A recent Reuters investigation has uncovered evidence suggesting Chinese universities and research institutes may have circumvented US sanctions on high-performance NVIDIA GPUs by purchasing servers containing the restricted chips. The sanctions tightened on November 17, 2023, prohibit the export of advanced NVIDIA GPUs like the consumer GeForce RTX 4090 to China. Despite these restrictions, Reuters found that at least ten China-based organizations acquired servers equipped with the sanctioned NVIDIA GPUs between November 20, 2023, and February 28, 2024. These servers were purchased from major vendors such as Dell, Gigabyte, and Supermicro, raising concerns about potential sanctions evasion. When contacted by Reuters, the companies provided varying responses.

Dell stated that it had not observed any instances of servers with restricted chips being shipped to China and expressed willingness to terminate relationships with resellers found to be violating export control regulations. Gigabyte, on the other hand, stated that it adheres to Taiwanese laws and international regulations. Notably, the sale and purchase of the sanctioned GPUs are not illegal in China. This raises the possibility that the restricted NVIDIA chips may have already been present in the country before the sanctions took effect on November 17, 2023. The findings highlight the challenges in enforcing export controls on advanced technologies, particularly in the realm of high-performance computing hardware. As tensions between the US and China continue to rise, the potential for further tightening of export restrictions on cutting-edge technologies remains a possibility.

As a part of its Q1 earnings call discussion, one of the largest semiconductor manufacturers, TSMC, has unveiled a strategic move to charge a premium for chips manufactured at its newly established overseas fabrication plants. During an earnings call, TSMC's CEO, C.C. Wei, announced that the company will impose higher pricing for chips produced outside Taiwan to offset the higher operational costs associated with these international locations. This move aims to maintain TSMC's target gross margin of 53% amidst rising expenses such as inflation and elevated electricity costs. This decision comes as TSMC expands its global footprint with new facilities in the United States, Germany, and Japan (JAMS) to meet the increasing demand for semiconductor chips worldwide. The company's new US-based Arizona facility, known as Fab 21, has faced delays due to equipment installation issues and labor negotiations.

Chips produced at this site, utilizing TSMC's advanced N5 and N4 nodes, could cost between 20% to 30% more than those manufactured in Taiwan. TSMC's strategy to manage the cost disparities across different geographic locations involves strategic pricing, securing government support, and leveraging its manufacturing technology leadership. This approach reflects the company's commitment to maintaining its competitive edge while navigating the complexities of global semiconductor manufacturing in today's fragmented market. Introducing a location premium is expected to impact American semiconductor designers, who may need to pass these costs on to specific market segments, particularly those with lower price sensitivity, such as government-related projects. Despite these challenges, TSMC's overseas expansion underscores its adaptive strategies in the face of global economic pressures and industry demands, ensuring its continued position as a leading player in the semiconductor industry.

Following in the wake of an earthquake that struck on April 3rd, TrendForce undertook an in-depth analysis of its effects on the DRAM industry, uncovering a sector that has shown remarkable resilience and faced minimal interruptions. Despite some damage and the necessity for inspections or disposal of wafers among suppliers, the facilities' strong earthquake preparedness of the facilities has kept the overall impact to a minimum.

Leading DRAM producers, including Micron, Nanya, PSMC, and Winbond had all returned to full operational status by April 8th. In particular, Micron's progression to cutting-edge processes—specifically the 1alpha and 1beta nm technologies—is anticipated to significantly alter the landscape of DRAM bit production. In contrast, other Taiwanese DRAM manufacturers are still working with 38 and 25 nm processes, contributing less to total output. TrendForce estimates that the earthquake's effect on DRAM production for the second quarter will be limited to a manageable 1%.

Micron Technology, Inc. (Nasdaq: MU) today reported that following the earthquake that struck Taiwan on April 3, 2024, all of Micron's team members have been accounted for and reported to be safe. Our thoughts are with those affected and their families. We are evaluating impact to our operations and supply chain. We will communicate changes to delivery commitments to our customers after this evaluation is completed.

