IBASE Technology Inc. (TPEx: 8050), a global leader in network appliances and embedded solutions, proudly announces the release of the INA8505 enterprise 1U edge server. Powered by the Intel Xeon D-2700 processor and offering versatile connectivity options, this state-of-the-art appliance is specifically designed to excel in demanding 5G Open vRAN & MEC applications such as real-time data analytics, autonomous vehicles, and smart city deployments. It enables full control over resource allocation in the RAN and MEC, and has the potential to seamlessly integrate AI capabilities to dynamically optimize network performance in real time at the edge of the 5G network infrastructure.

The INA8505 delivers unmatched performance, scalability, and efficiency with flexible storage, offering two SATA/NVMe 2.5" HDD/SSD slots, 2x M.2 (M-key) SATA/PCI-E storage slots, and one 16 GB/32 GB/64 GB eMMC. With an FHFL PCI-E (x16) Gen 4 (supports 75 W) and an FHFL PCI-E (x8) Gen 4 (supports 75 W) configurable as PCI-E (x16) Gen 4 double FHFL (supports 120 W), the INA8505 adapts effortlessly into different network environments and meet future demands for increased scalability. It boasts a rich array of I/O connectivity options, including a VGA port from BMC (Aspeed 2600, IPMI 2.0 support), two USB2.0 Type-A ports, an RJ45 console port, and four 25 GbE SFP28 ports, ensuring enhanced adaptability to various connectivity needs.

Artificial intelligence (AI) has emerged as a transformative force in chip design, with recent examples from China and the United States showcasing its potential. Jensen Huang, CEO of Nvidia, believes that AI can empower individuals to become programmers, while Lisa Su, CEO of AMD, predicts an era where AI dominates chip design. During the 2023 World Artificial Intelligence Conference (WAIC) in Shanghai, Su emphasized the importance of interdisciplinary collaboration for the next generation of chip designers. To excel in this field, engineers must possess a holistic understanding of hardware, software, and algorithms, enabling them to create superior chip designs that meet system usage, customer deployment, and application requirements.

The integration of AI into chip design processes has gained momentum, fueled by the AI revolution catalyzed by large language models (LLMs). Both Huang and Mark Papermaster, CTO of AMD, acknowledge the benefits of AI in accelerating computation and facilitating chip design. AMD has already started leveraging AI in semiconductor design, testing, and verification, with plans to expand its use of generative AI in chip design applications. Companies are now actively exploring the fusion of AI technology with Electronic Design Automation (EDA) tools to streamline complex tasks and minimize manual intervention in chip design. Despite limited data and accuracy challenges, the "EDA+AI" approach holds great promise. For instance, Synopsys has invested significantly in AI tool research and recently launched Synopsys.ai, the industry's first end-to-end AI-driven EDA solution. This comprehensive solution empowers developers to harness AI at every stage of chip development, from system architecture and design to manufacturing, marking a significant leap forward in AI's integration into chip design workflows.

NVIDIA RTX is spinning new cycles for designs. Trek Bicycle is using GPUs to bring design concepts to life. The Wisconsin-based company, one of the largest bicycle manufacturers in the world, aims to create bikes with the highest-quality craftsmanship. With its new partner Lidl, an international retailer chain, Trek Bicycle also owns a cycling team, now called Lidl-Trek. The team is competing in the annual Tour de France stage race on Trek Bicycle's flagship lineup, which includes the Emonda, Madone and Speed Concept. Many of the team's accessories and equipment, such as the wheels and road race helmets, were also designed at Trek.

Bicycle design involves complex physics—and a key challenge is balancing aerodynamic efficiency with comfort and ride quality. To address this, the team at Trek is using NVIDIA A100 Tensor Core GPUs to run high-fidelity computational fluid dynamics (CFD) simulations, setting new benchmarks for aerodynamics in a bicycle that's also comfortable to ride and handles smoothly. The designers and engineers are further enhancing their workflows using NVIDIA RTX technology in Dell Precision workstations, including the NVIDIA RTX A5500 GPU, as well as a Dell Precision 7920 running dual RTX A6000 GPUs.

