Cooler Master, a global leader in PC components, gaming peripherals, and tech lifestyle solutions, has today launched the MasterBox 600 - the latest offering in their renowned ATX case lineup. The MasterBox 600, is packed with features designed to provide great performance and is still easy to build. Features like a back-connected motherboard support to versatile cooling options and a removable HDD cage, ensure the MasterBox 600 is designed to provide the ultimate case for just about any type of build.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today launched multiple products for the discerning gamer on a budget. In hopes of fulfilling the needs of PC builders of all levels, XPG has delivered a new line of entry level Gold efficiency power supply units and ARGB PWM fans. With the new XPG CORE REACTOR II VE and XPG VENTO PWM fans, upgrading your system has never been easier.

CORE REACTOR II VE
While it is always a challenge to strike a balance between cost and performance, XPG always puts the needs of end users first. Although the CORE REACTOR II VE is being sold as a Value Edition product, the specs on this PSU are anything but cheap. Inspired by the design of the award winning CORE REACTOR II, through the use of XPG's exclusive PSU topology, this power supply still delivers performance that surpasses Intel ATX 3.1 standards. Between the Gold efficiency, DC-DC circuit design, and the dedicated 12V-2x6 connector, this power supply unit is perfect for your modern gaming needs. With 650 W, 750 W, and 850 W models available, XPG CORE REACTOR II VE is the perfect foundation for a current gen build.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is excited to launch the Dr. Power III, an enhanced portable power tester that supports the latest ATX12V v3.1 standard. This tester simplifies the process of checking the operational status of different PSU connectors. Compared to its predecessor, the Dr. Power III additionally supports a 12+4pin connector, enabling it to test the next-gen power supplies which are designed for high power consumption GPU.

Whether pre-build checks or troubleshooting existing setups, the Dr. Power III can offer straightforward voltage and PG value detection. To initiate testing, easily use cables to attach connectors between the power supply and the Dr. Power III, press the check button, and the test will begin. The Dr. Power III supports various connectors, including the latest 12+4pin, 24pin, PCIe 6/8pin, SATA, CPU 4/8pin, and peripheral connectors. It is compatible with all contemporary ATX PSU, Dr. Power III meticulously detects the SENSE0/SENSE1 sideband signals of the latest PCIe 12+4pin connector, distinguishing power levels of 150 W, 300 W, 450 W, and 600 W.

ENERMAX, an industry-leading force dedicated to designing high-performance computer hardware and cooling solutions, launches its latest power supply series, the REVOLUTION D.F. 12, the world's smallest ATX 3.1 power supply with only 122 mm in-depth. This design maximizes space for airflow within PC cases while delivering robust power in line with the ATX 3.1 specifications, including up to a 235% power excursion. Equipped with a 600 W 12V-2x6 cable, the REVOLUTION D.F. 12 ensures uncompromised performance for high-end graphics cards and cutting-edge AI computing. The REVOLUTION D.F. 12 also fits seamlessly into micro ATX cases, providing ample room for efficient cable management.

Committed to sustainable computing, REVOLUTION D.F. 12 offers a highly technical power solution aimed at enhancing power conversion efficiency and reducing carbon emissions. This commitment to sustainability is further demonstrated in the product's shipping and packaging innovations. The REVOLUTION D.F. 12 features an innovative 115 mm dual-ball bearing fan with ENERMAX's patented Dust-free Rotation (D.F.R.) technology, providing a self-cleaning function and an activated switch button to enhance system longevity by minimizing dust accumulation inside the power supply. The power supply operates in fanless mode when under 50% load, ensuring complete silence at low and medium workloads. Additionally, users will be able to manually activate the D.F.R. function using the D.F.R. switch button, which can also serve as a power-on indicator.

ASUS today announced the TUF Gaming GT302 ARGB chassis, a case that makes it easy to build a high-performance PC with great cooling. Prepped and ready for great out-of-the-box cooling, equipped for wide compatibility with high-performance parts, and thoughtfully constructed inside and out for an easy PC DIY experience, the GT302 ARGB resets expectations for a mainstream case.

Great cooling - right out of the box
Most PC builders go big on cooling to ensure an excellent balance of performance and quiet operation. From the moment it is pulled out of the packaging, the TUF Gaming GT302 ARGB gives users a superb foundation for high-end cooling. This starts with a front panel designed first and foremost to maximize airflow efficiency. It is constructed of a wide-open, high-porosity square-type mesh that leaves ample room for fresh air to enter a PC. Four pre-installed 140 mm ARGB case fans move cool air through the chassis. These fans are exceptionally thick, measuring 28 mm in depth. These fans deliver up to 3 mmH2O static pressure and 115 CFM airflow for excellent cooling with quiet operation.

