SSDs, with their advantages of high performance, compactness and low power consumption, are the perfect adaptation of storage products to the emergence of tablet PCs and Ultrabooks. Indeed, SSDs have become the defacto storage solution for ultra-thin notebooks. Apacer, a leading manufacturer of industrial SSDs, understands the demands for even more compactness and has produced a new mSATA A1 modular SSD that features a SATA 3.0 high-speed transmission interface and complies with JEDEC MO-300 standard codes. Currently, this model supports Intel Rapid Start and Intel Smart Response technologies, enabling users to enjoy an almost immediate start-up within seconds and enjoy a continuous high performance of the computer.

The largest professional computer show in Asia, the COMPUTEX TAIPEI, is coming on June 5. Team Group Inc., one of the leading memory manufacturers in the world, is ready to reveal its latest industrial memory modules to professional buyers around the world, including industrial-standard and server-grade memory modules, embedded industrial flash memories, and so on. The emphasis on customization, product performance and after-sale service quality are the live demonstration of how Team Group is determined for the industrial grade/SI market.

Team Group's industrial memory modules come with Standard series, Green series and Wide temperature series. The modules are produced with chips from original manufacturers and go through multiple meticulous and sophisticated verification analyses and hi-low temperature tests. The Wide temperature series is capable of working at the temperature ranging from -40℃ to 95℃, and provides stable operation performance even in conditions as punishing as at a desert or in arctic environment. The Green series works only with minimal voltage as low as 1.35V. You cannot be any greener than that. The newly developed high frequency and large volume memory modules complete the full product series for various demands in medial equipment, surveillance systems and industrial computers.

With the advent of Intel's Core "Ivy Bridge" processors, and DDR3-1600 MHz becoming a standard memory speed, there is a push among memory vendors for affordable memory kits supporting the standard. Princeton Japan launched no less than 12 new memory kits, spanning across standard DIMMs, SO-DIMMs (for notebooks and AIOs); single-module and dual-channel kits, with module densities of 2 GB, 4 GB, and 8 GB. The modules bear basic appearance, and lack fancy heatspreaders. The modules achieve their rated speed of 1600 MHz DDR with a CAS latency as high as 11T, and module voltage of 1.5V. The modules are hence JEDEC PC3-12800 specifications compliant, and don't require XMP profiles to operate at advertised speeds, on compatible platforms. The company is providing lifetime warranty. Prices start at 5,400 JPY (US $68).

As cloud computing becomes mature, most enterprises have already regarded this innovative management technology as the key point to building future information architecture so as to meet the needs for the massive data processing. To fully meet the stringent demands for cloud computing, Apacer, the leading memory module manufacturer, rolls out industry-leading enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference(Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It provides powerful computing to process on-going massive data, optimizes cloud computing and storage performance and realizes the most stable server storage environment.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-3 LPDDR3 Low Power Memory Device Standard, designed to satisfy the performance and memory density demands of the latest generation of mobile devices such as smartphones, tablets, ultra-thin notebooks and similar connected devices on the newest, high-speed 4G networks.

LPDDR3 offers a higher data rate, improved bandwidth and power efficiency, and higher memory densities over its groundbreaking predecessor, LPDDR2. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the LPDDR3 Low Power Memory Device Standard is available for free download from the JEDEC website: www.jedec.org/sites/default/files/docs/JESD209-3.pdf.

Green House Japan released a pair of new 8 GB DDR3-1333 MHz (PC3-10600) memory modules. These consist of the GH-DRT1333-8GB and GH-DVT1333-8GB, which are 240-pin standard DIMM, and differ by the former having lifetime warranty, while the latter has 5 year warranty; and GH-DNT1333 and GH-DWT1333, which are 204-pin SO-DIMM modules with lifetime and 5-year warranties, respectively. Both kinds of modules are JEDEC standards-compliant, and run at DDR3-1333 MHz speeds with CAS latency of 9T, and 1.50V DRAM voltage.

Team Group Inc. has been invested a great deal of efforts in developing commercial products that catch up with global trends. Now we are expanding our spectrum to industrial markets and dedicate ourselves in the development of industrial products that features high standard and resistance to extreme environmental conditions. This year, Team Group rolls out the new industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM, in the largest embedded system exhibition, the ESEC, in Japan.

The "industrial control wide-temperature series," the point in the show, is the "mighty warrior" that is able to operate in an environment at a temperature ranging from -40°C to 95°C. It is like operating stably in an extreme environment in the Arctic Circle or a scorching desert. This is absolutely the top choice for your industrial control memories and server memories.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced a new family of precision temperature sensors targeted at ultra-low-power solid state drive applications. This new family of devices minimizes power consumption and optimizes bill-of-materials (BOM) costs while maintaining compatibility with existing standards for high-volume memory modules.

