Once trusted as the staple of technology journalism, the website CNET has been publically demoted to Untrusted Sources on Wikipedia. CNET has faced public criticism since late 2022 for publishing AI-generated articles without disclosing humans did not write them. This practice has culminated in CNET being demoted from Trusted to Untrusted Sources on Wikipedia, following extensive debates between Wikipedia editors. CNET's reputation first declined in 2020 when it was acquired by publisher Red Ventures, who appeared to prioritize advertising and SEO traffic over editorial standards. However, the AI content scandal accelerated CNET's fall from grace. After discovering the AI-written articles, Wikipedia editors argued that CNET should be removed entirely as a reliable source, citing Red Ventures' pattern of misinformation.

One editor called for targeting Red Ventures as "a spam network." AI-generated content poses familiar challenges to spam bots - machine-created text that is frequently low quality or inaccurate. However, CNET claims it has stopped publishing AI content. This controversy highlights rising concerns about AI-generated text online. Using AI-generated stories might seem interesting as it lowers the publishing time; however, these stories usually rank low in the Google search index, as the engine detects and penalizes AI-generated content probably because Google's AI detection algorithms used the same training datasets as models used to write the text. Lawsuits like The New York Times v. OpenAI also allege AIs must scrape vast amounts of text without permission. As AI capabilities advance, maintaining information quality on the web will require increased diligence. But demoting once-reputable sites like CNET as trusted sources when they disregard ethics and quality control helps set a necessary precedent. Below, you can see the Wikipedia table about CNET.

The artificial intelligence boom is driving a sharp rise in electricity use across the United States, catching utilities and regulators off guard. In northern Virginia's "data center alley," demand is so high that the local utility temporarily halted new data center connections in 2022. Nation-wide, electricity consumption at data centers alone could triple by 2030 to 390 TeraWatt Hours. Add in new electric vehicle battery factories, chip plants, and other clean tech manufacturing spurred by federal incentives, and demand over the next five years is forecast to rise at 1.5%—the fastest rate since the 1990s. Unable to keep pace, some utilities are scrambling to revise projections and reconsider previous plans of closing fossil fuel plants even as the Biden administration pushes for more renewable energy. Some older coal power plans will stay online, until the grid adds more power production capacity. The result could be increased emissions in the near term and risks of rolling blackouts if infrastructure continues lagging behind demand.

The situation is especially dire in Virginia, the world's largest data center hub. The state's largest utility, Dominion Energy, was forced to pause new data center connections for three months last year due to surging demand in Loudoun County. Though connections have resumed, Dominion expects load growth to almost double over the next 15 years. With data centers, EV factories, and other power-hungry tech continuing rapid expansion, experts warn the US national electricity grid is poorly equipped to handle the spike. Substantial investments in new transmission lines and generation are urgently needed to avoid businesses being turned away or blackouts in some regions. Though many tech companies aim to power operations with clean energy, factories are increasingly open to any available power source.

Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

International Data Corporation (IDC) has upgraded its Semiconductor Market Outlook by calling a bottom and return to growth that accelerates next year. IDC raised its September 2023 revenue outlook from $518.8 billion to $526.5 billion in a new forecast. Revenue expectations for 2024 were also raised from $625.9 billion to $632.8 billion as IDC believes the U.S. market will remain resilient from a demand standpoint and China will begin recovering by the second half of 2024 (2H24).

IDC sees better semiconductor growth visibility as the long inventory correction subsides in two of the largest market segments: PCs and smartphones. Automotive and Industrials elevated inventory levels are expected to return to normal levels in 2H24 as electrification continues to drive semiconductor content over the next decade. Technology and large flagship product introductions will drive more semiconductor content and value across market segments in 2024 through 2026, including the introduction of AI PCs and AI Smartphones next year and a much-needed improvement in memory ASPs and DRAM bit volume.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

According to the editorial blog post published on the Samsung blog by SangJoon Hwang, Executive Vice President and Head of the DRAM Product & Technology Team at Samsung Electronics, we have information that High-Bandwidth Memory 4 (HBM4) is coming in 2025. In the recent timeline of HBM development, we saw the first appearance of HBM memory in 2015 with the AMD Radeon R9 Fury X. The second-generation HBM2 appeared with NVIDIA Tesla P100 in 2016, and the third-generation HBM3 saw the light of the day with NVIDIA Hopper GH100 GPU in 2022. Currently, Samsung has developed 9.8 Gbps HBM3E memory, which will start sampling to customers soon.