EK, the leading name in custom loop liquid cooling, is proudly announcing the launch of the latest water-cooling-focused PC case made in collaboration with InWin, the renowned case manufacturer. The new EK-Quantum InWin 977EK was engineered from scratch with water cooling and ease of use in mind. It's a premium quality PC case that can accommodate two 420 mm radiators, has dedicated mounts for pumps, reservoirs, and combo units, and offers the ultimate user-friendly experience for custom loop liquid cooling enthusiasts.

EK-QUANTUM InWin 977EK
Crafted from a single, robust piece of 4 mm-thick, high-quality brushed aluminium, the outer shell of this PC case proudly embodies the iconic InWin aesthetic. Meticulously bent by skilled artisans using hand-operated techniques, it showcases their dedication to craftsmanship.

Corsair today announced its re-entry into the dual chamber PC case market. Building on the direct airflow and impressive performance of the 680X and 280X cases, the new 6500 and 2500 Series deliver unprecedented levels of customization. Whether you need the spacious mid-tower chassis of the 6500 for a powerhouse desktop or the compact mid-tower design of the 2500 for a micro ATX build, their dual chamber layout makes building easier, promoting efficient cooling alongside a clean and professional look. With support for the latest reverse connector motherboards, options to convert from fully mesh airflow to tempered glass panels, and a range of functional and aesthetic accessories, these new cases mark a leap forward in dual-chamber case design.

The new reverse connector motherboards are a game-changer for PC builders. These motherboards, such as the ASUS BTF and MSI Project Zero, feature connections discreetly tucked away behind the motherboard tray. This layout, especially when combined with the Corsair iCUE LINK ecosystem, dramatically simplifies the building process and enables a nearly cable-free view within the main chamber of the case. iCUE LINK technology takes this a step further by enabling fans and other internal components to connect to each other seamlessly, reducing the need for multiple types of cables and connectors.

[Editor's note: Our in-depth review of the Corsair 6500X case is now live]

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the BIH61-AHA industrial motherboard, designed for smooth, seamless industrial application from AIOT machines, Edge computing, HMI machine, Digital Signage and more. Built based on the Intel H610 chipset, the BIOSTAR BIH61-AHA motherboard is engineered to support the latest Intel Core i7/i5/i3 processors (LGA1700). Featuring the latest DDR5 technology with support for 2x DDR5-4800 MHz LONG-DIMM up to 96 GB max, it offers extensive customization to meet the intricate needs of various industries.

Targeting a diverse audience, from system integrators looking to build sophisticated AIoT machines to enthusiasts aiming to construct powerful automation or edge computing systems, the BIH61-AHA provides unparalleled connectivity and expansion options. With 10 COM ports, 5 PCI slots, dual Intel GbE LAN ports for reliable and high-speed network communication, extensive USB connectivity with 6x USB2.0 & 4x USB 3.2 Gen 1 ports, and multiple storage interfaces, including 4x SATA 6 Gb/s and 1x M.2 M-KEY socket. Its support for a wide operating temperature range (0 ~ 60 degrees C) and ATX power input also ensures the motherboard's adaptability in challenging environments.

Thermaltake today rolled out the View 270 TG ARGB, a line of ATX mid-tower cases featuring a pillarless front-left corner, for a more unimpeded view of your build. Much like the ZALMAN P10, this case doesn't feature a wrap-around single-piece glass, but rather two planar tempered glass panels that meet at the corner, so you'll notice the edge line. Still, this is better than an inch-thick pillar. Also like the ZALMAN P10, the Thermaltake View 270 TG ARGB features a horizontally partitioned layout that extends to even its exterior—the tempered glasshouse only covers the upper compartment. The bottom compartment with the PSU- and drive bays feature static perforated panels along the left- and front sides; and is only accessible from the single piece right side-panel. The right panel features perforations toward the front, aligning with the side-facing radiator mount. An interesting aspect about this mount is that it's located entirely in the crawlspace behind the motherboard tray, it doesn't intrude into the motherboard tray compartment, and so you can mount a 360 mm radiator without its fans impeding your long graphics cards in any way.

