Intel's upcoming Ponte Vecchio graphics card is set to be the company's most powerful processor ever designed, and the chip is indeed looking like an engineering marvel. From Intel's previous teasers, we have learned that Ponte Vecchio is built using 47 "magical tiles" or 47 dies which are responsible either for computing elements, Rambo Cache, Xe links, or something else. Today, we are getting a new piece of information coming from Igor's LAB, regarding the Ponte Vecchio and some of its design choices. For starters, the GPU will be a heterogeneous design that consists out of many different nodes. Some parts of the GPU will be manufactured on Intel's 10 nm SuperFin and 7 nm technologies, while others will use TSMC's 7 nm and 5 nm nodes. The smaller and more efficient nodes will probably be used for computing elements. Everything will be held together by Intel's EMIB and Foveros 3D packaging.

Next up, we have information that this massive Intel processor will be accountable for around 600 Watts of heat output, which is a lot to cool. That is why in the leaked renders, we see that Intel envisioned these processors to be liquid-cooled, which would make the cooling much easier and much more efficient compared to air cooling of such a high heat output. Another interesting thing is that the Ponte Vecchio is designed to fit inside OAM (OCP Accelerator Module) form factor, an alternative to the regular PCIe-based accelerators in data centers. OAM is used primarily by hyper scalers like Facebook, Amazon, Google, etc., so we imagine that Intel already knows its customers before the product even hits the market.

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

Marvell today announced its new Bravera SC5 controller family, bringing unprecedented performance, best-in-class efficiency, and leading security features to address ever-expanding workloads in the cloud. The massive amount of data to be processed in cloud data centers is driving demand for faster and higher bandwidth storage in these environments. Marvell's Bravera SC5 SSD controllers address the critical requirements for scalable, containerized cloud storage infrastructure. By enabling the highest performing flash storage solutions, Marvell's controllers are poised to be the foundation for data centers that offer ultra-low latency, real-time applications while also providing cost-optimized, cloud-scale capacity.

As the industry's first SSD controllers to support PCIe 5.0 and NVMe 1.4b, Marvell's Bravera SC5 doubles the performance compared to PCIe 4.0 SSDs. This contributes to accelerated workloads and reduced latency, dramatically improving the user experience. In order to meet cloud service providers' stringent security requirements to ensure users' data is safe and protected, the controllers offer FIPS-compliant root of trust (RoT), AES 256-bit encryption and multi-key revocation. The new controllers are the first with a hardware-based Elastic SLA Enforcer to assure quality of service (QoS) and provide metering capabilities per customer to increase overall storage efficiency and utilization while lowering total cost of ownership (TCO).

MAINGEAR—an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations—today launched the MAINGEAR ELEMENT Lite, a 15" ultra-premium notebook designed in collaboration with Intel. Featuring Intel Iris Xe Graphics and up to an 11th Gen Intel Core i7 processor, the MAINGEAR ELEMENT Lite pairs next-generation hardware with a sleek and minimal machined aluminium alloy chassis for maximum power, speed, and portability. The new MAINGEAR ELEMENT Lite is the perfect Windows laptop for work and play on the go.

Custom designed and engineered in collaboration with Intel, this uncompromising notebook PC comes equipped with up to an Intel Core i7-1165G7 Processor running at 2.8 GHz with a Max Turbo Frequency of 4.7 GHz on 4 cores / 8 threads. Integrated Intel Iris Xe Graphics make multimedia viewing, content creation, and even light gaming a breeze. ELEMENT Lite systems can be equipped with 16 GB of DDR4 memory and up to 2 TB of user-replaceable PCI-E Gen4 M.2 NVMe SSD storage. MAINGEAR optimized the ELEMENT Lite to pack exceptional performance and cooling into its frame without sacrificing on battery life or upgradeability. It weighs in at just 3.64 lbs (1.65 kg) and is 14.9 mm thin—making it the thinnest notebook that MAINGEAR has ever offered.

