ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800 MHz memory up to 64 GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications. The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.

Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades. The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800 MHz SO-DIMM memory up to 64 GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.

From today, until the first of April, AMD will bundle a game code for Star Wars Jedi: Survivor with all of its Ryzen 7000-series CPUs. The promotion appears to be largely global, but limited to certain retailers, so if your favourite shop doesn't offer the bundled game code, you might have to look elsewhere. AMD offers a list on its website with participating retailers and in the US and Canada, this only appears to be Amazon and Newegg, whereas it varies much more widely in other parts of the world.

Oddly enough, many large retailers in various countries are missing and several countries are absent too, especially in Europe, for no apparent reason. What's even stranger, is that AMD doesn't appear to be offering the game code bundle through its own online shop, at least not in Europe. We should also point out that Star Wars Jedi: Survivor doesn't launch until the 17th of March, so if you jump the gun now, you're going to have to wait a few weeks before you'll be able to play the game.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

At the 2023 International CES, market leader Kingston expanded their FURY line of enthusiast-gaming PC memory with the introduction of several new DDR5 memory kits. The top-of-the-line FURY Renegade series comes in RGB and non-RGB trims, and with speeds of up to DDR5-7200 with Intel XMP 3.0 support. For the AMD crowd, the company showed off the FURY Beast RGB, which comes in speeds of up to DDR5-6000, and features AMD EXPO profiles along with extensive validation with Ryzen 7000 series processors.

For those still making the transition between DDR4 and DDR5, Kingston introduced the FURY Beast DDR4 RGB, which looks visually similar to their DDR5 FURY Beast, but comes with speeds of up to DDR4-3600, with validation on AMD Ryzen 5000 series processors. It also supports an Intel XMP 2.0 profile. For high-end gaming notebooks and SFF platforms, including the Intel NUC 12 Extreme, Kingston introduced the FURY Impact line of DDR5 SO-DIMM memory, which comes in speeds of up to DDR5-5600.

Here's the first look at the retail PIB package of an AMD Ryzen 9 7950X3D processor with 3D Vertical Cache technology. These chips come in box design that's distinct from the rest of the Ryzen 7000 lineup. Bright orange and silver accents make up the front face of the box, with "3D Vertical Cache technology" being mentioned prominently. With the Ryzen 7 5800X3D, the PIB package design was probably found to look too similar to the rest of the lineup and practically indistinguishable from those of the 5000G "Cezanne" desktop APUs, which is probably why AMD took this route.

It's very likely that we'll see Socket AM5 desktop APUs based on the "Phoenix Point" monolithic silicon later this year, with its 12 CU RDNA3 iGPU and 8-core/16-thread "Zen 4" CPU that has a 32 MB on-die L3 cache. These processors will have yet another distinguishable retail PIB packaging. AMD's then technical marketing director, Robert Hallock, assured us that the company will continue to invest in desktop APUs (processors with powerful iGPUs), despite Ryzen 7000 desktop processors coming with a low-power iGPU as standard.

Here are some of the first pictures of the yet-unnamed PCIe Gen 5-based NVMe SSD by ADATA XPG. Built in the M.2-2580 form-factor, the drive features a PCI-Express 5.0 x4 host interface and NVMe 2.0 protocol. At its core is a Silicon Motion SM2508 series controller, coupled with the latest generation 3D TLC NAND flash over a large number of flash channels; and a faster DRAM cache. The drive offers sequential transfer rates of up to 14 GB/s reads, with up to 12 GB/s writes. and 2 million IOPS 4K random transfers. It comes in capacity-based variants, with 8 TB being the largest one.

The most striking aspect about this drive is its active cooling solution. A ridged aluminium monoblock heatsink is used to cool the SM2508 controller. nestled in its center is what appears to be a miniature 10 mm lateral fan. The heatsink has surface-crystallization treatment to increase surface area for heat dissipation. A die-cast aluminium top-plate and 3-sided backplate sandwich the fan-heatsink and the main PCB. The fan is tightly controlled by temperature, and ADATA claims you should barely notice it. To use the drive to its fullest, you'll either need an AMD Ryzen 7000 "Zen 4" platform that has dedicated PCIe Gen 5 M.2 slots wired to the processor, or an Intel 700-series chipset motherboard that puts out a Gen 5 M.2 slot by subtracting lanes from the Gen 5 PEG slot.