The motherboard tray seats E-ATX (or smaller) motherboards with 7 expansion slots; you get room for graphics cards up to 42 cm in length, and CPU coolers up to 18 cm in height, so there's plenty of room to wrestle with your graphics card's 12VHPWR cable. Fan and radiator mounts, besides the 3x 120 mm side-facing mount detailed above, include three 140 mm / 120 mm top mounts that can hold a radiator as large as 360 mm; and a 120 mm rear exhaust. The partition dividing the bottom and top compartments is perforated, and you can mount up to three 120 mm fans here. The case measures 230 mm x 454 mm x 456 mm (WxDxH), weighing 6.3 kg. All its metal bits are made of SECC steel. The case comes in four color trims—Black (CA-1Y7-00M1WN-00), Snow (CA- 1Y7-00M6WN-00), Hydrangea Blue (CA-1Y7-00MFWN-000, and Matcha Green (CA-1Y7-00MEWN-00). The included rear 120 mm fan comes with addressable RGB lighting. The company didn't reveal pricing.

PC power supply manufacturer Seasonic has introduced a new limited-edition variant of its Vertex 1000 W 80+ Gold certified modular power supply featuring an eye-catching design inspired by cherry blossoms. Dubbed the "Vertex Sakura," this specially-themed PSU sports a clean white color scheme with pink Sakura flower graphics and a unique textured paint finish. The Vertex Sakura caters specifically to PC enthusiasts and case modders in Japan who want to build a themed rig coordinated around the colors and aesthetic of traditional Japanese cherry blossoms. It offers the same fully modular cabling as the standard Vertex 1000 W model, allowing builders flexibility in cable management.

The PSU also meets the latest ATX 3.0 specifications, including a 12VHPWR connector to support next-generation high-wattage GPUs. Seasonic showcased the Vertex Sakura 1000 W unit at 30,000 yen (around $200 USD) in Japan, where retailers recommend interested buyers preorder as soon as possible due to limited availability. Specific regional launch details outside of Japan are still forthcoming. But the Vertex Sakura's blend of technical prowess and stunning cherry blossom visual flair will likely attract global attention from PC builders looking to add an extra touch of style to their high-end systems.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

In addition to the new AIO coolers and PSUs, ENERMAX brought a full lineup of new PC cases to the CES 2024 show, including the new ENERPAZO lineup, the new EK98, and the SK30 V2 PC cases. The ENERPAZO lineup with the ENERPAZO EP33 mid-tower and the ENERPAZO EP23 mini-tower PC cases, and the EK98 mid-tower PC case, all come with built-in USB 3.2 Gen 1 and USB 3.2 Gen 2 Type C ports and reusable PCIe slots, as well as feature recognizable ENERMAX design with grill front and glass side panel.

The ENERPAZO EP33 supports up to an E-ATX motherboards, has support for a 420 mm AIO liquid CPU cooler and up to 11 fans, while the ENERPAZO EP23, as mini-tower PC case, supports up to a micro-ATX motherboard and a 360 mm AIO liquid CPU cooler and up to 8 fans. The EK98 supports up to a 360 mm AIO liquid CPU cooler and up to 9 fans, as well as comes with vertical GPU installation support with rotatable PCIe slots and pre-installed 4 ARGB PWM fans. ENERMAX also showcased the new SK30 V2 PC case mid-tower PC case which also comes with USB 3.2 Type-C ports, supports up to 360 mm AIO liquid CPU cooler ass well as comes with the same vertical GPU installation support and couple of pre-installed ARGB PWM fans.

CORSAIR had a brisk 2024 International CES announcements, and we begin our coverage with two new cases the gaming lifestyle brand debuted this year—the 6500X and the 2500X. The 6500X is a new vertically partitioned case with, or it looks that way from the front. The right-size partition begins from behind the motherboard tray, so the extra width toward the front of the case can be used to neatly slot in a 360 mm radiator in a manner that it doesn't obstruct long graphics cards; as shown in the example build below. There is no front-left pillar. There are plenty of fan vents, including three along the right side, along the bottom, the top, and the rear. As you can see, even an RTX 4080 ROG Strix can stretch itself without a side-facing radiator coming in the way—again, because the vertical partition begins behind the motherboard tray and doesn't extend all the way to the front.

