The University of Shanghai for Science and Technology (USST), Peking University and the Shanghai Institute of Optics and Fine Mechanics (SIOM) are collaborating on new Optical Data Storage (ODS) technologies—a recently published paper reveals that scientists are attempting to create 3D nanoscale optical disk memory that breaks into petabit capacities. Society (as a whole) has an ever-growing data demand—this requires the development of improved high-capacity storage technologies—the R&D teams believe that ODS presents a viable alternative route to traditional present day solutions: "data centers based on major storage technologies such as semiconductor flash devices and hard disk drives have high energy burdens, high operation costs and short lifespans."

The proposed ODS format could be a "promising solution for cost-effective long-term archival data storage." The researchers note that current (e.g Blu-ray) and previous generation ODS technologies have been: "limited by low capacities and the challenge of increasing areal density." In order to get ODS up to petabit capacity levels, several innovations are required—the Nature.com abstract stated: "extending the planar recording architecture to three dimensions with hundreds of layers, meanwhile breaking the optical diffraction limit barrier of the recorded spots. We develop an optical recording medium based on a photoresist film doped with aggregation-induced emission dye, which can be optically stimulated by femtosecond laser beams. This film is highly transparent and uniform, and the aggregation-induced emission phenomenon provides the storage mechanism. It can also be inhibited by another deactivating beam, resulting in a recording spot with a super-resolution scale." The novel optical storage medium relies on dye-doped photoresist (DDPR) with aggregation-induced emission luminogens (AIE-DDPR)—a 515 nm femtosecond Gaussian laser beam takes care of optical writing tasks, while a doughnut-shaped 639 nm continuous wave laser beam is tasked with retrieval. A 480 nm pulsed laser and a 592 nm continuous wave laser work in tandem to read data.

Semiconductor Manufacturing International Corp (SMIC) is preparing new semiconductor production lines at its Shanghai facilities according to a fresh Reuters report—China's largest contract chip maker is linked to next generation Huawei SoC designs, possibly 5 nm-based Kirin models. SMIC's newest Shanghai wafer fabrication site was an expensive endeavor—involving a $8.8 billion investment—but their flagship lines face a very challenging scenario with new phases of mass production. Huawei, a key customer, is expected to "upgrade" to a 5 nm process for new chip designs—their current flagship, Kirin 9000S, is based on a SMIC 7 nm node. Reuter's industry sources believe that the foundry's current stable of "U.S. and Dutch-made equipment" will be deployed to "produce 5-nanometer chips."

Revised trade rulings have prevented ASML shipping advanced DUV machinery to mainland China manufacturing sites—SMIC workers have reportedly already repurposed the existing inventory of lithography equipment for next-gen pursuits. Burn Lin (ex-TSMC), a renowned "chip guru," believes that it is possible to mass produce 5 nm product on slightly antiquated gear (previously used for 7 nm)—but the main caveats being increased expense and low yields. According to a DigiTimes Asia report, mass production of a 5 nm SoC on SMIC's existing DUV lithography would require four-fold patterning in a best case scenario.

NVIDIA's intrepid CEO, Jensen Huang, has spent a fair chunk of January travelling around China—news outlets believe that Team Green's leader has conducted business meetings with very important clients in the region. Insiders proposed that his low-profile business trip included visits to NVIDIA operations in Shenzhen, Shanghai and Beijing. The latest updates allege that a stopover in Taiwan was also planned, following the conclusion of Mainland activities. Photos from an NVIDIA Chinese new year celebratory event have been spreading across the internet lately—many were surprised to see Huang appear on-stage in Shanghai and quickly dispense with his trademark black leather jacket. He swapped into a colorful "Year of the Wood Dragon" sleeveless shirt for a traditional dance routine.