However, Samsung is more ambitious with development timelines this time, and the company expects to announce HBM4 in 2025, possibly with commercial products in the same calendar year. Interestingly, the HBM4 memory will have some technology optimized for high thermal properties, such as non-conductive film (NCF) assembly and hybrid copper bonding (HCB). The NCF is a polymer layer that enhances the stability of micro bumps and TSVs in the chip, so memory solder bump dies are protected from shock. Hybrid copper bonding is an advanced semiconductor packaging method that creates direct copper-to-copper connections between semiconductor components, enabling high-density, 3D-like packaging. It offers high I/O density, enhanced bandwidth, and improved power efficiency. It uses a copper layer as a conductor and oxide insulator instead of regular micro bumps to increase the connection density needed for HBM-like structures.

Jon Peddie Research reports the growth of the global PC-based graphics processor unit (GPU) market reached 61.6 million units in Q2'23 and PC CPU shipments decreased by -23% year over year. Overall, GPUs will have a compound annual growth rate of 3.70% during 2022-2026 and reach an installed base of 2,998 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in the PC will grow to reach a level of 32%.

Year to year, total GPU shipments, which include all platforms and all types of GPUs, decreased by -27%, desktop graphics decreased by -36%, and notebooks decreased by -23%.

International Data Corporation (IDC) today published its second forecast for the worldwide quantum computing market, projecting customer spend for quantum computing to grow from $1.1 billion in 2022 to $7.6 billion in 2027. This represents a five-year compound annual growth rate (CAGR) of 48.1%. The forecast includes base quantum computing as a service as well as enabling and adjacent quantum computing as a service.

The new forecast is considerably lower than IDC's previous quantum computing forecast, which was published in 2021. In the interim, customer spend for quantum computing has been negatively impacted by several factors, including: slower than expected advances in quantum hardware development, which have delayed potential return on investment; the emergence of other technologies such as generative AI, which are expected to offer greater near-term value for end users; and an array of macroeconomic factors, such as higher interest and inflation rates and the prospect of an economic recession.

Corsair Gaming, Inc. ("Corsair" or the "Company"), a leading global provider and innovator of high-performance gear for gamers, streamers, content-creators, and gaming PC builders, today announced financial results for the second quarter ended June 30, 2023, and reiterated its financial outlook for the full year 2023.

Second Quarter 2023 Select Financial Metrics

• Net revenue was $325.4 million compared to $283.9 million in the second quarter of 2022, an increase of 14.6%. Gaming components and systems segment net revenue was $246.7 million compared to $194.9 million in the second quarter of 2022, while Gamer and creator peripherals segment net revenue was $78.8 million compared to $89.0 million in the second quarter of 2022.
• Net income attributable to common shareholders was $1.1 million, or net income of $0.01 per diluted share, compared to a net loss of $59.4 million, or a net loss of $0.62 per diluted share, in the second quarter of 2022.
• Adjusted net income was $9.8 million, or net income of $0.09 per diluted share, compared to adjusted net loss of $19.0 million, or a net loss of $0.20 per diluted share, in the second quarter of 2022.
• Adjusted EBITDA was $17.8 million, compared to a loss of $11.0 million in the second quarter of 2022.
• Cash and cash equivalents were $184.0 million as of June 30, 2023.

Intel decided to drop the relatively new AVX-512 instruction set for laptop/mobile platforms when it was discovered that it would not work in conjunction with their E-core designs. Alder Lake was the last generation to (semi) support these sets thanks to P-cores agreeing to play nice, albeit with the efficiency side of proceedings disabled (via BIOS settings). Intel chose to fuse off AVX-512 support in production circa early 2022, with AMD picking up the slack soon after and working on the integration of AVX-512 into Zen 4 CPU architecture. The Ryzen 7040 series is the only current generation mobile platform that offers AVX-512 support. Phoronix decided to benchmark a Ryzen 7 7840U against older Intel i7-1165G7 (Tiger Lake) and i7-1065G7 (Ice Lake) SoCs in AVX-512-based workloads.

Team Red's debut foray into AVX-512 was surprisingly performant according to Phoronix's test results—the Ryzen 7 7840U did very well for itself. It outperformed the 1165G7 by 46%, and the older 1065G7 by an impressive 63%. The Ryzen 7 APU was found to attain the highest performance gain with AVX-512 enabled—a 54% performance margin over operating with AVX-512 disabled. In comparison Phoronix found that: "the i7-1165G7 Tiger Lake impact came in at 34% with these AVX-512-heavy benchmarks or 35% with the i7-1065G7 Ice Lake SoC for that generation where AVX-512 on Intel laptops became common."

