With its own 7 nm-class silicon fabrication node nowhere in sight for its processors, at least not until 2022-23, Intel is seeking out third-party semiconductor foundries to support its ambitious discrete GPU and scalar compute processor lineup under the Xe brand. A Taiwanese newspaper article interpreted by Chiakokhua provides a fascinating insight to the the new precious resource in the high-technology industry - allocation.

TSMC is one of these foundries, and will give Intel access to a refined 7 nm-class node, either the N7P or N7+, for some of its Xe scalar compute processors. The company could also seek out nodelets such as the N6. Trouble is, Intel will be locking horns with the likes of AMD for precious foundry allocation. NVIDIA too has secured a certain allocation of TSMC 7 nm for some of its upcoming "Ampere" GPUs. Sources tell China Times that TSMC will commence mass-production of Intel silicon as early as 2021, on either N7P, N7+, or N6. Business from Intel is timely for TSMC as it is losing orders from HiSilicon (Huawei) in wake of the prevailing geopolitical climate.

Taiwan Semiconductor Manufacturing Company, called TSMC shorty, has just become the world's biggest semiconductor company. The news broke after TSMC's stock reached a peak heights of $66.40 price per share, and market capitalization of 313 billion US dollars. That means that the Taiwanese company officially passed Intel, NVIDIA, and Samsung in terms of market capitalization, which is no small feat. And the news isn't that surprising. TSMC has been rather busy with orders from customers, just waiting for new spots so they can grab a piece of its production pipeline.

TrendForce, a market intelligence provider, estimates that TSMC has an amazing 51.9% of global semiconductor foundry share alone. That is no small feat but TSMC worked hard over the years to make it happen. With constant investments into R&D, TSMC has managed to make itself not only competitive with other foundries, but rather an industry leader. With 5 nm already going in high-volume manufacturing (HVM) in Q4 of this year, the company is demonstrating that it is the market leader with the latest node developments. Smaller nodes like 3 nm are already in development and TSMC doesn't plan to stop.

TSMC, one of the largest semiconductor manufacturing foundries, has officially confirmed that it will stop all orders from Chinese company Huawei Technologies. The Taiwanese silicon manufacturer has decided to comply with US regulations and will officially stop processing orders for Huawei on September 14th of this year. Precisely, the company was receiving orders from HiSilicon, a subsidiary of Huawei Technologies that focuses on creating custom silicon. Under the new regulation by the US, all non-US companies must apply for a license to ship any American-made technology to Huawei. Being that many American companies like KLA Corporation, Lam Research, and Applied Materials ship their tools to many manufacturing facilities, it would be quite difficult for Huawei to manufacture its silicon anywhere. That is why Huawei has already placed orders over at Chinese SMIC foundry.

The Taichung District Court in Taiwan ruled in favor of Micron Technology in a case dating back to 2017, against semiconductor foundry UMC and two of its former employees. Micron had alleged that UMC and three of Micron former employees stole Micron's trade secrets and conveyed them to Mainland Chinese DRAM maker Fujian Jinhua IC. One of the accused include Stephen Chen, former president for Micron Memory in Taiwan.

The Court ruled that the three former Micron employees serve 4.5-6.5 years in prison, in addition to paying NTD 4-6 million fines, each. As for UMC, it has been ordered to pay NTD 100 million (USD $3.4 million) in damages to Micron Technology, a parking ticket value compared to the commercial damage FJIC will inflict to Micron in the years to come.

The information has been circulating the industry about Apple and its plans to integrate Micro-LED technology into its products for some time now. Micro-LED is a new display technology that allows for much better characteristics of panels like higher brightness, fuller color gamut, and higher dynamic range. The technology also offers a higher refreshing rate, wider viewing angles, and lower power consumption. Being that Micro-LED display is physically thinner, it will allow for more portable devices and it will leave more room for other components.

According to the report from CENS, a Taiwanese media, Apple is investing $330 million into a new Micro-LED factory for Apple devices. A future factory located in Taiwan is seeing major investments from the company. Being that Apple plans to use Micro-LED displays in its future products like iPad Pro and MacBook Pro, it is expected to see this move from them. However, Apple isn't doing it alone. They have partnered with Epistar, Taiwan's biggest LED producer and Taiwanese LCD panel maker, AU Optronics. These two are experienced makers of panels so they should help Apple successfully launch and operate manufacturing facilities.

TSMC has just recently announced that they will be building a semiconductor factory in the US, thanks to the pressure from Trump administration. The 5 nm Fab will be built in Arizona, with construction starting in 2021. It will be finished in the year 2024 when the plant will operate at a capacity of 20,000 wafers per month. This is not a high number as TSMC Fabs usually operate at a rate of 100-150K wafers per month, however, the amazing thing is the location of the Fab. The US Fab in Arizona is set to change the global landscape of the semiconductor supply chain, as per the latest report from DigiTimes Research.