It was not all fun and games during Huang's first trip to China in four years—inside sources have informed the Wall Street Journey about growing unrest within the nation's top ranked Cloud AI tech firms. Anonymous informants allege that leadership, at Alibaba Group and Tencent, are not happy with NVIDIA's selection of compromised enterprise GPUs—it is posited that NVIDIA's President has spent time convincing key clients to not adopt natively-developed solutions (unaffected by US Sanctions). The short hop over to Taiwan is reported not to be for R&R purposes—insiders had Huang's visiting key supply partners; TSMC and Wistron. Industry experts think that these meetings are linked to NVIDIA's upcoming "Blackwell" B100 AI GPU, and "supercharged" H200 "Hopper" accelerator. It is too early for the rumor mill to start speculation about nerfed versions of NVIDIA's 2024 enterprise products reaching Chinese shores, but Jensen Huang is seemingly ready to hold diplomatic talks with all sides.

Pixelworks, Inc., a leading provider of innovative visual processing solutions, today announced the official launch of its new IRX gaming experience brand. As a brand targeted at smartphone users, IRX is grounded on Pixelworks' mobile visual processing solutions and coupled with in-depth game tuning services. This combination leverages Pixelworks' expertise to achieve ultra-smooth gaming experience and the highest picture quality for different types of games on mobile devices. In addition, it exercises effective control of power consumption, latency and other performance variables to ensure stable and long-lasting gaming with optimal visual performance, providing end users with unparalleled mobile gaming experiences.

The IRX gaming experience is enabled by a portfolio of technology advantages and product application experiences based on the Company's innovative distributed rendering architecture. More specifically, Pixelworks' ultra-low latency MotionEngine technology, low power super-resolution technology, AI Always-on HDR and other technologies bring optimized rendering capabilities to smartphones that exceed what can be achieved by a traditional chipset. Together with Pixelworks' profound tuning experience for different games on various mobile devices the result is a meaningfully enriched visual experience for smartphone users, which is the core foundation for the IRX gaming experience.

AMD's Chinese office has announced that company representatives will be present at this year's ChinaJoy event—their Weibo social media account confirmed that: "from July 28th to July 31st, 2023, in Hall E6 of Shanghai New International Expo Center, super hardcore and mega cool AMD hardware will be on the scene, bringing you a fast and fun gaming experience. We are looking forward to meeting you!" ITHome thinks that the timing of this announcement points to a possible official unveiling of the Radeon RX 7900 GRE (Golden Rabbit Edition) on the showroom floor.

The publication has cited a tip provided by the one and only momomo_us—the Chinese market exclusive Golden Rabbit Edition will be released tomorrow, which lines up with ChinaJoy 2023's kick off time. Recent leaks have revealed that the 84 Compute Units + 16 GB configured graphics card is a new SKU, sitting below the RX 7900 XT in Team Red's Radeon RDNA 3 hierarchy. It seems to be "built on the mysterious Navi 31 + Navi 32 hybrid GPU." Additionally, ITHome reports that AMD has partnered up with ASUS, and will be exhibiting ROG Moba 7 Plus series laptops (sporting Ryzen Dragon Range APUs) at the Shanghai event.

According to a short article released by ITHome, Machenike, a popular Chinese PC hardware company displayed several interesting Intel CPU-based systems at the Bilibili World exhibition (in Shanghai). The manufacturer confirmed (to the reporter) that their next generation hardware will be hitting the market within the next three months, which coincides with the rumored launch of Intel 14th Gen Core Raptor Lake-Refresh desktop K-series SKUs.

Exhibited material implied that Machenike's upcoming PCs—arriving in the form of a "LIGHT-05" desktop tower, mini models and laptops—could be among the first batch of systems to support PCIe Gen 5 storage (as standard). Potential buyers could be attracted to next-gen machines offering access to faster NVMe SSD, on top of rumored higher core counts provided by the Raptor Lake Refresh. ITHome believes that a number of the mini-PCs at Machenike's booth were already running on Raptor Lake Refresh or (Core rebrand) Meteor Lake processors.

Artificial intelligence (AI) has emerged as a transformative force in chip design, with recent examples from China and the United States showcasing its potential. Jensen Huang, CEO of Nvidia, believes that AI can empower individuals to become programmers, while Lisa Su, CEO of AMD, predicts an era where AI dominates chip design. During the 2023 World Artificial Intelligence Conference (WAIC) in Shanghai, Su emphasized the importance of interdisciplinary collaboration for the next generation of chip designers. To excel in this field, engineers must possess a holistic understanding of hardware, software, and algorithms, enabling them to create superior chip designs that meet system usage, customer deployment, and application requirements.