In July 2022, Intel announced that the company was winding down its Optane division, effectively discontinuing the development of 3D XPoint memory that it has been marketing for a long time. Once viewed as a competitive advantage, the support for Optane has been removed from future platforms. However, Intel has announced plans to extend Optane shipments by another quarter amidst additional stock or significant demand from customers buying Optane DIMMs for their enterprises. Initially set to ship the final Optane Persistent Memory 100-series DIMMs on September 30, Intel extends this date by three months to December 29, 2023.

Intel states, "Customers are recommended to secure additional Optane units at the specified 0.44% annualized failure rate (AFR) for safety stock. Intel will make commercially reasonable efforts to support last time order quantities for Intel Optane Persistent Memory 100 Series."

NVIDIA's compute and AI-oriented H100 GPU is supposedly getting an upgrade. The H100 GPU is NVIDIA's most powerful offering and comes in a few different flavors: H100 PCIe, H100 SXM, and H100 NVL (a duo of two GPUs). Currently, the H100 GPU comes with 80 GB of HBM2E, both in the PCIe and SXM5 version of the card. A notable exception if the H100 NVL, which comes with 188 GB of HBM3, but that is for two cards, making it 94 GB per each. However, we could see NVIDIA enable 94 and 64 GB options for the H100 accelerator soon, as the latest PCI ID Repository shows.

According to the PCI ID Repository listing, two messages are posted: "Kindly help to add H100 SXM5 64 GB into 2337." and "Kindly help to add H100 SXM5 94 GB into 2339." These two messages indicate that NVIDIA could prepare its H100 in more variations. In September 2022, we saw NVIDIA prepare an H100 variation with 120 GB of memory, but that still isn't official. These PCIe IDs could just come from engineering samples that NVIDIA is testing in the labs, and these cards could never appear on any market. So, we have to wait and see how it plays out.

According to the report from Reuters, Acer has apparently continued shipment of computer hardware to Russia, despite the firm supposedly suspending its operations in the country. With the war in Ukraine, on April 8 of, 2022, Acer published a statement: "Due to recent developments, Acer has decided to suspend its business in Russia." However, today Reuters reports that it has gained access to documents/data of customs that confirm that Acer has shipped computer hardware worth at least 70.4 million US Dollars between the period of April 8, 2022, and March 31, 2023.

Interestingly, Acer is a firm headquartered in Taiwan. However, Switzerland-based Acer Sales International SA entity shipped these units to Russia, thus not violating any Taiwanese sanctions to Russia that are in place. When asked about these shipments, Acer in Taiwan responded: "We strictly adhere to applicable international regulations and trade laws regarding exports to Russia." Additionally, the company stated that the Swiss subsidiary "had not shipped any laptops or desktops to Russia since April 8 last year." Still, instead, it had supplied a "limited number of displays and accessories to the Russian market for civilian daily use while ensuring compliance with international sanctions."

Lenovo Group today announced full-year results, reporting Group revenue of US$62 billion and net income of US$1.6 billion, or US$1.9 billion on a non-Hong Kong Financial Reporting Standards (HKFRS) [1] basis. Profitability was stable with gross margin and operating margin both delivering 18-year highs and non-HKFRS net margin flat year-to-year. While Group revenue was impacted due to the softness in the device market, revenue from non-PC businesses reached a fiscal year high of nearly 40%, fueled by Lenovo's diversified growth engines of Solutions and Services Group (SSG) and Infrastructure Solutions Group (ISG) growing revenue to record highs of US$6.7 billion and US$9.8 billion respectively, up 22% and 37% year-on-year.

After a year of industry and global uncertainties, Lenovo sees positive signs of the market stabilizing. The Group expects the entire PC and smart devices market to resume year-to-year growth in the second half of 2023, and for the IT services market to resume relatively high growth - together these will drive the total IT market in 2023 back to moderate growth. In the mid-to-long term, digital and intelligent transformation will continue to accelerate, leading to a big growth potential for cloud and computing infrastructure.

