This update is a continuation of our response to this issue. As mentioned, ASUS has been working with AMD on defining new rules for the new BIOS updates. These updates will continue to be completed as necessary. The BIOS updates address concerns regarding potential damage that may occur when using Ryzen 7000 series processors with our AM5 motherboards by following the latest guidance from AMD. This includes a cap on SOC voltage at 1.3 V. Please download the latest version of the BIOS updates from asus.com/support.

Thank you again for choosing our product. If you still have any questions, or are concerned that your motherboard may have been affected by this issue, please contact our ASUS support team in your region. If an issue is identified, your motherboard will be covered by our warranty. Our support teams are ready to assist you.

The latest AMD AGESA 1.0.0.7 AM5 platform microcode that the company recently released to improve stability of machines powered by Ryzen 7000X3D processors, more importantly, prevent them from physical damage due to increased voltage in voltage-assisted overclocking scenarios; reportedly impacts memory overclocking capabilities, too, reports g01d3nm4ng0. The "PROCHOT Control" and "PROCHOT Deassertation Ramp" toggles that were available in the oldest versions of AGESA for AM5, are not available in the latest production AGESA.

The memory compatibility is also affected. AMD recently added support for odd-density DDR5 memory modules, such as 24 GB and 48 GB, which make up 48 GB and 96 GB 2-module (dual-channel, four sub-channel) kits. It is possible to max out 192 GB, but while the older AGESA 1.0.0.6 allowed memory frequencies of up to DDR5-6000 with SoC voltage of 1.3 V, the newer AGESA is only stable up to DDR5-4400 at this density. To be fair, most motherboards advertise maximum memory frequencies of under DDR5-4800 for memory configurations where there are two DIMMs per channel, and both DIMMs are dual-rank (so four dual-rank DIMMs in all, which is the least optimal memory configuration from a memory frequency and latency perspective).

ASUS today announced ExpertCenter PN53, a mini PC that harnesses the power of the latest AMD Ryzen 7000 series processors and AMD Radeon 600M series graphics. ExpertCenter PN53 features a triple-storage design that can accommodate a variety of storage combinations. Two PCIe 4.0 M.2 SSDs and DDR5 memory ensure fast boot-up and app loading times. In addition, ExpertCenter PN53 includes cleverly designed cooling features, AI-powered noise-cancelation technology for improved voice communications, and can support a single 8K monitor or up to four 4K monitors.

ExpertCenter PN53 offers up to 34% better single-thread performance and up to a 29% boost in multithread performance, compared to the previous PN51 model. In PCMark 10 Essentials group tests, ExpertCenter PN53 showed a 10% improvement in web browsing, videoconferencing, and app start-up times. It also performed 10% better than ExpertCenter PN51 in the Productivity test group that measures system performance with everyday office applications, including spreadsheets and writing workloads.

Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.

Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.

AMD is late in releasing its Phoenix Zen 4 lineup of mobile APUs - the original April launch has been missed, and laptops bearing Ryzen 7000HS & H-series are expected to arrive at some point this month. Preview hardware has made its way into the hands of testers, and one particular outlet - Golden Pig Upgrade, a content creator on the Chinese Bilibili video site - has performed benchmark tests. He seems to be the first reviewer to get hands-on time with AMD Ryzen 7040 Phoenix APUs, and his findings point to class leading performance results in terms of graphical capabilities - the 7840HS (packing a Radeon 780M RDNA3 iGPU) is compared to the Rembrandt-based 7735H, as well as a pair of Intel Raptor Lake CPUs - the 13700H and 13500H models.

AMD's newest Phoenix APU is the group leader in GPU performance stakes, but the jump up from the last-gen Rembrandt (RDNA2 iGPU) chip is not all that significant. VideoCardz reckons that the Radeon 780M integrated GPU is roughly equivalent to an NVIDIA GeForce MX550 dGPU and not far off from a GeForce GTX 1650 Max-Q graphics card (in terms of benchmark performance). According to AMD's internal documentation the RDNA 3 core architecture utilized in Phoenix APUs is referred to as "2.5" so this perhaps explains why the 780M is not doing laps around its older silbing(s).

According to investigations undertaken by Igor's Lab and Hardware Busters this week it seems that AMD's problematic lineup of Ryzen 7000 & Ryzen 7000X3D CPUs are consuming unexpected levels of power in short bursts when running in idle mode. In conducting more in-depth tests over the past few days, Igor Wallossek and (outgoing TPU PSU expert) Aristeidis Bitziopoulos have both found that that the aforementioned AMD processors are producing (to the testers' slight concern) power spikes in situations involving minimal computing activity. It is not currently known whether the sharp climbs in power consumption are in any way related to the burnout issues experienced by unlucky overclockers this week.

