Micron Technology, Inc., today demonstrated its continued NAND technology leadership by announcing that its 232-layer QLC NAND is now in mass production and shipping in select Crucial SSDs, in volume production to enterprise storage customers and sampling to OEM PC manufacturers in the Micron 2500 NMVe SSD.

Micron 232-layer QLC NAND delivers unparalleled performance for use cases across mobile, client, edge and data center storage by leveraging these important capabilities:

• Industry-leading bit-density, up to 28% more compact than leading competitors'1 latest products
• Industry-leading NAND I/O speeds of 2400 MT/s, a 50% improvement over the prior generation
• 24% better read performance over the prior generation
• 31% better programming performance over the prior generation

The third quarter of 2023 witnessed suppliers dramatically cutting production, which underpinned enterprise SSD prices. The fourth quarter saw a resurgence in contract prices, driven by robust buying activity and heightened demand from server brands and buoyed by optimistic capital expenditure forecasts for 2024. This, combined with increased demand from various end products entering their peak sales period and ongoing reductions in OEM NAND Flash inventories, resulted in some capacity shortages. Consequently, fourth-quarter enterprise SSD prices surged by over 15%. TrendForce highlights that this surge in demand and prices led to a 47.6% QoQ increase in enterprise SSD industry revenues in 4Q23, reaching approximately $23.1 billion.

The stage is set for continued fervor as we settle into the new year and momentum from server brand orders continues to heat up—particularly from Chinese clients. On the supply side, falling inventory levels and efforts to exit loss-making positions have prompted enterprise SSD prices to climb, with contract prices expected to increase by over 25%. This is anticipated to fuel a 20% revenue growth in Q1.

Micron Technology, Inc. announced today that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in the world's most compact UFS package at 9x13 millimeters (mm). Built on its advanced 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides best-in-class performance and end-to-end innovation, enabling faster and more responsive experiences on flagship smartphones.

Micron UFS 4.0 accelerates data-intensive experiences with up to 4300 megabytes per second (MBps) sequential read and 4000 MBps sequential write speed, twice the performance of previous generations. With these speeds, users will be able to launch their favorite productivity, creativity, and emerging AI apps more quickly. Large language models in generative AI applications can be loaded 40% faster, resulting in a smoother experience when initializing conversations with AI digital companions.

Sabrent today announced its latest flagship M.2 NVMe SSD series, the Rocket 5. Built in the M.2-2280 form-factor, the Sabrent Rocket 5 is sold as a bare drive, with an included fan-heatsink that you install if needed. This cooler comes with a tiny fins-stack, two copper heat pipes, and a 20 mm fan. At the heart of the drive is the new Phison PS5026-E26 Max14um controller, paired with Micron B58R 232-layer 3D TLC NAND flash memory, and LPDDR4 based DRAM cache. The drive comes in 1 TB, 2 TB, and 4 TB capacity variants.

The company didn't put out capacity-specific performance or endurance numbers, but mentioned sequential read speeds of up to 14 GB/s, as is characteristic of the Max14um controller variant; up to 12 GB/s sequential write speeds, up to 1.55 million IOPS 4K random reads, with up to 1.8 million IOPS 4K random writes. The Rocket 5 replaces the Rocket 4 Plus as Sabrent's flagship SSD. The 4 TB variant is listed at $730, the 2 TB variant at $340, and the 1 TB variant at $190.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage, and gaming peripherals, proudly introduces the Viper PV553 M.2 2280 PCIe Gen 5 x4 SSD. This groundbreaking SSD is designed with the core idea of delivering next-gen performance, featuring an innovative active cooling system.

The PV553 introduces a revolutionary cooling solution as Patriot's first SSD with a blower fan design. Patriot Memory's cutting-edge advancements ensure active thermal dissipation, providing consistent cooling even during extended usage for intense gaming sessions. Crafted with premium materials and a slim 16.5 mm aluminium heat shield, the PV553 incorporates an embedded thermal sensor, guaranteeing unwavering high performance. With a 5-year warranty, this SSD exemplifies quality and reliability.