A group of researchers in China have used a new approach to AI to create a full RISC-V processor from scratch. The team set out to answer the question of whether an AI could design an entire processor on its own without human intervention. While AI design tools do already exist and are used for complex circuit design and validation today, they are generally limited in use and scope. The key improvements shown in this approach over traditional or AI assisted logic design are the automated capabilities, as well as its speed. The traditional assistive tools for designing circuits still require many hours of manual programming and validation to design a functional circuit. Even for such a simple processor as the one created by the AI, the team claims the design would have taken 1000x as long to be done by humans. The AI was trained by observing specific inputs and outputs of existing CPU designs, with the paper summarizing the approach as such:

(...) a new AI approach, which generates large-scale Boolean function with almost 100% validation accuracy (e.g., > 99.99999999999% as Intel) from only external input-output examples rather than formal programs written by the human. This approach generates the Boolean function represented by a graph structure called Binary Speculation Diagram (BSD), with a theoretical accuracy lower bound by using the Monte Carlo based expansion, and the distance of Boolean functions is used to tackle the intractability.

Google's Android logo has been reworked in recent times—their classic green robot design was debuted in a new 3D form earlier this year at CES 2023. 9to5Google reckons that the redesign will be rolled out soon, along with a new typeface. These are allegedly set to replace the flat aesthetic from the company's 2019 branding refresh. The specialist news outlets points to Google first teasing the 3D "bugdroid" head in early January via its Keyword blog, and further examples have popped up at trade events and conferences since then.

According to 9to5Google the reworked brand identity is official, but Google was acting coy about an official launch window—details will be revealed at a later date. Industry insiders posit that Google's new design language will debut with the release of Android 14 (codenamed "Upside Down Cake"). The next-gen mobile OS is currently in Beta (version 3) and has reached platform stability.

AZZA, a company known for creating cases of interesting design, had a new lineup to show at Computex 2023. The star of the show may very well be AZZA's new Sanctum 810, a giant cube case with a cut corner that carries support for up to seven 120 mm fans, creating adequate airflow once configured. There is even room to mount a 360 mm radiator for a custom water cooling build, as shown in the pictures below.

Next, we have AZZA's oddly-shaped Mesa 811 -- a twisted cube case that supports E-ATX motherboards, has glass side panels, and even has perforated aluminium panels. It also fits three 120 mm fans in the front and only has one 120 mm in the back, but there is space to do a custom cooling loop.

It was reported earlier this morning that Leadtek was preparing a new custom design NVIDIA GeForce RTX 4070 graphics card - Tom's Hardware pointed out that South Korea's National Radio Research Agency had uploaded a registration for a "RTX 4070 AI BLOWER" VGA card on behalf of "Leadtek Research Inc." The article delves into a possible scenario, based on the model name alone, of Leadtek producing a cooling solution that reflects NVIDIA's blower-style reference design. Team Green has gained quite the reputation for being protective of that blueprint, despite its Founders Edition lineup of gaming-oriented cards shifting to a traditional cooling solution (back in the RTX 20-series days). Board partners are normally expected to devise their own/unique cooling solutions, and NVIDIA has mostly reserved the blower + vapor chamber combination for its professional GPU model lineups.

Leadtek has created a product page for their new custom card this afternoon, and it is immediately clear that this morning's prediction was somewhat correct. The WinFast RTX 4070 AI BLOWER 12G sports a "streamlined" yet boxy black cooling solution that appears to be closer in appearance to an NVIDIA RTX A-series professional card, although a flash of silver trim and logo on the fan provides a bit of "gamer" visual language. Leadtek's specification info states that their AI Blower cooler features an aluminium die cast housing alongside a copper finned vapor chamber. The lone mounted fan is said to have a 50,000 hour operational lifespan thanks to a special internal arrangement: "WinFast double ball bearing fan provides better reliability, higher dust resistance levels, and moreso keeps friction and noise to a minimum." Tom's Hardware posited that Leadtek's custom card would be marketed as an enterprise product (for AI processing) - the freshly uploaded product page does position it for those purposes, but the rundown also mentions its supposed gaming performance prowess.

