AMD reportedly scaled down production of its Ryzen 7000 series desktop processors in response to bleak demand across the PC hardware industry. Wccftech claims to have read an internal company document calling for reduced supply to the channel as market response to the Ryzen 7000-series is weak. This comes hot on the heels of AMD revising its Q3-2022 forecast, trimming its guidance by a $1 billion drop in revenue, citing weak demand in the PC market. However, we are seeing no deviation from the launch pricing for Ryzen 7000-series SKUs or compatible Socket AM5 motherboards. The platform went on sale from late September, on the same day that Intel announced its competing 13th Gen Core "Raptor Lake" processors. The new Intel chips are expected to start selling from a little later this month.

Unlike 13th Gen Core processors, Ryzen 7000 series processors appear to be a victim of the platform—notwithstanding the high pricing of the processors, which start at $299 for the 6-core 7600X, buyers lack access to affordable motherboards, and have to contend with expensive DDR5 memory. Pricing of cheaper LGA1700 motherboards based on entry-level H610 and B660 chipsets with cost-effective DDR4 memory support have added depth to consumer choice, besides Intel's 12th Gen range starting from under $150.

ASUS today announced the new Precision Boost Overdrive (PBO) enhancement, an exclusive temperature control feature for its range of X670 and B650 motherboards designed for AMD Ryzen 7000 series processors.

These latest CPUs push the limits of performance farther than ever before. They dynamically take advantage of available thermal headroom to give users higher clock speeds. This means that users might see higher CPU temperatures than they are used to in a new AMD Ryzen-powered machine. To put users in control, ASUS is rolling out a BIOS update for its X670 and B650 motherboards with new options for its PBO enhancement feature that makes it easy to balance thermals and performance. With just a few clicks, users will be able to dramatically reduce CPU temperatures—and maybe even increase performance and reduce fan noise in the process.

With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

Noctua today announced its new NA-TPG1 thermal paste guard for AMD's latest AM5 based Ryzen processors. When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heat-spreader and may become difficult to remove. Simple and risk-free to apply, the NA-TPG1 prevents this undesired phenomenon.

"While there's no denying that AMD's new Ryzen 7000 processors perform fantastic, we found that the cut-outs at the side of the heat-spreader tend to attract thermal paste that can be challenging to clean off" says Roland Mossig (Noctua CEO). "This is where our new thermal paste guard steps in: it's a simple yet highly effective tool for keeping your new Ryzen 7000 series CPU nice and clean."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.

Last week NZXT announced its high-end Z790 motherboard for Intel's upcoming 13th gen Core processors and this week, the company is following up that announcement with its first AM5 motherboard for the Ryzen 7000 series, in the shape of the N7 B650E. The board comes with either white or black shielding, although the PCB is black in both cases, as is the rear I/O cover. NZXT has gone for a mid-range feature set, with a 16+2+1 Smart Power Stage design rated at 90 A, which places it on par with ASRock's B650E Steel Legend. Speaking of ASRock, it has been NZXT's OEM in the past, but we can't find a board with the same general layout as the N7 B650E in ASRocks' lineup this time around, so this is either a proper custom design or NZXT has changed its OEM partner.

The board has one PCIe 5.0 x16 slot and two PCIe 4.0 x16 slots, with one having four lanes of bandwidth and the other two lanes of bandwidth. The board also features three M.2 slots, one PCIe 5.0 and two PCIe 4.0, one of which is limited to two lanes of PCIe bandwidth. Other features include 2.5 Gbps Ethernet, a WiFi 6E/Bluetooth 5.2 combo module, an HDMI 2.1 port, four SATA ports and sadly what appears to be a 10 Gbps rather than a 20 Gbps USB-C port around the back. There's also a front header for another 10 Gbps USB-C port. NZXT has all the standard features you'd expect to see on a modern motherboard such as rear mounted clear CMOS and BIOS flashing buttons, debugging LEDs, albeit the basic kind and a good spread of fan headers and RGB LED connectors. A full set of audio connectors are also present and the audio chip of choice is the Realtek ALC1220. The only real hurdle for this board to become a success is going to be the price tag, as NZXT lists the board on its site for US$349.99/€429.99/£429.99, which is a very steep asking price for what's on offer here.

