Chinese processor designers need help creating a leading-edge design that satisfies their needs, with the imposed sanctions and restrictions of Western countries. However, designers are using creative ways to make a server processor to fulfill their needs. According to the latest Sina report, Chinese company Loongson has developed a 32-core processor using chiplet technology. Previously, the company announced its 16-core 3C5000 processor based on LA464 cores, which utilize LoongArch ISA. Loongson used chiplet technology to fuse two 3C5000 processors into a single-socket solution called 3D5000, which features 32 LA464 cores to create a higher-performing design. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm.

The company claims that the typical power consumption is rated for 130 Watts at 2.0 GHz or 170 Watts at 2.2 GHz, with TDP power consumption not exceeding 300 Watts at 2.2 GHz even with peaks. The performance of the new 3D5000 processor, measured using SPEC2006, is 400 points and 800 points for single-socket and dual-socket servers, respectively. The four-socket server is expected to reach 1600 points in the same benchmark, so scaling is advertised as linear. Loongson hopes to provide samples to industry partners in the first half of 2023 with an unknown price tag.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

The Core product line takes shape with the new coolers in the usual high quality, excellent performance and functional design language. The heart of the copper cooler is an assembly of connector terminal and cooler, which is milled from one piece of copper. The fine workmanship combined with the hard and resistant chrome plating of the entire copper cooler meet the highest quality standards. The brass G1/4" threads integrated on both sides, also chrome-plated, stand out visually striking from the terminal and are one of the key points of the new design language that will be present in all products of the Core series.

The aluminium backplate matched to the design together with the terminal forms a single unit. It convinces with clear and homogeneous optics on the back of the cooler. The individually controllable lighting consists of digitally addressable RGB LEDs and enables the even and colorful illumination of the entire cooler.

We have discovered an issue with our all-in-one watercooler Lumen. Following user reports of an increase in CPU temperatures, an investigation was started to determine the potential cause. Our findings conclude that the soldering material used in the aluminium radiator, as well as impurities introduced during manufacturing, may cause a reaction with the chemical composition of the cooling fluid. Over time this may lead to sediment build-up in the circulating liquid getting caught in the fins of the CPU block, causing an increase in temperatures as a result of the blockage.

Although Lumen units that are not currently causing temperature issues are safe for continued use, the experience of our users is our main priority. We have therefore decided to halt all Lumen sales globally, until we are satisfied that the quality standards we and our users expect are fully met. In order to address the issue, our teams will be working on a new version with an updated radiator and a new liquid formula, produced following revised processes and guidelines for assembly. With our currently estimated timeline, we are hoping to have new units available as replacements for Lumen owners, as well as substitutes for stock at distributors and resellers; in about six weeks. A web form for users to request a replacement can be found on our dedicated website, which also provides ongoing updates, timeline and further information. Ticket holders will also receive updates via e-mail. We sincerely apologize for the inconvenience.

peel 3d, the developers of best-in-class professional-grade 3D scanners that offer superior value at unmatched price points, today announced the launch of peel 3 and peel 3.CAD—two new scanners that will elevate the 3D scanning experience for professional users across many different sectors without compromising affordability.

peel 3 and peel 3.CAD handle like a charm as they feature a revamped ergonomic design unlike any other on the market and an intuitive multi-function touchscreen interface. Industry-first haptic user communication through vibration simplifies generating high-quality 3D scans regardless of users' skill levels. Improved resolution and performance for more complex geometries, surfaces and colours provide additional versatility to 3D scan any type of object.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

ViewSonic Corp., a leading global provider of visual solutions, announces the new Fogra-certified professional display, ColorPro VP2786-4K. Built with 100% Adobe RGB color gamut, it delivers true-to-life color reproduction on all digital and print mediums. The monitor is tailored for the all-new ColorPro Sense software, which automatically suggests color combinations from Pantone 's color library to best match the creator's vision. It is also equipped with the intuitive ColorPro Wheel for in-depth color control and management.