In its recent Second Quarter of the Fiscal Year 2023 conference, Synopsys issued interesting information about the recent moves of chip developers and their usage of artificial intelligence. As the call notes, over 200+ chips have been taped out using Synopsys DSO.ai place-and-route (PnR) tool, making it a successful commercially proven AI chip design tool. The DSO.ai uses AI to optimize the placement and routing of the chip's transistors so that the layout is compact and efficient with regard to the strict timing constraints of the modern chip. According to Aart J. de Geus, CEO of Synopsys, "By the end of 2022, adoption, including 9 of the top 10 semiconductor vendors have moved forward at great speed with 100 AI-driven commercial tape-outs. Today, the tally is well over 200 and continues to increase at a very fast clip as the industry broadly adopts AI for design from Synopsys."

This is an interesting fact that means that customers are seeing the benefits of AI-assisted tools like DSO.ai. However, the company is not stopping there, and a whole suite of tools is getting an AI makeover. "We unveiled the industry's first full-stack AI-driven EDA suite, sydnopsys.ai," noted the CEO, adding that "Specifically, in parallel to second-generation advances in DSO.ai we announced VSO.ai, which stands for verification space optimization; and TSO.ai, test space optimization. In addition, we are extending AI across the design stack to include analog design and manufacturing." Synopsys' partners in this include NVIDIA, TSMC, MediaTek, Renesas, and IBM Research, all of which used AI-assisted tools for chip design efforts. A much wider range of industry players is expected to adopt these tools as chip design costs continue to soar as we scale the nodes down. With future 3 nm GPU costing an estimated $1.5 billion, 40% of that will account for software, and Synopsys plans to take a cut in that percentage.

Three years ago, Intel announced a goal to increase global annual spending with diverse suppliers to $2 billion by 2030. We are proud to announce we reached $2.2 billion in diverse supplier spending in 2022, eight years ahead of schedule. This $2.2 billion represents nearly 15 times the annual total when our supplier diversity program launched in 2015 and double our 2019 results.

According to data from Mercury Research posted on Twitter, AMD has gained CPU market share against Intel over the past year. AMD has gone from a 27.7 percent market share in Q1 2022 to a 34.6 percent market share in the first quarter of 2023, which is an increase of 6.9 percent, whereas Intel has gone from 72.3 percent to 65.4 percent, still placing Intel at almost two thirds of the market of x86 CPUs. It should be noted that this includes all types of CPUs, but it's unclear if it includes the chips AMD sells to Microsoft and Sony for their respective consoles.

A separate screenshot posted by @firstadopter details server CPU market share, excluding IoT, although it's unclear what that means in this specific case. Here, AMD has gained 6.3 percent market share, but the company has only gone from a meager 11.6 percent last year, to 18 percent this year, with Intel holding a massive 82 percent market share. AMD's gain here was lower than overall, but it shows that larger corporations are starting to adopt more and more AMD hardware on the server side, where in all fairness, AMD has taken something of a lead over Intel when it comes to the maximum amount of CPU cores each company can offer, even though the per core performance still lags behind Intel to a degree. It'll be interesting to see if AMD can maintain its momentum in market share gain once Intel launches more competitive products later this year, especially in the server market space.

MediaTek has been unveiling some new mobile chipsets this week, but keen-eyed news outlets have noticed that the Taiwanese fabless semiconductor company is simply renaming and relaunching hardware from last year, with some tweaks here and there. Today's announcement of the Dimensity 8050 SoC was almost immediately questioned - GSMArena noticed that this "new" model was a near dead ringer, in terms of specifications, for last year's mid-range Dimensity 1300 and 1200 smartphone chipsets. There are some upgrades in terms of memory bandwidth, and MediaTek boasts that the 8050 has been updated with its sixth generation HyperEngine technology.

Alarm bells were ringing when folks realized that the much older Dimensity 8000 SoC was built on a 5 nm process - the supposedly superior (in terms of model number hierarchy) 8005 is a 6 nm chip. Last week the mobile specialist site also spotted that MediaTek's Dimensity 7050 chipset was yet another example of the smartphone tech company rolling out a "rebranding phase." The news outlet pointed out that this newly revealed mobile CPU was just a renamed Dimensity 1080 - with the original model having hit the market in November 2022. MediaTek seems to renaming several older chipsets based on TSMC's 6 nm process - it is possible that this effort is part of a company drive to clear surplus silicon.