MSI Spatium M580 Liquid Frozr is easily one of the most interesting SSDs we've come across in CES 2024. Picture this—an M.2-2280 SSD that has a self-contained liquid cooler, complete with a fan, radiator, a pump-block, and coolant channels. This is both cute and a little sad. M.2 SSDs were supposed to stay out of sight and be completely cable-free, like DIMMs. This isn't MSI's fault, they have to use the fastest controllers in the market, which are built on older 12 nm foundry nodes. PCI-Express 5.0 x4 is comparable bandwidth to PCI-Express 3.0 x16, and moving this kind of data is bound to generate heat for an SSD controller. Enough banter—the Spatium M580 uses the fastest Phison E26 Max14um controller, with Micron's fastest B58R 232-layer 3D NAND flash chips that deliver 2400 MT/s per flash channel.

The combination of Phison Max14um and B58R results in sequential transfer speeds beyond the 14 GB/s mark, which is where most PCIe Gen 5 x4 drives will end up accounting for the interface+protocol overhead. The theoretical max bandwidth of Gen 5 x4 is 16 GB/s. The drive comes in capacities of up to 4 TB. As for the cooler's design, the bare drive makes contact with a copper cold-plate, which has the block+reservoir, with a tiny pump. This sends coolant through a real aluminium heat-exchanger—this is probably the smallest radiator we've ever seen. The radiator is held up, a supporting structure has a tiny 20 mm lateral-flow fan, which blows air through the radiator. We can't wait to review this thing!

Crucial, the client-focused brand of memory giant Micron Technology, showed off a handful new innovations at its booth along the sidelines of the 2024 International CES. First up, is a prototype USB4 portable SSD and prototype desktop SSD. These are proofs of concept, and not actual products. With this, Crucial is testing the waters with USB4 and its delicious 40 Gbps bidirectional bandwidth, which unlocks a new generation of fast removable storage devices. The prototype USB4 portable SSD comes in a tiny chassis about the size of a burner phone. It is a PCB with an M.2-2280 slot with PCIe Gen 4 x4 wiring, connected to an ASMedia ASM2464PD USB4 bridge chip. An OEM Micron Gen 4 SSD with 232-layer 3D TLC NAND flash and LPDDR4 DRAM cache, is installed on this drive. The CDM reading for this drive is 3821 MB/s sequential reads, with 885 MB/s sequential writes.

Next up, is a larger desktop SSD prototype (which again, isn't an actual product but a proof of concept). Its metal chassis is about the size of a 3.5-inch HDD. Inside is at least one M.2-2280 Gen 4 slot (there are probably more); with a preinstalled drive. An ASMedia ASM2464PD handles things here, too. The performance is mostly similar, at 3792 MB/s sequential reads, but with significantly increase 3803 MB/s sequential writes. This may seem unspectacular because Thunderbolt 4 has been delivering 40 Gbps for many years now, and we've had TB4-based external SSDs; but USB4 somewhat democratizes this kind of bandwidth.

Micron Technology, Inc., today announced it is shipping the Micron 3500 NVMe SSD, which leverages its 232-layer NAND to power demanding workloads for business applications, scientific computing, cutting-edge gaming and content creation, pushing the limits of what is possible. The Micron 3500 SSD, available in the M.2 form factor and with capacities up to 2 TB, provides a superior user experience over the competition as proven by its best-in-class SPECwpcsm performance, including an up to 71% improvement for product development applications.

"At Micron, we are focused on delivering exceptional products that best meet the rigorous needs of end-users," said Prasad Alluri, Micron's vice president and general manager of Client Storage. "With impressive specs like a remarkable 132% improvement in scientific computing benchmark scores, the 3500 SSD will turn your next PC or workstation into a powerhouse to enable insights and empower creativity."

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

Silicon Power (SP) is thrilled to announce its inaugural participation at the renowned Penny Arcade Expo (PAX) from October 6-8. Together with Mwave and Umart, the company's distributors in Australia, SP will offer exclusive promotions to gaming enthusiasts. The company will also showcase its cutting-edge gaming solutions, including the debut of its groundbreaking product, the XPOWER XS80 PCIe Gen 5 SSD. Taking place at the Melbourne Convention and Exhibition Centre (MCEC), PAX provides the perfect backdrop for SP to unveil its latest innovation, further solidifying the brand's commitment to delivering high-performance storage solutions for gamers.