"Photographers, printing professionals, and colorists require precise color reproduction to best represent their visions, which is why we offer solutions that ensure their masterpieces can be replicated in their truest form," said Oscar Lin, General Manager of the Monitor Business Unit at ViewSonic. "The ColorPro VP2786-4K takes another step forward into the realm of true color management with its combination of software and hardware. With that, we hope to give creators the freedom to command how their work looks like."

The Chinese technology giant, SMIC, has managed to advance its semiconductor manufacturing technology and shipped the first 7 nm silicon manufactured on China's soil. According to analyst firm TechInsights, who examined the 7 nm Bitcoin mining SoC made for MinerVa firm, there are doubts that SMIC 7 nm process is somewhat similar to TSMC's 7 nm process. Despite having no access to advanced semiconductor manufacturing tools, and US restrictions placed around it, SMIC has managed to produce what resembles an almost perfect 7 nm node. This could lead to a true 7 nm logic and memory bitcells sometimes in the future, as the node advances in SMIC's labs.

Having done an in-depth die analysis, the TechInsights report indicates that TSMC, Intel, and Samsung have a more advanced 7 nm node and are two nodes ahead of the Chinese SMIC. The results are not great regarding the economics and yield of this SMIC 7 nm process. While we have no specific data, the report indicates that the actual working chips made with older DUV tools are not perfect. This is not a problem for the Chinese market as it seeks independence from Western companies and technology. However, introducing a China-made 7 nm chip is more critical as it shows that the country can manufacture advanced nodes with restrictions and sanctions in place. The MinerVa SoC die and the PCB that houses those chips are pictured below.

The recent semiconductor shortage has put an unprecedented amount of focus on the industry. Both commercial and government entities have come to recognize the lack of advanced node semiconductor manufacturing capabilities onshore in the United States. Intel Foundry Services (IFS) entry into the commercial foundry space is poised to change all that. As part of IFS Accelerator program, Intel recently announced their new IFS Cloud Alliance program, with Microsoft Azure as one of the inaugural members.

This is the latest chapter in a partnership between Intel and Microsoft that stretches back decades all the way back to the early days of the personal computer. In the last few years, Intel and Microsoft have collaborated on advancing semiconductor design on the cloud by working together to bring out EDA centric cloud compute such as the FX series on Azure, working with EDA vendors to enhance their software to better take advantage of the elasticity of the Azure cloud, as well as collaborating on a secure cloud-based semiconductor development platform for the US Department of Defense RAMP and RAMP-C programs.

When designing integrated circuits, engineers aim to produce an efficient design that is easier to manufacture. If they manage to keep the circuit size down, the economics of manufacturing that circuit is also going down. NVIDIA has posted on its technical blog a technique where the company uses an artificial intelligence model called PrefixRL. Using deep reinforcement learning, NVIDIA uses the PrefixRL model to outperform traditional EDA (Electronics Design Automation) tools from major vendors such as Cadence, Synopsys, or Siemens/Mentor. EDA vendors usually implement their in-house AI solution to silicon placement and routing (PnR); however, NVIDIA's PrefixRL solution seems to be doing wonders in the company's workflow.

Creating a deep reinforcement learning model that aims to keep the latency the same as the EDA PnR attempt while achieving a smaller die area is the goal of PrefixRL. According to the technical blog, the latest Hopper H100 GPU architecture uses 13,000 instances of arithmetic circuits that the PrefixRL AI model designed. NVIDIA produced a model that outputs a 25% smaller circuit than comparable EDA output. This is all while achieving similar or better latency. Below, you can compare a 64-bit adder design made by PrefixRL and the same design made by an industry-leading EDA tool.

Samsung Foundry will engage Ansys' industry-leading electromagnetic (EM) simulation tools to develop ultramodern designs, including 5G/6G, on the most advanced chips, nodes, and process technologies. Ansys' simulation solutions will deliver a comprehensive EM-aware design flow with greater capacity, speed, and integration capabilities for Samsung's most advanced semiconductor technology, accelerating on-chip design cycle times to boost high-speed connectivity while helping to reduce design error and risk.

