SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

Strontium Technology has announced a new series of high-performance solid state drives (SSDs) named HAWK. These Hynix-built solid state drives with Strontium branding are based on SandForce's SF2281 controller and SK Hynix Flash. These drives are said to be a good upgrade option featuring 500MB/s of read and write performance and also claim to offer faster performance for PCs and Macs. Needless to say, SSDs feature enhanced durability, shock-proof, silent operation and are more reliable as compared to traditional hard drives.

The 2.5-inch HAWK drive is available in 120GB and 240GB storage capacities. The sequential (256KB, MAX) read speed is 510 MB/s and write speed is 470 MB/s. The random (4KB, MAX) performance is 50,000 IOPS read and 38,000 IOPS write. It comes with support for SATA I/ II/ III interface, TRIM Support (O/S support required) and has a Mean Time between Failures (MBTF) of 1.2M. Strontium HAWK SSD has been designed to offer quicker boot up and shorter lead time in the loading of applications to enhance productivity.

SK Hynix announced its launch of client SSD (Solid State Drive). The SSD features faster speed and low power consumption than HDD (Hard Disk Drive) so it is expected to replace the HDD as another type of storage for PCs and other applications.

The first ever SK Hynix's client 2.5" SSD consists of ONFI synchronous NAND Flash memory using 20nm class process and densities of 128GB (Gigabyte) and 256GB are available. It significantly improves the speed and reliability by adopting SATA III interface with data transmissions at 6Gb/s (Gigabits per second). This high performance SSD generates sequential read speeds of 510MB/s (Megabytes per second) and sequential write speeds of 470MB/s. It is three or four times faster than the traditional HDD.

Hard drive prices refuse to budge after last year's floods that struck manufacturing facilities in Thailand, even as manufacturers turn record profit. The solid-state drive market, on the other hand, is finally rolling with competition, high volume production, and advancements in NAND flash technologies. With memory majors such as Hynix adding new NAND flash manufacturing facilities to their infrastructure, SSD is expected to finally get its big break in the mainstream market.

SSD prices, according to price aggregators, are on a free-fall. Models which once held relative pricing as high as $2 per gigabyte, and going deep within the $1 mark. For example, Crucial's widely-praised M4 256 GB SSD has a price per GB of 'just' $0.82, and a market price around $200, something unheard of, for a 256 GB SSD with transfer rates of over 500 MB/s. With SSD major OCZ Technology releasing new generations of drives under the Vertex 4 and Agility 4 series that use Indilinx processors, older Vertex 3 and Agility 3 models are being phased out, some of these are seeing sub $1/GB prices. Intel is also responding to market trends, with prices of its SSD 520 series dropping sharply. Find a boat-load of stats at the source.

SK hynix Inc. ('SK hynix' or 'the Company') announced that it has entered into an agreement to acquire California-based storage solution company Link_A_Media Devices Corporation ('LAMD'). LAMD, founded in 2004, is a leader in the development of semiconductor system-on-chip (SoC) solutions for the data storage market. These SoC solutions, also called controllers, interface with processors to significantly increase the speed and reliability of Flash memory. Upon completion of the acquisition, LAMD will join SK hynix as a business unit focused on customized NAND based solutions.

As various mobile applications such as smartphones and tablet PCs are being rapidly adopted and cloud computing grows in popularity, the NAND Flash market has been evolving from raw NAND memory solutions for USB and memory cards to value-added products equipped with controllers. The role of the NAND controller in premium products such as e-MMC (embedded Multi Media Card) and SSDs (Solid State Drives) has become increasingly important to meet the high memory densities and improved interface speeds required by end users.

Korean memory giant SK Hynix is launching its own branded consumer and enterprise SSD lines, à la Samsung (the other Korean memory giant). It is starting off with high-performance consumer SSDs targeting Ultrabooks, built in the 2.5-inch 7 mm-thick SATA form-factor. The SH910 series SSDs combine Hynix' homegrown H27QDG8VEBIR-BCB MLC NAND flash chips built in the 25 nm fab process, with LSI-SandForce SF-2281 processor.

The drive will be initially available in two capacities, 128 GB and 256 GB (higher than usual capacities thanks to adjusted overprovisioning). Both drives offer sequential transfer speeds of up to 520 MB/s reads with 500 MB/s writes; up to 60,000 IOPS 4K random seek, 35,000 IOPS random write; and feature-set that includes 128-bit AES encryption, TRIM, NCQ, and SMART. A performance review can be found at the source.