Leading global motherboard manufacturer, ASRock, is proud to announce its AMD B650E/B650 motherboard series. These motherboards are targeted at the mainstream AM5 segment featuring various exciting new products such as our flagship B650E Taichi, the high-end B650E Steel Legend Wi-Fi for high end market, B650E PG Riptide Wi-Fi and B650 PRO RS for mainstream users, and B650 PG Lightning a new SKU joining the Phantom Gaming family targeted the entry level market. ASRock also offers the new B650E PG-ITX WiFi for small form factor enthusiasts.

ASRock went all-out on its VRM design by creating a 24+2+1 phase Smart Power Stage (SPS) Dr.MOS on the B650E Taichi series, providing users with the most powerful AM5 platform it can offer ready to unlock maximum CPU performance. The flagship ASRock B650E Taichi motherboards are equipped with many exciting features and technologies such as PCIe 5.0 technology for graphics cards and M.2 SSDs, an incredible IO that includes the latest USB4 offering a fast and simple level of connection for work or home.

MSI, a world leading motherboard brand in high-performance and innovative computing, announces its brand new AMD B650 Series motherboards. MSI is not only tailored for enthusiast gamers, but also offers possibilities for content creation and office use. MSI is fully dedicated to all types of PC users by satisfying their needs. This time, we carefully prepared a variety of advanced technologies and exclusive features to help our customers create the most immersive experiences and maximize every ounce of performance.

"With DDR5 memory boost and an enhanced thermal design, MSI B650 Series motherboards are built to fully support the performance and capabilities of AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "Designed specifically for gamers and content creators, MSI motherboards feature advanced technologies that take full advantage of the AM5 platform."

GIGABYTE released three of the first Socket AM5 server motherboards and barebones, letting you build small-business/home servers using AMD Ryzen 7000 series processors. These boards may feature a client-segment CPU socket, but come with server-grade components for 24/7 or high-uptime operation, and remote-management features. The three are based on the AMD B650E chipset, which means it gets full PCI-Express Gen 5 (for an x16 slot and an x4 Gen 5 NVMe).

The MC13-LE0 and MC13-LE1 motherboards are built in the Micro-ATX form-factor, but with a design optimized for rack airflow. Both boards feature an identical PCB layout, but differ in their network connectivity options. The MC13-LE1 offers two 10 GbE interfaces driven by an Intel X710 controller; while the MC13-LE0 gives you two 1 GbE interfaces, each driven by an Intel i210. Both boards offer an ASPEED AST2600 remote-management chip with its dedicated 1 GbE port; one M.2 PCIe Gen 5 slot, a PCI-Express 4.0 x4 slot, and four SATA 6 Gbps ports. The W332-Z00 is an M-ATX tower server/workstation barebones (you add your own processor, DDR5 memory, and storage). This features a different motherboard than the MC13-LE#, with two M.2 PCIe Gen 5 slots, and Realtek-supplied remote-management and 2.5 GbE chips.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its comprehensive product readiness for the newly available AMD Ryzen 7000 series of processors and the accompanying X670 and B650 chipset motherboards. From a new dedicated range of CORSAIR DDR5 memory for AMD platforms, to a huge lineup of award-winning CPU coolers, PC power supplies, cases and accessories, CORSAIR has the complete lineup of products to help enthusiasts build their new AMD-powered PC.

New AMD Ryzen 7000 processors and their supporting X670 and B650 chipset motherboards bring with them a huge change from past generations in the adoption of DDR5 memory, substantially increasing memory frequency versus DDR4. CORSAIR has a complete range of performance DDR5 created especially for AMD platforms, including the illustrious DOMINATOR PLATINUM RGB DDR5, the panoramically lit VENGEANCE RGB DDR5, or minimalist VENGEANCE DDR5. Available in a range of frequencies up to 6,000 MHz and capacities up to 64 GB, all CORSAIR DDR5 memory for AMD supports the new AMD EXPO (Extended Profiles for Overclocking) standard, offering single-setting-setup to ensure owners can easily run their memory at the speed it was created to run at.