Game-Changing Gen 5 Performance with the XS80
The XS80 offers exceptional gaming performance with the latest PCIe Gen 5 technology, NVMe 2.0 support, and 232-layer 3D NAND flash, delivering twice the data transfer rate of Gen 4 and four times that of Gen 3.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announced today the latest AORUS Gen5 12000 SSD with an M.2 2280 form factor. Harnessing the power of a PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, the AORUS Gen5 12000 SSD delivers a boosted performance of more than 70% over PCIe 4.0 SSDs with easy installation and superb capability. Equipped with the ultimate thermal design of M.2 Thermal Guard Extreme, the AORUS Gen5 12000 SSD becomes the perfect choice for power users, content creators, and gamers.

With PCIe 5.0 support on new motherboard platforms, the bandwidth and transfer performance are raised to the next level. The AORUS Gen5 12000 SSD is equipped with the latest Phison PS5026-E26 8-channel controller, providing users with superior control of random read speeds. Along with an over 232-layer stack structure of 3D-TLC NAND Flash and a built-in LPDDR4 cache design, the AORUS Gen5 12000 SSD unleashes the full potential of PCIe 5.0 performance with 12 GB/s ultra-fast access speed, which is more than a 70% increase compared to its predecessor. Furthermore, with AORUS optimized Direct Storage support, the AORUS Gen5 12000 SSD brings next-level performance with optimized stability.

The first batch of PCIe 5.0 NVMe SSDs didn't quite deliver on the promise of doubling performance from PCIe 4.0 NVMe SSDs, but now it appears that Sabrent has managed to work some magic with its upcoming Rocket X5 SSD. The SSD is still based on the same Phison E26 controller as all other current PCIe 5.0 NVMe drives and from what we know, the controller is paired to Micron's 232-layer B58R NAND, a combination that should be able to reach 2400 MT/s across eight channels. However, it's not the only drive with this combination of components, so it seems like the magic here might be in the firmware.

A 2 TB version of the Rocket X5 was tested in CrystalDiskMark 8.0.4 and reached a read speed of 14,179 MB/s or just over 14 GB/s, with write speeds trailing somewhat at 12,280 MB/s. The random 4K numbers are looking good too with 106 MB/s for reads and 448 MB/s for writes, a step up from the competition at least, if not a major one with regards to the read speed. The downside you ask? Sabrent has equipped the Rocket X5 with not only a heatsink and heatpipes, but also a tiny fan, which is likely to add some noise at some time in the future when the fan starts to give up. We obviously don't know the price of the Rocket X5 either, but Sabrent tends to have competitively priced products.

Micron Technology, Inc. announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND. Offered in high capacities up to 1 terabyte (TB), the UFS 4.0 storage solution is being shipped to select global smartphone manufacturers and chipset vendors. Micron's newest mobile flash storage outpaces competition on several critical NAND benchmarks, delivering the industry's fastest performance for flagship smartphones with fast bootup, app launches and video downloads.

"Micron's latest mobile solution tightly weaves together our best-in-class UFS 4.0 technology, proprietary low-power controller, 232-layer NAND and highly configurable firmware architecture to deliver unmatched performance," said Mark Montierth, corporate vice president and general manager of Micron's Mobile Business Unit. "Together, these technologies position Micron at the forefront of delivering the performance and low-power innovations our customers need to enable an exceptional end-user experience for flagship smartphones."

Micron Technology, Inc., today announced the release of two SSDs, the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD. Designed to keep pace with the accelerating growth of data, these drives provide a major advancement for data centers by lowering operating costs and improving storage efficiency. The Micron 6500 ION is a high-capacity SSD that offers a superior value over competitive QLC-based drives by providing best-in-class performance and enabling a more environmentally sustainable data center. The 6500 ION is able to deliver TLC performance and QLC-like cost due to Micron's 232-layer technology node leadership compared to the competition's use of sub-200-layer QLC technology. When paired with Micron 6500 ION drives or other SSDs, the Micron XTR SSD delivers extreme endurance that enhances system performance.