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or 'PCRAM') technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM's expertise in such disciplines with SK Hynix's cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

Century Japan started selling a [relatively] affordable 16 GB DDR3-1600 MHz (PC3-12800) ECC Registered DIMM. The module runs at 1600 MHz with timings of 11-11-11, and has been tested on EVGA SR-X platform to achieve 192 GB (12 x 16 GB), scraping the address-space limits of Windows 7 64-bit client operating systems. The 240-pin RDIMM uses 36 Hynix-made DRAM chips. In Japan, Century's new 16 GB RDIMM is priced at 25,000 JPY (US $314) a pop. For reference, DDR3-1066 MHz 16 GB RDIMMs are priced around $300.

Japanese DRAM maker Elpida has been reporting chronic financial problems since the beginning of 2012. It soon filed for bankruptcy, driving interest in competitors Toshiba, Global Foundries, Micron and Hynix (SK Hynix), to acquire it. Hynix has now reportedly withdrawn from the Elpida takeover bid. The withdrawal is likely due to its own financial situation. Hynix is not the first to withdraw from the bid, the first to drop out was Toshiba. With the two gone, Micron Technology is next in line, with a bid of US $1.4 billion to buy out Elpida.

Solid manufacturing and strong pricing allowed Micron Technology Inc. and Hynix Semiconductor Inc. to post strong performances in the global NAND flash business in the fourth quarter, allowing them to narrow the gap in market share between them and the industry leaders, and setting the stage for further advances in 2012.

No. 3-ranked Micron Technology Inc. of the United States achieved 11.7 percent revenue growth in the fourth quarter compared to the third, according to a new IHS iSuppli Data Flash Market Tracker report from information and analytics provider IHS. Meanwhile, fourth-placed Hynix Semiconductor Inc. of South Korea expanded its revenue by 5.4 percent, as presented in the table below.

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.

Spansion Inc. and SK Hynix today announced an alliance to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The first Spansion SLC NAND products resulting from this alliance will be available beginning in the second quarter of 2012. As part of the relationship, the companies will enter into a patent cross-licensing agreement.

Spansion's NAND products complement its NOR offering and complete its product line, which is targeted at embedded applications such as automotive, industrial and telecommunications. Spansion's high performance and high reliability SLC NAND product portfolio will come with Spansion's recognized customer support and commitment for longevity of supply, which is highly valued in the embedded market, where Spansion has established relationships. Spansion will apply its stringent process for qualification, testing, extended temperature support and packaging to its NAND products. The company plans to introduce a family of NAND products over the next few quarters.

ZOTAC is flexing its engineering muscle. First, it was talk of a 2 GHz GeForce GTX 680 by one of its senior executives, and now this, ZOTAC GeForce GTX 680 Extreme Edition. Pictured below, the card's design is reminiscent of the crazy engineering endeavors ZOTAC China undertakes, to come up with some extremely powerful designs, which seldom get out of the APAC region (to EMEAI and NA regions).

ZOTAC took a top-tier binned GK104 GPU, 2 GB of high-grade Hynix GDDR5 memory chips, and paired them with a 12-phase VRM power supply. Apart from bleeding-edge International Rectifier GaNpowIR driver-MOSFETs, the VRM uses server-grade tantalum capacitors, and FPCAP multi-phase capacitors. To drive it all, ZOTAC used CHiL CHL8318 VRM controller.

With significant growth in demand for NAND flash memory, with the advent of Intel's Ultrabook form-factor, and the transition of Apple's MacBook range to slimmer form-factors that could raise demand of solid-state storage, memory makers are stepping up production of NAND flash memory. Samsung recently announced the setting up of a 12-inch NAND flash wafer production facility in China. In response to this, the other major Korean memory-maker, Hynix, indicated that its plant located in Wuxi, China, will switch from producing DRAM to NAND flash. This switch seems short-term and Hynix plans to expand the plant later, to accommodate NAND flash production. Hynix is currently a much smaller player in the NAND flash industry than Samsung.

Even as Elpida has filed for bankruptcy protection and is dealing with restructuring, its disposal of a subsidiary Taiwan-based DRAM foundry Rexchip will impact DRAM supply and pricing, sources told DigiTimes. Rexchip has a monthly foundry capacity of 800,000 12-inch wafers and uses 65,000 wafers currently. Elpida has just finished development of 25 nm DRAM technology, which gives it competitiveness over other DRAM majors, Samsung Electronics and SK-Hynix.