The newest 2023 Lenovo Legion lineup of battle-ready PCs, monitors, and accessories are unveiled today, setting a new standard in PC gaming for 2023 that gives gamers the edge they need to top the leaderboards. Lenovo is harnessing the pure power of PC gaming with its new lineup for CES 2023, unlocking the freedom to dominate the battlefield with AI-tuned performance that lets gamers crush both framerates and the competition. Brand new for 2023 is the new Lenovo LA AI chip, the world's first dedicated AI chip on a gaming laptop, installed on the new Lenovo Legion Pro 7 and 7i (16", 8) laptops and the Lenovo Legion Pro 5 and 5i (16", 8) laptops.

Lenovo AI Engine+, powered by the Lenovo LA AI chip, deploys a software machine learning algorithm to optimally tune system performance. The chip uses software machine learning, deployed through Lenovo Vantage, to help monitor in-game FPS and dynamically adjust for the highest performance output. Offering up to 15% higher TDP, this chip and machine learning software combo allows Legion Pro Series laptops to deliver higher performance compared to previous generations. Lenovo Legion Pro 7i and Lenovo Legion Pro 5 and 5i laptops also come with Tobii Horizon, providing gearless head tracking that gives players an extra level of immersion when playing their favorite games, as well as Tobii Aware.

Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

We are coming to you live from the 2023 International CES! AMD CEO Dr Lisa Su is kicking things off with her Keynote address, where her company is expected to announce its next generation Ryzen 7000 series "Zen 4" mobile processors, a much broader range of Ryzen 7000 desktop processors, including the fabled X3D processors; and much more!02:29 UTC: The show is about to begin with AMD CEO Dr Lisa Su taking centerstage, as CEA inaugurates its 2023 show.02:38 UTC: "Intelligence needs computing power"

Today, Alienware crushes new barriers with the introduction of the world's fastest refresh rate of 500Hzi on a Fast IPS Gaming Monitor and the evolved Aurora R15 gaming desktop with AMD technology. These industry-leading display and desktop advancements further Alienware's competitive edge, underscoring our longtime legacy as both technology pioneers and gamers at heart. Following last year's incredible portfolio upgrades, we're full throttle into 2023 with no signs of slowing down.

Introducing the monitor with the world's fastest refresh rate of 500Hzi, the Alienware 500 Hz Gaming Monitor (AW2524H), a CES 2023 Innovation Award and Best of Innovation winner, delivers the world-class speed today's champions demand. Coming in at a 24.5-inch full high-definition (FHD) resolution with a supersonic refresh rate of 500 Hz overclocked (480 Hz native) on a Fast IPS panel, this elite display offers incredible frame rates to deliver stunning motion clarity in fast-paced games and help gamers clinch victory.

EK, the premium liquid cooling gear manufacturer, is releasing yet another unique pump-reservoir-water block combo. This time for AMD AM5 Socket, Ryzen 7000-series CPUs, and AM5 socket-based motherboards. It features the latest socket-specific EK-Quantum Velocity² cooling engine, while the CPU water block has an integrated DDC 4.2 PWM pump that is cooled by the metal part of the water block acting as a heatsink. The combo is the perfect companion for ITX (SFF) builds where space for a dedicated pump and reservoir is an issue. This product effectively combines four different products into a single small enclosure for ultimate space-saving.

The product combines a Velocity² CPU water block, a genuine DDC 4.2 PWM pump with a reservoir, and a DDC heatsink. All this is contained in an assembly significantly smaller than the sum of its parts. A total of four products in a footprint of a hefty CPU water block that fits perfectly. EK-Quantum Velocity² series CPU water blocks embed the next-generation cooling engine. They use a specific combination of mounting pressure and coldplate geometry tailored for the IHS and chiplet layout of AMD AM5 socket processors. Low hydraulic flow restriction enables these products to be used in setups with weaker water pumps or lower pump speeds for added silent operation while still being able to easily achieve top performance. The lathe-turned coldplate is made with precision to cover the IHS effectively and put pressure on the die area.

