NVIDIA's intrepid CEO, Jensen Huang, has spent a fair chunk of January travelling around China—news outlets believe that Team Green's leader has conducted business meetings with very important clients in the region. Insiders proposed that his low-profile business trip included visits to NVIDIA operations in Shenzhen, Shanghai and Beijing. The latest updates allege that a stopover in Taiwan was also planned, following the conclusion of Mainland activities. Photos from an NVIDIA Chinese new year celebratory event have been spreading across the internet lately—many were surprised to see Huang appear on-stage in Shanghai and quickly dispense with his trademark black leather jacket. He swapped into a colorful "Year of the Wood Dragon" sleeveless shirt for a traditional dance routine.

It was not all fun and games during Huang's first trip to China in four years—inside sources have informed the Wall Street Journey about growing unrest within the nation's top ranked Cloud AI tech firms. Anonymous informants allege that leadership, at Alibaba Group and Tencent, are not happy with NVIDIA's selection of compromised enterprise GPUs—it is posited that NVIDIA's President has spent time convincing key clients to not adopt natively-developed solutions (unaffected by US Sanctions). The short hop over to Taiwan is reported not to be for R&R purposes—insiders had Huang's visiting key supply partners; TSMC and Wistron. Industry experts think that these meetings are linked to NVIDIA's upcoming "Blackwell" B100 AI GPU, and "supercharged" H200 "Hopper" accelerator. It is too early for the rumor mill to start speculation about nerfed versions of NVIDIA's 2024 enterprise products reaching Chinese shores, but Jensen Huang is seemingly ready to hold diplomatic talks with all sides.

News reports from Asia point to an ongoing price battle between major chip foundries in the region—sluggish market conditions in 2023 have caused the big industry names to adjust charges, in concerted efforts to retain customers. This situation has escalated in early 2024—news media outlets claim that mainland China-situated factories have plenty of new production capacity, and are therefore eager to get their order books filled. The reports point to: "Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor and Jinghe Semiconductor lowering the price of tape-out services to chip design companies in Taiwan." Industry insiders believe that several Taiwanese IC designers have jumped onto better deals, as offered by Chinese facilities—it is alleged that Samsung, GlobalFoundries, UMC and Powerchip have all experienced a worrying increase in customer cancellations (at the tail end of 2023). The loss of long-term clients has forced manufacturers—in South Korea and Taiwan—into a price war.

TrendForce's analysis of market trends stated: "Due to the mature manufacturing processes in China, unaffected by US export restrictions, the lowered wafer fabrication costs have become attractive to Taiwanese IC design companies seeking to enhance their cost competitiveness. Reports also indicate that this competitive pressure has forced Taiwan's foundries, UMC and PSMC, to follow suit by reducing their prices. UMC has lowered its 12-inch wafer foundry services by an average of 10-15%, while its 8-inch wafer services have seen an average price reduction of 20%. These price adjustments took effect in the fourth quarter of 2023." Samsung is reportedly slashing prices by ~10-15%, and is expressing a "willingness to negotiate" with key clients in early 2024. Reports state this is a major change in attitude for the South Korean chip giant—allegedly, leadership was unwilling to budge on 2023 tape-out costs. TrendForce reckons that TSMC's response was a bit quicker: "(having) already initiated pricing concessions last year, mainly related to mask costs rather than wafer fabrication. It was reported that these concessions primarily applied to the 7 nm process and were dependent on order volumes."

Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

The recent attacks on cargo ships in the Red Sea are affecting not only oil shipments, but also cargo ships from Asia to Europe. All major carriers such as CMA CGM, Cosco, Evergreen, Hapag-Lloyd, Maersk, MSC and so forth are affected and all have delayed their shipments through the area. A coordinated security action called Operations Prosperity Guardian which includes over half a dozen nations so far, is getting ready to guide shipments through the affected area by Yemen, but it'll lead to slower shipments through the area.