Molex, a company known for making various electronics and connectors, has today announced that the company has developed a first-of-its-kind chip-to-chip connector. Designed mainly for the data center, the Molex 224G product portfolio includes next-generation cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable solutions. Running at 224 Gbps speeds, these products use PAM4 signaling and boast with " highest levels of electrical, mechanical, physical and signal integrity." As the company states, future high-performance computing (HPC) data centers require a lot of board-to-board, chip-to-chip, and other types of communication to improve overall efficiency and remove bottlenecks in data transfer. To tackle this problem, Molex has a range of products, including Mirror Mezz Enhanced, Inception, and CX2 Dual Speed products.

Future generative AI, 1.6T (1.6 Tb/s) Ethernet, and other data center challenges need a dedicated communication standard, which Molex is aiming to provide. Working with various data center and enterprise customers, the company claims to have set the pace for products based on this 224G PAM4 chip-to-chip technology. We suspect that Open Compute Project (OCP) will be first in the line of adoption, ad Molex has historically worked with them as they adopted Mirror Mezz and Mirror Mezz Pro board-to-board connectors. The new products can be seen below, and we expect to hear more announcements from Molex's partners. Solutions like OSFP 1600, QSFP 800, and QSFP-DD 1600 already use 224G products.

Scientific researchers need massive computational resources that can support exploration wherever it happens. Whether they're conducting groundbreaking pharmaceutical research, exploring alternative energy sources or discovering new ways to prevent financial fraud, accessible state-of-the-art AI computing resources are key to driving innovation. This new model of computing can solve the challenges of generative AI and power the next wave of innovation. Cambridge-1, a supercomputer NVIDIA launched in the U.K. during the pandemic, has powered discoveries from some of the country's top healthcare researchers. The system is now becoming part of NVIDIA DGX Cloud to accelerate the pace of scientific innovation and discovery - across almost every industry.

As a cloud-based resource, it will broaden access to AI supercomputing for researchers in climate science, autonomous machines, worker safety and other areas, delivered with the simplicity and speed of the cloud, ideally located for the U.K. and European access. DGX Cloud is a multinode AI training service that makes it possible for any enterprise to access leading-edge supercomputing resources from a browser. The original Cambridge-1 infrastructure included 80 NVIDIA DGX systems; now it will join with DGX Cloud, to allow customers access to world-class infrastructure.

Applied Materials, Inc. today announced a landmark investment to build the world's largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D). The new Equipment and Process Innovation and Commercialization (EPIC) Center is planned as the heart of a high-velocity innovation platform designed to accelerate development and commercialization of the foundational technologies needed by the global semiconductor and computing industries.

To be located at an Applied campus in Silicon Valley, the multibillion-dollar facility is designed to provide a breadth and scale of capabilities that is unique in the industry, including more than 180,000 square feet - more than three American football fields - of state-of-the-art cleanroom for collaborative innovation with chipmakers, universities and ecosystem partners. Designed from the ground up to accelerate the pace of introducing new manufacturing innovations, the new EPIC Center is expected to reduce the time it takes the industry to bring a technology from concept to commercialization by several years, while simultaneously increasing the commercial success rate of new innovations and the return on R&D investments for the entire semiconductor ecosystem.

We have seen a few examples of custom design/board partner Radeon RX 7600 graphics card models via leaks over the past two weeks - and AMD's alleged reference design has made an appearance this weekend, only fours days prior to the official product launch date (May 25). The leaked images once again come courtesy of VideoCardz - the set of two photos show a dual-fan setup on a mostly black shroud with the company's simple "Radeon" logo positioned near the top - this design seems to be missing an underlining strip of RGB (as seen on the big boy cards).

The picture of the card's flipside depicts a very plain looking backplate. The overall aesthetic is not too far removed from the existing high-end Radeon RX 7900 XT and 7900 XTX reference siblings, although this leaked entry-level offering is tiny in comparison - it is reported to be just under 21 centimeters in length (versus the 7900 XT at 27.6 cm and 7900 XTX at 28.7 cm). The RX 7600 MBA (made-by-AMD) card is said to be two slots wide.