Aris/crmaris (at Hardware Busters) says that he has tested many of the affected processors in the past, but was not privy to any major problems relating to burnout or power consumption spikes. By running new tests this week, using his own Powenetics v2 board, Aris has found out that: "There are some interesting facts here, which I didn't pay much attention to during the reviews because I only look at the average values and not the peak ones in idle. In the 7950X3D, there is a high spike during idle at 130 W, which is unjustified because the peak CPU load is only 3.53%. Even with the Curve Optimized enabled and a -15 setting, the idle power spike is close to 125 W, so something is happening there. On the 7800X3D, the spike during idle stays low, but this is not the case for the 7900X, which has an idle power spike at 109 W, while the peak CPU load at idle was at 5.12%, so these 109 W are not justified, either."

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

AMD has today released another statement to the press, following on from controversy surrounding faulty Ryzen 7000X3D series processors - unlucky users are reporting hardware burnouts resulting from voltage-assisted overclocking. TPU has provided coverage of this matter this week, and made light of AMD's first statement yesterday. AMD ensures customers that it has fully informed ODM partners (motherboard manufacturers) about up-to-date and correct voltages for the Ryzen processor family - yet user feedback (via online hardware discussions) suggests that standard Ryzen 7000 models are also being affected by the burnout issue - this side topic has not been addressed by AMD (at the time of writing). This second statement repeats the previous one's recommendation that affected users should absolutely make contact with AMD Support personnel:

AMD Statement"We have root caused the issue and have already distributed a new AGESA that puts measures in place on certain power rails on AM5 motherboards to prevent the CPU from operating beyond its specification limits, including a cap on SOC voltage at 1.3 V. None of these changes affect the ability of our Ryzen 7000 Series processors to overclock memory using EXPO or XMP kits or boost performance using PBO technology. We expect all of our ODM partners to release new BIOS for their AM5 boards over the next few days. We recommend all users to check their motherboard manufacturers website and update their BIOS to ensure their system has the most up to date software for their processor.

Anyone whose CPU may have been impacted by this issue should contact AMD customer support. Our customer service team is aware of the situation and prioritizing these cases."

The recent escalating AMD Ryzen 7000X3D Series CPU issue has come to our attention, ASRock treats this type of incident seriously and would like to offer the most updated BIOS across our entire range of AM5 motherboards. ASRock has released new BIOS as well as A-Tuning utility for following AM5 chipset motherboards which limit CPU voltage on certain power rails. We encourage users to update to the new BIOS with the appropriate voltage settings urgently to ensure system stability and durability.

Apart from bringing rock-solid hardware products to PC users, ASRock is also keen on working with AMD and integrating the most up to date technologies into its products. If you're unsure about the risk of using old BIOS version, please seek professional support from ASRock customer service.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, has released a new BIOS update for its X670E VALKYRIE, RACING B650EGTQ, and B650M-SILVER motherboards. This update aims to limit the voltages of AMD Ryzen 7000X3D processors, ensuring improved CPU safety. Recent reports suggest that AMD Ryzen 7000X3D processors are prone to physical damage when overclocked with voltage assistance. This has prompted motherboard vendors to rush BIOS updates with voltage limiters, and BIOSTAR is no exception.

The new BIOS update from BIOSTAR restricts direct voltage to CPU Vcore Voltage, CPU SOC Voltage, and CPU MISC Voltage, preventing over-voltage and reducing the risk of damage to the 7000X3D series CPUs. Additionally, BIOSTAR also has PBO (Precision Boot Overdrive, Default: Auto) function to provide the best performance for 7000X3D series CPUs even under Voltage restrictions.

DOWNLOAD: the latest motherboard BIOS updates for BIOSTAR X670E Valkyrie | BIOSTAR Racing B650E GTQ | BIOSTAR B650M Silver

ASUS has released an official statement regarding the recently discovered issues with AMD Ryzen 7000 series CPUs, especially the Ryzen 7000X3D series. ASUS has also released EFI updates on Friday, that include thermal monitoring mechanism to protect motherboards and CPUs and is working on new updates that should be available soon and define new rules for AMD Expo and SoC voltage, which appear to be the main issue related to the CPU VDDIO/MC voltages.