"Customers are looking for new capabilities to address the data growth and performance needs of artificial intelligence data lakes and other demanding workloads. As a result, we are seeing tremendous traction on the 6500 ION and XTR with customers who are deploying storage at scale due to their unrivaled combination of large capacity, superior performance, and amazing endurance," said Alvaro Toledo, vice president and general manager of Micron's Data Center Storage group. "The 6500 ION SSD offers QLC value with TLC performance and up to a 20% reduction in power consumption versus competing QLC SSDs, allowing our customers to reduce their carbon footprint. Together, these SSDs enable customers to leap ahead and harness the power of artificial intelligence without compromising performance."

According to the South China Morning Post (SCMP) sources, Yangtze Memory Technologies Corp (YMTC) has been plotting to manufacture its advanced 3D NAND flash using locally sourced equipment. As the source notes, YMTC has placed big orders from local equipment makers in a secret project codenamed Wudangshan, named after the Taoist mountain in the company's home province of Hubei. Last year, YTMC announced significant progress towards creating 200+ layer 3D NAND flash before other 3D NAND makers like Micron and SK Hynix. Called X3-9070, the chip is a 232-layer 3D NAND based on the company's advanced Xtacking 3.0 architecture.

As the SCMP finds, YTMC has placed big orders at Beijing-based Naura Technology Group, maker of etching tools and competitor to Lam Research, to manufacture its advanced flash memory. Additionally, YTMC has reportedly asked all its tool suppliers to remove all logos and other marks from equipment to avoid additional US sanctions holding the development back. This significant order block comes after the state invested 7 billion US Dollars into YTMC to boost its production capacity, and we see the company utilizing those resources right away. However, few industry analysts have identified a few "choke points" in YTMC's path to independent manufacturing, as there are still no viable domestic alternatives to US-based tool makers in areas such as metrology tools, where KLA is the dominant player, and lithography tools, where ASML, Nikon, and Canon, are noteworthy. The Wuhan-based Wudangshan project remains secret about dealing with those choke points in the future.

Galax is joining the PCIe 5.0 SSD crowd with its newest HOF Extreme 50 SSD that has been launched in China, and should come to the rest of the markets soon. The Galax HOF Extreme 50 will be only available in 1 TB and 2 TB capacities, and comes with thick heatsink with active cooling via PWM fan.

As it is the case with all other PCIe 5.0 SSDs currently on the market, the HOF Extreme 50 is based on Phison E26 controller paired up with Micron 232-layer 3D NAND flash and up to 4 GB of LPDDR4 DRAM cache. The Galax HOF Extreme 50 is not the fastest Phison E26-based PCIe 5.0 SSD announced, as Gigabyte Aorus Gen 5 1000, MSI Spatium M570 Pro, and Crucial T700, are coming and reaching up to 12 GB/s (12.4 GB/s for the Crucial T700).

TrendForce's latest investigations reveal that the global NAND Flash market has been facing a demand headwind since 2H22. In response, the supply chain has been scrambling to clear out inventory, driving down NAND Flash contract prices by 20-25%. Enterprise SSD took the brunt of the fall with prices plummeting 23-28%. Despite manufacturers lowering prices in an attempt to drive up demand, clients are hesitant to purchase more components for fear of overstock. As a result, NAND Flash bit shipments rose by a mere 5.3% as ASP fell 22.8%. Global NAND Flash revenue was reported to be US$10.29 billion in 4Q22—down 25% QoQ.

TrendForce reports that Kioxia and Micron saw both a reduction in production and price in 4Q22. Kioxia's revenue plunged 30.5% due to weak demand from PC and smartphone clients and data centers readjusting their inventory. Micron generated a quarterly revenue of US$1.1 billion—a staggering 34.7% QoQ drop—that has led them to drastically decrease their capacity utilization rate for fabs. Luckily, Micron was able to ship their 232-layer client SSDs in 4Q22 as scheduled, and with the 176-layer QLC enterprise SSD hot on its heels, Micron's bit shipments are predicted to steadily improve in 2023 with their revenue climbing gradually quarter by quarter.