Following the news that Oppo is likely to pull out of the French market, it now appears that the company has closed its chip design unit named Zeku. According to the South China Morning Post, workers at Zeku got less than a day's notice that the company was shutting down, which was on Thursday last week. Employees weren't even allowed back into the office to collect their personal belongings. As recent as two weeks ago, Zeku was still looking for new hires, which makes the abrupt closure even more peculiar, especially as Zeku is said to have employed upwards of 3,000 people.

Considering that Oppo is ranked as the fourth largest smartphone maker in terms of globally shipped units in Q1, the way the company has handled the closure of its chip design unit reeks of desperation. It should be noted that Zeku wasn't designing chips to power Oppo's phones, but presumably Zeku was behind the MariSilicon X, which was Oppo's own imaging co-processor. In all fairness, Oppo is far from the only company to have closed down business units this year, but the company is also said to be suffering in terms of shipments of smartphones, as the company saw a drop of 22 percent in shipments last year, to 103 million units. This appears to be part of the reason behind the shutdown of Zeku, but Oppo hasn't provided much in terms of details behind the closure.

Barron's Magazine has been on a technology industry kick this week and published their interview with AMD CEO Dr. Lisa Su on May 3. The interviewer asks Su about her views on Moore's Law and it becomes apparent that she remains a believer of Gordon Moore's (more than half-century old) prediction - Moore, an Intel co-founder passed away in late March. Su explains that her company's engineers will need to innovate in order to carry on with that legacy: "I would certainly say I don't think Moore's Law is dead. I think Moore's Law has slowed down. We have to do different things to continue to get that performance and that energy efficiency. We've done chiplets - that's been one big step. We've now done 3-D packaging. We think there are a number of other innovations, as well." Expertise in other areas is also key in hitting technological goals: "Software and algorithms are also quite important. I think you need all of these pieces for us to continue this performance trajectory that we've all been on."

When asked about the challenges involved in advancing CPU designs within limitations, Su responds with: "Yes. The transistor costs and the amount of improvement you're getting from density and overall energy reduction is less from each generation. But we're still moving (forward) generation to generation. We're doing plenty of work in 3 nanometer today, and we're looking beyond that to 2 nm as well. But we'll continue to use chiplets and these type of constructions to try to get around some of the Moore's Law challenges." AMD and Intel continue to hold firm with Moore's Law, even though slightly younger upstarts disagree (see NVIDIA). Dr. Lisa Su's latest thoughts stay consistent with her colleague's past statements - AMD CTO Mark Papermaster reckoned that the theory is pertinent for another six to eight years, although it could be a costly endeavor for AMD - the company believes that it cannot double transistor density every 18 to 24 months without incurring extra expenses.

According to Tom's Hardware, Microsoft is busy hiring engineers to help the company design its own Arm based SoC for Windows 12. Based on job listings, Microsoft is adding people to its "Silicon team," which is currently involved in designing products for Microsoft's Azure, Xbox Surface and HoloLens products. That said, the specific job listings mentioned by Tom's Hardware mentions "optimizing Windows 12 for Silicon-ARM architecture" suggesting we're looking at a custom Arm SoC, with others mentioning "internally developed silicon components" and "building complex, state-of-the-art SOCs using leading silicon technology nodes and will collaborate closely with internal customers and partners."

That said, Microsoft is currently working with Qualcomm and the Microsoft SQ3 found in the Surface Pro 9 is the latest result of that partnership. This brings the question if Microsoft has decided to make its own chip to compete with the Apple M-series of silicon, or if Microsoft is simply looking at working closer with Qualcomm by hiring inhouse talent that can help tweak the Qualcomm silicon to better suit its needs. With Windows 12 scheduled for a 2024 release, it looks like we'll have to wait a while longer to find out what Microsoft is cooking up, but regardless of what it is, it looks like Windows on Arm isn't going anywhere.

Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology. The TSMC N2 process, which adopts nanosheet transistor structure, represents a major advancement in semiconductor technology with significant speed and power advantages for high performance computing (HPC), mobile chips, and 3D-IC chiplets. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2, including the effects of self-heat on long-term reliability of wires and transistors. This latest collaboration builds on the recent certification of the Ansys platform for TSMC's N4 and N3E FinFLEX processes.

