Leading global motherboard manufacturer, ASRock, proudly announces its new ASRock Z790 PG SONIC, an officially licensed motherboard featuring SEGA's Sonic the Hedgehog. A 16-bit spinning ring emblazons the rear IO cover, while on the rear side you'll even catch a glimpse of Sonic mid-run. The ASRock motherboard is co-launched to celebrate the release of SEGA's new Sonic Frontiers game.

"Designed to bring back epic memories of catching rings in Green Hill Zone, the motherboard echoes Sonic's lightning speed with its fast blue and silver shards and Sonic silhouette, besides the motherboard outlook is designed around the Sonic the Hedgehog theme, the ASRock Z790 PG SONIC also features a SONIC-inspired UEFI BIOS interface", Said Chris Lee, Vice President of ASRock motherboard & gaming monitor business unit.

Leading global motherboard manufacturer, ASRock, is proud to announce its new lineup, LiveMixer. There are Z790 LiveMixer and B650 LiveMixer for Intel's and AMD's new platform separately, which are produced in partnership with content creators that need motherboards with superb reliability, cutting-edge performance and an extended connectivity mix for the many auxiliary devices required for streaming. LiveMixer is the incarnation of valiance. It sets us free from the concrete jungle with its colorful graffiti. The stylish pattern represents the courage and bravery we possess to speak up for ourselves and try new things enriching life.

"We've studied the need of live streaming for a long time, and here comes our first LiveMixer that helps streamers to stream in great quality with its well VRM design, additional PCIe slots and twenty-plus USB ports." Says Chris Lee, Vice President of ASRock Motherboard & Gaming Monitor Business Unit. With a maximum of 23 USB ports to connect external devices, users will never run short. Hook up every peripheral, whether it's mice, keyboards, microphones, headsets, multiple cameras, fill-lights, macropads, and much more. Equipped with dual PCI-Express 4x slots & Thunderbolt header, The LiveMixer allows users to connect a graphics card, a high-speed capture card and a Thunderbolt add-in card at the same time.

BIOSTAR today introduced the Racing B650EGTQ, a Socket AM5 motherboard based on the AMD B650E chipset, in the Micro-ATX form-factor. The board offers a premium feature-set, including PCI-Express Gen 5 for both the x16 PEG slot, and the M.2 NVMe slot wired to the CPU. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It uses a 14-phase VRM with 90 A DrMOS to power the processor. The processor is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16, and two M.2 NVMe slots with PCI-Express 5.0 x4 wiring. Other expansion slots include a PCI-Express 4.0 x16 (electrical Gen 4 x4) wired to the B650E chipset.

Storage connectivity on the BIOSTAR Racing B650EGTQ includes two M.2 NVMe Gen 5, one M.2 NVMe Gen 4, and four SATA 6 Gbps ports. This is one of the very few motherboards to wire out both Gen 5 x4 GPP interfaces of the Socket AM5 SoC as M.2 NVMe slots. Network connectivity include a 2.5 GbE driven by a Realtek 8125B controller; and preparation for a WLAN card, although the board doesn't have any M.2 E-key slots. The onboard audio soludion features a premium Realtek ALC1220 CODEC. The company didn't reveal pricing.

Leading global motherboard manufacturer, ASRock, is proud to announce its AMD B650E/B650 motherboard series. These motherboards are targeted at the mainstream AM5 segment featuring various exciting new products such as our flagship B650E Taichi, the high-end B650E Steel Legend Wi-Fi for high end market, B650E PG Riptide Wi-Fi and B650 PRO RS for mainstream users, and B650 PG Lightning a new SKU joining the Phantom Gaming family targeted the entry level market. ASRock also offers the new B650E PG-ITX WiFi for small form factor enthusiasts.

ASRock went all-out on its VRM design by creating a 24+2+1 phase Smart Power Stage (SPS) Dr.MOS on the B650E Taichi series, providing users with the most powerful AM5 platform it can offer ready to unlock maximum CPU performance. The flagship ASRock B650E Taichi motherboards are equipped with many exciting features and technologies such as PCIe 5.0 technology for graphics cards and M.2 SSDs, an incredible IO that includes the latest USB4 offering a fast and simple level of connection for work or home.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel Z790 motherboards supporting the latest 13th Generation Intel Core Processors. ASRock's Z790 series includes premium Z790 Taichi, including a new Special Edition Z790 Taichi Carrara, in addition to Z790 Steel Legend WiFi targeting high-end users, Z790 PRO RS, Z790 PG Lightning and Z790 PG Riptide designed for mainstream users, and also the Z790 PG-ITX/TB4, a powerful mini ITX motherboard with Thunderbolt 4 for small form factor lovers.

