Friday, April 22nd 2022

Thermalright Launches Bending Corrector Frame for Alder Lake Processors

Taiwanese company Thermalright has recently launched the LGA1700-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 12th Generation Intel Alder Lake processors. Intel has previously disclosed that their Alder Lake processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for Alder Lake processors. The Thermalright LGA1700-BCF is now available to purchase for 39 RMB (6 USD) in red and silver color options with support for H610, B660, and Z690 motherboards.
Source: Taobao (via VideoCardz)
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60 Comments on Thermalright Launches Bending Corrector Frame for Alder Lake Processors

#1
Fourstaff
Looks like a very nicely machined piece of aluminium.
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#2
Arcdar
black and silver? Don't you mean red and silver? :D

but the price is actually O.K. - I'm surprised :)
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#3
Max(IT)
The idea is interesting but… why we do have such an issue ? Intel retain mechanism is not really new. My 12700K doesn’t seem to be affected , with temperatures very low using an Arctic liquid freezer II 360, but I didn’t check it for any bent (and I’m not going to do that before the next upgrade).
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#4
Solid State Brain
This modification looks nice at first, but with it CPU pressure on the socket pins will largely depend on how the screws are tightened, whereas the stock LGA1700 ILM will behave more or less consistently even after installing washers or other shims.
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#5
zlobby
LOL! Spending so much on an 'elite' CPU, only to find out it needs ghetto mods to stay in place... Bravo, intel, bravo!
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#6
Dammeron
Kinda reminds me of Athlon XP shims that protected the bare CPU core...
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#7
freeagent
Max(IT)The idea is interesting but… why we do have such an issue ? Intel retain mechanism is not really new. My 12700K doesn’t seem to be affected , with temperatures very low using an Arctic liquid freezer II 360, but I didn’t check it for any bent (and I’m not going to do that before the next upgrade).
Low mounting pressure with the arctic maybe?
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#8
jesdals
Hmm to hot to handle? Or is it to early?
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#9
Max(IT)
freeagentLow mounting pressure with the arctic maybe?
I don't know, but the results are quite good.



even overclocked it stays below 70° (Tamb is around 20°C)



I'm experienced and I did an accurate mounting job, for sure, but it is working very well.
The only precautions I took was to NOT put the CPU in the socket before installing the backplate, in order to have more rigidity on the board.
I don't know if it helped.
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#10
Just Some Noise
Solid State BrainThis modification looks nice at first, but with it CPU pressure on the socket pins will largely depend on how the screws are tightened.....
Not if they use screws with stoppers on them.

And for 6 USD, i actually think this is a nice looking piece of CNC Aluminium.

I'm positively surprised.
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#11
Sithaer
Luckily I don't seem to have this issue with my 12100F and a ID-Cooling SE-224-XT V3 cooler, even with the stock cooler temps were within the normal range of that cooler.
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#12
Baum
? what ?


why and when does my new cpu bend? can anyone please inform me why it would bend when it is in the original socket?
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#13
DeathtoGnomes
I thought the warping was caused by the air cooler weight. If its warping with out of box MB and CPU, maybe there is an issue with the mounting bracket itself and/or the MB.
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#14
Solid State Brain
Just Some NoiseNot if they use screws with stoppers on them.
It seems it will come with a 1g syringe of Thermalright TF7 thermal paste and a Torx wrench, but there has been no mention of special screws.
Given the low price I assumed it would only include the frame, so the screws would be reused from the stock ILM.
Baumwhy and when does my new cpu bend? can anyone please inform me why it would bend when it is in the original socket?
Due to the increased number of pins and longer package length compared to 11th gen Intel processors, the retention mechanism (or ILM / Independent Loading Mechanism) is now applying a stronger force on the heat spreader (IHS) to make the CPU have good electrical contact with the pins in the socket.

Since it is an overall cheap design, this causes uneven pressure which slightly bends the IHS, causing less-than-optimal contact with the cooler, which is not a big issue under power limited scenarios (e.g. the Intel-specified 125W "base power") where temperatures aren't an issue in the first place, but it can be with overclocking or without power limits.

This can be easily observed by looking at how thermal paste spreads, here is an example:



Thermal paste collects in the middle = CPU height is lower there, i.e. it is bending.
Posted on Reply
#15
maxitaxi96
DeathtoGnomesI thought the warping was caused by the air cooler weight. If its warping with out of box MB and CPU, maybe there is an issue with the mounting bracket itself and/or the MB.
Baum? what ?