As analyzed in an older report, should Elpida's restructuring take a turn for the worse, leading to an exit from the DRAM industry, it could have huge consequences on the competitive environment of the industry. DigiTimes currently reports that DRAM prices are slowly, but surely creeping back up. DRAM contract prices for March have risen 5.7% on average, the prices of 4 GB DDR3 modules have gone as high as US $18.75, with average prices of $18.50.

In case Elpida is unable to repay its debts due in April and goes insolvent, marking its exit from the DRAM industry, the consequences for not just the DRAM industry, but also the PC industry as a whole, will be huge, note industry observers. On the 15th, Eplida released a statement on the assumed going concern in the company with regards to its debt situation. The company has been unable to recover from its condition despite injections of capital backed by no less than the Japanese government.

Elpida has to repay nearly 40 billion JPY US ($505.8 million) to the government, and another 80 billion JPY (US $1.02 billion) in short-term bank loans. Frantic negotiates are on between the company and its long list of creditors that include the Japanese government and other banks to seek an interim relief from the default, even as the company searches for a cash-source that would alleviate the situation and make it survive. Elpida's situation is different from that of Qimonda, it's larger, has more technologies in the pipeline, and has recently set up 30 nm-class mass-production and is testing 20 nm-class production. In other words, it has much greater potential as a company that contributes to the industry, if it survives. Its exit will leave the industry imbalanced, and dominated by Korean DRAM makers such as Samsung and Hynix, and American Micron Technology, a step closer to oligarchical price-controls, observers note.

Rambus is the company best known for suing dozens of companies over memory patents that it holds and is suing so prolifically, that many just see this company as a patent troll. It has been accused many times of obtaining submarine patents while a member of the JEDEC group until a decade ago, which it is now fraudulently using to try and extort royalties from every other company using DDR memory and its derivatives. Unfortunately, those lawsuits didn't stick, encouraging Rambus to carry on enthusiastically. Rambus won patent fights against NVIDIA and Samsung for example, who now have to pay them ongoing royalties. However, it looks like Rambus may have bitten off more than it could chew, because it has just lost a $4 billion antitrust lawsuit against Micron Technology Inc and Hynix Semiconductor Inc, erasing more than half of the chipmaker's value as investors abandoned its stock in droves. Rambus stock immediately plunged more than 60% on this good news.

Hynix Semiconductor Inc. and Toshiba Corporation today announced that they have agreed to strategic collaboration in the joint development of Spin-Transfer Torque Magnetoresistance Random Access Memory (MRAM), a fast emerging next generation memory device. Once technology development is successfully completed, the companies intend to cooperate in manufacturing MRAM products in a production joint venture. Hynix and Toshiba have also extended their patent cross licensing and product supply agreements.

Toshiba recognizes MRAM as an important next-generation memory technology with the potential to sustain future growth in its semiconductor business. Hynix has a cutting-edge memory technology, most notably in manufacturing process optimization and cost competitiveness. The collaboration announced today, between two of the world's leading semiconductor manufacturers in a promising new technology, is expected to make a significant contribution to the continued progress of the world semiconductor industry.

Gigabyte is constantly revising designs of its already-launched graphics cards. This time around, it's the Radeon HD 6970 WindForce 3X (GV-R697UD-2GD). This custom design graphics card sticks to AMD's reference clock speeds, but creates some overclocking headroom with its WindForce 3X cooler, and a strong VRM on the PCB. The new revision 2.0 packs an NEC/Tokin Proadlizer, which is a high-grade multiphase capacitor, that helps in conditioning the power to the GPU.

Apart from this small yet important change, everything else is the same. The PCB uses Gigabyte's Ultra Durable VGA+ construction, which includes 2 oz copper PCB, low RDS (on) MOSFETs, ferrite core chokes, hand-picked tier-1 GDDR5 memory chips by Samsung or Hynix, hand-picked GPU, and clock speeds of 880 MHz core and 5.50 GHz GDDR5 effective memory. There is 2 GB of memory. Expect the new revision to cost roughly the same as the original.

Hynix Semiconductor Inc. ('Hynix') today announced that it has developed 2Gb(Gigabit) DDR4 DRAM and DDR4 DRAM based 2GB(Gigabyte) ECC-SODIMM(Error Check & Correction Small Outline Dual In-line Memory Module) applying its leading 30nm class process technology. The DDR4 DRAM product meets the JEDEC standard and the module product is designed for the micro server.