Here are some of the first pictures of the GoodRAM IRDM Ultimate PCIe Gen 5 M.2 NVMe SSD. Built in the M.2-2580 form-factor, the drive combines Phison's upcoming E26 controller, with what's likely KIOXIA 162-layer 3D TLC NAND flash memory. The controller takes advantage of the PCI-Express 5.0 x4 interface, and NVMe 2.0 protocol, offering sequential transfer speeds of around 10 GB/s reads, with around 9.5 GB/s writes. The drive comes in capacities of 1 TB, 2 TB, and 4 TB. It comes with a fairly large heatsink included. AMD Socket AM5 will be the first platform to feature CPU-attached PCIe Gen 5 M.2 slots, which goes on sale by late-September. The first PCIe Gen 5 NVMe SSDs, according to AMD, should be here by November.

When testing recent high-end GPU launches such as the AMD Radeon RX 6950 XT graphics card, we observed some system reboots that caused due to power-draw spikes (technically known as "excursions"). This is when a graphics card, for a brief moment, draws more power than the connector is capable of supplying, triggering the PSU's electrical protections, and causing a reboot. The new ATX 3.0 specification for the next-generation of desktop PC power supplies enable PSUs with a high tolerance for excursions, and prescribes testing standards to ensure a PSU meets the ATX 3.0 spec. Aris Mpitziopoulos (crmaris) and Jon Gerow (Jonnyguru) discovered wording in the latest Intel ATX 3.0 specification that could make you pay closer attention to reviews of ATX 3.0-spec PSU, when they're out.

In a Hardware Busters article, Mpitziopoulos clears the confusion that the ATX 3.0 power supply specs by Intel and the PCI-Express 5.0 power specification by the PCI-SIG, are mutually-inclusive—they're not. An ATX 3.0 PSU is not required to include a 12+4 pin (or 16-pin) ATX 12VHPWR connector, whether or not their nameplate Wattage is above 450 W, which means it's subjected to passing less stressful transient-response tests, particularly the ability to deal with a 200% excursion for at least 100 µs.

BIOSTAR finalized the design of its flagship Socket AM5 motherboard, the X670E Valkyrie. While the PCB design appears identical to the board BIOSTAR showed at Computex 2022, there are some aesthetic improvements, such as some ARGB lighting elements with acrylic diffusers on the large VRM heatsink and the chipset heatsink. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS connectors. Powering the CPU is a 22-phase VRM that uses 105 A DrMOS. The Socket AM5 is wired to four DDR5 slots, two PCI-Express 5.0 x16 slots (x16/NC or x8/x8), and a couple of M.2 Gen 5 slots.

Storage options on the BIOSTAR X670E Valkyrie include two M.2 slots with PCI-Express 5.0 x4 wiring, two additional M.2 slots with PCI-Express 4.0 x4 wiring, and six SATA 6 Gbps ports. Besides the Gen 5 x16 slots from the CPU, there's one PCI-Express 4.0 x16 (electrical x4) slot wired to the chipset, and an M.2 E-key slot for the WLAN card. There's no WLAN module included with the board, but there's preparation that includes two coaxial antenna jacks, and a cable leading up to the M.2 E-key slot. Wired networking comes from a 2.5 GbE interface powered by an Intel i225 controller. The board is expected to go on sale alongside Ryzen 7000 series processors, in September.

NVIDIA designed the Grace CPU, a processor in the classical sense, to replace the Intel Xeon or AMD EPYC processors it was having to cram into its pre-built HPC compute servers for serial-processing roles, and mainly because those half-a-dozen GPU HPC processors need to be interconnected by a CPU. The company studied the CPU-level limitations and bottlenecks not just with I/O, but also the machine-architecture, and realized its compute servers need a CPU purpose-built for the role, with an architecture that's heavily optimized for NVIDIA's APIs. This, the NVIDIA Grace CPU was born.