Meta Platforms, Inc. (formerly known as Facebook) has begun implementing widespread staff layoffs across multiple company departments. The cutback operation was announced last month, with the social media giant targeting 10,000 positions (throughout 2023) in an effort to become more efficient. 13,000 staffers were released from their jobs last year, representing 13% of the workforce at the time - advertising revenues had declined in 2022 and Meta said that the change was required in order to navigate economic downturns. A repeat of that sentiment has been issued this year and two internal games development studios have been affected quite heavily by the latest layoff initiative, reports suggest. Ready at Dawn and Downpour Interactive are getting a lot of press coverage - due to former staffers divulging details of Meta's cutbacks via social media.

Thomas Griebel, a (now former) Senior engine programmer at Ready at Dawn, took to Twitter two days ago and made claim that: "One third of the studio was laid off today, including the studio head." He also observes that the studio has been shrinking over time: "Also lost some really great people just due to attrition. Think we're down almost (down to a) half since when I started in August (2022)." Former Ready at Dawn technical designer Colin McInerney has also released a string of information about co-workers being let go. Michael Tsarouhas (senior designer) and Daan van Zelst (level designer) have confirmed that they were released from their roles at Downpour Interactive.

or the fifth consecutive month, International Data Corporation (IDC) has lowered its 2023 forecast for worldwide IT spending as technology investments continue to show the impact of a weakening economy. In its new monthly forecast for worldwide IT spending growth, IDC projects overall growth this year in constant currency of 4.4% to $3.25 trillion. This is slightly down from 4.5% in the previous month's forecast and represents a swing from a 6.0% growth forecast in October 2022.

"Since the fourth quarter of last year, we have seen clear and measurable signs of a moderate pullback in some areas of IT spending," said Stephen Minton, vice president in IDC's Data & Analytics research group. "Tech spending remains resilient compared to historical economic downturns and other types of business spending, but rising interest rates are now impacting capital spending."

IBM today unveiled new single frame and rack mount configurations of IBM z16 and IBM LinuxONE 4, expanding their capabilities to a broader range of data center environments. Based on IBM's Telum processor, the new options are designed with sustainability in mind for highly efficient data centers, helping clients adapt to a digitized economy and ongoing global uncertainty.

Introduced in April 2022, the IBM z16 multi frame has helped transform industries with real-time AI inferencing at scale and quantum-safe cryptography. IBM LinuxONE Emperor 4, launched in September 2022, features capabilities that can reduce both energy consumption and data center floor space while delivering the scale, performance and security that clients need. The new single frame and rack mount configurations expand client infrastructure choices and help bring these benefits to data center environments where space, sustainability and standardization are paramount.

According to the International Data Corporation (IDC) Worldwide Quarterly Enterprise Infrastructure Tracker: Buyer and Cloud Deployment, spending on compute and storage infrastructure products for cloud deployments, including dedicated and shared IT environments, increased 16.3% year over year in the fourth quarter of 2022 (4Q22) to $24.1 billion. Spending on cloud infrastructure continues to outgrow the non-cloud segment although the latter had strong growth in 4Q22 as well, increasing 9.4% year over year to $18.7 billion. For the full year, cloud infrastructure grew 19.4% to $87.7 billion, while non-cloud grew 13.6% to $66.7 billion. The market continues to benefit from high demand, large backlogs, rising prices, and an improving infrastructure supply chain.

On the heels of a weaker than expected 2022, International Data Corporation (IDC) has lowered its forecast for augmented and virtual reality (AR/VR) headsets in 2023. Global shipments are now expected to reach 10.1 million units this year, according to the International Data Corporation (IDC) Worldwide Quarterly Augmented and Virtual Reality Headset Tracker. Despite the revised outlook, total AR/VR headset shipments are expected to grow 14% in 2023 and accelerate over the 2023-2027 forecast period with a five-year compound annual growth rate (CAGR) of 32.6%.

According to TrendForce's latest survey of the server market, many cloud service providers (CSPs) have begun large-scale investments in the kinds of equipment that support artificial intelligence (AI) technologies. This development is in response to the emergence of new applications such as self-driving cars, artificial intelligence of things (AIoT), and edge computing since 2018. TrendForce estimates that in 2022, AI servers that are equipped with general-purpose GPUs (GPGPUs) accounted for almost 1% of annual global server shipments. Moving into 2023, shipments of AI servers are projected to grow by 8% YoY thanks to ChatBot and similar applications generating demand across AI-related fields. Furthermore, shipments of AI servers are forecasted to increase at a CAGR of 10.8% from 2022 to 2026.