TechPowerUp has already received reports from sources in Taiwan that their products are on some of these ships that are now stuck waiting for naval escorts through the area. However, it appears that there might be shortages of some computer components for the foreseeable future, alongside many other products that are being shipped this route and onwards via the Suez Canal. According to the BBC, it takes 25.5 days on average to ship goods from Taiwan to the Netherlands via the Red Sea and Suez Canal whereas the only alternative route via the Cape of Good Hope takes 34 days and adds extra fuel costs. Regardless of the extra shipping times and costs, it appears some shipping companies are willing to take the longer route to avoid being attacked. This is likely to have a knock on effect on prices for a lot of consumer goods in Europe, so if you haven't bought that hardware you've been holding off getting, now might be as good a time as any.

The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.

Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.

Microsoft is preparing a big update for its Windows operating system. Currently at version 11, the company is gearing up for the launch of Windows 12, which is supposed to bring a monumental shift in the tectonic plates of the regular PC user experience. Enhanced by AI, the Windows 12 OS should utilize many features like generative AI, large language models, some GPT integration, and many other tools that could benefit AI, like photo editors. The confirmation for the Windows 12 launch coming in 2024 is sourced from the Taiwanese Commercial Times, which analyzed comments from Barry Lam, the founder and chairman of PC contract manufacturer Quanta, and Junsheng (Jason) Chen, the chairman and chief executive of Acer.

Both of them underscored the importance of AI and that AI PCs are coming with the next version of Windows. Supposedly, the launch date for Windows 12 is set for June 2024. In that timeframe, hardware vendors should roll out their SoCs embedding AI processing elements at every silicon block. Qualcomm is set to debut its Snapdragon Elite X SoCs in mid-2024, aligning with the alleged release schedule of Windows 12. With more players like NVIDIA, AMD, and others planning to utilize an Arm instruction set for their next-generation PC chips, we expect to see Windows 12 get full-fledged support for Arm ISA and treat it like a first-class citizen in the OS.

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

Pierre Ferragu, the Global Technology Infrastructure chief at New Street Research, has predicted a very positive 2025 financial outcome for Taiwan Semiconductor Manufacturing Company Limited (TSMC). A global slowdown in consumer purchasing of personal computers and smartphones has affected a number of companies including the likes of NVIDIA and AMD—their financial reports have projected a 10% annual revenue drop for 2023. TSMC has similarly forecast that its full year revenue for 2023 will settle at $68.31 billion, after an approximate 10% fall. Ferragu did not contest these figures—via his team's analysis—TSMC is expected to pull in $68 billion in net sales for this financial year.

The rumor mill has TSMC revising its revenue guidance for a third time this year—but company leadership has denied that this will occur. New Street Research estimates that conditions will improve next year, with an uptick in client orders placed at TSMC's foundries. Ferragu reckons that TSMC could hit an all-time revenue high of $100 billion by 2025. His hunch is based on the upcoming spending habits of VIP foundry patrons encompassing: "a bottom-up perspective, looking at how TSMC's top customers, which we all know very well, will contribute to such growth." The Taiwanese foundry's order books are reported to be filling up for next year, with Apple and NVIDIA seizing the moment to stand firmly at the front of the 3 nm process queue.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces. To assist the industry in grasping the key to high-end semiconductor manufacturing and integration capabilities, the Heterogeneous Integrated Chiplet System Package (Hi-CHIP) Alliance brings together leading semiconductor companies from Taiwan and around the world to provide comprehensive services, spanning from packaging design, testing and verification, to pilot production. Since its establishment in 2021, the alliance has accumulated important industry players as its members, including EVG, Kulicke and Soffa (K&S), USI, Raytek Semiconductor, Unimicron, DuPont, and Brewer Science. Looking forward, the alliance is set to actively explore its global market potential.

Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at ITRI and Chairman of the Hi-CHIP Alliance, indicated that advanced manufacturing processes have led to a considerable increase in IC design cycles and costs. Multi-dimensional chip design and heterogeneous integrated packaging architecture are key tools to tackle this demand in semiconductors. On top of that, the advent of GAI such as ChatGPT, which demands substantial computing power and transmission speed, requires even higher levels of integration capacity in chip manufacturing. ITRI has been committed to developing manufacturing technologies and upgrading materials and equipment to enhance heterogeneous integration technologies. Achievements include the fan-out wafer level packaging (FOWLP), 2.5 and 3D chips, embedded interposer connections (EIC), and programmable packages. With both local and foreign semiconductor manufacturer members, the Hi-CHIP Alliance is establishing an advanced packaging process production line to provide an integrated one-stop service platform.

Mass production at TSMC's Phoenix, Arizona Fab 21 facility has been delayed until 2025, but the top brass are keen to get some activity started at their North American foundry—it is possible that they want to avoid potential contract breaches, caused by various setbacks. Taiwan's Money DJ (interpreted by TrendForce) reports that a pilot scheme will be implemented by the first quarter of 2024—industry sources believe that a small batch trial run will result in 4000 to 5000 wafer starts per month (WSPM). Setup delays have dropped projected efficiency ratings—analysts reckon that the Arizona plant cannot match the sheer effectiveness of operations back in Taiwan.

TrendForce cites a number of factors, including: "a shortage of skilled equipment installation personnel, local union protests, and differences in overseas safety regulations have caused delays in equipment installation." TSMC chairman Mark Liu expressed optimism about the situation earlier this month—citing significant progress (at the Fab 21 site) over the past five months as an early sign of success for the project. Insiders claim that TSMC is considering a major upgrade of its currently in-construction Japanese facility—extra capacity at the existing location and a second foundry could be on the table.

TSMC's Japanese facilities are set to fabricate "mature-technology chips" (28 nm and 22 nm) once construction at the site concludes next year—this $8.6 billion fab on Kyushu Island is proving to be a promising prospect for company leadership back in Taiwan. A Reuters report suggests that more ambitious plans are afoot for Japan as a key production base—two anonymous insiders claim that problems encountered at the Arizona plant have caused a shift in focus onto other global TSMC sites.

There is potential for further expansion and upgrades in Kikuyo, Kumamoto Prefecture—TSMC has reportedly taken an "increasingly optimistic view" of Japan's work culture, relatively cheap-to-build facility and a co-operative government. A smooth ramp-up of the first fabrication facility is the primary goal in 2024, but adjusted plans could add more capacity. The insiders think that a second site is also a possibility, with consideration for more advanced chip making.

We're happy to share that ordering is now available in Taiwan! That includes the in-stock Framework Laptop 13 (13th Gen Intel Core) with Traditional Chinese keyboard, pre-orders for AMD Ryzen 7040 Series and Framework Laptop 16, and the modules in the Framework Marketplace. This is an especially important launch for us because our manufacturing site for laptops, our main warehouse, and about a third of the Framework team itself are all in Taiwan. This also means that shipping is going to be ultra fast for local customers! As always, we're continuing to build out infrastructure to reach more of you across the world. We're in 13 countries now, and actively preparing for more. The best way to let us know where to go next is to register your interest on the country selection page.

Starting production on Framework Laptop 13 (AMD Ryzen 7040 Series)
We're also excited to announce that we've started mass production of Framework Laptop 13 (AMD Ryzen 7040 Series)! A set of electrical issues we found during validation along with late delivery of firmware from our upstream suppliers required us to delay our original production schedule. We've been sending bi-weekly status updates on this to customers in Batches 1-3 whose orders were at risk of delay. This week, we kicked off SMT (surface mount production of Mainboards) in Taiwan, which feeds into FATP (final assembly, test, and pack out of laptops) in the same factory, after which we'll transfer inventory to our warehouse and start shipments. We've doubled production capacity and moved into a new, larger logistics warehouse since the launch of 13th Gen Intel Core earlier this year, so we're confident we'll be able to move through the pre-order backlog quickly.

