A few months ago, we covered proof of overclocking an off-the-shelf 2.5-inch SATA III NAND Flash SSD thanks to Gabriel Ferraz, Computer Engineer and TechPowerUp's SSD database maintainer. Now, he is back with another equally interesting project of modifying a Quad-Level Cell (QLC) SATA III SSD into a Single-Level Cell (SLC) SATA III SSD. Using the Crucial BX500 512 GB SSD, he aimed at transforming the QLC drive into a more endurant and higher-performance SLC. Silicon Motion SM2259XT2 powers the drive of choice with a single-core ARC 32-bit CPU clocked at 550 MHz and two channels running at 800 MT/s (400 MHz) without a DRAM cache. This particular SSD uses four NAND Flash dies from Micron with NY240 part numbers. Two dies are controlled per channel. These NAND Flash dies were designed to operate at 1,600 MT/s (800 MHz) but are limited to only 525 MT/s in this drive in the real world.

The average endurance of these dies is 1,500 P/E cycles in NANDs FortisFlash and about 900 P/E cycles in Mediagrade. Transforming the same drive in the pSLC is bumping those numbers to 100,000 and 60,000, respectively. However, getting that to work is the tricky part. To achieve this, you have to download MPtools for the Silicon Motion SM2259XT2 controller from the USBdev.ru website and find the correct die used in the SSD. Then, the software is modified carefully, and a case-sensitive configuration file is modified to allow for SLC mode, which forces the die to run as a SLC NAND Flash die. Finally, firmware folder must be reached and files need to be moved arround in a way seen in the video.

SK hynix Inc. announced today that it recorded 12.43 trillion won in revenues, 2.886 trillion won in operating profit (with an operating margin of 23%), and 1.917 trillion won in net profit (with a net margin of 15%) in the first quarter. With revenues marking an all-time high for a first quarter and the operating profit a second-highest following the records of the first quarter of 2018, SK hynix believes that it has entered the phase of a clear rebound following a prolonged downturn.

The company said that an increase in the sales of AI server products backed by its leadership in AI memory technology including HBM and continued efforts to prioritize profitability led to a 734% on-quarter jump in the operating profit. With the sales ratio of eSSD, a premium product, on the rise and the average selling prices rising, the NAND business has also achieved a meaningful turnaround in the same period.

North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers. This, in turn, is driving up demand for QLC enterprise SSDs. Currently, only Solidigm and Samsung have certified QLC products, with Solidigm actively promoting its QLC products and standing to benefit the most from this surge in demand. TrendForce predicts shipments of QLC enterprise SSD bits to reach 30 exabytes in 2024—increasing fourfold in volume from 2023.

TrendForce identifies two main reasons for the increasing use of QLC SSDs in AI applications: the products' fast read speeds and TCO advantages. AI inference servers primarily perform read operations, which occur less frequently than the data writing required by AI training servers. In comparison to HDDs, QLC enterprise SSDs offer superior read speeds and have capacities that have expanded up to 64 TB.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

"We are excited to deliver the industry's first 9th-gen V-NAND, which will bring future applications leaps forward. In order to address the evolving needs for NAND flash solutions, Samsung has pushed the boundaries in cell architecture and operational scheme for our next-generation product," said SungHoi Hur, Head of Flash Product & Technology at Samsung Electronics. "Through our latest V-NAND, Samsung will continue to set the trend for the high-performance, high-density solid state drive (SSD) market that meets the needs for the coming AI generation."

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

Micron Technology, Inc., today demonstrated its continued NAND technology leadership by announcing that its 232-layer QLC NAND is now in mass production and shipping in select Crucial SSDs, in volume production to enterprise storage customers and sampling to OEM PC manufacturers in the Micron 2500 NMVe SSD.

Micron 232-layer QLC NAND delivers unparalleled performance for use cases across mobile, client, edge and data center storage by leveraging these important capabilities:

• Industry-leading bit-density, up to 28% more compact than leading competitors'1 latest products
• Industry-leading NAND I/O speeds of 2400 MT/s, a 50% improvement over the prior generation
• 24% better read performance over the prior generation
• 31% better programming performance over the prior generation

YMTC X3-6070 3D QLC NAND flash chips are claimed by the company to offer endurance comparable to 3D TLC NAND flash chips from its competitors, ITHome reports. The company launched the new NAND flash chip at an event earlier this week. The X3-6070 is based on YMTC's 3rd Generation Xtracking architecture, and is 128-layer, which may not sound very competitive, given that other brands have moved up to 176-layer, or 232-layer; but YMTC says that the 128-layer design-choice is one of the four key ingredients to achieving high endurance for this chip.