The CORSAIR 2500X is a miniaturized version of the 6500X design concept, where the case is vertically partitioned, but the partitioning doesn't extend all the way to the front; creating space for the side-facing radiator, so it doesn't obstruct a long graphics card. This case is designed for Micro-ATX (or smaller) motherboards. The 2500X has a cozy, wood-like accents along the top, front-right, and top-right edges. It lacks a left pillar just like the 6500X. Perhaps the most interesting aspect about the 2500X and 6500X is that they support both MSI Project Zero and ASUS BTF motherboard types, with their backside connectivity. The 2500X has enough room for up to three 120 mm fans along the bottom and top panels; and two along the side panel. Corsair is expected to launch the 6500X and 2500X toward the end of February, 2024. The company hasn't finalized pricing. The company also showed off some user-replaceable body panels for these cases.

At CES 2024 in Las Vegas, case maker InWin displayed several innovative new models for custom PC builds. The company continues its reputation for eye-catching designs with the debut of the adjustable flatpack POC One case and highly modular Mini Mod-II and Mod-III chassis. The POC One features interlocking panels for easy snap-together assembly, an advancement over the original April-launched POC line. It includes repositionable top or side handles for portable or horizontal setups. Using a mix of aluminium, other metals, and acrylic, the POC One initially comes in black/orange or blue/silver styles. Despite its minimalist flatpack form, it fits full-size components like 335 mm long triple-slot GPUs, 140 mm tall CPU coolers, and standard ATX power supplies. Three PCIe slots and an included riser allow vertical graphics card mounting.

During the CES 2024, Thermaltake announced the CTE E600 MX series of cases, in addition to the Tower 300 micro-ATX design shown at the company booth. Firstly, The Thermaltake CTE E600 MX mid-tower chassis focuses on exceptional cooling, customization, and tidy cable management. Its dual-chamber layout separates hot components from cables, with 12 potential fan mounts and 420 mm radiator support. Interchangeable front panels allow configuring for either maximum airflow or sleek tempered glass viewing. A bundled 400 mm PCIe 4.0 riser cable uniquely enables three GPU orientation options - standard, vertical, or a "floating" centered mount showcasing your graphics card. Anchor points and included ties facilitate organizing wiring neatly out of sight in the partitioned cable chamber. With outstanding flexibility tailoring both form and function, the CTE E600 MX empowers users to build their perfect customized system matching individual style and cooling demands. The CTE E600 comes with an MSRP of $179.99.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.

Taiwanese power supply manufacturer FSP showcased upcoming products for 2023 and 2024. This included new power supply lineups with updated naming schemes - the entry-level VITA series, mid-range ADVAN series, and high-end MEGA and DAGGER series. The simplified naming clarifies the differentiation between affordable, mainstream, and premium offerings across wattages and efficiency certifications. Specific new PSU models include 1500+ Watts beasts for maxed-out systems, redundant server-class units ensuring uptime, and 80+ Titanium efficiency ratings for eco-conscious builds. Star of the show is FSP's flagship unit, which boasts a staggering 2500 Watts, 100% modular cabling, and cutting-edge 12V-2x6 PCIe Gen 5 graphics card power connectors.

Called the Cannon Pro, the 2500-watt power supply has four 12V-2x6 PCIe Gen 5 connectors to feed even the highest power-rated GPUs and the three 6+2-pin connectors. This new PSU is also rated for ATX 3.1 specifications, 80+ Platinum Specification, and the upgraded version of the 12VHPWR PCIe Gen 5 connector, supposedly overcoming all the issues, in the form of a 12V-2x6 PCIe Gen 5 connector. The PSU should be able to power four NVIDIA GeForce RTX 4090 GPUs simultaneously with its high capacity. Pricing and availability aren't specified, so we must wait for FSP to launch these products in 2024.

Sharkoon Technologies is an international supplier of high-quality, high-performance PC components and peripherals. With the C60, Sharkoon is launching a new Rebel series PC case that, this time, aims to provide a particularly elegant presentation of the built-in hardware thanks to a tempered-glass front panel as well as a tempered-glass side panel.

Smart Airflow
So that the hardware is not only optimally showcased but can also be fully utilized, Sharkoon relies on an airflow in which fresh air is drawn in through the bottom of the case while heated air is transported out through the rear panel and the perforated side panel. To achieve this, the Rebel C60 RGB is already supplied with four 120-millimeter fans in the corresponding locations. A particular eye-catcher among these addressable RGB fans is the bottom panel fan, which has been installed at an angle. To prevent dust and dirt being transported from underneath the case into its inside, the entire bottom panel is protected with a detachable dust filter.