We have already covered the first reports of damaged Ryzen 7000X3D series CPUs that suffered physical damage, and some motherboard manufacturers have already released new BIOS updates, including MSI. In the meantime, Roman "Der8auer" Hartung has also discovered that the issue might not be just limited to the Ryzen 7000X3D series, but could also impact the Ryzen 7000 X-series CPUs. Although there were no earlier reports on such issues, AMD Expo appears to be the main source of the problem and users can either disable it or manually set the SoC voltage, at least until motherboard makers come up with new BIOS updates or we hear an official statement from AMD.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces the launch of the brand new B650MP-E PRO motherboard, designed to cater to the needs of home, office, and business users. The B650MP-E PRO motherboard supports the latest AMD Ryzen 7000 series processors with the AMD B650 single-chip architecture, making it an excellent choice for users who demand high performance and stability. It supports 4-DIMM DDR5 memory up to 128 GB, PCIe 4.0, and PCIe M.2 4.0 (64 Gb/s) for lightning-fast DATA transfer speeds.

Offering flag-ship tier features and exceptional computing performance, the B650MP-E PRO motherboard incorporates advanced technology, such as the A.I FAN, CPU OPT Header, 55 A Dr. MOS, Debug LED, Digital PWM, LED ROCK ZONE, VIVID LED DJ with RGB Sync, and 2.5Guard. These features ensure superior efficiency and performance, allowing users to optimize their computing needs to the next level. Moreover, the SMART BIOS UPDATE button and USB port ensure hassle-free BIOS updates, ensuring a reliable and error-free operation.

ASUS today announced Vivobook 15X OLED (M3504), Vivobook 16X OLED (M3604), and Vivobook 17X (M3704), a trio of stylish everyday laptops smoothly powered by AMD Ryzen 7000-Series Processors. Featuring up to a power-efficient eight-core 4.5 GHz AMD Ryzen 7 7730U processor that's capable of handling all everyday tasks, 16 GB of RAM, and a 1 TB PCIe SSD, these laptops also have high-capacity up to 63 Wh batteries that offer outstanding battery life for daily productivity on the go.

Equipped with brilliant world-leading up to 4KOLED HDR Pantone Validated displays on the OLED models (M3504, M3604), or a crisp and clear FHD IPS display (M3704 only), the laptops also include a powerful DTS-tuned ASUS SonicMaster audio system for rich, immersive entertainment. Home users and remote workers will both appreciate the crystal-clear video and noise-free audio during video or audio conference calls, enabled by the FHD webcam with ASUS 3DNR technology and AI noise-canceling audio.

When you buy a notebook powered by a Ryzen 7000 series mobile processor, you're either getting a cutting-edge chip powered by the company's latest "Zen 4" CPU cores, or one that has been rebadged from the company's previous-gen Ryzen 6000 "Zen 3+" or even Ryzen 5000 "Zen 3" (DDR4) processor series. The question on the tech buyer's mind will be "how to I spot a Ryzen 7000 series processor-powered notebook that actually gives me "Zen 4" CPU cores?"

AMD attempted to answer this with an exclusive new case badge for Ryzen 7000 series processors with "Zen 4" CPU cores. This new case badge looks not much different from the AMD Expo logo, in that the AMD Ryzen main branding is set against an orange backdrop. This bit is surrounded by a silver-metallic frame, with the 5/7/9 brand extension on its corner, along with "7000 series" marked. This case badge is only to be included with a Ryzen 7040 series "Phoenix" or Ryzen 7045 series "Dragon Range" processor present, and cannot be used with Ryzen 7035 series "Rembrandt Refresh" or Ryzen 7030 series "Barcelo Refresh," or Ryzen 7020 series "Mendocino."

Leading global motherboard manufacturer ASRock proudly announces its new series of AMD A620 motherboards. The latest AMD A620 platform aims at a more budget-friendly market while still offering a wide variety of features, such as DDR5 memory support, multiple M.2 slots for NVMe storage devices, and WiFi 6E for daily tasks as well as gaming.

To maximize the affordability of the AMD A620 platform, ASRock offers four models, including both 4 and 2 DIMMs motherboard layout options. If 4 DDR5 memory is a must for your next build, the A620M Pro RS will definitely be the number one choice. It offers a luxurious amount of USBs including Type-C for both front and rear panels, 3 M.2 Key-M onboard and 2 of which support PCIe Gen 4 x4 to give multiple storage options. With a 6-layer PCB and Dr.MOS for Vcore design, A620M Pro RS can fully support the latest AMD Ryzen 7000 Series Processors. A620M Pro RS also comes with a WiFi 6E variant the A620M Pro RS WiFi, an all-rounder choice for wireless environments.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest AMD A620 series motherboards with optimal memory performance and all-round features. With the perfect support of the latest AMD Ryzen 7000 series processors, GIGABYTE A620 motherboards deliver the most competitive AM5 platform for users to enjoy performance flexibly and affordably.