Intel's upcoming Xeon "Sapphire Rapids" processors which debut in the second half of 2021, will feature up to 80 "Golden Cove" CPU cores, and not the previously rumored "Willow Cove." This was clarified by an Intel developer in a Linux Kernel code e-mail chain. "Golden Cove" CPU cores are more advanced than the "Willow Cove" cores found in current-generation Intel products, such as the client "Tiger Lake" processors. Intel stated that "Golden Cove" introduces an IPC gain over "Willow Cove" (expressed as "ST perf"), increased AI inference performance from an updated GNI component, "network and 5G perf," which is possibly some form of network stack acceleration, and additional security features.

Over in the client segment, the 12th Gen Core "Alder Lake" processor debuts a client variant of "Golden Cove." The "Alder Lake-S" silicon features eight "Golden Cove" cores serving as the "big" performance cores, next to eight "little" low-power "Gracemont" cores. The client- and server implementations of "Golden Cove" could differ mainly in the ISA, with the client chip receiving a slightly skimmed AVX-512 and DLBoost instruction-sets, with only client-relevant instructions. The server variant, in addition being optimized for a high core-count multi-core topology; could feature a more substantial AVX-512 and DLBoost implementation relevant for HPC use-cases.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

The discrete GPU market has been a duopoly for quite some time, and when Intel announced that the company is rebooting plans for its discrete GPU lineup, another player was about to break that duopoly. Today, that has been changed forever and Intel has officially become the third manufacturer of discrete GPUs, as we can see on the online listing. On BestBuy, CyberPowerPC has listed "Gamer Xtreme Gaming Desktop" powered exclusively by Intel components. When it comes to the CPU choice, Intel's 6C/12T Core i5-11400F CPU model is present without iGPU. Now comes the interesting part. The GPU powering the system is Intel Iris Xe discrete graphics card, which is a DG1 GPU based on Xe-LP SKU.

This model features 80 EUs, resulting in 640 shading units. While this is not any gaming beast, casual 1080p gaming should be just fine on this configuration. The system is listed for 750 US Dollars, and it is sold out, as of the time of writing this. While the performance of this configuration may not be something monumental, it is an important step towards Intel's inclusion in the discrete GPU market. By using OEMs, the GPU will reach a very large market without any major problems. We are waiting to see the first reviews of the system, which will surely take a good look at the card and examine its performance.

Intel has been extensively teasing its Xe HP scalable compute architecture for some time now, and Igor's Lab has an exclusive look at GPU compute cards based on the Xe HP silicon. We know from older reports that Intel's Xe HP compute accelerator packages come in three essential variants—1 tile, 2 tiles, and 4 tiles. A "tile" here is an independent GPU accelerator die. Each of these tiles has 512 execution units, which convert to 4,096 programmable shaders. The single-tile card is a compact, half-height card capable of 1U and 2U chassis. According to Igor's Lab, it comes with 16 GB of HBM2E memory with 716 GB/s memory bandwidth, and the single tile has 384 out of 512 EUs enabled (3,072 shaders). The card also has a typical board power of just 150 W.

The Arctic Sound 2T card is an interesting contraption. A much larger 2-slot card of length easily above 28 cm, and a workstation spacer, the 2T card uses a 2-tile variant of the Xe HP package, but each of the two tiles only has 480 out of 512 EUs enabled. This works out to 7,680 shaders. The dual-chiplet MCM uses 32 GB of HBM2E memory (16 GB per tile), and a typical board power of 300 W. A single 4+4 pin EPS connector, capable of up to 225 W, is used to power the card.

A fresh rumor straight from the rumor mill paints AMD's next APU iterations as being updated to the latest and greatest architectures the company has to offer. The rumor comes from ExecutableFix via Twitter, a leaker who has a relatively proven track record on being right regarding upcoming hardware releases. This rumor can lay some credence to others, painting AMD's Ryzen 7000 series as being the first AMD APU-only release since they began their journey with the Zen architecture - it makes sense for the company to integrate their latest architectures in the mobile-geared Rembrandt first, working out some possible interaction quirks that might arise between the two architectures when deployed in the same package.