The integration of AI into chip design processes has gained momentum, fueled by the AI revolution catalyzed by large language models (LLMs). Both Huang and Mark Papermaster, CTO of AMD, acknowledge the benefits of AI in accelerating computation and facilitating chip design. AMD has already started leveraging AI in semiconductor design, testing, and verification, with plans to expand its use of generative AI in chip design applications. Companies are now actively exploring the fusion of AI technology with Electronic Design Automation (EDA) tools to streamline complex tasks and minimize manual intervention in chip design. Despite limited data and accuracy challenges, the "EDA+AI" approach holds great promise. For instance, Synopsys has invested significantly in AI tool research and recently launched Synopsys.ai, the industry's first end-to-end AI-driven EDA solution. This comprehensive solution empowers developers to harness AI at every stage of chip development, from system architecture and design to manufacturing, marking a significant leap forward in AI's integration into chip design workflows.

China electric vehicle maker XPENG Motors has announced its new G6 coupe SUV—featuring an NVIDIA-powered intelligent advanced driver assistance system—is now available to the China market. The G6 is XPENG's first model featuring the company's proprietary Smart Electric Platform Architecture (SEPA) 2.0, which aims to reduce development and manufacturing costs and shorten R&D cycles since the modular architecture will be compatible with future models.

The electric SUV also features the XPENG Navigation Guided Pilot (XNGP), a full scenario-based intelligent assisted driving system. It's powered by the cutting-edge NVIDIA DRIVE Orin compute and XPENG's full-stack software developed in-house. The XNGP system first made its debut in the EV maker's flagship G9 SUV, touting a safe, reliable, advanced driving experience behind the wheel.

American McGee has been busy (since 2017) with the pre-production phase of his proposed follow up to 2011's Alice: Madness Returns. The third game in the series was going to be called Alice: Asylum, but after recent interactions with Electronic Arts McGee has admitted that: "Alice had a good run but the dream is over." McGee and a team of collaborators (artists, writers, designers, modelers and producers) have contributed to a massive Alice: Asylum Design Bible, and it was hoped that after many years of negotiations with EA, that the large chunk of presentation material would provide enough motivation for the publisher to sign up for a push into full development. The Alice: Asylum Design Bible was financed via fan contributions, through the Patreon crowd funding platform.

The publisher has decided to not finance the Asylum project, and will pursue other routes with the Alice intellectual property. McGee provided an update on the game's Patreon page: "After several weeks of review, EA has come back with a response regarding funding and/or licensing for Alice: Asylum. On the question of funding, they have ultimately decided to pass on the project based on an internal analysis of the IP, market conditions, and details of the production proposal. On the question of licensing, they replied that "Alice" is an important part of EA's overall game catalog, and selling or licensing it isn't something they're prepared to do right now."

TSMC is under pressure from the U.S. to reconsider its plans to expand its facilities in mainland China, sources close to the matter told DigiTimes. TSMC currently operates a fab near Shanghai, and one in Nanjing, which it had originally planned to expand, meeting resistance from the U.S. It is not known if this is government (diplomatic) pressure or by U.S. based customers of TSMC., but is likely a combination of the two. The same forces were possibly behind getting TSMC to invest north of $3.5 billion toward a facility in Arizona with six more "Gigafabs" being planned in the southwestern state. U.S. hand-holding in TSMC's policymaking could be part of a strategy to deny cutting-edge silicon fabrication technology to China (PRC), and to help TSMC expand its manufacturing in safer regions as the security situation across the Taiwan strait continues to deteriorate. TSMC, specifically western tech companies' dependence on it, makes it a soft target on the island, and a bargaining chip to deter western military intervention.