At 07:58 local time, Taiwan was rocked by a magnitude 7.4 earthquake on the east coast which was felt nationwide and as far as to the southeastern parts of China and southern Japan. It caused some major damage in the east coast city of Hualien where the epicentre of the quake was located, as well as surrounding areas. The earthquake reportedly left nine people dead and over 900 people injured islandwide. TSMC, UMC, PSMC and Innolux all halted some of their production lines in the Hsinchu Science Park on the west coast of the island, although this is said to have been as a preventive step, rather than caused by actual damage from the earthquake.

All the above-mentioned companies also evacuated their staff from their factories due to the intensity of the quake, as it reached a magnitude of around four or five almost island wide. The semiconductor manufacturers are all inspecting their fabs now to make sure none of the equipment was damaged by the earthquake. Innolux also has a factory in the southern city of Kaohsiung and has reported that it has suspended production in Hsinchu, but that production in Kaohsiung wasn't affected. Local media in Taiwan hasn't made any mention of the likes of Micron or other chip manufacturers, but it's likely that the situation is similar, since all of these companies are located in the same areas on the island. Aftershocks have continued throughout the day and there's a risk for further big earthquakes to follow in the coming days.Images courtesy of the Taiwan Central Weather Administration (CWA).

Update 15:11 UTC: Updated with an official statement from Micron below.

The Taiwanese Ministry of Economic Affairs (MOEA) managed to herd government representatives and leading Information and Communication Technology (ICT) industry figures together for an important meeting, according to DigiTimes Asia. The report suggests that the main topic of discussion focused on an anticipated growth of Taiwan's ICT industry—current market trends were analyzed, revealing that the nation absolutely dominates in the AI server segment. The MOEA has (allegedly) determined that Taiwan has shipped 90% of global AI server equipment—DigiTimes claims (based on insider info) that: "American brand vendors are expected to source their AI servers from Taiwanese partners." North American customers could be (presently) 100% reliant on supplies of Taiwanese-produced equipment—a scenario that potentially complicates ongoing international tensions.

The report posits that involved parties have formed plans to seize opportunities within an evergrowing global demand for AI hardware—a 90% market dominance is clearly not enough for some very ambitious industry bosses—although manufacturers will need to jump over several (rising) cost hurdles. Key components for AI servers are reported to be much higher than vanilla server parts—DigiTimes believes that AI processor/accelerator chips are priced close to ten times higher than general purpose server CPUs. Similar price hikes have reportedly affected AI adjacent component supply chains—notably cooling, power supplies and passive parts. Taiwanese manufacturers have spread operations around the world, but industry watchdogs (largely) believe that the best stuff gets produced on home ground—global expansions are underway, perhaps inching closer to better balanced supply conditions.

A manufacturing plant near Hsinchu, Taiwan's Silicon Valley, is among facilities worldwide boosting energy efficiency with AI-enabled digital twins. A virtual model can help streamline operations, maximizing throughput for its physical counterpart, say engineers at Wistron, a global designer and manufacturer of computers and electronics systems. In the first of several use cases, the company built a digital copy of a room where NVIDIA DGX systems undergo thermal stress tests (pictured above). Early results were impressive.

Making Smart Simulations
Using NVIDIA Modulus, a framework for building AI models that understand the laws of physics, Wistron created digital twins that let them accurately predict the airflow and temperature in test facilities that must remain between 27 and 32 degrees C. A simulation that would've taken nearly 15 hours with traditional methods on a CPU took just 3.3 seconds on an NVIDIA GPU running inference with an AI model developed using Modulus, a whopping 15,000x speedup. The results were fed into tools and applications built by Wistron developers with NVIDIA Omniverse, a platform for creating 3D workflows and applications based on OpenUSD.