The leaker further affirms that the Rembrandt APUs will feature up to 12 RDNA2 CUs, which would amount to 768 stream processors on-chip - a marked increase from the current-generation 8 CUs based on the Vega architecture on their Ryzen 4000 mobile series. The leaker also discloses that AMD's Warhol seems to be MIA in recent AMD documentation and planning when it comes to the deployment of Zen3+, and that Rembrandt should be the one to carry that particular architecture refinement through to the 6 nm process. It would seem that AMD's Vega would "finally" see its demise, bringing about some much-needed performance improvements to counter Intel's investments in GPU performance with Xe.

A senior game developer relations engineer at Intel, Pete Brubaker, Tweeted late Wednesday that the company's DG2 discrete graphics card is "right around the corner," and that "it's about to get exciting." Brubaker's Tweet comes as the company is looking to recruit more engineers to work with its developer relations, the team that interfaces with game devs to optimize their engines and games for Intel's graphics architectures.

While the DG1, which was productized as the Iris Xe MAX graphics card, was essentially an iGPU-on-a-stick, the DG2 should spark a lot more interest. Based on a third-party foundry process, the DG2 is the first client graphics product based on the Xe HPG (high performance gaming) graphics architecture, and allegedly crams up to 512 execution units or 4,096 unified shaders—a 4.3x gain over the Iris Xe MAX. It's also rumored to ship with up to 16 GB of GDDR6 memory across a 256-bit wide memory bus. Whether it features DirectX 12 Ultimate features or not, remains to be seen, but it's becoming clear that Intel wants a crack at the high-volume e-sports market, with a product that's fast enough for competitive e-sports gaming, and capable of AAA.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

We have recently received pictures of any early engineering sample of Intel's upcoming DG2 GPU from YouTuber Moore's Law is Dead. The card features 512 Execution Units and will be the flagship model for Intel's upcoming Xe-HPG lineup reportedly targeting performance between the RTX 3070 and RTX 3080. The final product is rumored to feature a base clock of 2.2 GHz along with 16 GB GDDR6 memory and a 256-bit bus. The sample has a TDP of 275 W with 8 + 6 pin power connectors up from original targets of 225 W - 250 W.

The report also notes that Intel is still deciding between three cooler designs with the finished card potentially featuring a white shroud. Intel also appears to be working on a NVIDIA DLSS/AMD FidelityFX Super Resolution competitor codenamed XeSS which confirms support for hardware-accelerated raytracing and resolution upscaling tech. The card is unlikely to launch until Q4 2021 with wider availability in 2022, lower end 128 EU, and 256 EU cards will follow shortly afterward. The full report can be viewed below.

Intel today launched its most advanced, highest performance data center platform optimized to power the industry's broadest range of workloads—from the cloud to the network to the intelligent edge. New 3rd Gen Intel Xeon Scalable processors (code-named "Ice Lake") are the foundation of Intel's data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.

New 3rd Gen Intel Xeon Scalable processors deliver a significant performance increase compared with the prior generation, with an average 46% improvement on popular data center workloads. The processors also add new and enhanced platform capabilities including Intel SGX for built-in security, and Intel Crypto Acceleration and Intel DL Boost for AI acceleration. These new capabilities, combined with Intel's broad portfolio of Intel Select Solutions and Intel Market Ready Solutions, enable customers to accelerate deployments across cloud, AI, enterprise, HPC, networking, security and edge applications.

MSI first Summit laptops have been well-acclaimed by business users. Now the new members are introduced! Surrounded by the captivating golden ratio spiral special effect, MSI grandly unveiled the "MSIology: Determined to Succeed 2021" virtual event. Exemplifying the perfection of the golden ratio, MSI launched the Summit series, including the honorees of "CES Innovation Awards" MSI Summit E16 Flip and MSI Pen, "Best of the CES 2021" winner Summit E13 Flip Evo, and the MSI USB-C Docking Station Gen 2. During the virtual event, MSI showcased the versatile work styles and displayed how the MSI Summit series can unleash users' potential to boost business and productivity.