Arizona is a place in the US where lots of companies are building semiconductors. Intel, Raytheon, Microchip, ON Semiconductor, VLSI, Freescale, NXP, STMicroelectronics, Honeywell, Marvel, Amkor, Philips, and Western Digital have their facilities there and Arizona can be considered one of the key places for semiconductor manufacturing in the US. With TSMC adding their manufacturing facilities to that list as well, there could be a change in the supplier ecosystem. In light of the need for TSMC 5 nm Fab, the world's leading OSAT (Outsourced Semiconductor Assembly and Test) suppliers may be encouraged to set up local production in Arizona to help TSMC with its plans. A lot of OSAT providers are headquartered in Taiwan, however, if there is a need, they are possibly going to build their manufacturing facilities in Arizona. This alone could change the way semiconductor manufacturing facilities are supplied, and the US could become a major center of OSAT providers.

TSMC, as one of the largest silicon manufacturers in the world, has been subject to pressure from the Trump administration to build a Fab and manufacture silicon on US soil. The reasoning behind this is that the US government could order chips that are supposed to be used in military applications. For security reasons, they need to be manufactured on US grounds and "checked" by the US government. However, it seems like a Taiwanese company has no concrete plans to realize the building of the US Fab.

Thanks to the report of DigiTimes, TSMC has confirmed that they have resisted requests from the US government, and will not build a Fab on US soil for the government. They haven't dismissed the possibility of building one or silicon manufacturing facilities in the US completely. TSMC chairman Mark Liu has told DigiTimes previously that if the company wants to build a US Fab, it will do so because of consumer demand, not the government demand. And that is understandable. It is much easier to work with regular customers compared to the US government which would force a company to go through rigorous security levels to deliver chips.

Power Logic, a graphics card cooling solution OEM, in an interview with Taiwan tech industry observer DigiTimes, commented that it expects graphics card shipments to rise in the second half of 2020, on the backs of new product announcements from both NVIDIA and AMD, as well as HPC accelerators from the likes of Intel and NVIDIA. NVIDIA is expected to launch its "Ampere" based GeForce RTX 30-series graphics cards, while AMD is preparing to launch its Radeon RX 6000-series "Navi 2#" graphics cards based on the RDNA2 graphics architecture. Power Logic has apparently commenced prototyping certain cooling solutions, and is expected to begin mass-production at its Jiangxi-based plant towards the end of Q2-2020; so it could begin shipping coolers to graphics card manufacturers in the following quarters.

A DigiTimes premium report, interpreted by Chiakokhua, aka Retired Engineer, chronicling NVIDIA's move to contract TSMC for 7 nm and 5 nm EUV nodes for GPU manufacturing, made a startling revelation about NVIDIA's recent foundry diversification moves. Back in July 2019, a leading Korean publication confirmed NVIDIA's decision to contract Samsung for its next-generation GPU manufacturing. This was a week before AMD announced its first new-generation 7 nm products built for the TSMC N7 node, "Navi" and "Zen 2." The DigiTimes report reveals that NVIDIA underestimated the efficiency gains AMD would yield from TSMC N7.

With NVIDIA's bonhomie with Samsung underway, and Apple transitioning to TSMC N5, AMD moved in to quickly grab 7 nm-class foundry allocation and gained prominence with the Taiwanese foundry. The report also calls out a possible strategic error on NVIDIA's part. Upon realizing the efficiency gains AMD managed, NVIDIA decided to bet on TSMC again (apparently without withdrawing from its partnership with Samsung), only to find that AMD had secured a big chunk of its nodal allocation needed to support its growth in the x86 processor and discrete GPU markets. NVIDIA has hence decided to leapfrog AMD by adapting its next-generation graphics architectures to TSMC's EUV nodes, namely the N7+ and N5. The report also speaks of NVIDIA using its Samsung foundry allocation as a bargaining chip in price negotiations with TSMC, but with limited success as TSMC established its 7 nm-class industry leadership. As it stands now, NVIDIA may manufacture its 7 nm-class and 5 nm-class GPUs on both TSMC and Samsung.

Huawei's subsidiary, HiSilicon, which designs the processors used in Huawei's smartphones and telecommunications equipment, has reportedly moved its silicon orders from Taiwan Semiconductor Manufacturing Company (TSMC) to Semiconductor Manufacturing International Corporation (SMIC), according to DigiTimes. Why Huawei decided to do is move all of the 14 nm orders from Taiwanese foundry to China's largest silicon manufacturing fab, is to give itself peace of mind if the plan of the US Government goes through to stop TSMC from supplying Huawei. At least for the mid-tier chips built using 14 nm node, Huawei would gain some peace as a Chinese fab is a safer choice given the current political situation.