The other three ingredients are innovations in the materials making up the NAND flash physical layer, new error-correction algorithms, and optimizations at the level of the SSD controller. The X3-6070 can sustain 4,000 P/E cycles per cell, YMTC claims, which is in league of contemporary 3D TLC NAND flash chips. It is able to do so, at lower costs from the QLC architecture. Besides the X3-6070, YMTC also launched a few first-party reference design SSDs that fully implement the controller-level optimizations needed for the chip to perform and endure as advertised.

TrendForce projects a strong 13-18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative. The slight dip in Q2 NAND Flash purchasing—compared to Q1—does not detract from the overall market's momentum, which continues to be influenced by decreasing supplier inventories and the impact of production cuts.

eMMC demand is predominantly driven by Chinese smartphone brands, leading to a substantial boost in shipments from Chinese module makers as some suppliers have reduced their supply. Buyers are increasingly adopting solutions from module makers to meet production needs, enhancing the technological advancement of Chinese module factories and their outreach to premier clients. This trend is likely to increase the penetration of eMMC products among smartphone customers, with a projected 10-15% rise in eMMC contract prices in Q2 due to a sharp rebound in NAND Flash wafer prices.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

As the IT sector continues to seek answers for scaling data processing performance while simultaneously improving efficiency - in terms of performance and density per watt, per system, per rack, and per dollar of CapEx and OpEx - ScaleFlux is answering the call with innovative design choices in its SSD controllers. The SFX 5016 promises to set new standards both for performance and for power efficiency.

In addition to carrying forward the transparent compression feature that ScaleFlux first released in 2020 in upgraded in 2022 with the SFX 3016 computational storage drive controller, the new SFX 5016 SOC processor includes a number of design advances.

In addition to the 37 Gbps GDDR7 memory, Samsung Electronics prepares to showcase several other memory innovations at the 2024 IEEE-SSCC as compiled by VideoCardz. To begin with, the company is showcasing a new 280-layer 3D QLC NAND flash memory in the 1 Tb density, enabling next generation of mainstream SSDs and smartphone storage. This chip offers an areal density of 28.5 Gb/mm², and a speed of 3.2 GB/s. To put this into perspective, the fastest 3D NAND flash types powering the current crop of flagship NVMe SSDs rely on 2.4 GB/s of I/O data rates.

Next up, is a new generation DDR5 memory chip offers data rates of DDR5-8000 with a density of 32 Gbit (4 GB). This chip uses a symmetric-mosaic DRAM cell architecture, and is built on a 5th generation 10 nm class foundry node Samsung optimized for DRAM products. What's impressive about this chip is that it will allow PC memory vendors to build 32 GB and 48 GB DIMMs in single-rank configuration with DDR5-8000 speeds; as well as 64 GB and 96 GB DIMMs in dual-rank configuration (impressive, provided your platform can play well with DDR5-8000 in dual-rank).

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Next week at CES 2024, KIOXIA, the inventors of NAND flash, will highlight its extensive portfolio of solid state drives (SSDs) and memory solutions. This diverse lineup - one of the broadest range of flash solutions in the industry - is well-suited to virtually any solution that uses flash and includes new products, form factors and standards designed for upcoming IT requirements.

In today's dynamic technological landscape, where evolving standards push performance boundaries higher and end user expectations continue to climb, KIOXIA stands poised for the future by making the memory to process, manage and store the world's data. "Whether it's designing ultra-thin consumer PCs, enabling the automotive in-vehicle experience or streamlining professional photography - we make flash memory that brings applications to life and enhances user experiences," said Alex Mei, vice president of corporate marketing for KIOXIA America, Inc. "Countless consumer devices and applications rely on KIOXIA technology solutions to enrich lives and make new memories. CES gives us an opportunity to explore new possibilities and showcase the depth and breadth of our solutions."