It appears things are tougher at Micron than expected, as according to Boise State Public Radio, the company is looking at cutting an additional five percent of its workforce. Back in December, Micron announced it was planning to lay off around 10 percent of its global workforce, which at the time sat at around 49,000 employees, but it appears that cut wasn't enough, as company spokesman Tate Tran has confirmed the total headcount reduction is expected to around 15 percent, although that is for the entire year of 2023. This suggests that there might be several stages of layoffs, unless things improve and demand for Micron's products pick up.

The company is also lowering its capex, not just for 2023, but also for 2024, although the company is expecting more on building new fabs. Micron has already reduced its wafer starts, for both DRAM and NAND flash by around 20 percent. This is all taking place while the company is slowing down its tech node transitions and as such, its 1-gamma note will be moved to 2025. This means that Micron will be stuck at 232-layer 3D TLC NAND for longer than initially planned, which could lead to Micron losing market to its competitors, specifically SK Hynix and Samsung in this case, while allowing other competitors to catch up. Micron will reports is financial Q2 '23 results at the end of March, with previous quarters results indicating that Micron is expecting a drop in revenue of up to US$300 million compared to the previous quarter.

Mushkin at the 2023 International CES showed off its Vortex Redline and Vortex LX M.2 NVMe SSDs. The Vortex Redline is the company's top PCIe Gen 4 drive, combining an Innogrit IG5236 NVMe 1.4 controller with 3D TLC NAND flash, to offer transfer speeds of up to 7415 MB/s. The Vortex Redline comes in capacities of 512 GB, 1 TB, and 2 TB. The Vortex LX is a more value-oriented product, based on an unnamed Innogrit-sourced DRAMless controller. This drive features a PCIe Gen 4 interface, but offers slightly lower performance that the company didn't disclose.

The star attraction at the Mushkin booth was its Epsilon SSD that features a PCI-Express 5.0 x4 + NVMe 2.0 interface, a Phison E26-series controller, and next generation 3D NAND flash memory (possibly 232-layer). The drive features active cooling from a fan-heatsink, and while the company didn't talk about performance, drives based on this controller are known to offer up to 12 GB/s of sequential transfers. Lastly, the company showed off its lineup of 2.5-inch SATA 6 Gbps SSDs in capacities ranging all the way up to 16 TB, which are meant to be HDD replacements, and "warm" storage devices.

Acer at the 2023 International CES showed off its latest lineup of memory and storage products targeting the DIY PC enthusiast market segment under its high-end Predator brand. Leading the booth is the Vesta II line of DDR5 memory modules featuring a high-end product design, and RGB LED lighting. The one shown to us featured a rather modest DDR5-5200 speed and 2x 16 GB density, but the company assured it is spreading the lineup to higher frequencies. The Pallas II line of performance-segment memory targeting creators, for example, does DDR5-6000.

A star attraction in the booth was the Predator GM7 M.2 NVMe SSD. Built in the M.2-2280 form-factor, the drive features a PCI-Express 4.0 x4 + NVMe 2.0 host interface, and combines a Maxiotech MAP1602 controller with YMTC 232-layer 3D TLC NAND flash based on the Xtacking 3.0 architecture. The drive offers sequential transfer speeds of up to 7400 MB/s reads, with up to 6300 MB/s writes, and comes in sizes of 512 GB, 1 TB, and 2 TB, priced at USD $49.90, $89.90, and $159.99, respectively. Acer is backing these drives with a 5-year warranty.