The IDT TS3000GB0A0 is a low-power, high-accuracy temperature sensor for enterprise server and storage applications. It supports a 1.8 V power supply for reduced power consumption and compatibility with the existing supply voltage for SSD memory modules, eliminating the need for additional voltage regulators.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.

Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).

I-O Data of Japan introduced a new value 8 GB DDR3 memory module (model: DY1333-8G). The module runs at JEDEC-specified speeds of DDR3-1333 MHz, with 9-9-9-24/CR-1T timings, with 1.5V module voltage. The module is sold standalone, and in 16 GB dual-channel kits (model: 8GX2 DY1333). It features standard 240pin UDIMM dimensions, without any heat-spreaders. The single-module kit is priced at 18,060 JPY (US $217.2), while the dual-channel kit goes for 35,280 JPY (US $424.4).

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. J-STD-033C effectively provides guidance for this category of electronic components that has not been covered by any standard in the past.

IPC/JEDEC J-STD-033C provides surface mount device (SMD) manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Use of the standard helps achieve safe and damage-free reflow with the dry-packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices. JESD229 may be downloaded free of charge from the JEDEC website here.

Wide I/O mobile DRAM enables chip-level three dimensional (3D) stacking with Through Silicon Via (TSV) interconnects and memory chips directly stacked upon a System on a Chip (SoC). The standard defines features, functionalities, AC and DC characteristics, and ball/signal assignments. It is particularly well-suited for applications requiring extreme power efficiency and increased memory bandwidth (up to 17GBps). Examples include 3D Gaming, HD Video (1080p H264 video, pico projectors), and running multiple applications simultaneously. Wide I/O offers twice the bandwidth of the previous generation standard, LPDDR2, at the same rate of power consumption.

Buffalo Japan unveiled new 8 GB memory modules in the 204-pin SO-DIMM and standard 240-pin DIMM form-factors. These modules pack 8 GB capacity, and stick to JEDEC DDR3-1333 MHz standards. Featured in the D3N1333 series, these modules 1024M x 64bit DIMM configuration. They achieve 1333 MHz speeds with CAS latency of 9T and DRAM voltage of 1.5V. The Buffalo Tools software comes bundled with these modules. The two are priced at 26,670 JPY, around US $341.6.

Micron Technology, one of the biggest DRAM companies, has announced that it's working the JEDEC standards organization for computer memory, to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS, which may be incorporated into the upcoming DDR4 standard. X-bit labs has a nice summary of how 3DS works:

The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active logic, single shared external I/O, improved timing, and reduced load to the external world. This combination of features can improve timing, bus speeds, and signal integrity while lowering both power consumption and system overhead for next-generation modules, according to Micron.

After releasing the tri-channel RAM to take "Triple-Channel" initiatives, the global leading brand Team Group Inc. presents the 8GB memory module of the Team Elite DDR3 series. The ultra memory storage item goes with the JEDEC standard, marking a turning point of the RAM market to enter the "Triple-Channel" and also the ultra big storage generation.

The new memory module of the Elite series, U-DIMM with 16 GB (8GBx2 kit) as its largest storage capacity and SO-DIMM 8GB, both uses selected DDR3 chips and passes 100% stringent testing. The item is in BGA package with stability and compatibility between memory modules and PC platforms have been greatly improved. Meanwhile, the Elite's exclusive heat spreader is helpful in cooling computing temperatures and enlarging storage to offer stability and efficiency. In addition, it features high speed, low power consumption, and high efficiency. It takes only 1.5V low voltage to function well, it lowers carbon emissions, is electricity-saving, power-saving, and environmentally friendly. All these taken together make it the best choice for your PC.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today introduced new industry-leading, single piece 8GB DDR3-1333 high-density memory modules. Implementing state-of-the-art technology and strict control of the production processes, these modules provide professionals and enthusiasts with new heights of high-speed computing experience.

ADATA is committed to providing high performance and stable memory solutions. This single piece 8GB Premier Series DDR3-1333 memory module series supports advanced user and professional data operation needs. With the limited space available on many motherboards, an insufficient number of DRAM slots is a common dilemma. This most recent advance in density further allows consumers to easily enhance overall system performance.

In August, we got a first glimpse of AMD Radeon-branded DDR3 memory modules sold at select stores in Japan. At the time, AMD denied plans of directly selling AMD-branded memory to customers, and that it was determining if the sale of AMD Radeon-branded memory through channel partners is a viable opportunity. Today there is concrete evidence that AMD wants to go directly to customers with their DDR3 memory products, and has partnered with two well known companies in its effort.