"TSMC works closely with our Open Innovation Platform (OIP) ecosystem partners to help our mutual customers achieve the best design results with the full stack of design solutions on TSMC's most advanced N2 process," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our latest collaboration with Ansys RedHawk-SC and Totem analysis tools allows our customers to benefit from the significant power and performance improvements of our N2 technology while ensuring predictively accurate power and thermal signoff for the long-term reliability of their designs."

Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (Nasdaq: SNPS) has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing. Synopsys provides the industry's most comprehensive EDA and IP solutions for multi-die systems on TSMC's advanced 7 nm, 5 nm and 3 nm process technologies with support for TSMC 3DFabric technologies and 3Dblox standard. The integration of Synopsys implementation and signoff solutions and Ansys multi-physics analysis technology on TSMC processes allows designers to tackle the biggest challenges of multi-die systems, from early exploration to architecture design with signoff power, signal and thermal integrity analysis.

"Multi-die systems provide a way forward to achieve reduced power and area and higher performance, opening the door to a new era of innovation at the system-level," said Dan Kochpatcharin, head of Design Infrastructure Management Division at TSMC. "Our long-standing collaboration with Open Innovation Platform (OIP) ecosystem partners like Synopsys and Ansys gives mutual customers a faster path to multi-die system success through a full spectrum of best-in-class EDA and IP solutions optimized for our most advanced technologies."

MSI, a world leader in high-performance and innovative computing solutions, proudly announces that the Modern MD271UL monitor has won the prestigious Red Dot Award 2023 for outstanding design and innovation. The Modern MD271UL is a 27-inch 4K monitor that offers an immersive visual experience with its wide color gamut and advanced EyesErgo eye-care technology. In addition, it is tailored for efficiency and productivity with a touch of personal style.

Elegantly Crafted with Vibrancy
Modern MD271UL monitors are inspired by Mid-century Modern Style, which has clean, low-key, and breathtaking functionality. With a sleek & minimalist design, it meshes well with stylish home or office furniture. Unlike the typical monitor, it is an elegant decor in any living room. The frameless and minimalist designs let you express your aesthetic and define your environment. The Modern MD271UL is designed not only for working but also for personal lifestyle.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

IBM today unveiled new single frame and rack mount configurations of IBM z16 and IBM LinuxONE 4, expanding their capabilities to a broader range of data center environments. Based on IBM's Telum processor, the new options are designed with sustainability in mind for highly efficient data centers, helping clients adapt to a digitized economy and ongoing global uncertainty.

Introduced in April 2022, the IBM z16 multi frame has helped transform industries with real-time AI inferencing at scale and quantum-safe cryptography. IBM LinuxONE Emperor 4, launched in September 2022, features capabilities that can reduce both energy consumption and data center floor space while delivering the scale, performance and security that clients need. The new single frame and rack mount configurations expand client infrastructure choices and help bring these benefits to data center environments where space, sustainability and standardization are paramount.

Cooler Master, the global frontrunner in PC components and peripherals, proudly reveals the triumphant entries of the Case Mod World Series 2022. This annual contest, which began in 2009, continues to captivate the imagination with trailblazing custom PC creations from artists across the globe.

This year's winner of the Best Tower Mod category is Timeplay who wowed the judges with a breathtaking Cosmos C700M mod that redefined the classic Full Tower case in an ITX form factor. In the Best Scratch Build category, Keir Graham took home the top honors with his PowerCore build—a remarkable custom liquid-cooled system that showcased both intricate detail and ingenious design.

Amid the US sanctions, Chinese technology giant Huawei has reportedly developed tools to create processors with 14 nm and above lithography. According to Chinese media Yicai, Huawei and its semiconductor partners have teamed up to create replacement tools in place of US chip toolmakers like Cadence, Synopsys, and Mentor/Siemens. These three companies control all of the world's Electronic Design Automation (EDA) tools used for every step of chip design, from architecture to placement and routing to the final physical layout. Many steps need to be taken before making a tapeout of a physical chip, and Huawei's newly developed EDA tools will help the Chinese industry with US sanctions which crippled Huawei for a long time.