When the US decided to impose sanctions on all US-made technology use in foreign countries (China), the Chinese semiconductor manufacturing industry seemed at the time that it would just completely stop. Without the tools to manufacture silicon, Chinese manufacturers would need to turn to other countries to search for a possible solution. That, however, turned out impossible as the US administration has decided to stop the silicon from going into the hands of Chinese companies, by making a condition that any US-made technology can not get to China. Many of the parts for silicon manufacturing are designed in the US, so they have the power to restrict the use.

Today, in a surprising turn of events, we have information that Shanghai Micro Electronic Equipment (SMEE) has developed a deep ultraviolet (DUV) lithography scanner that is set for delivery in 2021. With a plan to deliver it in the fourth quarter of 2021, SMEE has designed this DUV scanner for the production of 28 nm node. While not being the most advanced node available to date, it is a significant start for Chinese technology independence. ASML, the producer of such scanners, used to be one of the few options there, however, it just gained a competitor. China will deliver its new silicon on a 28 nm process at the end of 2021. Pictured below, you can see how the scanner from SMEE looks like.

Semiconductor manufacturing has been the latest victim of the recent trade war between China and the United States. With the US imposing sanctions on Chinese manufacturers, they have not been able to use any US technology without the approval of the US government. That has caused many companies to lose customers and switch their preferred foundry. The US government has also decided to sanction a Chinese company Huawei from accessing any US-technology-based manufacturing facilities, thus has prevented the Chinese company from manufacturing its chips in the facilities of TSMC. Left without almost any way to keep up with the latest semiconductor technology, Huawei is reportedly working on its own manufacturing facilities.

According to the Financial Times, Huawei is about to enter domestic silicon production with its partner company Shanghai IC R&D. And a big note here is that the manufacturing facility will not use any US technology. The production is allegedly going to start as soon as the end of this year, and the first process that will come out the door will be a rather outdated 45 nm node. The company is expecting to move on to a more advanced 28 nm node by the end of next year. While the capacities are unknown, we can assume that it will be enough for the company's purposes. With this move, Huawei will be 100% independent from any US influence and will own the complete vector of software and hardware, that is a custom made design by the company.Huawei R&D Center

Intel today revealed plans for Project Athena Open Labs in Taipei, Shanghai and Folsom, California, to support performance and low-power optimization of vendor components for laptops built to Project Athena design specifications and target experiences in 2020. Located in key ecosystem hubs and operated by teams of Intel engineers with system-on-chip (SOC) and platform power optimization expertise, the three Open Labs sites will begin operating in June 2019 to enable and optimize components.

"Across the industry, we each play an important role in delivering the advanced laptops of today and the future. Project Athena Open Labs are a critical step in enabling more extensive, day-to-day collaboration with the components ecosystem to continuously raise the bar for innovation across the platform," said Josh Newman, Intel vice president and general manager of PC Innovation Segments, Client Computing Group.

Remember that piece regarding Microsoft's Windows 10 for the chinese government? Well, Microsoft has just officially announced it in its Shanghai presentation today. In a joint-venture with China's government, CETC (China Electronics Technology Group), CMIT (a conglomerate of China-based manufacturers), and Lenovo, the Redmond-based company has apparently managed to deliver what they themselves thought impossible: a version of their operating system that doesn't spy on its users. Lenovo, as you might have guessed already, will be one of the first OEM partners to preinstall Windows 10 China Government Edition on new devices.

Based on Windows 10 Enterprise Edition, the Windows 10 China Government Edition ironically ticks all the boxes for what enthusiasts would like to see from their OS: it's a modular approach to Windows, where users (read, in this case, government entities) can remove features they aren't looking to take advantage of (like OneDrive), whilst giving the capability to "manage all telemetry and updates." Aren't those just great features to have?

In the highly competitive, high-stakes scene of the business world - and particularly so in the silicon giants of the era - trade secrets, specifications, and protecting one's intellectual property that give the leg-up on competitors is key towards success. And while most companies work within the meanders of law (even if sometimes skirting it ever so lightly), some don't. And things like this happen: the steal (or purported steal, because no one has been convicted yet) of trade secrets by former employees is one of the most dreaded occurrences in the tech world - remember Zenimax and Carmack's "dovetailing"?

