Friday, November 17th 2023
YMTC Develops 128 and 232-Layer Xtacking 4.0 NAND Memory Chips
Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.
While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.
Source:
Tom's Hardware
While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.
9 Comments on YMTC Develops 128 and 232-Layer Xtacking 4.0 NAND Memory Chips
I know there are enterprise drives out there that are purely SLC NAND and they do outperform typical TLC drives all things being equal, but they still far away from the performance of optane. That being said, I still think it'd be cool if they offered 250GB all SLC drives for consumers to use as an OS drive.
I would care about possible future sanctions and protectionist economy politics that will give a huge TAX on cheap chinese NAND/SSD and we costumers lose the race while every other "western manufacturer" plan to raising the prices.... :mad:
What's illgocial is not balking at the fact that a new company can just walk into the market and magically start beating companies with hundreds of billions of dollars in R&D and decades of experience. Chip manufactuering isn't one of the industries where small players or startups can hit the ground running like in shoe manufacturing, you need to build up experience and IP in order to develop the latest chips and that takes talent, time, and money.