Most of us are fortunate enough not to need a monster power supply in our PCs, but for those that do, SilverStone has launched an updated version of its 2050 Watt HELA 2050 power supply, simply named the HELA 2050R. It delivers no less than 170 Ampere on its 12 V rail and SilverStone claims a power density of 882 Watts per liter. The updated version comes with a pair of 12VHPWR connectors, with one modular cable with two GPU connectors and one modular cable with a single GPU connector.

The HELA 2050R is rather amazingly only 180 mm deep and in addition to the 12VHPWR connector it also has three standard 6+2 GPU connector with support for up to 14 GPU connectors, as well as support for up to 12 SATA drives, three Molex connectors, one floppy drive type connector and of course, the standard ATX and EPS power connectors. Note that the HELA 2050R is limited to 200-240 Volt input, as a standard 115 Volt outlet would be limited to 1650 Watt. No pricing was announced, but considering that the HELA 2050 is retailing for well over US$500, it's not expected that the 2050R will be any cheaper.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Seasonic, one of the leading manufacturers of high-quality power supplies for the PC market, has announced a significant enhancement to its customer service offerings. In a move that underscores the company's confidence in its products' durability and performance, Seasonic has extended the warranty period for its VERTEX power supply units from the industry-standard of ten years to as much as 12 years. This extension applies to its popular series of power supplies, known for their reliability and efficiency. The company's decision reflects its commitment to excellence and its belief in the longevity of its components, aiming to provide users with added peace of mind and long-term value.

The VERTEX series of PSUs are Seasonic's first ATX 3.0 models on the market, which bring a plethora of features like complete modularity, 80+ Platinum efficiency, support for PCIe 5.0 devices, 12VHPWR cable, and now an upgraded warranty period of 12 years. The extended warranty indicates that Seasonic is prepared to back its claims of great product lifespan, reinforcing its position as a trusted name in power supply solutions.

NZXT, a leader in PC gaming hardware and services, today announces the H6 Flow and H6 Flow RGB, a compact dual chamber mid-tower ATX case. The H6 Flow offers a harmonious blend of performance and visual appeal for PC enthusiasts. Designed for an expansive and uninterrupted view, the H6 Flow is adorned with consistent tempered glass on the front and sides, granting a panoramic peek into the insides of your build. Leveraging its dual chamber architecture, the new angel front panel directs the airflow from the three pre-included 120 mm fans (or 120 mm RGB fans for the H6 Flow RGB version) and two 140 mm fans at the base of the case allow you to cool your heat generating components. The revamped perforated panels come with a design fine-tuned for optimal airflow and superior performance. While all being easy to build with the H6 Flow facilitates generous cable-routing channels and straps, ensuring organized cable management.

Advanced Performance Nexus (APNX), a new player in the computer components market, is proud to announce the global release of the APNX C1 gaming case. The premium mid-tower ATX case brings together a beautiful new look with a one-piece mesh panel that wraps around the front and right-side panel, robust build quality, and impressive out-of-the-box cooling performance with its 4x pre-installed 120 mm FP1 PWM ARGB fans. Available in black, white, and two-toned ChromaFlair, the C1 starts at MSRP $139 USD.

APNX is comprised of teams across Taiwan and Europe with over 20 years of experience in product development in the gaming and PC hardware space. APNX is one of nine brands from the group, Pro Gamersware, and benefits from the combined resources, expertise, and investment in the formation of its products. "This launch is a historical moment for our team," said Tony Lin, CEO of APNX. " APNX is our first chance to collaborate and put everything we've learned into a single brand. So far, everyone's expectations have been exceeded."

Sharkoon Technologies is an international supplier of high-performance, high-quality PC components and peripherals, and in response to numerous customer requests, the manufacturer is now launching a white version of its REV300 Midi-ATX case. With the REV300 White, hardware builds take the proven approach of being installed around a 90-degree rotated mainboard, while the tempered-glass side panel is unconventionally placed on the right side of the PC case. In addition, the REV300 White comes with seven pre-installed PWM RGB fans.

Like its black counterpart, the white version of the REV300 comes readily equipped with the maximum possible number of fans: Apart from three addressable 140-millimeter RGB LED fans behind the front panel, there are also three equally addressable 120-millimeter RGB LED fans on the rear panel and another one under the top panel. To further maximize airflow, the front panel of the case consists of an air-permeable mesh. If water cooling is preferred instead of air cooling, an up to 360-millimeter radiator can be installed in the back of the case. There is also space for a radiator of up to 420 millimeters in the case's front - provided that the radiator does not exceed a height of 3.2 centimeters, a length of 46.5 centimeters, and a width of 14.1 centimeters.