AMD today released the Adrenalin 22.9.2 drivers. These drivers add support for the Radeon Graphics iGPU of the new Ryzen 7000 desktop processors that go on sale today. Game optimization is added for "Grounded." A handful of issues have been identified with the release. Radeon Super Resolution failing to trigger after changing resolution in games such as Nioh 2, has been identified. Improper rendering of Oculus dashboard menus with RX 6000-series graphics cards has been identified. GPU utilization being stuck at 100% in Performance Metrics after closing games in some cards such as the RX 570, has been identified. Display briefly showing corruption when switching between video and games in some GPUs such as the RX 6700 XT, has been identified. Vertical Refresh Sync being set to "off" globally causing stuttering or driver timeouts, has been identified. Dropped frames in video playback have been identified.

DOWNLOAD: AMD Software Adreanlin 22.9.2 beta

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of their latest AMD X670 motherboards, including two segments of X670E and X670 chipsets which showcase an abundance of notable features. High-end X670E models natively support PCIe 5.0 graphics cards with enhanced slot design, while mainstream X670 models adopt PCIe 4.0 graphics card slot design. The lineup supports PCIe 5.0 M.2 slots with PCIe and M.2 EZ-Latch design, which makes it easier for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, the features of 18+2+2 direct power, 105 Amps Smart Power Stage, and 8 layer PCB provide higher stability, optimal compatibility, and performance for coming AMD Ryzen 7000 Series processors. With the advanced thermal design, VRM temperature is reduced. This stabilizes the power and performance of the PCIe x16 slot and M.2 SSD, avoiding thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, the lineup takes advantage of Active OC Tuner technology and all-new GCC (GIGABYTE Control Center) software to align with GIGABYTE's new PCIe 5.0 M.2 SSD and EXPO/ XMP dual mode DDR, delivering extreme performance with more user- friendly experience.

"The new GIGABYTE X670 motherboard lineup offers exclusive features and new designs, enhancing the excellent performance and multifunctioning capabilities for AMD Ryzen 7000 Series processors," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "The AM5 platform is well-supported to bring the best-in-class experience that AMD users have come to expect."

With only a couple of days to go until the official retail availability of the Ryzen 7000-series CPUs and accompanying X670 and X670E motherboards, early pricing of the motherboards are starting to crop up in Europe. Courtesy of @momomo_us we now have pricing from an unknown European retailer for 11 ASUS models, as well as MSI's Godlike board. We also managed to dig up some additional pricing over at Geizhals, which is a European price comparison site, for five ASRock models and one from Gigabyte. Hopefully we're looking at placeholder pricing here, as it's not looking good in terms of value for money. Admittedly, ASUS is known for charging a premium over its competitors, but it's not looking good anywhere right now.

Starting with @momomo_us pricing and MSI for no specific reason, its upcoming MEG X670E Godlike is listed at €2,399 and that doesn't include any kind of liquid cooling accessories. This has to be one of the most expensive consumer motherboards ever, if this is the actual retail pricing it'll sell for. Moving over to ASUS, its Prime X670-P model is listed at €418.53, with the WiFi version jumping to €446.89. This is the first indicator that these are not the actual retail prices, as WiFi versions of motherboards tend to have a $/€/£10-20 premium over non-WiFi models. We're not going to go over every individual board price here, simply look at the attached pictures, but based on these early prices, ASUS has two models for well over €1,000, the ROG Crosshair X670E Hero and the ROG Crosshair X670E Extreme, with the latter being listed at €1,486.95.