Taiwan's Economic Daily reckons that a freshly formed partnership between TSMC, Broadcom, and NVIDIA will result in the development of cutting-edge silicon photonics. The likes of IBM, Intel and various academic institutes are already deep into their own research and development processes, but the alleged new alliance is said to focus on advancing AI computer hardware. The report cites a significant allocation of—roughly 200—TSMC staffers onto R&D involving the integration of silicon photonic technologies into high performance computing (HPC) solutions. They are very likely hoping that the usage of optical interconnects (on a silicon medium) will result in greater data transfer rates between and within microchips. Other benefits include longer transmission distances and a lower consumption of power.

TSMC vice president Yu Zhenhua has placed emphasis on innovation, in a similar fashion to his boss, within the development process (industry-wide): "If we can provide a good silicon photonics integrated system, we can solve the two key issues of energy efficiency and AI computing power. This will be a new one...Paradigm shift. We may be at the beginning of a new era." The firm is facing unprecedented demand from its clients—it hopes to further expand its advanced chip packaging capacity to address these issues by late 2024. A shift away from the limitations of "conventional electric" data transmissions could bring next generation AI compute GPUs onto the market by 2025.

TSMC Chairman Mark Liu was asked to comment on all things artificial intelligence-related at the SEMICON Taiwan 2023 industry event. According to a Nikkei Asia report, he foresees supply constraints lasting until the tail end of 2024: "It's not the shortage of AI chips. It's the shortage of our chip-on-wafer-on-substrate (COWOS) capacity...Currently, we can't fulfill 100% of our customers' needs, but we try to support about 80%. We think this is a temporary phenomenon. After our expansion of advanced chip packaging capacity, it should be alleviated in one and a half years." He cites a recent and very "sudden" spike in demand for COWOS, with numbers tripling within the span of a year. Market leader NVIDIA relies on TSMC's advanced packaging system—most notably with the production of highly-prized A100 and H100 series Tensor Core compute GPUs.

These issues are deemed a "temporary" problem—it could take around 18 months to eliminate production output "bottlenecks." TSMC is racing to bolster its native activities with new facilities—plans for a new $2.9 billion advanced chip packaging plant (in Miaoli County) were disclosed during summer time. Liu reckons that industry-wide innovation is necessary to meet growing demand through new methods to "connect, package and stack chips." Liu elaborated: "We are now putting together many chips into a tightly integrated massive interconnect system. This is a paradigm shift in semiconductor technology integration." The TSMC boss reckons that processing units fielding over one trillion transistors are viable within the next decade: "it's through packaging with multiple chips that this could be possible.".

Yesterday we pre-announced that we're developing an SD Expansion Card. Normally we don't announce a product until we've fully locked the feature-set, brought up the necessary suppliers and manufacturing environment, completed most of the engineering and a substantial level of testing and validation, and are on a high confidence path to a specific release date at a specific price. This is because development of brand new products requires charting a course into the unknown. We set a target for what the product will be from the start, but as we proceed and learn, we often need to adjust the schedule, scope, and cost, and sometimes even need to outright pause or cancel development. Announcing just before shipping is how most companies operate to reduce churn and public uncertainty, but it means the product development process ends up extremely opaque.

We decided we're going to treat this one product on our roadmap a little differently. A full-size SD Expansion Card is consistently the most requested Expansion Card by the community, which makes it a great one to open up. We're just at the start of the process now, and Hyelim on our Marketing team is creating a new YouTube series to share updates and insights as we go through the New Product Introduction (NPI) process. Take a look at the first video (below) and let us know what you think as we complete (or don't complete) the product.

Framework products are now available to order in three more countries: Italy, Spain, and Belgium! That includes Framework Laptop 13, Framework Laptop 16 pre-orders, and the range of modules and parts in the Framework Marketplace. We have Italian, Spanish, and Belgian keyboard layouts available as well. This brings the total number of countries we're in up to 12 (US, Canada, Germany, France, UK, Netherlands, Ireland, Austria, Australia, Italy, Spain, Belgium) and we're still on track to open ordering in Taiwan later this summer. We know there are more of you out there who want upgradeable, repairable, customizable products, and we're continuing to build the infrastructure to expand to more of the world. We prioritize countries based both on the operational complexity and on community interest. The best way to help us gauge demand is by signing up for the waitlist for your country.