Enhanced by GIGABYTE exclusive layout design and BIOS setting, the A620 lineup can achieve optimal memory performance of DDR5 EXPO/XMP overclocking up to DDR5-6400, which exerts the utmost value and performance of the AM5 platform. Boasted with comprehensive features, GIGABYTE A620 motherboards can best fit users' needs and budget, and become the best choice for users who plans on stepping up to the latest AM5 platform.Meanwhile, GIGABYTE's A620 motherboards boast the innovative PCIe EZ-Latch technology to simplify the upgrade of graphics cards, and to avoid accidental damage to the surrounding components. By GIGABYTE exclusive Q-Flash Plus feature, users can update the BIOS without installing any processor, memory, or even graphics card, making it possible for users to easily enjoy the benefits brought about by the new BIOS code and processors. Further with GIGABYTE GCC software platform, GIGABYTE delivers the competitive A620 platform with user-friendly features and multiple form factor options which covers Micro ATX to Mini ITX.

In no mood to cede its market-share growth to Intel, AMD has reportedly decided to accelerate the development of its next-generation "Zen 5" microarchitecture for debut within 2023. In its mid-2022 presentations, AMD had publicly given "Zen 5" a 2024 release date. This is part of a reading-in-between the lines for a recent GIGABYTE press release announcing server platforms powered by relatively low-cost Ryzen desktop processors. The specific sentence from that release reads "The next generation of AMD Ryzen desktop processors that will come out later this year will also be supported on this AM5 platform, so customers who purchase these servers today have the opportunity to upgrade to the Ryzen 7000 series successor."

While the GIGABYTE press release speaks of a next-generation Ryzen desktop processor, it stands to reason that it is referencing an early release of "Zen 5," and since AMD shares the CPU complex dies (CCDs) between its Ryzen client and EPYC server processors, the company is looking at a two-pronged upgrade to its processor lineup, with its next-generation EPYC "Turin" processor competing with Xeon Scalable "Emerald Rapids," and Ryzen "Granite Ridge" desktop processors taking on Intel's Core "Raptor Lake Refresh" and "Meteor Lake-S" desktop processors. It is rumored that "Zen 5" is being designed for the TSMC 3 nm node, and could see an increase in CPU core count per CCD, up from the present 8. TSMC 3 nm node goes into commercial mass-production in the first half of 2023 as the TSMC N3 node, with a refined N3E node slated for the second half of the year.

Creating, consuming and collaborating in a hybrid world just got easier with Lenovo's latest generation of Windows 11 Yoga laptops that deliver impressive performance, incredible versatility, and easy mobility in a sleek and portable design:

"We know that digital content creators continue to embrace the hybrid lifestyle to create anytime, anywhere, from making videos to designing graphics on the move," says Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "Lenovo's latest new premium Yoga Pro laptops are made for creators. Combining performance and portability, including an impressive new Mini-LED PureSight Pro display and an upgraded keyboard, creators will revel in the exceptional user experience to create whenever inspiration strikes."

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.

AMD's next-generation RDNA4 graphics architecture will retain a design-focus on gaming performance, without being drawn into an AI feature-set competition with rival NVIDIA. David Wang, SVP Radeon Technologies Group; and Rick Bergman, EVP of Computing and Graphics Business at AMD; gave an interview to Japanese tech publication 4Gamers, in which they dropped the first hints on the direction which the company's next-generation graphics architecture will take.

While acknowledging NVIDIA's movement in the GPU-accelerated AI space, AMD said that it didn't believe that image processing and performance-upscaling is the best use of the AI-compute resources of the GPU, and that the client segment still hasn't found extensive use of GPU-accelerated AI (or for that matter, even CPU-based AI acceleration). AMD's own image processing tech, FSR, doesn't leverage AI acceleration. Wang said that with the company introducing AI acceleration hardware with its RDNA3 architecture, he hopes that AI is leveraged in improving gameplay—such as procedural world generation, NPCs, bot AI, etc; to add the next level of complexity; rather than spending the hardware resources on image-processing.

Raijintek today introduced the Forkis DDC Ultra, a CPU water block with an integrated pump, with which you can connect a DIY liquid cooling loop using your own fittings. With its retention module in place, it measures 80 mm x 84 mm x 45 mm (WxDxH), and features a nickel-plated copper cold-plate. Right above it is the POM+aluminium casing, which contains a DDC Ultra pump with 150 kPa (21.7 PSI) pressure, and 3.8 m (13 ft) head, and 750 L/h discharge rate; along with a ceramic bearing that's rated for 50,000 hours. The cold-plate features a large microfin lattice throughout its inner surface, so the block is even optimized for MCMs such as the Ryzen 7000 "Raphael." The block has threads for standard G 1/4" (fittings not included). Among the CPU socket types supported are LGA1700, LGA1200, AM5, and AM4. The company didn't reveal pricing.