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

YMTC delivered on its roadmaps to achieve a mass-production 232-layer 3D NAND flash memory, beating entrenched players Kioxia, Micron Technology, Samsung Electronics, and SK Hynix, to the production 200+ layer feat. The Chinese memory and NAND flash giant announced this memory back in August 2022 as the YMTC X3-9070, along with its new Xtacking 3.0 architecture—a proprietary method by which the company can reliably stack a large number of NAND flash layers. Micron Technology is ready with a 232-layer 3D NAND flash of its own, although it hasn't hit a production ramp, yet. This is an incredible feat considering that YMTC only got into this business in 2016, compared to the other players that each have over two decades of market presence.

YMTC's ramp to 232-layer closely follows its unexpected 2020 feat of a production-grade 128-layer 3D NAND, which was groundbreaking enough to win a supply contract with Apple, before losing it in October 2022, due to political reasons (not technological reasons). The Xtacking 3.0 architecture involves back side source connect (BSSC) for the memory cell wafer, which leads to simpler process and lower cost compared to Xtacking 2.0 (up to 128-layers, which had introduced nickel silicide (NiSi) instead of tungsten silicide (WSi) for better device performance and I/O speed for CMOS wafer. The original Xtacking architecture from YMTC, which it debuted back in 2016, with layer counts going up to 64-layer, relied on cost-effective wafer-to-wafer bonding. The YMTC 232-layer 3D NAND flash should find plenty of takers in the consumer electronics industry, spanning smartphones, consumer storage devices, TVs, and other appliances. The high layer-count has a direct impact on density, which can help designers lower costs by using fewer chips, or increase capacity.

According to a TrendForce investigations, memory pricing began to decline from 4Q21 due to weakening demand for certain consumer electronics. Coupled with the impact of rising inflation, the Russian-Ukrainian war, and pandemic policies, demand in peak season was weak, resulting in inventory pressure that has extended from the buyer side to manufacturers. In response to the aforementioned situation, Micron announced last week that it would cut production of DRAM and NAND Flash, becoming the first major memory manufacturer to officially reduce its capacity utilization plan. In terms of NAND Flash, the market situation is more severe than that of DRAM. As the average contract price of mainstream capacity wafers has fallen to their cash cost and is approaching the periphery of selling at a loss for various manufacturers, Kioxia also announced that it will reduce NAND Flash capacity utilization by 30% from October on the heels of Micron's announcement.

In terms of DRAM, current contract pricing remains higher than the total production cost of various mainstream suppliers. Therefore, compared with NAND Flash, it remains to be seen whether there will be a significant reduction in production. In addition to mentioning the slight reduction in capacity utilization in this sector currently, Micron mainly emphasized its sharp downward revision of capital expenditures in 2023 and that the annual growth of DRAM production bits next year will only be around 5%. TrendForce believes, according to Micron, to actualize such conservative bit growth means that there is still room for a significant downward revision in capacity utilization and the extent to which Micron's subsequent production reductions are implemented remains to be seen.

The first batch of PCIe 5.0 SSDs are all likely to be based on Phison's PS5026-E26 controller, which offers eight NAND channels, capable of supporting NAND speeds of up to 2400 MT/s. Phison's own figures for the controller are 13 GB/s writes and 12 GB/s reads, with up to 1.5 million random read IOPS and 2 million random write IOPS. However, as we've already seen from various SSD brands, many PCIe 5.0 SSDs won't exceed 10 GB/s when it comes to the sequential read/write speeds. This is because the current NAND flash simply isn't fast enough to saturate the PCIe 5.0 bus, which is capable of 15.75 GB/s. That said, Micron's 232-layer 3D NAND should be able to boost the performance up to 12.4 GB/s based on the numbers Gigabyte announced for their Aorus Gen 10000 SSD.

Based on an article over at Tom's Hardware, we shouldn't expect too many drives that exceed 10 GB/s sequential writes at launch, due to most drives using 176-layer 3D NAND flash, that is limited to 1600 MT/s. As such, it might be wise to hold off on buying the first generation of PCIe 5.0 drives and wait for better availability of 232-layer 3D NAND, as beyond Micron, SK Hynix is expected to have a 238-layer 3D NAND flash in the market sometime in the first half of 2023. If you're not really eager to have the fastest SSD out there for pure bragging rights, it would seem that mid 2023 might be the right time to get a PCIe 5.0 SSD.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.