When it comes to the high-end SoCs built on 7 nm, and 5 nm in the future, it is is still uncertain how will Huawei behave in this situation, meaning that if US cuts off TSMC's supply to Huawei, they will be forced to use SMIC's 7 nm-class N+1 node instead of anything from TSMC. Another option would be Samsung, but it is a question will Huawei put itself in risk to be dependant on another foreign company. The lack of 14 nm orders from Huawei will not be reflecting much on TSMC, because whenever someone decides to cut orders, another company takes up the manufacturing capactiy. For example, when Huawei cut its 5 nm orders, Apple absorbed by ordering more capacity. When Huawei also cut 7 nm orders, AMD and other big customers decided to order more, making the situation feel like there is a real fight for TSMC's capacity.

TSMC, Taiwan's flagship manufacturer of silicon, has seen a substantial increase in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, according to the report from DigiTimes. CoWoS is a multi-chip packaging technology that gives an option to build silicon like LEGO, allowing for dies to be placed side by side on interposer that is providing high interconnect density and performance. You can see more about CoWoS in detail here. Some of the examples of CoWoS are NVIDIA's P100 and V100 dies that integrate logic (computing elements), and memory (in the form of HBM) on a single die.

Recently, TSMC updated its CoWoS technology, where this new second-generation parts could scale far larger than the first-generation implementation - up to 1700 squared millimeters of die space, allowing for some very creative solutions to be implemented. This may be the reason that the demand in Q2 has risen so substantially and that TSMC's production lines are now running at full capacity, trying to meet the demand for this packaging technology.

The U.S. government announced advanced measures that make it harder for foreign companies, such as Taiwan's TSMC, to supply chips to Chinese telecom hardware giant Huawei. Foreign companies that use American chipmaking equipment, are required to obtain a license from the U.S. before supplying certain chips to Huawei. Sources comment that the new rule was tailor-made to curb TSMC fabricating smartphone SoCs for Huawei's HiSilicon subsidiary.

Mainland Chinese semiconductor companies are still behind Samsung and TSMC in 7 nm-class fab technologies, forcing HiSilicon to source from the latter. 7 nm fabrication is a key requirement for SoCs and modem chips capable of 5G. The high data transceiving rates of 5G requires a certain amount of compute power that can fit into smartphone-level power-envelopes only with the help of 7 nm, at least for premium smartphone form-factors. Same applies to 5G infrastructure equipment. This is hence perceived as a means for the U.S. to clamp brakes on Huawei's plans of playing a big role in 5G tech rollouts around the world, buying western 5G tech suppliers such as Nokia time to catch up. Huawei has been a flashpoint for a bitter political spat between the U.S. and China, with the Chinese press even threatening that the matter could hamper medical supplies to the U.S. to fight the COVID-19 pandemic.

The world's leading memory brand, TEAMGROUP today announces that the T-FORCE XTREEM ARGB Full Mirror Gaming Memory has won the Red Dot Design Award 2020. The XTREEM ARGB has earned an enthusiastic response from gamers around the globe ever since its release. It stands out among 6,500 entries worldwide and overwhelmingly praised by international experts. TEAMGROUP's strength and creativity in product research and development make the T-FORCE gaming brand shine at international design awards once again.

The German Red Dot Design Award, one of the world's four major design awards, has an extraordinary influence in the industry and is also an important indicator for designers. It was founded by the famous German design association, Design Zentrum Nordrhein Westfalen in 1955. Global professional jury judge entries based on creativity, solutions, product communication design and concept. The award has attracted over six thousand entries from more than 60 countries. And T-FORE XTREEM ARGB Full Mirror Gaming Memory has won the award with product uniqueness and rich creativity, and shines in the design field.

The Taiwan (ROC) Government announced a ban on the entry of all foreign visitors into the country until further notice. The ban takes effect from Thursday, March 19, in the wake of the COVID-19 global pandemic that has claimed thousands of lives worldwide. All foreign arrivals already on their way will be placed in a mandatory 14-day quarantine.

Exceptions to the ban include ARC (alien resident certificate) holders, diplomatic passport holders, and businesspersons with special entry permits issued by the government (these are not the same as business visas), although even these persons must subject themselves to the quarantine. The ban is expected to force most commercial airlines to reduce or suspend their services to the country. The travel ban to Taiwan puts Computex 2020 in jeopardy. Although held in June, preparations for the show typically begin as early as April, with foreign exhibitors preparing to import their exhibits, organizing their booths, arranging logistics, etc.