Noctua today confirmed that all its CPU coolers and mounting-kits that support AMD AM4 also support the upcoming AM5 socket, except the NH-L9a-AM4 low-profile cooler and the NM-AM4-L9aL9i mounting-kit. For the latter, Noctua announced the new NM-AM5-L9aL9i kit that will be available free-of-charge from end of October. Mounting upgrade kits for older heatsink models that do not yet support AM4 will also be provided to customers at no additional cost.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Ryzen 7000 series processors and their new AM5 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support AM5 out of the box and don't require any updates, customers will be able to upgrade the NH-L9a as well as most older coolers at no additional cost, so even 15-year-old coolers can be used on the latest processors!"

Leading global motherboard manufacturer, ASRock, is proud to announce its X670E motherboard series, ready for new AMD Ryzen 7000 Series processors. This first wave of AMD Socket AM5 motherboards includes Special Edition X670E Taichi Carrara, flagship X670E Taichi, high-end X670E Steel Legend, mainstream X670E PRO RS, and entry X670E PG Lightning.

"With the AM5 platform we're investing in the next generation of high-performance computing and gaming," said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. "With the continued support of best-in-class partners like ASRock, AMD is bringing the most advanced features and technologies to desktop. The X670 Extreme is designed to bring the best connectivity and ultimate overclocking with PCIe 5.0 support."

TechPowerUp released the latest version of TechPowerUp GPU-Z, the popular graphics information and diagnostics utility for gamers and PC enthusiasts. Version 2.49.0 adds support for the iGPU of the upcoming Ryzen 7000-series "Zen 4" desktop processors, codenamed "Raphael." CPU temperature monitoring for these processors works the same way as it does for older Ryzens, so no changes needed in that regard. The GPU model reporting for Intel Arc A750/A770 has been fixed. Support is added for the Intel Arc A580. Some rare application crashes with AMD Radeon cards have been fixed. The NVIDIA DLSS game scan we introduced with the previous version doesn't actually "use" DLSS in any way, it only scans for games supporting DLSS, so we made it available on all systems.

DOWNLOAD: TechPowerUp GPU-Z 2.49.0

Bitspower, one of the world's leading suppliers of water-cooling equipment for performance computers, today launched the Bitspower AM5 kit which can transform AMD-based Bitspower CPU water blocks into an AM5-compatible product. More and more setups used by gamers, streamers, and creators will harness AMD's new AM5 platform, which provides native support for up to 170 W—meaning there's power to do more, play more, and create more than ever before. However, with this increased power comes higher temperatures.

Fortunately, AMD has ensured that existing AM4 cooling solutions can be supported with their newest motherboards, with the product's height and port distance being managed in a 7 mm increment. With the new AM5 kit, Bitspower's current range of AMD CPU blocks can directly migrate to AM5 socket motherboards. The company's latest generation CPU water blocks, such as the M Pro Water Blocks, are optimized for cooling Ryzen 7000-series CPUs, allowing users to take that already-powerful processor to new heights.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is pleased to announce that a selection of its current all-in-one (AIO) liquid and air coolers will be fully compatible with AM5 (LGA1718) socket designed for the upcoming AMD Ryzen 7000 Series CPUs. A list of compatible ENERMAX coolers is provided in the table below. For users who already own the selected ENERMAX CPU coolers and plan to switch motherboard to AMD Ryzen 7000 series, you may contact your ENERMAX local branch for assistance. For the latest installation guide and video, please visit this page.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

At IFA 2022, MSI introduces its latest products, tailor-made for gamers, creators, and professionals, to the world. From gaming laptops, desktops, and components, to business monitors, industrial computers, and automotive and commercial solutions, MSI is revealing the most powerful, capable new products, covering every need and every aspect of technology.

Exhibition Date: Sep 2nd - Sep 6th, 2022
Opening Hours: 10:00 AM - 06:00 PM
Location: Stand 102, Hall 11.2 @ Messe Berlin, Germany
"IFA 2022 is one of the world's most important consumer electronics trade shows. After years of virtual and distanced living, MSI is especially well-prepared to support all industries and professions with our innovations and solutions, to help them adapt to new ways of working, living and entertaining," said Sam Chern, MSI Marketing Vice President.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.