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Taiwan's Commercial Times has published coverage of a newly launched TSMC recruitment drive—proceedings kicked off last weekend with company representatives heading to the National Taiwan University campus. On the second of March, TSMC set up an outdoor booth on the grounds of Taipei's public research university—where the national comprehensive institute organized a Talent Recruitment Enterprise Expo. Unsurprisingly, TSMC recruiters are seeking potential "talents with high enthusiasm for semiconductors." Ctee's reporter found out that Taiwan's premier foundry is expecting to: "recruit approximately 6,000 new colleagues in Taiwan in 2024, including engineers and technicians." TSMC is reportedly responding to business growth and technology development demands—so much so, that its native manufacturing plants require a fresh influx of workers.

According to Ctee's report, TSMC's March recruitment tour is due to snake through Taiwan and then head over to mainland China: "Tsinghua University, National Cheng Kung University, National Yang-Ming Jiaotong University, Central China University, Zhongxing University, Zhongshan, National Chung Cheng University, Beijing University of Science and Technology, etc., totaling 19 physical activities and four online talent recruitment briefings." A parallel "2024 DNA Summer Internship Program" has also been rolled out: "inviting interested students to join and use internships to personally experience the environment and culture of TSMC." The company's growing global layout also provides opportunities for new employees to work overseas—the article highlights TSMC's newly opened semiconductor fabrication plant in Kumamoto Prefecture, Japan as the preferred choice for "internal employees." The multinational firm's Arizona facilities did not get a shout out, despite recent good news. Reports from mid-2023 suggest that TSMC's core values are at odds with North American work culture.

Morris Chang, TSMC's founder and semiconductor industry icon, was present at the opening ceremony of his company's new semiconductor fabrication plant in Kumamoto Prefecture, Japan. According to a Nikkei Asia article, Chang predicted that the nation will experience "a chip renaissance" during his February 24 commencement speech. The Japanese government also announced that it will supply an additional ¥732 billion ($4.86 billion) in subsidies for Taiwan Semiconductor Manufacturing Co. to expand semiconductor operations on the island of Kyūshū. Economy Minister Ken Saito stated: "TSMC is the most important partner for Japan in realizing digital transformation, and its Kumamoto factory is an important contributor for us to stably procure cutting-edge logic chips that is extremely essential for the future of industries in Japan."

Chang disclosed some interesting insights during last weekend's conference segment—according to Nikkei's report, he revealed that unnamed TSMC customers had made some outlandish requests: "They are not talking about tens of thousands of wafers. They are talking about fabs, (saying): 'We need so many fabs. We need three fabs, five fabs, 10 fabs.' Well, I can hardly believe that one." The Taiwanese chip manufacturing giant reportedly has the resources to create a new "Gigafab" within reasonable timeframes, but demands for (up to) ten new plants are extremely fanciful. Chang set expectations at a reasonable level—he predicted that demand for AI processors would lie somewhere in the middle ground: "between tens of thousands of wafers and tens of fabs." Past insider reports suggested that OpenAI has been discussing the formation of a proprietary fabrication network, with proposed investments of roughly $5 to $7 trillion. OpenAI CEO, Sam Altman, reportedly engaged in talks with notable contract chip manufacturers—The Wall Street Journal posited that TSMC would be an ideal partner.

TSMC Arizona's second semiconductor fabrication site has celebrated a "topping out" milestone—as documented in an official blog post (via LinkedIn) from yesterday. Workers were photographed installing an important/final piece of structure—the aforementioned "topping out" milestone signifies: "the last steel beam being raised into place on a construction project." The Taiwanese multinational semiconductor contract manufacturer has had a rough time in establishing operations out in the desert/greater Phoenix area—the "Fab 21 Phase 2" plant is not expected to meet its original 2026 opening window. TSMC Chairman Mark Liu is reportedly leaving his position due to consistent Arizona-related problems and delays.