Having no access to US-made chipmaking tools, Huawei has invested substantial time into making these EDA tools. However, with competing EDA makers supporting lithography way below 14 nm, Huawei's job still needs to be completed. Chinese semiconductor factories are currently capable of 7 nm chip production, and Huawei itself is working on making a sub-7 nm EUV scanner to aid manufacturing goals and compete with the latest from TSMC and other. If Huawei can create EUV scanners that can achieve transistor sizes smaller than 7 nm, we expect to see their EDA tools keep pace as well. It is only a matter of time before they announce adaptation for smaller nodes.

Apple CEO Tim Cook has reportedly set an ambitious end of the year launch window for the company's mixed reality headset. Operations Chief Jeff Williams has also pushed in favor of a late 2023 debut of the much delayed VR/AR hybrid product. According to anonymous insider sources who have divulged juicy details to the Financial Times, the decision to launch in 2023 has caused an internal clash with the Apple Design team at its Cupertino, California headquarters.

The Apple Park design team has called for additional development time, this would push the headset's launch back by several years. Insiders claim that the design team would prefer to have more time to refine the product's aesthetics and functionality, with emphasis on creating a sleek and more lightweight visor. Doubts about the efficacy of the headset's proposed internal technology were also expressed, the designers would prefer to delay until Augmented Reality development reaches a satisfying level of maturity.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced today that it has selected Amazon Web Services, Inc. (AWS) as its cloud provider for electronic design automation (EDA). A cloud-first approach helps Marvell to rapidly and securely scale its service on the world's leading cloud, rise to the challenges brought by increasingly complex chip design processes, and deliver continuous innovation for the expanding needs across the automotive, carrier, data center, and enterprise infrastructure markets it serves. The work extends the longstanding relationship between the two companies—Marvell is also a key semiconductor supplier for AWS, helping the company support the design and rapid delivery of cloud services that best meet customers' demanding requirements.

EDA refers to the specialized and compute-intensive processes used in chip making and is a critical piece of Marvell's R&D. Over the years, the number of transistors on an integrated chip has increased exponentially. Each advance in chip design calls for a calculated application of software modules overseeing logic design, debugging, component placement, wire routing, optimization of time and power consumption, and verification. Due to the computationally intensive nature of EDA workloads, it is no longer cost-effective or timely to run EDA on premises. By powering its EDA with AWS, Marvell leverages an unmatched portfolio of services including secure, elastic, high-performance compute capacity in the cloud to solve challenges around speed, latency, security of IP, and data transfer.

iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today announced the new RDY Ouro Kronii system featuring the special edition Y60 Ouro Kronii PC case.

"It's been an incredible journey collaborating with Kronii and hololive Engish," said King Perez de Tagle, Marketing Executive Producer of HYTE and iBUYPOWER. "It's about time The Warden of Time gets a high-performance gaming PC and the RDY Ouro Kronii limited edition systems are ready to ship. stay tuned for even more!" The RDY Ouro Kronii will boast the latest Intel Core i9 13900K or KF CPU, NVIDIA RTX 4070 Ti GPU, Z790 motherboard, and the custom Y60 Ouro Kronii PC case. The RDY Ouro Kronii will provide users with maximum performance in virtually any application with reliable components and iBUYPOWER's expert assembly.

Even more performance for RTX 4070 Ti GPUs! With the Eisblock Aurora cooler, Alphacool presents a new, innovative solution for active water cooling of Nvidia's Geforce RTX 4070 Ti graphics cards in the reference design.

In order to dissipate the enormous waste heat of this graphics card generation, in the best possible way, numerous optimizations have been carried out on the water cooler compared to the cooler models of the 30XX card generation. The fin structure was adapted and enables an optimal water flow while simultaneously increasing the cooling surface. The modified nozzle plate with improved Inflow Engine ensures the best possible distribution of water on the cooling fins. The fully chrome-plated copper base is resistant to acids, scratches and damage. In addition, the chrome plating provides homogeneity and reflectivity that cannot be achieved by nickel plating.