Chinese manufacturers are looking to enter the high-performance computing market with their own products, designs, and manufacturing capability. In this case, former TSMC engineer Hsu is being accused of stealing proprietary information and other materials related to the foundry's 28 nm process technology. The goal would be to pass them to China-based Shanghai Huali Microelectronics (HLMC), with which he accepted a job offer, according to the Hsinchu District Prosecutors Office. Digitimes reports that HLMC had been aggressively headhunting for talent to kick start its 28 nm manufacturing process, though if true, this sound like a little too aggressive of a headhunting.

AMD Radeon Technologies Group (RTG) chief Raja Koduri was in Shanghai last week to meet with one of the design teams of the "Polaris10" and the upcoming "Vega10." He tweeted that development of "Vega10" had just crossed a milestone, although it's a long way to go before you can see it. The 5th generation Graphics CoreNext architecture, and successor to the upcoming "Polaris" architecture, "Vega" promises a higher performance/Watt than "Polaris," which in turn boasts of a large energy efficiency leap over its predecessor.

One of the most notable derivatives of "Vega" is the "Vega10," poised to be a performance-segment GPU, which will make it to the market alongside "Vega11," a larger enthusiast-segment chip. The Vega10 is rumored to feature 4,096 stream processors spread across 64 compute units, and is expected to be a competitor to NVIDIA's GP104 silicon. The larger Vega11 could compete with larger chips based on the "Pascal" architecture, such as the GP102.

SanDisk Corporation, a global leader in flash storage solutions, today announced it has shipped more than two billion microSD cards since it started commercial shipment of the technology ten years ago. The company commemorates this milestone on the eve of Mobile World Congress Shanghai.

Invented by SanDisk in 2004, the microSD format was initially known as TransFlash. In 2005 SanDisk contributed the technology to the SD Card Association who renamed and released the final specifications for the microSD format on July 13, 2005. This format has become the most popular removable memory card in SanDisk's history. Collectively, SanDisk's two billion microSD cards could store an estimated 11,103 billion megabytes (MB)* worth of memory - the equivalent of more than 100MB of flash storage for every man, woman and child that ever lived on Earth.

Asia is set to get its very own edition of the International Consumer Electronics Show (CES), from 2015. CEA, the organizers of the International CES, announced that the inaugural CES Asia expo will be held between May 25 and May 27, 2015. Shanghai, China, will be the seat of this event, with the event being hosted at the Shanghai New International Expo Center (SNIEC.) The event is a partnership between CEA and Shanghai-based event organizer Intex Shanghai.

Industry experts don't see this as CEA's attempt to compete with Computex, a PC industry-centric expo held each June in Taipei. CES, in its typical early January annual edition held in Las Vegas, USA, sees one of the consumer electronics industry's biggest gatherings, with manufacturers of not just PC hardware, but also home entertainment, automobile electronics, digital photography, mobiles and tablets, among others; meet, to show off their latest. CES Asia could serve as an important platform for China's emerging global brands in the consumer electronics industry, and make it easier for brands from across Asia to converge at a more convenient location than the US.

Colorful unveiled a limited edition GeForce GTX 660 Ti iGame graphics card that's hand-painted to celebrate World Cyber Games 2012 Final, which was recently held in Shanghai, China. Its cooler shroud features streaks and patterns of multiple colors. Why? Because it's Colorful, that's why! In addition to dual-fan cooler that looks more than capable to handle the 150W GPU, Colorful included detachable auxiliary heatsinks that are part of the "Air Kit."

The card features a 4+2 phase VRM that draws power from two 6-pin PCIe power connectors, redundant BIOS loaded in two separate EEPROM chips, and 2 GB of GDDR5 memory across a 192-bit wide memory interface. Based on the 28 nm GK104 silicon, the GeForce GTX 660 Ti packs 1344 CUDA cores. Colorful manufactured very small numbers of these cards, which will be sold in the Greater China region, some of the cards could make it to Europe.