The TSMC LinkedIn account shared some additional and certainly much-needed positive news: "We also recently achieved the topping milestone on our second fab's auxiliary buildings, which will supply the necessary utilities infrastructure to the second fab clean room." Thursday's blog (February 22) also discloses that the primary site—Fab 21 Phase 1—is still on track to begin production within the first half of 2025, thanks to "significant" bursts in construction progress. The author moved onto future production prospects: "Once operational, our two fabs at TSMC Arizona will manufacture the most advanced semiconductor technology in the U.S., creating 4,500 direct high-tech, high-wage jobs and enabling our customers' leadership in the high-performance computing and artificial intelligence era for decades."

Taiwan Semiconductor Manufacturing Company (TSMC) is set to open its new semiconductor fabrication plant in Kumamoto Prefecture, Japan, on February 24. This facility, known as Japan Advanced Semiconductor Manufacturing (JASM), represents a significant milestone for Japan's semiconductor industry. JASM spans 52 hectares and is designed to produce mature 40, 22/28, and 12/16 nm fabrication technologies in the Fab 1. The Fab 1 has an initial monthly capacity of 40,000 300 mm wafers, scalable to 50,000 wafers per month in the near term. However, TSMC is set to expand the Kumamoto facility with Fab 2, which will produce 7 nm and 6 nm nodes and is scheduled to begin operations at the end of the 2027 calendar year. The Japanese government is set to subsidize the Fab 2 expansion with around $5 billion in aid. Combining Fab 1 and Fab 2, the JASM Kumamoto facility could produce 100,000 300 mm wafers per month once the production of Fab 2 starts. According to market research firm TrendForce, JASM provides significant additional capacity for TSMC amid a global chip shortage. It also boosts Japan's domestic chipmaking capabilities, reducing reliance on imports.

JASM is the first brand-new foreign-operated fab built in Japan. The Japanese government provided grants and tax breaks to incentivize Kumamoto Fab 1 construction as part of a national strategy to re-shore more semiconductor production and is now doing it again with Fab 2. TSMC also received subsidies from customers like Sony, SSS, DENSO and Toyota. Dr. CC Wei, CEO of TSMC, stated that JASM will "shape Japan's semiconductor landscape over the next decade." TrendForce analysts echo this sentiment, noting that JASM's advanced nodes will enable cutting-edge chip designs from Japanese automotive and consumer electronics brands. The inauguration ceremony on February 24 will be attended by TSMC partners, customers, and government representatives. JASM is expected to ramp up production over the coming year. TSMC has other non-Taiwan investments, like the facility in construction in Phoenix, Arizona, which will start mass production of chips by the end of 2027 or early 2028. At that point, the global semiconductor capacity constraints will ease significantly.

COMPUTEX 2024, a global leading technology exhibition, featuring AIoT applications, generative AI & and startup ecosystems, will take place from June 4th to 7th at the Taipei Nangang Exhibition Center Halls 1 and 2. Themed "Connecting AI," this year's exhibition focuses on the latest global AI technologies and industry trends. The show will attract 1,500 international and local exhibitors using 4,500 booths. The Opening Keynote will be delivered by Dr. Lisa Su, Chair and CEO of AMD, on the morning of June 3rd to set the stage for the event.

COMPUTEX 2024: Global Tech Giants Unite, Paving the Way for the Era of the AI Ecosystem
2024 is acclaimed as the AI PC era, with the development of artificial intelligence propelling products like AI PCs, AI servers, and AI smartphones to thrive in the market. This year's COMPUTEX covers six major themes: AI computing, Advanced Connectivity, Future Mobility, Immersive Reality, Sustainability, and Innovations. Collaborating with international technology powerhouses, including Acer, ASRock, ASUS, Delta, Gigabyte, G.Skill, Intel, MSI, Pro Gamersware, and more, shapes the AI ecosystem. Moreover, the InnoVEX exhibit for startups will connect innovative teams from around the globe, sparking cross-industry collaboration and revitalizing AI technology with fresh energy.