Samsung designers will leverage Ansys' EM design tools, Ansys RaptorX, Ansys VeloceRF, and Ansys Exalto, to help reduce time to market by two to three weeks on smaller designs and up to two months for complex designs. With automation capabilities that optimize calculations and modeling, coupled with larger capacity, Ansys' software will allow the Samsung team to design at faster speeds with higher fidelity.

Samsung Electronics, the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. Multi-Bridge-Channel FET (MBCFET), Samsung's GAA technology implemented for the first time ever, defies the performance limitations of FinFET, improving power efficiency by reducing the supply voltage level, while also enhancing performance by increasing drive current capability. Samsung is starting the first application of the nanosheet transistor with semiconductor chips for high performance, low power computing application and plans to expand to mobile processors.

"Samsung has grown rapidly as we continue to demonstrate leadership in applying next-generation technologies to manufacturing, such as foundry industry's first High-K Metal Gate, FinFET, as well as EUV. We seek to continue this leadership with the world's first 3 nm process with the MBCFET," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "We will continue active innovation in competitive technology development and build processes that help expedite achieving maturity of technology."

Today, leading global fabless chipmaker MediaTek Inc., [joined by Indiana Governor Eric J. Holcomb, Deputy Secretary of Commerce Don Graves, Indiana Secretary of Commerce Bradley B. Chambers, and Purdue College of Engineering's Dr. Mung Chiang] announced their commitment to accept a state transition assistance package from the Indiana Economic Development Commission (IEDC) to support its very first Midwest semiconductor chip design center in West Lafayette, Indiana. MediaTek also shared its intention to create a new research partnership with Purdue to collaborate on engineering talent development and new research on next-generation computing and communications chip design. The news was shared with senior leaders, other international investors and policymakers assembled in National Harbor, Maryland for the 2022 SelectUSA Investment Summit.

This novel partnership in Indiana represents a new U.S. growth model for MediaTek USA; outside the traditional centers of gravity for chip design. "We believe strongly that being in Indiana means we'll have access to some of the best engineering talent in the world," said Dr. Kou-Hung Lawrence Loh, Corporate Senior Vice President of MediaTek Inc. and President of MediaTek USA, Inc. "Not just at Purdue, but West Lafayette is only four hours away from nearly a dozen of the top engineering schools in the country. In the post pandemic world, top candidates tell us they want to be closer to home, near family and they want to have a real house and great schools. Indiana offers all that and more."

Cadence Design Systems, Inc. today announced that its digital and custom/analog design flows have been certified for the TSMC N3E and N4P processes, supporting the latest Design Rule Manual (DRM). In addition, Cadence and TSMC delivered N3E and N4P process design kits (PDKs) and design flows to accelerate customer adoption and advance mobile, AI and hyperscale computing design innovation. Joint customers are actively designing with the new N3E and N4P PDKs, and several test chips have already been taped out, which demonstrates how Cadence solutions help customers improve engineering efficiency and maximize the power, performance and area (PPA) benefits offered by the latest TSMC process technologies. The Cadence digital and custom/analog advanced-node solutions support the company's Intelligent System Design strategy, enabling system-on-chip (SoC) design excellence.

Cadence worked closely with TSMC to ensure the digital full flow was optimized for TSMC's advanced N3E and N4P process technologies. The complete RTL-to-GDS flow includes the Cadence Innovus Implementation System, Quantus Extraction Solution, Quantus Field Solver, Tempus Timing Signoff Solution and ECO option, Pegasus Verification System, Liberate Characterization Solution and Voltus IC Power Integrity Solution. Additionally, the Cadence Genus Synthesis Solution and predictive iSpatial technology are enabled for the TSMC N3E and N4P process technologies.

Google Cloud and AMD today announced a technology partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, further extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud's global networking, storage, artificial intelligence, and machine learning capabilities to further improve upon its hybrid and multicloud strategy for these EDA workloads.

Scale, elasticity, and efficient utilization of resources play critical roles in chip design, particularly given that the demand for compute processing grows with each node advancement. To remain flexible and scale easily, AMD will add Google Cloud's newest compute-optimized C2D VM instance, powered by 3rd Gen AMD EPYC processors, to its suite of resources focused on EDA workloads. By leveraging Google Cloud, AMD anticipates being able to run more designs in parallel, giving the team more flexibility to manage short-term compute demands, without reducing allocation on long-term projects.

