify buying it. (mid range card, FFS)

arbiterIts pretty close to launch price of a 970

TheLostSwedeprices aren't utterly crazy

medi01Cause some yadayada "memory costs" you just made up. I see.

medi01Even 970 at its $379 is in "way too expensive" category for me.

But perhaps the biggest issue is cost. The average IC design cost for a 28nm device is about $30 million, according to Gartner. In comparison, the IC design cost for a mid-range 14nm SoC is about $80 million. “Add an extra 60% (to that cost) if embedded software development and mask costs are included,” Gartner’s Wang said. “A high-end SoC can be double this amount, and a low-end SoC with re-used IP can be half of the amount. If that’s not enough, there is also a sizable jump in manufacturing costs. In a typical 11-metal level process, there are 52 mask steps at 28nm. With an 80% fab utilization rate at 28nm, the loaded manufacturing cost is about $3,500 per 300mm wafer, according to Gartner.
At 1.3 days per lithography layer, the cycle time for a 28nm chip is about 68 days. “Add one week minimum for package testing,” Wang said. “So, the total is two-and-half months from wafer start to chip delivery.”
At 16nm/14nm, there are 66 mask steps. With an 80% fab utilization rate at 16nm/14nm, the loaded cost is about $4,800 per 300mm wafer, according to Gartner. “It takes three months from wafer start to chip delivery,” he added.
On top of that, it takes 100 engineer-years to bring out a 28nm chip design. “Therefore, a team of 50 engineers will need two years to complete the chip design to tape-out. Then, add 9 to 12 months more for prototype manufacturing, testing and qualification before production starts. That is if the first silicon works,” he said. “For a 14nm mid-range SoC, it takes 200 man-years. A team of 50 engineers will need four years of chip design time, plus add nine to 12 months for production.”