NVIDIA unveiled GeForce Experience, a new cloud-based technology that assesses PC hardware and tweaks settings of games to deliver the most optimal gaming experience. GeForce Experience goes a step beyond today's System Requirements Labs applets, and assesses hardware at a much more minute scale, sends information back to a data center that houses supercomputers, which methodically build the perfect game settings for each GPU, CPU, motherboard, and drivers configuration.

Speaking at GeForce LAN Shanghai, NVIDIA president and CEO Jen-Hsun Huang said that PC games require a greater knowledge about the capabilities of the system than required by consoles. To get the most out of PC games, gamers need to dig into its settings and tweak them to work best with the hardware available, and that could be a disadvantage compared to consoles.

NVIDIA today announced the GeForce GTX 690, the world's fastest consumer graphics card -- with a bold industrial design to match. Powered by dual Kepler architecture-based GeForce GPUs, the GTX 690 is meticulously designed -- inside and out -- to deliver the most refined, elegant and smooth PC gaming experience possible.

The surprise announcement was made by NVIDIA CEO and co-founder Jen-Hsun Huang during his keynote address at the NVIDIA Game Festival in Shanghai, which is being attended by more than 6,000 gamers from across China.

NVIDIA is poised to launch its high-end GeForce GTX 690 dual-GPU graphics card on the 28th of April, according to a VR-Zone report. NVIDIA has chosen the 2012 NVIDIA GeForce LAN / NVIDIA Gaming Festival (NGF) held in Shanghai, China, as its launchpad. NVIDIA even put up a countdown timer on GeForce.com that counts down to the event. GeForce GTX 690 combines two 28 nm GK104 graphics processors for an SLI-on-a-stick solution. It is gunning for absolute performance leadership, enabling gamers to throw any game, at any resolution at PCs equipped with it.

GIGABYTE, a leading manufacturer of motherboards and graphics cards, is excited to kick off GIGABYTE "Real Graphics, True Gaming" Tech Tour 2012. GIGABYTE will start the Tech Tour from Taiwan on April 20th with an exciting announcement of several whole new products. As for last year, GIGABYTE presented a perfect gaming environment for hardcore gamers; this year, GIGABYTE is going to upgrade it even more.

With the latest 28nm fabrication process GeForce GTX 680 GPU, GIGABYTE is going to unveil their own-designed GTX 680 Super Overclock Edition. Thanks for all the supports from gamers, GIGABYTE will also announce their new Aivia gaming keyboard and mouse, and wireless HD sync device during Tech Tour.

Silicon Image (NASDAQ: SIMG), a leading provider of wireless and wired HD connectivity solutions, today announced the opening of its newest research and development (R&D) center in Hyderabad, India. Opened on January 27, 2012, the facility located in Hyderabad's technology hub, focuses on the design and development of semiconductor and IP core technologies for implementation in mobile, wireless and consumer electronics (CE) products from manufacturers across the globe.

"The technology innovation and growth occurring in Hyderabad made the location a natural fit for Silicon Image's expanding R&D portfolio," said Rashid Osmani, vice president of worldwide engineering at Silicon Image, Inc. "The expertise of Silicon Image's worldwide engineering team has been strengthened by the addition of the talented engineers in Hyderabad, who we foresee becoming an integral part of new product development."

Issues of labour-welfare and ethical-sourcing are back to haunt Apple, as one of its key foundry partners, Pegatron, reported an explosion at its facilities of Riteng Computer Accessory Company, Shanghai. The explosion injured 57 workers in all, hospitalising 23, while leaving 34 more with minor injuries. No deaths are reported so far. This facility manufactures the aluminum bodies of iPad 2, the incident is similar in nature to a previous one earlier this year, caused by improper exhaustion of combustible bi-products.

Pegatron CFO Charles Lin confirmed to the press, the number of people injured, the extant of their injuries, and what is being done. He went on to detail the current state of the facility. "The factory has not started operations yet. Part of the facility is still under pre-operation inspection and part is running trial production." Meanwhile, Apple expressed its condolences. In a statement, it said "Our hearts go out to the people who were hurt in Songjiang. We are working closely with Pegatron to understand the cause of this accident." This incident could affect supply of iPad 2.