The cutting edge 2 nm EUV foundry node by TSMC is expected to enter risk product in Q4 2024, according to a report by Taiwan-based industry observer DigiTimes. 2 nm would be an important milestone for the foundry company, as it would be the first from the company to implement GAA (gates all around) FETs, the technological successor to FinFETs, which drove silicon fabrication node development for almost a decade, from 16 nm to 3 nm. The GAAFET technology will be critical for the foundry's journey between 2 nm and 1 nm.

TSMC is expected to risk-produce chips on its 2 nm node in its new fab at the Baoshan campus in the Hsinchu Science Park, located in northern Taiwan. Should all go well with risk production, one can expect mass production of chips by Q2-2025. Until then, refinements to the company's final FinFET node, the N3 family, will remain the cutting-edge of silicon fabrication. Samsung has a similar 2025 target set for mass production on its 2 nm node, dubbed SF2. Across the Pacific, Intel Foundry Services has its Intel 20A node, which implements GAAFET (aka RibbonFET) technology aiming for similar timelines, including an ambitious 2024 mass production target.

The publication of ASML's 2023 Annual Report has revealed some interesting insights into how the photolithography producer remains diplomatic in times of global tension. Peter Wennink (President, Chief Executive Officer and Chair of the Board of Management) discussed his company's carefully considered tightrope act—here is his message to stakeholders: "In 2023, demand for our DUV systems continued to be strong, particularly in China. During the previous two years, our Chinese customers had received significantly fewer systems than they had ordered, due to global demand for our systems exceeding supply. However, the shifts in demand timing from other customers that we experienced in 2023 meant that we had the opportunity to backfill these orders for mature and midcritical nodes to China, while of course complying with export regulations." ASML is seemingly keen to continue doing business with Chinese customers, despite having to juggle with strict international trade rulings—as revealed in their financial report, trade in this region accounts for "26.3% of our 2023 total net sales." This places China in a second tier position, just behind Taiwan (29.3% of 2023 total net sale).

ASML was expecting to deliver a grand total of 600 DUV equipment units to Chinese customers by the end of 2025, but trade restriction adjustments nixed that avenue of business. The report's "Strategy and products" section highlights the company's concerns about narrowed lanes: "Geopolitical tensions may result in export control restrictions, trade sanctions, tariffs and more generally international trade regulations which may impact our ability to deliver our systems, technology, and services." China's leading foundry—Semiconductor Manufacturing International Corp (SMIC)—is reportedly targeting a 5 nm process node, although this would require a major readjustment of its existing collection of (older) lithography equipment. SMIC's flagship Shanghai location cannot upgrade to the most advanced DUV machinery in ASML's catalog, therefore workers are reliant on slightly antiquated gear (previously tasked with 7 nm manufacturing)—low yields and added expense are the anticipated headaches.

Last week SK Hynix revealed ambitious plans for its next wave of High Bandwidth Memory (HBM) products—their SEMICON Korea 2024 presentation included an announcement about cutting-edge HBM3E entering mass production within the first quarter of this year. True next-gen HBM development has already kicked off—TPU's previous report outlines an HBM4 sampling phase in 2025, followed by full production in 2026. South Korea's Pulse News believes that TSMC has been roped into a joint venture (with SK Hynix). An alleged "One Team" strategic alliance has been formed according to reports emerging from Asia—this joint effort could focus on the development of HBM4 solutions for AI fields.