This is NVIDIA's first outing with a CPU with a processing footprint rivaling server processors from Intel and AMD. Built on the TSMC N4 (4 nm EUV) silicon fabrication process, it is a monolithic chip that's deployed standalone with an H100 HPC processor on a single board that NVIDIA calls a "Superchip." A board with a Grace and an H100, makes up a "Grace Hopper" Superchip. A board with two Grace CPUs makes a Grace CPU Superchip. Each Grace CPU contains a 900 GB/s switching fabric, a coherent interface, which has seven times the bandwidth of PCI-Express 5.0 x16. This is key to connecting the companion H100 processor, or neighboring Superchips on the node, with coherent memory access.

ASRock is bringing as many as five motherboard models based on the AMD X670E chipset, for upcoming Ryzen 7000-series Socket AM5 processors. The lineup includes the twins X670E Taichi and X670E Taichi Carrara at the top; followed by the X670E Steel Legend, X670E Pro RS, and the X670E Phantom Gaming Lightning. The X670E Taichi/Carrara feature a mammoth 26-phase VRM, which going by the trends, could use 90 to 105 A power-stages. You get two PCi-Express 5.0 x16 slots (x8/x8 with both populated), at least two Gen 5 M.2 slots wired to the SoC, additional Gen 5 M.2 slots from the chipset, and a plethora of connectivity options.

What sets the two Taichi boards apart is the Carrara does away with the matte-black "gearwheel" design theme, and instead features a white marble appearance. It's not known if the marble pattern is a print, or if ASRock used actual stone. ASRock has been trying to upmarket its Steel Legend SKUs for the past couple of generations, and it appears like the X670E Steel Legend will be the third-based board from the series, with no PG Velocita SKU in sight. You get just the one PCI-Express 5.0 x16, at least two Gen 5 M.2 slots, a couple of Gen 4 M.2 slots, and fairly premium connectivity, including WLAN.

GIGABYTE today showed off its upcoming AMD X670E and X670 chipset-based Socket AM5 motherboard lineup for the Ryzen 7000-series "Zen 4" desktop processors due to launch in September. Given AMD's push for PCI-Express Gen 5 connectivity beyond just the PEG slot, the new X670E chipset, with multiple Gen 5 M.2 slots, covers the upper end of the GIGABYTE AORUS motherboard series, with the X670E AORUS Xtreme and the X670E AORUS Master. The lower-end of the lineup is based on the X670, with the AORUS Pro and AORUS Elite tiers.

Both the X670E and X670 offer at least one PCI-Express 5.0 x16 slot (which can be further split into two x8 Gen 5 slots); and at least one PCI-Express 5.0 x4 M.2 NVMe slot wired to the AM5 processor. The X670E is differentiated in having an additional Gen 5 M.2 slot that is wired to the SoC, besides downstream Gen 5 PCIe connectivity from the chipset. The AORUS Xtreme leads the pack with a monstrous 18-phase VRM that uses 105 A DrMOS, an 8-layer PCB, four Gen 5 M.2 slots, the highest-grade onboard audio with ESS-made headphones DAC, AQuantia 10 GbE, WiFi 6E, and a plethora of overclocker-friendly features.

Intel's next-generation "Meteor Lake-P" mobile processor with a 6P+8E Compute Tile was shown off at the 2022 IEEE VLSI Symposium on Tech and Circuits (6 performance cores and 8 efficiency cores). We now have annotations for all four tiles, as well as a close-up die-shot of the Compute Tile. Intel also confirmed that the Compute Tile will be built on its homebrew Intel 4 silicon fabrication process, which offers over 20% iso-power performance increase versus the Intel 7 node, through extensive use of EUV lithography.

We had earlier seen a 2P+8E version of the "Meteor Lake" Compute Tile, probably from the "Meteor Lake-U" package. The larger 6P+8E Compute tile features six "Redwood Cove" performance cores, and two "Crestmont" efficiency core clusters, each with four E-cores. Assuming the L3 cache slice per P-core or E-core cluster is 2.5 MB, there has to be 20 MB of L3 cache on the compute tile. Each P-core has 2 MB of dedicated L2 cache, while each of the two E-core clusters shares 4 MB of L2 cache among four E-cores.

BIOSTAR today introduced the B660T-Silver, a Socket LGA1700 motherboard in the Mini-ITX form-factor, based on the Intel B660 chipset. The board wires a 12th Gen Core "Alder Lake" processor with DDR4 memory, and a PCI-Express 5.0 x16 slot. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 9-phase CPU VRM. Up to 64 GB of dual-channel DDR4 memory is supported, at overclocked speeds of up to DDR4-5000.