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

Today, IBM introduced the new IBM Storage Scale System 6000, a cloud-scale global data platform designed to meet today's data intensive and AI workload demands, and the latest offering in the IBM Storage for Data and AI portfolio.

For the seventh consecutive year and counting, IBM is a 2022 Gartner Magic Quadrant for Distributed File Systems and Object Storage Leader, recognized for its vision and execution. The new IBM Storage Scale System 6000 seeks to build on IBM's leadership position with an enhanced high performance parallel file system designed for data intensive use-cases. It provides up to 7M IOPs and up to 256 GB/s throughput for read only workloads per system in a 4U (four rack units) footprint.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications—including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company's vision for "Memory Reimagined," covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.

TrendForce research reveals that, due to the impacts of high inflation and economic downturn, CSPs are adopting more conservative strategies when it comes to capital expenditure and consistently reducing their annual server demand forecasts. Currently, CSPs in China have reported a decline in cloud orders compared to last year, leading to a subsequent decrease in annual procurement volumes for enterprise SSDs. In North America, some clients have postponed mass production timelines for new server platforms while ramping up investments in AI servers. These factors have resulted in enterprise SSD orders falling below expectations. Consequently, global enterprise SSD revenue hit an all-time low in the second quarter, totaling just $1,500 million—a QoQ decrease of 24.9%.

Demand for AI servers remains strong in the third quarter, while orders and shipment momentum for general-purpose servers have yet to show signs of recovery. This continues to put pressure on the purchasing volume of enterprise SSDs, and annual bit volume is expected to be lower than last year. Meanwhile, vendors have once again reduced capacity utilization to slow down inventory growth. Server customers still maintain high inventory levels, and their purchasing momentum remains insufficient. This is expected to lead to an approximate 15% QoQ decline in the average price of enterprise SSDs in the third quarter, which may further result in a lackluster revenue performance for the peak season.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

DDN, the global leader in artificial intelligence (AI) and multi-cloud data management solutions, today announced a major breakthrough for its all flash and hybrid storage solutions. DDN's parallel file system technology, combined with AI and data center specific data compression, delivers the highest performance efficiency straight into generative AI, machine learning and other enterprise high-performance applications.

Eliminating the need for complex networking and heavily bottlenecked performance found in other data storage solutions, DDN's new AI400X2 QLC and hybrid storage arrays combine DDN's parallel file system with novel client-side data compression, increasing performance by 10x, growing effective capacity by up to 15x and reducing data center footprint by 2x.

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of two new PCIe Gen 4 M.2 Solid State Drives—the MP600 MINI and the MP600 CORE XT. These drives extend the CORSAIR SSD range to an ultra-compact M.2 2230 form factor, and a new highly competitive combination of price and performance, allowing a new wave of device upgrades.

The MP600 MINI brings CORSAIR M.2 SSD performance to its smallest ever size, with the M.2 2230 form factor measuring just 22 mm x 30 mm. The MP600 MINI is compatible with popular handheld gaming systems, such as the Valve Steam Deck, as well as thin and light machines where space is at a premium, such as the Microsoft Surface Pro 8 and 9. With an impressive 1 TB of capacity and PCIe Gen 4 performance of up to 4,800 MB/sec read and 4,800 MB/sec write, the MP600 MINI is an ideal performance and storage upgrade for data hungry small-form-factor devices, whether it's to store a growing game collection, or essential files.

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

No more to traditional mechanical drives as the era of high-capacity QLC has arrived. Leading memory brand Team Group today has announced the launch of two QLC SSDs to meet the various needs of users: Team Group MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD come in capacities of up to 2 TB and 4 TB, respectively. Whether for more storage for installing or storing OSs, programs, games, or documents, they are the perfect upgrade solutions for your computer.

In response to different storage upgrade needs of consumers, Team Group MP33Q M.2 PCIe SSD is designed with 3D QLC flash memory chips, PCIe Gen 3 x4 interface and NVMe 1.3 protocol. With up to 2,500 MB/s in read speed and 2,100 MB/s in write speed, it outperforms SATA III SSDs by five times and is available in capacities of up to 2 TB. With its carefully selected 3D QLC NAND flash and SLC Cache technology, Team Group MP33Q M.2 PCIe SSD brings a top-of-the-line solution to the storage market.