A few months ago, AMD has launched its highly anticipated Ryzen 7000 series of processors based on Zen 4 architecture. However, the company only launched the "X" SKUs (example being 7900X) for now, while the remaining ones are awaiting a launch date. Today, we have information from VideoCardz that confirm AMD's new launch on January 10th, when team red plans to update its remaining processor family with Ryzen 7000 series non-X SKUs. There will be three initial models to choose from Ryzen 9 7900 (12C/24T), Ryzen 7 7700 (8C/16T), and Ryzen 5 7600 (6C/12T). These SKUs follow the traditional Zen 4 path; however, the only distinction from their "X" counterparts is the reduced TDP to 65 Watts, down from up to 170 Watt TDP in some of those models.

A leaked slide from AMD's product presentation regarding these SKUs is a comparison between AMD's own Ryzen 9 5900X and Ryzen 9 7900, where the Zen 4 variant successfully beat the older SKU by a significant percentage. Pricing and further details are listed on the slides below.

KINGMAX, a world-renowned professional supplier of memory products, has introduced the latest "Horizon" series of DDR5-5200, DDR5-5600, and DDR5-6000 memory that fully supports both Intel's 13th Gen Raptor Lake and Z790 platform and AMD's Ryzen 7000 processors and 600-series motherboards. DDR5 Horizon also promises to make the most of the overclocking capacities of Intel XMP 3.0 and AMD EXPO, thereby bringing speed-hungry gamers, overclocking enthusiasts, and creators an utterly satisfying performance.

Made from choice chips and fully conforming to JEDEC criteria, KINGMAX's DDR5 Horizon comes in three frequencies: 5200 MHz, 5600 MHz, and 6000 MHz. With a CL36 latency and running at 1.25 V, it is available in single- or dual-channel versions with 8 GB/16 GB/32 GB capacities to cater to different consumer needs. Moreover, the QVL certification of a good number of leading motherboard manufacturers attests to its superior compatibility with brand-new PC platforms.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B650M-SILVER motherboard. Designed based on the AMD M5 socket, the B650M-SILVER motherboard is fully stacked to enable the latest Ryzen 7000 series processors. Leveraging the latest DDR5 memory technology, it performs exceptionally well at any given task, powered by advanced design elements like support for both AMD EXPO and Intel XMP RAM modules.

The B650M-SILVER, despite its Micro-ATX form factor, offers top-shelf features like a PCI-E Gen4 x16 slot with iron protection. The SILVER series motherboard combines 14 phase (10+2+2) power design with a 90 A power stage VRM solution to match today's power-hungry hardware, thanks to the company's signature DIGITAL PWM and 90 A Dr.MOS technologies.

Ahead of CES, Lenovo unveiled its latest generation of consumer devices loaded with standout features and enhancements designed to help people connect with their passions and achieve their daily goals. With five new performance-driving and portable IdeaPad laptops, a sleek and compact IdeaCentre desktop, and a 9-inch Lenovo tablet, these devices are designed for all the spaces and places in line with the on-the-go lifestyle of today's consumer. Whether working, studying, creating, or just catching up with friends out of town, these new products offer speed, versatility, and convenience to suit their needs wherever they are.

"As consumers continue to seek out the most effective ways of working and studying in a hybrid world where versatility and convenience are paramount, Lenovo's IdeaPad products continue to provide reliability and performance at incredible value," says Jun OuYang, Vice President of the Consumer Segment, Intelligent Devices Group, Lenovo. "This latest generation of products come with a range of striking new features and enhancements that significantly improve the user experience while still maintaining its reputation as an affordable product."

Ahead of their market debut early January, we got confirmation of the specifications of the three upcoming AMD Ryzen 7000 series non-X processor SKUs. There will indeed only be three new SKUs, the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900; and no 16-core part. All three SKUs have their TDP rated at 65 W, which means that their PIB (processor in box) retail packages will include a stock cooling solution. The 7600 comes with a Wraith Stealth cooler that's capable of handling thermal loads of 65 W TDP processors at stock speeds; while the 7700 and 7900 will include a feature-packed Wraith Prism RGB cooler that's designed for 140 W TDP processors. Since Socket AM5 has cooler compatibility with AM4, AMD could simply be reusing the same coolers it packed with past-generation Ryzen processors.