Storage connectivity of the BIOSTAR B660T-Silver includes four SATA 6 Gbps ports, and two M.2-2280 slots with PCI-Express 4.0 x4 wiring, one of which is connected to the CPU, and the other from the B660 PCH. Network connectivity includes a 2.5 GbE port driven by a Realtek RTL8125B, and provision for WLAN connectivity, including 2x2 antenna coaxial jacks, and an M.2 E-key slot with PCI-Express 3.0 x1 and USB 2.0 wiring, so you drop in your own WLAN module. 6-channel HD audio driven by a premium Realtek ALC1220 CODEC makes for the rest of it. The company didn't reveal pricing.

Intel today debuted the 12th Gen Core HX "Alder Lake" processors for high-end gaming notebooks and mobile workstations. These processors are designed to bring desktop-class performance to the mobile segment, and debut the "Alder Lake" C0 silicon in a mobile package. Until now, the fastest Core "Alder Lake" mobile processor was based on a silicon that physically had 6 performance cores (P-cores), and 8 efficiency cores (E-cores). The HX-series sees the desktop C0 silicon, with its 8 P-cores and 8 E-cores, and 30 MB of L3 cache, in the mobile form factor.

This also brings PCI-Express 5.0 x16 PEG connectivity for discrete graphics cards, 8-lane DMI 4.0 chipset bus, and a mobile variant of the Z690 chipset, which can put out two M.2 NVMe Gen 4 slots in addition to the one from the processor die. The additional PCIe budget should allow up to two discrete Thunderbolt 4 controllers. Memory support includes dual-channel (4 sub-channel) DDR5-4800, dual-channel DDR4-3200, and LPDDR4-4267. Certain models even have ECC memory support, targeted at mobile workstations. Intel is using the highest bins of the C0 die, coupled with some aggressive power-management, to achieve processor base power (PBP) of 55 W (10 W lower than the 65 W PBP of the desktop Core i9-12900). The maximum turbo power value for all SKUs is set at 154 W. All processor models in the Core HX series will come with memory overclocking support, some even with CPU overclocking support.

The NVIDIA GH100 silicon powering the next-generation NVIDIA H100 compute processor is a monstrosity on paper, with an NVIDIA whitepaper published over the weekend revealing its key specifications. NVIDIA is tapping into the most advanced silicon fabrication node currently available from TSMC to build the compute die, which is TSMC N4 (4 nm-class EUV). The H100 features a monolithic silicon surrounded by up to six on-package HBM3 stacks.

The GH100 compute die is built on the 4 nm EUV process, and has a monstrous transistor-count of 80 billion, a nearly 50% increase over the GA100. Interestingly though, at 814 mm², the die-area of the GH100 is less than that of the GA100, with its 826 mm² die built on the 7 nm DUV (TSMC N7) node, all thanks to the transistor-density gains of the 4 nm node over the 7 nm one.

NVIDIA's next-generation GeForce "Ada" graphics architecture may stick to PCI-Express 4.0 as its system bus interface, according to kopite7kimi, a reliable source with NVIDIA leaks. This is unlike Ada's sister-architecture for compute, "Hopper," which leverages PCI-Express 5.0 in its AIC form-factor cards, for its shared memory pools and other resource-sharing features similar to CXL. This would make Ada the second graphics architecture from NVIDIA to use PCIe Gen 4, after the current-gen "Ampere." The previous-gen "Turing" used PCIe Gen 3. PCI-Express 4.0 x16 offers 32 GB/s per-direction bandwidth, and NVIDIA has implemented the Resizable-BAR feature with "Ampere," which lets the system see the entire dedicated video memory as one addressable block, rather than through tiny 256 MB apertures.

Despite using PCI-Express 4.0 for its host interface, GeForce "Ada" graphics cards are expected to extensively use the ATX 3.0 spec 16-pin power connector that the company debuted with the RTX 3090 Ti, particularly with higher-end GPUs that have typical board power above 225 W. The 16-pin connector is being marketed as a "PCIe Gen 5" generation standard, particularly by PSU manufacturers cashing in on early-adopter demand. All eyes are now on AMD's RDNA3 graphics architecture, on whether it's first to market with PCI-Express Gen 5, the way RDNA (RX 5000 series) was with PCIe Gen 4. The decision to stick with PCIe Gen 4 is particularly interesting given that Microsoft DirectStorage may gain use in the coming years, something that is expected to strain the system bus for the GPU, as SSD I/O transfer-rates increase with M.2 PCIe Gen 5 SSDs.