13th Gen Intel Core now in stock
We've shipped out the last batch of pre-orders, and the Framework Laptop 13 (13th Gen Intel Core) is now in stock and shipping from inventory, including for shipments to the three new countries. This means after placing an order, your laptop will ship within five business days from our warehouse in Taiwan. If you're past the point of repair on your current system and are looking for a high-performance, upgradeable, repairable notebook, check out the reviews from The Verge, Tom's Guide, and Ars Technica to figure out if a Framework Laptop 13 is for you.

T-FORCE, the gaming division of Team Group, today announced the addition of new coolers to its lineup, including the T-FORCE DARK AirFlow I SSD Cooler and the T-FORCE RT-X120 ARGB Fan. In response to the rapid development of consumer storage products, especially the transition from PCIe Gen 4 SSDs to PCIe Gen 5 SSDs, Team Group provides a complete cooling solution for the hotter temperatures of PCIe Gen 5 SSDs during high transfer speeds. Team Group cooler allows SSDs to maintain optimal operating temperatures and achieve stable high-speed operation over sustained periods, providing consumers with a flawless read and write experience with the latest Gen 5 SSDs.

The T-FORCE DARK AirFlow I SSD Cooler was granted a Taiwan Utility Model Patent this year. It uses graphene patented dual-layer structure for cooling and two 5 mm diameter pure copper heat pipes with multi-layered aluminium alloy cooling fins to multiply the cooling area and accelerate heat transfer and dispersion. In addition, it features a high-pressure smart PWM fan that can precisely adjust fan speeds according to the temperature to efficiently remove heat accumulated in the aluminium fins. The cooling structure utilizes patented ultra-thin graphene, excellent thermal conductive material, increased cooling area, and a high air pressure smart PWM fan, and other cooling methods to make the M.2 2280 Gen 5 SSDs run stably and transfer at extremely fast speeds, creating the highest performing active M.2 2280 Gen 5 SSD cooler.

TSMC today held an inauguration ceremony for its global Research and Development Center in Hsinchu, Taiwan, celebrating the Company's newest hub for bringing the next generations of semiconductor technology into reality with customers, R&D partners in industry and academia, design ecosystem partners, and senior government leaders.

The R&D Center will serve as the new home for TSMC's R&D Organization, including the researchers who will develop TSMC's leading-edge process technology at the 2-nanometer generation and beyond, as well as scientists and scholars blazing the trail with exploratory research into fields such as novel materials and transistor structures. With R&D employees already relocating to their workplaces in the new building, it will be ready for its full complement of more than 7,000 staff by September 2023.

Stan Shih, the co-founder & honorary chairman of Acer Inc., thinks that the USA will have hard time catching up with Asian semiconductor production facilities. Yahoo Taiwan managed to extract some choice comments from the multi-faceted businessman—he believes that the US government's initiative to boost native chip making will not be enough to match existing overseas strongholds. A key area of focus was volume output—Shih reckons that North America is already too far behind Asian counterpart industries, with Acer's home base of Taiwan being particularly strong (in his opinion). Workplace culture and state of the art equipment are cited as the main pillars for success.

Shih observed that that US chip industry has historically been far too reliant on outsourcing (going back many decades) production to foreign facilities, and Asia's position has been fortified thanks to long established and optimized supply chains—he thinks that the American system is not mature enough to reach parity. On a semi-related note, TSMC is reportedly struggling to get its new US facility fully operational—company chairman Mark Liu (according to Tom's Hardware): "said that the Taiwanese company would delay mass production of its Arizona fab from early 2024 to 2025, partly due to a lack of cleanroom tools necessary to produce chips at scale." TSMC has been transferring staff from its home turf to plug staffing gaps at the Phoenix facility—Liu divulged his latest batch of complaints during an earnings conference (last Thursday): "We are encountering certain challenges, as there is an insufficient number of skilled workers with the specialized expertise required for equipment installation in a semiconductor-grade facility."