Reports from last November pointed to a possible SK Hynix and NVIDIA HBM4 partnership, with TSMC involved as the designated fabricator. We are not sure if the emerging "One Team" progressive partnership will have any impact on previously agreed upon deals, but South Korean news outlets reckon that the TSMC + SK Hynix alliance will attempt to outdo Samsung's development of "new-generation AI semiconductor packaging." Team Green's upcoming roster of—"Hopper" H200 and "Blackwell" B100—AI GPUs are linked to a massive pre-paid shipment of SK Hynix HMB3E parts. HBM4 products could be fitted on a second iteration of NVIDIA's Blackwell GPU, and the mysterious "Vera Rubin" family. Notorious silicon industry tipster, kopite7kimi, believes that "R100 and GR200" GPUs are next up in Team Green's AI-cruncher queue.

DigiTimes Asia has reached out to insiders at fabrication toolmakers in an effort to delve deeper into claims made by industry analysts at the start of 2024—both SemiAnalysis and China Renaissance have proposed that TSMC is unlikely to adopt High-NA EUV production techniques within a five year period. The latest news article explores a non-upgrade approach for the next couple of years: "TSMC has not placed orders for high-numerical aperture (High-NA) extreme ultraviolet (EUV) tools and is unlikely to use the technology in 2 nm and 1.4 nm (A14) process manufacturing." Intel Foundry Services (IFS) will be one of the first semiconductor manufacturers to go online with ASML's latest and greatest machinery, although no firm timeframes have been confirmed. Team Blue's Taiwanese rival (and occasional business partner) is seemingly happy with its existing infrastructure, but industry watchdogs propose that cost considerations are key factors behind TSMC's cautious planning for the next decade.

The DigiTimes insider sources believe that TSMC will not budge until at least 2029, possibly coinciding with a 1 nm production node—analysts at China Renaissance reckon that High-NA EUV machines could be delivered in the future when facilities are readied for an "A10" codenamed process. TSMC published a very ambitious "transistor count" product timeline in early January (see below)—the first "1 nm" products are supposedly targeted for a 2030 rollout, but this schedule could change due to unforeseen circumstances. Intel is expected to "phase in" its fanciest ASML gear collection once the 18A process becomes old hat—Tom's Hardware thinks that 2026 - 2027 is a feasible timeframe.

Taiwan Semiconductor Manufacturing Company (TSMC) has reached a significant milestone, overtaking Intel and Samsung to become the world's largest semiconductor maker by revenue. According to Taiwanese financial analyst Dan Nystedt, TSMC earned $69.3 billion in revenue in 2023, surpassing Intel's $63 billion and Samsung's $58 billion. This is a remarkable achievement for the Taiwanese chipmaker, which has historically lagged behind Intel and Samsung in terms of revenue despite being the world's largest semiconductor foundry. TSMC's meteoric rise has been fueled by the increased demand for everything digital - from PCs to game consoles - during the coronavirus pandemic in 2020, and AI demand in the previous year. With its cutting-edge production capabilities allowing it to manufacture chips using the latest process technologies, TSMC has pulled far ahead of Intel and Samsung and can now charge a premium for its services.

This is reflected in its financials. For the 6th straight quarter, TSMC's Q4 2023 revenue of $19.55 billion also beat Intel's $15.41 billion and Samsung's $16.42 billion chip division revenue. As the world continues its rapid transformation in the AI era of devices, TSMC looks set to hold on to its top position for the foreseeable future. Its revenue and profits will likely continue to eclipse those of historical giants like Intel and Samsung. However, a big contender is Intel Foundry Services, which is slowly starting to gain external customers. If IFS takes off and new customers start adopting Intel as their foundry of choice, team blue could regain leadership in the coming years.

Faraday Technology Corporation, a Taiwanese silicon IP designer, has announced plans to develop a new 64-core system-on-chip (SoC) utilizing Intel's most advanced 18A process technology. The Arm-based SoC will integrate Arm Neoverse compute subsystems (CSS) to deliver high performance and efficiency for data centers, infrastructure edge, and 5G networks. This collaboration brings together Faraday, Arm, and Intel Foundry Services. Faraday will leverage its ASIC design and IP solutions expertise to build the SoC. Arm will provide the Neoverse compute subsystem IP to enable scalable computing. Intel Foundry Services will manufacture the chip using its cutting-edge 18A process, which delivers one of the best-in-class transistor performance.