The Ryzen 5 7600 comes with an MSRP of USD $229, clock speeds of up to 5.10 GHz boost, and targets the likes of the Intel Core i5-13600 or i5-12600. The $329 MSRP Ryzen 7 7700 ticks at speeds of up to 5.30 GHz boost, and is designed to compete with the Core i7-13700 or i7-12700. The Ryzen 9 7900 has an interesting price tag of $429 (MSRP), ticks at speeds of up to 5.40 GHz boost, and purportedly competes against the Core i9-13900 (non-K) and i9-12900. The three chips should be drop-in compatible with Socket AM5 motherboards being sold right now, likely with no need for a BIOS update. Although launch of these three SKUs in January is certain, the company might use the 2023 International CES keynote address by its CEO Dr Lisa Su to either tease or announce the Ryzen 7000X3D processors featuring 3D Vertical Cache memory, which is known to boost gaming performance.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.85 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 6.85 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 6.85 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 6.85 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The new AIDA64 update introduces AVX-512 optimized stress testing for AMD Ryzen 7000 Series processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.

DOWNLOAD: FinalWire AIDA64 Extreme v6.85

Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

AMD on Monday issued a statement refuting reports of performance deltas noticed for its Ryzen 7000-series "Zen 4" desktop processors observed between Windows 11 and Windows 10 operating systems when gaming. The company said that while it is investigating the reports, it has not been able to reproduce these performance deltas, and maintains that Ryzen 7000 series should perform consistently between both operating systems. Architecturally, "Zen 4" isn't different from "Zen 3" with the exception of its AVX-512 ISA that even Windows 10 supports. Windows 10 has awareness for "Zen 4" multi-core topology since it isn't any different from Ryzen 5000 "Vermeer." AMD stated that it continues to work with game developers to ensure their titles are optimized for Ryzen processors.The statement from AMD on the matter follows.

ASUS Turkey has jumped the gun and revealed ASUS' upcoming Zenbook 14 laptop, which in itself might not be a big deal, but the UM3402 as the specific model is known as, will apparently be available with an AMD Ryzen 7 7730U CPU. As AMD has as yet to unveil such a CPU, it appears that ASUS Turkey has gotten ahead of things. A quick search for the Zenbook 14 SKU in question reveals that the current UM3402 model has a Ryzen 5825U processor.

The remaining specs appear identical to the current model, but this is clearly not a typo, as the CPU SKU is mentioned at multiple points on the product page. Based on AMD's CPU model name "decoder", the Ryzen 7 7730U is based on a Zen 3 or a Zen 3+ core that sits in the 15-28 W TDP range. According to Videocardz, it will be using an AMD Vega based GPU. Beyond that, we don't know any specifics about the CPU, but one thing that stands out and may or may not be correct, is that the Zenbook 14 is only listed as supporting two USB 3.2 10 Gbps USB-C ports, rather than USB4, which seems a bit odd. Then again, this is a lower-tier CPU, so it's possible that this is the reason for lack of USB4 support. The fact that ASUS has moved to an IPS based display, from an OLED display on the current UM3402 SKU, also suggests that this might be a cheaper model in ASUS lineup.

AMD earlier this week released basic enablement for the GNU Compiler Collections (GCC), which extend "Zen 4" microarchitecture awareness. The "basic enablement patch" for the new Zenver4 target is essentially similar to Zenver3, but with added support for the new AVX-512 instructions, namely AVX512F, AVX512DQ, AVX512IFMA, AVX512CD, AVX512BW, AVX512VL, AVX512BF16, AVX512VBMI, AVX512VBMI2, GFNI, AVX512VNNI, AVX512BITALG, and AVX512VPOPCNTDQ. Besides AVX-512, "Zen 4" is largely identical to its predecessor, architecturally, and so the enablement is rather basic. This should come just in time for software vendors to prepare for next-generation EPYC "Genoa" server processors, or even small/medium businesses building servers with Ryzen 7000-series processors.