TSMC is set to hire about 4000 new staff members to gain a workforce for its development of next-generation semiconductor manufacturing nodes. The goal of the company is to gather talent so it can develop the world's leading semiconductor nodes, like 3 nm and below. With 15 billion USD planned for R&D purposes alone this year, TSMC is investing a big part of its capital back into development on new and improved technology. Markets such as 5G and High-Performance Computing are leading the charge and require smaller, faster, and more efficient semiconductor nodes, which TSMC plans to deliver. To gather talent, TSMC started job listing using recruitment website TaiwanJobs and started campaigns on university campuses to attract grad students.

ASRock, a Taiwanese manufacturer of motherboards and graphics cards, had an amazing 2019 when it comes to the revenue. Surging around 31% on a Year-over-Year (YoY) basis and delivering revenue of 443.16 million US Dollars, ASRock is expecting to deliver even better results in 2020. When it comes to the underlying reasons for this notable increase, ASRock attributes it to the recent success of AMD's Ryzen family of processors and strong demand for the platform surrounding it. Adopting the AMD Ryzen processors in Mini-PCs, motherboards and server boards, ASRocks see strong demand for these products that should carry over in 2020.

Another reason for strong profits and even better chapters ahead is the developments in the US and European markets. Having previously been focused on the Asian market and marketing its products to that part, ASRock changed the strategy and started advertising its brand more to other regions like the US and Europe. This new strategy is progressing well and is expected to continue in the coming years. Additionally, it is worth noting that ASRock's graphics card sales started to turn profitable in 2019, and now that part of ASRock is attributing to profits as well.

Taiwan Semiconductor Manufacturing Company, Limited, also known as TSMC shortly became Asia's biggest and the most valuable company with a market cap of over 8.02 trillion New Taiwan Dollars, which roughly translates to 262.75 billion US Dollars. Becoming the biggest Asian company, TSMC's market capitalization has now surpassed Samsung for the first time in the history of company existence.

The underlying reasons for becoming a company that TSMC is today, are plenty. Firstly, they are providing customers with the flexibility of choosing any manufacturing node, whatever it is the latest 7 nm or the older ones like 180 nm. They have a choice whatever they want to use something older and less expensive or something newer for high-performance and lower power. Additionally, TSMC is re-investing a big part of its profits into research and development efforts to stay competitive and deliver only the best technology to its customers, on time.

Panasonic, an electronics manufacturing giant, has today sold its silicon manufacturing business, marking the end of an era of Japanese semiconductor manufacturing. Once a big player in silicon manufacturing scene, particularly in the '80s and '90s era when Japan's silicon output was huge, Panasonic was considered one of the main players in the silicon manufacturing business. However, due to some difficulties like operating a business with a loss of over $215 million yearly, and having to compete with Chinese and Taiwanese silicon manufacturing firms, Panasonic is selling its silicon production lines.

The subsidiary of Panasonic called "Semiconductors Solutions" is being sold to Nuvoton Technology Corporation, a semiconductor company that spun-off from Winbond Electronics Corporation in 2008, where Winbond still owns 61% stake in Nuvoton despite the spinoff. Additionally, Panasonic forecasts a 27% drop in operating profit for this physical year, with the declining semiconductor manufacturing business counted. The reasoning behind this sale is that the company plans to exit all declining businesses that also include LCD manufacturing, as Chinese alternative manufacturers are stiff competition for Panasonic when it comes to pricing and panel output.

TSMC has been very aggressive with its approach to silicon manufacturing, with more investments into its R&D that now match or beat the capex investments of Intel. That indicates a strong demand for new technologies and TSMC's strong will not drop out of the never-ending race for more performance and smaller node sizes.

According to the sources over at DigiTimes, TSMC has acquired as much as 30 hectares of land in the Southern Taiwan Science Park to begin the construction of its fabs that are supposed to start high-volume manufacturing 3 nm node in 2023. Construction of 3 nm manufacturing facilities are set to begin in 2020 when TSMC will lay the groundwork for the new fab. The 3 nm semiconductor node is expected to be TSMC's third attempt at EUV lithography, right after the 7 nm+, and 5 nm nodes which are also based on EUV technology.

Apacer, the leading manufacturer of industrial-grade memory, announces the release of the XR-DIMM. This rugged memory module is the first on the market to meet the exacting standards of the US RTCA DO-160G test, an aviation equipment certification that marks the XR-DIMM as resistant to high levels of vibration and therefore ideal for defense and aeronautical applications.