The new 64-core SoC will be a key component of Faraday's upcoming SoC evaluation platform. This platform aims to accelerate customer development of data center servers, high-performance computing ASICs, and custom SoCs. The platform will also incorporate interface IPs from the Arm Total Design ecosystem for complete implementation and verification. Both Arm and Intel Foundry Services expressed excitement about working with Faraday on this advanced Arm-based custom silicon project. "We're thrilled to see industry leaders like Faraday and Intel on the cutting edge of Arm-based custom silicon development," said an Arm spokesperson. Intel SVP Stuart Pann said, "We are pleased to work with Faraday in the development of the SoC based on Arm Neoverse CSS utilizing our most competitive Intel 18A process technology." The collaboration represents Faraday's strategic focus on leading-edge technologies to meet evolving application requirements. With its extensive silicon IP portfolio and design capabilities, Faraday wants to deliver innovative solutions and break into next-generation computing design.

A Taiwan Economic Daily news article proposes that a couple of high profile clients are considering TSMC's 2 nanometer process—Apple is widely believed to be the first customer to join the foundry's queue for cutting edge services. The report posits that Intel is also signed up on the Taiwanese firm's 2 nm reservation list—TSMC is expected to start production in 2025—insiders reckon that Team Blue's "Nova Lake" CPU family is the prime candidate here. Its CPU tile is alleged to utilize TSMC 2 nm node. Intel's recent "Core" processor roadmaps do not display any technologies beyond 2025—many believe that "Nova Lake" is pencilled in for a loose 2026 launch window, perhaps within the second half of the year.

The existence of "Nova Lake" was revealed late last year by HWiNFO patch notes—a short entry mentioned preliminary support for the family's integrated GPU. Intel is engaged in hyping up of its own foundry's 20A and 18A processes, but remain reliant on TSMC plants for various bits of silicon. Industry tipsters reckon that aspects of "Lunar Lake" CPUs are based on the Taiwanese foundry's N3B node. Team Blue Corporation and United Microelectronics Corporation (UMC) announced a new development partnership last week, but initial offerings will arrive on a relatively passé "12-nanometer semiconductor process platform." TSMC's very advanced foundry services seem to be unmatched at this juncture.

LaminiAI appeared to be one of the first customers to receive an initial shipment of AMD's Instinct MI300X accelerators, as disclosed by their CEO posting about functioning hardware on social media late last week. A recent Taiwan Economic Daily article states that the "MI300X is rumored to have begun supply"—we are not sure about why they have adopted a semi-secretive tone in their news piece, but a couple of anonymous sources are cited. A person familiar with supply chains in Taiwan divulged that: "(they have) been receiving AMD MI300X chips one after another...due to the huge shortage of NVIDIA AI chips, the arrival of new AMD products is really a timely rainfall." Favorable industry analysis (from earlier this month) has placed Team Red in a position of strength, due to growing interest in their very performant flagship AI accelerator.

The secrecy seems to lie in Team Red's negotiation strategies in Taiwan—the news piece alleges that big manufacturers in the region have been courted. AMD has been aggressive in a push to: "cooperate and seize AI business opportunities, with GIGABYTE taking the lead and attracting the most attention. Not only was GIGABYTE the first to obtain a partnership with AMD's MI300A chip, which had previously been mass-produced, but GIGABYTE was also one of the few Taiwanese manufacturers included in AMD's first batch of MI300X partners." GIGABYTE is expected to release two new "G593" product lines of server hardware later this year, based on combinations of AMD's Instinct MI300X accelerator and EPYC 9004 series processors.