GIGABYTE Technology announced a total of four products under its gaming-focused AORUS brand, including a trio of AORUS high-end Z690 motherboards and the AORUS FO48U large-sized gaming monitor, which have been awarded the prestigious iF Design Award 2022 for their excellence in product design.

The awarded Z690 AORUS XTREME WATERFORCE, Z690 AORUS XTREME, and Z690 AORUS MASTER are the top-of-the-line motherboards engineered to perfectly support the Intel 12th-gen processors. These three motherboards impress the performance-driven enthusiasts with GIGABYTE's state-of-the-art cooling solutions and class-leading power deliveries. Combined with the exclusive DDR5 memory overclocking function, these AORUS Z690 can fully unleash the gaming prowess of the new-gen processors, putting together a powerful and durable platform for those who seek nothing but the extreme performance from their desktop PCs.

Designing Artificial Intelligence / Machine Learning hardware accelerators takes effort from hardware engineers in conjunction with scientists working in the AI/ML area itself. A few years ago, we started seeing AI incorporated into parts of electronic design automation (EDA) software tools, helping chip designers speed up the process of creating hardware. What we were "used to" seeing AI do are just a couple of things like placement and routing. And having that automated is a huge deal. However, it looks like the power of AI for chip design is not going to stop there. Researchers at Google and UC Berkeley have made a research project that helps AI design and develop AI-tailored accelerators smaller and faster than anything humans made.

In the published paper, researchers present PRIME - a framework that created AI processors based on a database of blueprints. The PRIME framework feeds off an offline database containing accelerator designs and their corresponding performance metrics (e.g., latency, power, etc.) to design next-generation hardware accelerators. According to Google, PRIME can do so without further hardware simulation and has processors ready for use. As per the paper, PRIME improves performance upon state-of-the-art simulation-driven methods by as much as 1.2x-1.5x. It also reduces the required total simulation time by 93% and 99%, respectively. The framework is also capable of architecting accelerators for unseen applications.

Apple yesterday announced its M1 Ultra processor. It is designed to be one of the most powerful solutions ever envisioned for desktop users, and it leverages some of the already existing technologies. Essentially, the M1 Ultra chip combines two monolithic dies containing M1 Max designs. They are stitched together to create one massive chip behaving in a rather exciting way. To pair the two M1 Max dies together, Apple has designed a package called UltraFusion, which is a die-to-die interposer with more than 10,000 signals. It provides 2.5 TB/s low latency inter-processor bandwidth and enables seamless sharing of information across two dies.

What is more interesting is that this approach, called multi-chip module (MCM) design philosophy, allows the software to view these two dies as a single, unified processor. Memory is shared across a vast pool of processor cache and system memory in a single package. This approach is software agnostic and allows hardware to function efficiently with loads of bandwidth. Apple notes that no additional developer optimization is required for the new processor, and the already-existing stack of applications for M1 Max works out-of-the-box. Talking about numbers, the M1 Ultra chip has a potential main memory bandwidth of 800 GB/s, with up to 128 GB of unified system memory. We are yet to see how this design behaves as the first Mac Studio units start shipping, so we have to wait for more tests to check these claims out.

Ansys announced it is collaborating with GF to deliver innovative, unique, and feature-rich solutions to solve some of the biggest challenges facing data centers today. With data being generated at a record pace, causing a surge of power consumption in data centers globally, there is an ever-increasing need for innovative solutions to accelerate data transmission while optimizing energy efficiency. To meet such rising demands, GF is focused on developing groundbreaking semiconductor solutions that leverage the potential of photons—instead of electrons—to transfer and move data, maintaining GF's position as a leader in the rapidly growing optical networking space.