Here is the first picture of a next-generation AMD EPYC "Genoa" processor with its integrated heatspreader (IHS) removed. This is also possibly the first picture of a "Zen 4" CPU Complex Die (CCD). The picture reveals as many as twelve CCDs, and a large sIOD silicon. The "Zen 4" CCDs, built on the TSMC N5 (5 nm EUV) process, look visibly similar in size to the "Zen 3" CCDs built on the N7 (7 nm) process, which means the CCD's transistor count could be significantly higher, given the transistor-density gained from the 5 nm node. Besides more number-crunching machinery on the CPU core, we're hearing that AMD will increase cache sizes, particularly the dedicated L2 cache size, which is expected to be 1 MB per core, doubling from the previous generations of the "Zen" microarchitecture.

Each "Zen 4" CCD is reported to be about 8 mm² smaller in die-area than the "Zen 3" CCD, or about 10% smaller. What's interesting, though, is that the sIOD (server I/O die) is smaller in size, too, estimated to measure 397 mm², compared to the 416 mm² of the "Rome" and "Milan" sIOD. This is good reason to believe that AMD has switched over to a newer foundry process, such as the TSMC N7 (7 nm), to build the sIOD. The current-gen sIOD is built on Global Foundries 12LPP (12 nm). Supporting this theory is the fact that the "Genoa" sIOD has a 50% wider memory I/O (12-channel DDR5), 50% more IFOP ports (Infinity Fabric over package) to interconnect with the CCDs, and the mere fact that PCI-Express 5.0 and DDR5 switching fabric and SerDes (serializer/deserializers), may have higher TDP; which together compel AMD to use a smaller node such as 7 nm, for the sIOD. AMD is expected to debut the EPYC "Genoa" enterprise processors in the second half of 2022.

Here's the first picture of AMD Socket SP5, the huge new CPU socket the company is building its next-generation EPYC "Genoa" enterprise processors around. "Genoa" will be AMD's first server products to implement the new "Zen 4" CPU cores, and next-gen I/O, including DDR5 memory and PCI-Express Gen 5. SP5, much like its predecessor SP3, is a land-grid array (LGA) socket, and has 6,096 pins.

The vast pin-count enables power to support CPU core-counts of up to 96 on the EPYC "Genoa," and up to 128 on the EPYC "Bergamo" cloud processor; a 12-channel DDR5 memory interface (24 sub-channels); and up to 128 PCI-Express 5.0 lanes. The socket's retention mechanism and processor installation procedure appears similar to that of the SP3, although the thermal requirements of SP5 will be entirely new, with processors expected to ship with TDP as high as 400 W, compared to 280 W on the current-generation EPYC "Milan." AMD is expected to debut EPYC "Genoa" in the second half of 2022.

Intel Xeon Scalable "Sapphire Rapids" is an upcoming enterprise processor with a CPU core count of up to 60. This core-count is achieved using four dies inter-connected using EMIB. Locuza, who leads social media with logic die annotation, posted one for "Sapphire Rapids," based on a high-resolution die-shot revealed by Intel in its ISSCC 2022 presentation.

Each of the four dies in "Sapphire Rapids" is a fully-fledged multi-core processor in its own right, complete with CPU cores, integrated northbridge, memory and PCIe interfaces, and other platform I/O. What brings four of these together is the use of five EMIB bridges per die. This allows CPU cores of a die to transparantly access the I/O and memory controlled any of the other dies transparently. Logically, "Sapphire Rapids" isn't unlike AMD "Naples," which uses IFOP (Infinity Fabric over package) to inter-connect four 8-core "Zeppelin" dies, but the effort here appears to be to minimize the latency arising from an on-package interconnect, toward a high-bandwidth, low-latency one that uses silicon bridges with high-density microscopic wiring between them (akin to an interposer).

Introducing the EVGA Z690 DARK K|NGP|N - The Motherboard Designed by and Used by Professional Overclockers. EVGA DARK motherboards blaze the trail for other boards to follow, and the Z690 DARK K|NGP|N is no exception. The ability to destroy world records is insignificant next to the power of a 21-phase VRM and a 10-layer PCB - capable of driving the most powerful 12th Gen Intel Core processors. With support for 64 GB of DDR5 memory at up to 6600 MHz+(OC), PCIe Gen5, and PCIe Gen4 M.2 NVMe SSDs, a new DARK age of overclocking will rise as quickly as new hardware becomes available. The Z690 DARK K|NGP|N is today's choice for the future of overclocking and gaming.