A DigiTimes Asia report posits that TSMC is preparing another VVIP foundry lane for Apple Inc.—insiders claim that the Taiwanese foundry giant is in the process of expanding production capacity into next generation 2 nm nanometer fields. This expensive and time consuming endeavor is only made possible with the reassurance of big customers being added to the foundry's order books. TSMC's 2 nm-class N2, N2P, and N2X process technologies are due in 2025 and beyond (according to recent presentation slides)—these advanced packages are set to drop with all sorts of innovations: nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance metal-insulator-metal (SHPMIM). According to a DigiTimes source "Apple is widely believed to be the initial client to utilize the (next-gen) process."

Apple and NVIDIA were reported to be ahead of many important clients in the queue for TSMC's 3 nm process nodes, so it is not surprising to see old patterns repeat (according to industry rumors) again. Apple is expected to update its next generation iPhones, iPad, and Mac laptop product lines with more advanced Bionic and M-series chipsets in 2025. Last year's roster included a rollout of 3 nm TSMC silicon across Apple A17 Pro and M3 ARM-based processors.

Intel Corp. and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile, communication infrastructure and networking. The long-term agreement brings together Intel's at-scale U.S. manufacturing capacity and UMC's extensive foundry experience on mature nodes to enable an expanded process portfolio. It also offers global customers greater choice in their sourcing decisions with access to a more geographically diversified and resilient supply chain.

"Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative companies in Taiwan, such as UMC, to help better serve global customers," said Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS). "Intel's strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain and is another important step toward our goal of becoming the world's second-largest foundry by 2030."

With computation potential far beyond current supercomputers, quantum computers are the subject of enthusiastic research and development worldwide. In 2023, Academia Sinica successfully overcame various bottlenecks in the fabrication, control, and measurement of quantum chips. In October, the creation of a 5-qubit superconducting quantum computer developed in Taiwan marked a significant milestone. Starting this week, it will be made available online to project collaborators.

Dr. Chii Dong Chen, Distinguished Research Fellow at Academia Sinica's Institute of Physics and Research Center for Applied Sciences, noted that this project is part of the quantum technology special project funded by the National Science and Technology Council. Initially scheduled to build a 3-qubit quantum computer by February of 2024, Academia Sinica's research team surpassed the development schedule approved by the National Science and Technology Council and built a 5-qubit system by October of 2023. The fidelity of the quantum bit logic gates reached an impressive 99.9%.

NVIDIA's intrepid CEO, Jensen Huang, has spent a fair chunk of January travelling around China—news outlets believe that Team Green's leader has conducted business meetings with very important clients in the region. Insiders proposed that his low-profile business trip included visits to NVIDIA operations in Shenzhen, Shanghai and Beijing. The latest updates allege that a stopover in Taiwan was also planned, following the conclusion of Mainland activities. Photos from an NVIDIA Chinese new year celebratory event have been spreading across the internet lately—many were surprised to see Huang appear on-stage in Shanghai and quickly dispense with his trademark black leather jacket. He swapped into a colorful "Year of the Wood Dragon" sleeveless shirt for a traditional dance routine.

It was not all fun and games during Huang's first trip to China in four years—inside sources have informed the Wall Street Journey about growing unrest within the nation's top ranked Cloud AI tech firms. Anonymous informants allege that leadership, at Alibaba Group and Tencent, are not happy with NVIDIA's selection of compromised enterprise GPUs—it is posited that NVIDIA's President has spent time convincing key clients to not adopt natively-developed solutions (unaffected by US Sanctions). The short hop over to Taiwan is reported not to be for R&R purposes—insiders had Huang's visiting key supply partners; TSMC and Wistron. Industry experts think that these meetings are linked to NVIDIA's upcoming "Blackwell" B100 AI GPU, and "supercharged" H200 "Hopper" accelerator. It is too early for the rumor mill to start speculation about nerfed versions of NVIDIA's 2024 enterprise products reaching Chinese shores, but Jensen Huang is seemingly ready to hold diplomatic talks with all sides.