GF Fotonix is GF's next generation, widely disruptive, monolithic platform. GF Fotonix is the first in the industry to combine its differentiated 300 mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale. "Our engagement with Ansys is another example of how GF is partnering with the ecosystem leaders to deliver innovative, time to market solutions for our customers," said Mike Cadigan, senior vice president for Customer Design Enablement, GF. "By coupling GF Fotonix with Ansys' industry-leading simulation solutions, we are reaching new levels in photonic chip design. With support for Verilog-A simulation and process-enabled custom design, designers have greater modeling capabilities to meet their performance, power, and density requirements."

Ansys today announced its inaugural partnership to IFS Accelerator - EDA Alliance to provide best-in-class EDA tools and simulation solutions that will support customer innovation, including bespoke silicon for customizable three-dimensional integrated circuit (3D-IC) designs. By leveraging Ansys' market-leading multiphysics solutions, IFS Accelerator will make silicon technology available to customers to design uniquely innovative chips. Ansys' cutting-edge EDA and simulation tools will enable mutual customers to reduce design barriers, minimize design risk and cost, and accelerate time-to-market.

The IFS Accelerator will foster collaborative innovation with world-leading EDA, design services and IP partners to provide a comprehensive design ecosystem with premium process technologies, advanced packaging technologies, and manufacturing capabilities. "We are excited to announce the IFS Accelerator - EDA Alliance as a major step forward for Intel's foundry ambitions," said Rahul Goyal, VP and GM of Intel Product & Design Ecosystem Enablement. "Together with Ansys and other partners, this alliance will create advanced flows and methodologies, and accelerate productivity by combining our knowledge, resources, and shared passion to drive electronic design."

Phanteks announced the launch of the new Eclipse P600s and Evolv X Matte White Edition along with the Gen4 PCI-e Riser Cables. Its stunning all-new matte white look makes the Evolv X and Eclipse P600s a perfect combination for color-themed builds while maintaining a wide range of flexibility and premium materials.

Evolv X & Eclipse P600S Matte White Edition
The Evolv X and Eclipse P600s are mid-tower cases that offer dual system capabilities, massive storage, and extensive water-cooling support. The Evolv X features a 3 mm aluminium exterior with hinged clear tempered glass, improved airflow, smart spacing, and additional mesh elements. The P600s, a hybrid forged between silent and high-performance chassis. Designed with an effective soundproofing panel and Phanteks' new high-airflow fabric, the Eclipse P600s offers the full potential of two opposites, minimum noise, and maximum airflow. Whether it's a high-end water-cooling build, professional data storage system, or even a dual-system PC, both cases can accommodate your desired configuration thanks to the effective interior design that utilizes the space efficiently.

Phanteks debuts a host of new products for the upcoming year at CES 2022 - The brand new Evolv Shift XT Mini-ITX Chassis and Revolt SFX Power Supplies, Matte White Editions for the Evolv X & Eclipse P600S Chassis, white SK PWM D-RGB Fans, white AMP Power Supply and a complete range of Gen4 PCIe Riser Cables and Gen4 Vertical GPU Bracket.

Brand new and unique Evolv Shift XT Mini-ITX Chassis and super compact Revolt SFX Power Supplies
Evolv Shift XT - Compact, Powerful, Futureproof
The Evolv Shift XT brings a unique small form factor that can extend in size to tailor to your cooling performance needs. The Evolv Shift XT has no compromise on performance with support for powerful hardware, whether in Compact, Aircooled, or Liquid Cooled Mode.

The semicondustor market in 3Q21 is red hot with total revenue of the global top 10 IC design (fabless) companies reaching US$33.7 billion or 45% growth YoY, according to TrendForce's latest investigations. In addition to the Taiwanese companies MediaTek, Novatek, and Realtek already on the list, Himax comes in at number ten, bringing the total number of Taiwanese companies on the top 10 list to 4.

Qualcomm has been buoyed by continuing robust demand for 5G mobile phones form major mobile phone manufacturers with further revenue growth from its processor and radio frequency front end (RFFE) departments. Qualcomm's IoT department benefited from strong demand in the consumer electronics, edge networking, and industrial sectors, posting revenue growth of 66% YoY, highest among Qualcomm departments. In turn, this drove Qualcomm's total 3Q21 revenue to US$7.7 billion, 56% growth YoY, and ranking first in the world.