Since 2018, Apacer has been manufacturing DDR4 XR-DIMM modules with rugged stability in mind. Though previous models have been compliant with MIL-STD-810G, this new module is the first to be proven compliant with the US RTCA DO-160G standard, making it the ideal choice for manufacturers who need reliable operation through extreme vibration and shock.

Prices of DRAM shot up by 20 percent as Japan put in place export curbs that restrict high-technology exports to South Korea, and as Toshiba recovers from a power blackout that temporarily halted production. This could impact prices of end-user products such as PC memory modules, or consumer electronics, such as smartphones, in the coming weeks, as inventories either dry up, or are marked-up at various stages of the supply-chain. The memory industry is inter-dependent between fabrication and packaging units spread across South Korea, Japan, and Taiwan.

Memory and flash industry observer DRAMeXchange reported that spot-pricing of 8-gigabit DDR4 DRAM chips, which is used as a benchmark for DRAM pricing as a whole, closed at USD $3.74 at the end of trading on Friday (19/07). It's up 14.6 percent week-over-week, and 23 percent up pricing as on 5th July. An industry observer who spoke with KBS World notes that the recent hikes are not directly infuenced by the trade-spat between Japan and Korea, but rather a power blackout experienced at a Toshiba DRAM manufacturing facility last month. The observer noted that if the trade-spat affects production at Samsung Electronics or SK Hynix, DRAM prices could "skyrocket."

Intel today revealed plans for Project Athena Open Labs in Taipei, Shanghai and Folsom, California, to support performance and low-power optimization of vendor components for laptops built to Project Athena design specifications and target experiences in 2020. Located in key ecosystem hubs and operated by teams of Intel engineers with system-on-chip (SOC) and platform power optimization expertise, the three Open Labs sites will begin operating in June 2019 to enable and optimize components.

"Across the industry, we each play an important role in delivering the advanced laptops of today and the future. Project Athena Open Labs are a critical step in enabling more extensive, day-to-day collaboration with the components ecosystem to continuously raise the bar for innovation across the platform," said Josh Newman, Intel vice president and general manager of PC Innovation Segments, Client Computing Group.

The world's largest contract semiconductor manufacturing company, TSMC, has been cleared to commence construction of a new 3 nm chip factory at the Southern Taiwan Science Park in Tainan. The new factory is expected to use 20 percent renewable energy and 50 percent recycled water.

The factory's environmental impact assessment was accepted by the Environmental Protection Administration (EPA) on Dec. 19, after concerns were raised about use of water and power sources. TSMC is expected to invest NT$600 million (US$19.45 million) in the project, with construction to begin in 2022. Production is planned to start in late 2022 or early 2023. At the same site, TSMC is also building a 5 nm chip factory, which is expected to be up and running in late 2019 or early 2020.

The "sustained chill in the crypto mining sector" is, according to Taiwan-based sources cited at DigiTimes, one of the leading reasons motherboard and graphics cards makers will face a bleak scenario in the next few months. According to those sources, other factors such as the US-China trade war doesn't help a situation on which NVIDIA new RTX family hasn't helped due to the high price of those GPUs. ASUSTeK Computer and Gigabyte Technology have seen their inventory levels drive up, "causing their revenues for the peak season to fall under expectations".

These problems now join the ones Intel is facing with its shortage of processors, and according to DigiTimes, revenue prospects for the fourth quarter are further dimmed by lingering sluggish demand from the DIY market among other things. To counteract these problems those companies could actually be could be further adversely affected: "Nvidia and Intel likely to raise their chip prices to maintain profitability", a move that could lead to a bleak profitability period starting in 2019.

A federal grand jury indicted a state-owned enterprise of the People's Republic of China (PRC), a Taiwan company, and three individuals, charging them with crimes related to a conspiracy to steal, convey, and possess stolen trade secrets of an American semiconductor company for the benefit of a company controlled by the PRC government. All of the defendants are charged with a conspiracy to commit economic espionage, among other crimes. Attorney General Jeff Sessions, FBI Director Christopher Wray, Assistant Attorney General for National Security John Demers, Assistant Attorney General for the Criminal Division Brian A. Benczkowski, United States Attorney Alex G. Tse of the Northern District of California, and FBI Special Agent in Charge for the San Francisco Field Office John F. Bennett made the announcement.

In addition, the United States filed a civil lawsuit seeking to enjoin the further transfer of the stolen trade secrets and to enjoin certain defendants from exporting to the United States any products manufactured by UMC or Jinhua that were created using the trade secrets at issue. The indictment was filed on September 27, 2018, and unsealed today. The civil lawsuit was filed today.