Phison is on a mission to be the first to market with PCIe Gen 5 SSD controllers, having announced the E26-series controllers this CES. The company is ready with a branded drive under the MSI Spatium brand, the MSI Spatium E26. Built in the PCIe add-in-card (AIC) form-factor, the drive features a PCI-Express 5.0 x4 interface (128 Gbps per direction), and very likely sticks to the reference design that Phison demoed in its own booth.

This PCB is used in its client configuration, with just the controller, DRAM, and NAND flash chips; while the PCB allows an enterprise configuration with banks of capacitors offering explicit power-loss protection (the NAND flash chips offer implicit PLP). A simple copper-film heatspreader is used. Neither MSI nor Phison put out actual performance numbers, but mentioned sequential reads being "10 GB/s or beyond" (the interface is physically capable of 16 GB/s).Update Jan 17th: MSI clarified that this is not yet a shipping product, but a representation of what such a device could be. Thus, this should be considered a concept or at best proof of concept. Both MSI and Phison are actively working together on exploring what such a retail product could be.

ASRock, is proud to announce its latest H670, B660 and H610 motherboards. This comprehensive range of feature-filled motherboards is designed to bring great performance and practicality - including up to PCI-Express 5.0 - to PC builders, gamers and office users looking to partner with either just launched Intel 12th Generation Core 'non-K series' processors, or existing K-series processors (LGA1700).

ASRock offers SFF builders a full range of Mini-ITX motherboards featuring H670, B660, H610 chipsets. The fully-featured ASRock H670M-ITX/ax includes support for future PCI-Express 5.0 16x graphics cards, plus space for two PCI-Express Gen-4 M.2 NVMe SSDs. A powerful 8-phase Dr.MOS VRM design and up to DDR4 5000 MHz OC means ensures small form factor builds still offer maximum performance. Three types of connectivity include extreme performance Wi-Fi 6E (2x2), Dragon 2.5G LAN and Intel Gigabit Ethernet.

Phison Electronics Corp., a global leader in NAND flash controller integrated circuits and storage solutions, will showcase its lineup of next-generation gaming solutions for customers, partners, media and other interested parties during CES 2022, January 5-8 exclusively by private virtual demos. The new-class of solutions include the company's first PCIe Gen5 controller for high-end desktop gaming, a future high-performance Gen4 solution, and demonstration of the next-generation game workload coming soon to PCs.

Phison, the leader in gaming-optimized SSDs pushes the boundaries of performance. The company's solutions power seamless experiences for modern console, desktop/notebook and mobile gaming, which are delivered to consumers through an extensive and diverse group of partners.Update Jan 4th: Added presentation slides, product images and closeups of the PCB designs.

Intel is preparing to significantly expand its 12th Gen Core "Alder Lake" desktop processor series next January, alongside more motherboard chipset choices for the client-desktop segment. These include the H670, the B660, and the H610. The H670 offers most of the I/O features of the top Z690 chipset, but you lose out on CPU overclocking. The B660 is the mid-tier option, and while you still get a formidable I/O feature-set, the chipset bus is narrower. The H610 is the entry-level chipset with very basic I/O, and no CPU-attached NVMe slots. The interesting thing is that all these chipsets support PCI-Express 5.0 x16 (PEG) from the CPU, but leave it to the motherboard vendors whether they want to implement it. There do exist Z690 motherboard that lack Gen 5 PEG (and only feature Gen 4).

The chipset-attached downstream PCIe also varies greatly across the lineup. The top Z690 part puts out 12 Gen 4 lanes besides 16 Gen 3 lanes; while the H670 puts out 12 each of Gen 4 and Gen 3. The B660 puts out 6 Gen 4 lanes and 8 Gen 3 lanes. The H610 completely lacks downstream Gen 4, and only puts out 8 Gen 3 lanes. The H670 and B660 put out up to two 20 Gbps USB 3.2 Gen 2x2 ports; while the H610 lacks 20 Gbps ports. All chipset models put out at least two 10 Gbps Gen 2x1 ports; and at least four 5 Gbps Gen 1x1 ports. An interesting aspect of the lineup is that Intel is allowing memory overclocking across H670 and B660 chipsets, provided the CPU supports it.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).