why and when does my new cpu bend? can anyone please inform me why it would bend when it is in the original socket?
Both Igor from Igorslab and Buildzoid have talked about this problem. The ILM only pushes down on die CPU with 2 little Tabs. Put in Newtons third law and you know that the rest of the CPU gets pushed upward by the socket pins. So you basically get a bend along the axis of the tabs of the ILM.
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#16
44722E4D616E68617474616E
zlobbyLOL! Spending so much on an 'elite' CPU, only to find out it needs ghetto mods to stay in place... Bravo, intel, bravo!
Exactly This! :clap::peace::laugh:
Posted on Reply
#17
DeathtoGnomes
zlobbyLOL! Spending so much on an 'elite' CPU, only to find out it needs ghetto mods to stay in place... Bravo, intel, bravo!
wait til ya see what the graphics card needs to stay in place. o_O
Posted on Reply
#18
Chrispy_
12th gen Bendgate is worrying. Will these sockets fail after a few years? I've already put together a dozen 12th gen machines using modest 120mm tower coolers and I don't like the idea that there's a design flaw that could easily cause failure after the warranty ends but long before the expected lifespan of the system is up.
DammeronKinda reminds me of Athlon XP shims that protected the bare CPU core...
It was definitely better to spend $5 on a shim than it is to spend $30 on a de-lidding tool and invalidate your warranty!
Posted on Reply
#19
zlobby
DeathtoGnomeswait til ya see what the graphics card needs to stay in place. o_O
Reeks of sarcasm but I'll play along anyway.

Simple physics (or more like applied mechanics) tells us that something small and light like a CPU should have no issues when lying on such a large contact surface.
The fact that is does in intel's case speaks volumes.

Massive and heavy GPU are bound to bend under their own weight (not the scientific term but let's skip the fancy talk for argument's sake). Even a 6th grader can 'sense' that such a heavy GPU would have issues without proper structural design or support.
Posted on Reply
#20
Unregistered
Solid State BrainIt seems it will come with a 1g syringe of Thermalright TF7 thermal paste and a Torx wrench, but there has been no mention of special screws.
Given the low price I assumed it would only include the frame, so the screws would be reused from the stock ILM.



Due to the increased number of pins and longer package length compared to 11th gen Intel processors, the retention mechanism (or ILM / Independent Loading Mechanism) is now applying a stronger force on the heat spreader (IHS) to make the CPU have good electrical contact with the pins in the socket.

Since it is an overall cheap design, this causes uneven pressure which slightly bends the IHS, causing less-than-optimal contact with the cooler, which is not a big issue under power limited scenarios (e.g. the Intel-specified 125W "base power") where temperatures aren't an issue in the first place, but it can be with overclocking or without power limits.

This can be easily observed by looking at how thermal paste spreads, here is an example:



Thermal paste collects in the middle = CPU height is lower there, i.e. it is bending.
Here is mine-



I'm using the thick EK backplate, but might have a look at one of these to use in combination.
Posted on Edit | Reply
#21
Solid State Brain
By the way, I also have a photo after installing 1.1 mm washers. The thermal paste footprint improved but the issue wasn't completely solved. I haven't been able to fit thicker washers, unfortunately:



However, currently I'm not using this washer mod. Every time I tried using them (I did many tests), for some reason motherboard VRM coil whine always increased to annoying levels. Without washers I get 4-5 °C higher temperatures under load without power limits (~200-210W package power), but minimal coil whine.

From this, my conclusion is that there probably are good technical reasons for the pressure used, and the Thermaltake frame might actually make things worse in some aspects like the washers did for me (I've even read about people reporting losing PCIe slot functionality or memory channels with them, although reversibly so—didn't happen to me).
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#22
rethcirE
So what's the result if you're experiencing "warping/bending? 4-5C hotter on average? 10C hotter?
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#23
zlobby
Chrispy_12th gen Bendgate is worrying. Will these sockets fail after a few years? I've already put together a dozen 12th gen machines using modest 120mm tower coolers and I don't like the idea that there's a design flaw that could easily cause failure after the warranty ends but long before the expected lifespan of the system is up.


It was definitely better to spend $5 on a shim than it is to spend $30 on a de-lidding tool and invalidate your warranty!
The $30 tool is not even the issue here. The real deal(breaker) is the huge risk involved with de-lidding, even if proper tools are used. Messing around with $500 CPU because someone put toothpaste inside and they didn't think of rigidity? Hard pass!
Posted on Reply
#24
Chrispy_
zlobbyThe $30 tool is not even the issue here. The real deal(breaker) is the huge risk involved with de-lidding, even if proper tools are used. Messing around with $500 CPU because someone put toothpaste inside and they didn't think of rigidity? Hard pass!
You've gotta melt the solder to do that these days, too. Your warranty is super-FUBAR the instant you put your CPU under the heat gun.
Posted on Reply
#25
Solid State Brain
rethcirESo what's the result if you're experiencing "warping/bending? 4-5C hotter on average? 10C hotter?
Several (me included) have seen difference around that ballpark (4-5 °C and Igor's Lab results were in line with this), others have seen improvements up to 15 °C. However, results are proportional not just to the degree of IHS deformation (which may vary), but also to the thermal load / CPU package power.

The Thermaltake frame could potentially yield better results than the washers since it looks like it could be truly making pressure on the CPU more or less homogeneous, while the washers with the stock ILM only decrease it.
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