Presenting a more polished AMD memory module lineup. The first ones (pictured in the link above) looked not much more than bare, generic-looking DDR3 modules with Radeon logo stickers. The new ones look better designed for customers, since good product design pays heavily in the retail channel. The new modules use black colored PCBs, metal heatspreaders, and red colored full-length stickers. A confirmation that these products are headed to the retail channel is the box. OEMs don't buy memory modules in boxes, they buy them in trays. AMD has a nice-looking product box design with a carbon-fiber pattern and appropriate branding.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced its participation in the 2012 International Consumer Electronics Show (CES) in Las Vegas, Nevada, on January 12. CES, produced by the Consumer Electronics Association, is the preeminent showcase for the worldwide consumer electronics industry. JEDEC's partner program, Memory Matters: Memory Solutions for Consumer Products and Mobile Devices, will explore how technological advancements and new standards can enhance device performance, reduce power usage and enable compact form factors.

Ever-increasing expectations for device speed and performance, as well as the trend towards smaller form factors, are driving the need for versatile memory solutions. Speakers from Agilent, CST, Micron and Samsung will highlight leading-edge memory solutions for next-generation mobile applications, a new generation of low-power memories for smartphones and tablets, and much more.

Rambus is the company best known for suing dozens of companies over memory patents that it holds and is suing so prolifically, that many just see this company as a patent troll. It has been accused many times of obtaining submarine patents while a member of the JEDEC group until a decade ago, which it is now fraudulently using to try and extort royalties from every other company using DDR memory and its derivatives. Unfortunately, those lawsuits didn't stick, encouraging Rambus to carry on enthusiastically. Rambus won patent fights against NVIDIA and Samsung for example, who now have to pay them ongoing royalties. However, it looks like Rambus may have bitten off more than it could chew, because it has just lost a $4 billion antitrust lawsuit against Micron Technology Inc and Hynix Semiconductor Inc, erasing more than half of the chipmaker's value as investors abandoned its stock in droves. Rambus stock immediately plunged more than 60% on this good news.

Biostar's coveted TPower brand makes a comeback with TPower X79, Biostar's premium overclocking motherboard for the Core i7 "Sandy Bridge-E" platform. TPower motherboards have been known to be a part of some record-setting CPU OC feats right from the days of LGA775. The TPower X79 is another product that's meant for record-setting feats, with its strong VRM and slim feature-set that does away with everything overclockers don't need and adds to the bloat of the motherboard.

The CPU is powered by an 8-phase DuraMax VRM with active phase control and direct FETs. It draws power from two 8-pin EPS connectors, apart from the 24-pin ATX and an optional 4-pin Molex for PCIe slot stability. Apart from a strong VRM, the board makes use of POSCAP capacitors in the CPU area, and a high-quality clock generator. The VRM and chipset heatsinks are connected with a 6 mm heat pipe, the heatsinks are made of a ceramic surface material for better dissipation. The CPU is wired to just four DDR3 DIMM slots, one per channel, which shouldn't be an issue for overclockers. It gives you shorter memory traces. Apart from JEDEC speeds of up to DDR3-1600 MHz, the board supports DDR3-2400 MHz by overclocking.

Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design also reduces the Voltage requirements a full 10%, from the traditional 1.5V traditional voltage to the new 1.35 volt standard.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the availability of JESD216: Serial Flash Discoverable Parameters (SFDP) for Serial NOR Flash. Widely anticipated by software engineers, the SFDP will allow Serial Flash manufacturers to embed a standard description of important device characteristics inside the Flash chip.

Users can read the description and obtain critical information about the functional characteristics and capabilities of SFDP compliant Flash memory devices, which will enable user applications such as mobile phones, set-top boxes, HDTVs, PC/NB motherboards, or any system that needs to support multiple Serial NOR Flash device types, to configure themselves to handle various Serial Flash implementations.

Active Media Products, a leading manufacturer of small form factor SSDs and DOMs, today announced a new line of SaberTooth M1 mini SATA (mSATA) SSD drives for notebook upgrades that deliver transfer speeds up to 160 MB/sec, write speeds of up to 80 MB/sec, and are fully compliant with the JEDEC MO-300B mSATA specification.

mSATA is a new JEDEC standard for small form factor SSDs based on the ubiquitous SATA-II, 3Gbps interface. Measuring only 2.0 x 1.2 inches (51 x 30 mm) mSATA SSDs are extremely small and lightweight. This very small and low cost package is perfectly suited for netbooks, notebooks and other ultra mobile computing devices. mSATA drives use an existing mini PCIe connector, but with a modified SATA pinout.