DDR4 DRAM is a next generation memory product which consumes less electronic power while it transfers data as twice as faster than the existing DDR3 DRAM. The device works at the industry's fastest speed of 2400Mbps(Megabits per second), which is also 80% faster than DDR3 1333Mbps product. The Module product operates at such a low voltage of 1.2V and processes up to 19.2 GB (Gigabytes) of data per second with a 64-bit I/O.

Colorful, the brains behind the iGame series of fully-loaded performance-thru-mainstream graphics cards is continuing to let its creativity fly. This time around, the company is working on a new GeForce GTS 450 graphics card that's "slim" in more ways than one. To begin with, the card will feature a single-slot cooling solution, next, the designers completely did away with "big" and redundant components on the PCB, and replaced them with higher-grade yet compact and less in number components. For example, while most other graphics card vendors fill up the 128-bit wide GDDR5 memory bus of the GeForce GTS 450 with eight 1 Gbit (128 MB) chips, with two chips sharing a 32-bit wide path, Colorful used just four higher-density memory chips. That's four 2 Gbit (256 MB) memory chips made by Hynix to achieve the same capacity, reducing board footprint, and possibly heat and energy draw.

All cylindrical capacitors are replaced by server-grade flatbed high-C POSCAP capacitors. The card uses a simple 3+1 phase VRM, driven by an ON-Semi made controller. The chokes used don't exactly sit on the PCB, rather, they're suspended in openings of the PCB, by their leads, this improves ventilation around the chokes, and reduces the size of the chokes on the obverse side, reducing the obstruction caused to the cooler. The PCB itself is well "ventilated". All free-space on the PCB is used to carve out vents for the cooler to draw in air from. Colorful did not mention when tentatively it plans to release this product.

Colorful made global headlines when it unveiled the iGame GTX 460 graphics card to markets outside its niche of China and other East Asian markets. With the more affordable GeForce GTS 450, we thought it went softer with its non-reference GTS 450 graphics card that is designed appropriately for the market-segment. Now it looks like Colorful is back to an exorbitant product design, with the iGame GTS 450. This card sports similar styling to its GTX 460 cousin. The "shark-fin" cooler design that "breathes in" air for efficient ventilation is also there, but the key feature here is a design meant for overclocking.

The iGame GTS 450 makes use of a strong VRM area that makes use of a 5-phase design, with high-grade ONSEMI-made MOSFETs and server-grade NCC POSCAP capacitors, low-latency GDDR5 memory chips from Hynix, and a dual-BIOS design that is user-controllable with a switch on the rear panel. Each BIOS stores a different clock-speed profile, the first one is failsafe, sticking to reference speeds of 783/3608 MHz (core/memory); while the second one sports aggressive speeds of 900/4100 MHz. Colorful also mentions that with all the high-grade components on board, one can benefit from its overclocking capabilities that take it beyond that high-speed clock profile. Outside Asia, Colorful will release this card in Europe, the company has not finalised its price.

HP today announced that it has entered into a joint development agreement with Hynix Semiconductor Inc., a world-leading memory supplier, to bring memristor, a new circuit element first intentionally demonstrated in HP Labs, to market in future memory products. Memristors require less energy to operate, are faster than present solid-state storage technologies and can retain information even when power is off. The memristor, short for "memory resistor," was postulated to be the fourth basic circuit element by Prof. Leon Chua of the University of California at Berkeley in 1971 and first intentionally reduced to practice by researchers in HP Labs, the company's central research arm, in 2006.

Earlier this year, HP announced the discovery that the memristor also can perform logic, showing that memristor-based devices could change the standard paradigm of computing by enabling computation to one day be performed in chips where data is stored, rather than on a specialized central processing unit.

Hynix Semiconductor Inc., today announced that it has begun mass producing 64 Gigabit (Gb) NAND Flash using 20nm class technology at its 300mm Fabrication, M11 in Cheongju site. The Company developed this cutting edge technology last February.

Hynix's 20nm class 64Gb chip doubles the density in a package over the current 32Gb product. 20nm class process technology also provides a 60% increase in productivity over Hynix's existing 30nm class technology. By providing these high density and cost efficient chips, Hynix will respond to the needs of advanced mobile solutions which require smaller size and higher density storage capacity.