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial computing solutions, unveils the SI-624-AI industrial AI computer, which won the Embedded Computing Design's Embedded World 2023 Best in Show Award in Germany. This recognition highlights the exceptional performance and innovation of the rugged system in the field of AI deep learning.

The SI-624-AI is designed to meet the demands of high-speed multiple tasks for artificial neural network applications. Powered by the 12th Gen Intel Core CPU and incorporating the NVIDIA Ampere Architecture MXM GPU, this cutting-edge system delivers image processing capabilities that enable real-time analysis of visual data, enhancing automation, quality control, and overall production efficiency for AIoT applications in smart factory, retail, transportation or medical fields. It is suitable for use as a digital signage control system in mission-critical control rooms in transportation networks, smart retail, healthcare, or AI education where remote AI data analysis capabilities are required.

A Newegg product page popped up last week, giving us a first glimpse at ASRock's Phantom Gaming Arc A770 16 GB graphics card. The e-tailer had no stock available on July 20, but the listing included an asking price of $329.99 (MSRP is $349). The Taiwanese manufacturer was radio silent at the time—no press material was released, and their own website was not updated with a product page for the 16 GB variant of its existing custom Alchemist design.

The ASRock Arc A770 Phantom Gaming 16 GB OC model's page is now live and fully accessible, and Newegg appears to have units in stock. TPU has not received any fresh PR material, so ASRock is seemingly taking a quiet approach to their new product's launch. The spec sheet shows that the card's memory clock comes in at 17.5 Gbps, which makes it a good alternative to Intel's recently discontinued A770 Limited Edition. It joins Acer's competing Predator BiFrost model in an exclusive club—these are the only 16 GB A770 custom design graphics cards available in the West.

AMD's CEO Lisa Su is reported to be visiting a number of companies in Taiwan this week—one of her objectives seems to be getting next generation AM5 desktop platforms prepped with USB4 support. Hardware news site MyDrivers believes that Asmedia played host to Team Red's leader at some point—this is a significant development given that this Taiwanese company specializes in making motherboard chipsets and USB controllers, although Su has allegedly met with other competing firms. Asmedia is reported to be a market leader in terms of implementing the latest USB4 tech, with certification awarded by the USB-IF Association.

Prior leaks have implied that the two companies are already involved with each other on a separate project—their collective goal being Thunderbolt 4 support on next-gen AMD platforms. The timing of this trip to Taiwan suggests that forthcoming AM5 motherboards offering USB4 support could be lined up for launch next year, alongside the "Zen 5" Ryzen 8000 CPU series. Boards based on current gen A620, B650 and X670 chipsets could be refreshed with the latest USB connectivity standard.

Last week Bethesda announced AMD as its exclusive partner for Starfield on the PC platform, although the short video presentation did not tease upcoming hardware/software bundles. Details of a Ryzen 7000-series CPUs promotional campaign emerged seven days later thanks to a mini-store page appearing on Newegg's retail site. The Starfield promo was not active at the time, but AMD Taiwan has made it official that the event will be going live on July 11 (at least in that territory).

According to the freshly published event site their offer will be running until September 30, and product serial numbers will not be redeemable after October 28. Eligible hardware includes the aforementioned Ryzen 7000 processor family, as well as Radeon GPUs. Thankfully Team Red has made sure to make a significant number of RDNA 2 models eligible for the Starfield incentive, with the entry point being RX 6600. All discrete RDNA 3 cards qualify—starting with RX 7600 and jumping up to the expensive RX 7900 XT and 7900 XTX GPUs. AMD Taiwan's info graphics show a two tier system—Standard Edition (NT$1990) applies to buyers of Ryzen 5/7 7000 series CPUs or Radeon 6600 through 7600 cards. Premium Edition (NT$2890) will grant a 5-day early access period—exclusive to buyers of Ryzen 9 7000 CPUs or Radeon cards starting at RX 6700.