"As the famous author Arthur C. Clarke once said, any sufficiently advanced technology is equivalent to magic. Today, we are here to witness the magic of the new MSI Summit.", Iris Chuang, Product Management Director of MSI Notebook, proudly announced in the opening of the new product launch. A symbol of aesthetics, a giant golden ratio spiral outlined the spirit of MSIology, which is to design impeccable laptops for perfectionists who are determined to succeed.

XPG, a fast growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts,is pleased to announce a new Intel collaboration for a 15.6"performance EVO certified ultrabook with thin and light form factor, the XPG XENIA Xe.

With a sleek and modem design, XPG XENIA Xe is built with a premium CNC anodized aluminium chassis with an overall thickness of only 14.9 mm (0.58 in) and weight of 1.65 kg (3.6 lbs). The ultrabook sports an Intel 11th Gen Core i5-1135G7 or i7-1165G7 processor, Intel Iris Xe graphics, a low power, high brightness 1080P Full HD IPS 15.6" display with capacitive touch, as well as XPG's very own PCIe Gen 4 high speed M.2 solid state drive (SSD).

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.3 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency. Designed to Game: With its new 11th Gen desktop processors, Intel continues to push desktop gaming performance to the limits and deliver the most amazing immersive experiences for players everywhere.Read the TechPowerUp Reviews of the Core i9-11900K and Core i5-11600K.

Intel Graphics tweeted a marketing splash screen of its upcoming Xe HPG gaming discrete graphics architecture. There's not much to the video, except announcing the Xe HPG logo. It starts off with a depiction of the Xe LP architecture, on which the company's Gen12 iGPUs and Iris Xe MAX entry-level discrete GPUs are based; and swells into a larger silicon that grows in all directions. The animation could be a hint that Xe HPG chips will be an order of magnitude faster than the Iris Xe MAX, target serious gaming, and take the fight to both NVIDIA and AMD.

Intel is designing the Xe HPG graphics architecture for third-party silicon fabrication nodes, such as TSMC and Samsung, and could leverage a sub-10 nm node to significantly scale up from the Xe LP. A recent report pointed to the likelihood of 512 execution units on a certain Xe HPG variant (4,096 unified shaders) and contemporary GDDR6 memory, while Intel has the necessary IP to pull off DirectX 12 Ultimate logo readiness, including raytracing. Intel is likely eyeing a slice of the e-sports hardware segment, although a high-end GPU cannot be completely ruled out. Watch the video from the source link below.

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.30 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance​. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency.

Intel is expected to unveil its 11th generation Core "Tiger Lake-H" performance-segment mobile processor, and the highly anticipated 11th Gen Core "Rocket Lake-S" desktop processor family on March 18, 2021. The two will be launched on the sidelines of the 2021 GDC (Game Developers Conference), an online event. The agenda page of GDC mentions both "Tiger Lake-H" and "Rocket Lake." The "Tiger Lake-H" family of processors begin with quad-core SKUs based on the 4-core "Tiger Lake" silicon, extending to 6-core and 8-core ones based on a newer 8-core silicon. Both dies are built on the 10 nm SuperFin node, and combine Intel's highest-IPC "Willow Cove" CPU cores with a Gen 12 Xe iGPU.

The 11th Gen Core "Rocket Lake-S" has been unveiled back at the 2021 International CES (online event) in January, and is heading toward a mid/late-March launch. The chips pack up to eight "Cypress Cove" CPU cores, which are a back-port of Intel's 10 nm CPU core architectures to the 14 nm node, bringing the first IPC increase on the client desktop platform from Intel since 2015. At GDC, we expect Intel to detail individual SKUs within the 11th Gen Core processor family, giving us a broader idea of what chips will launch this month. The GDC backdrop also foreshadows the marketing strategy for Intel with both these platforms—gaming. The company will take advantage of the IPC uplift to present its processors as being better for gaming, and sufficiently fast in most client-relevant tasks. The GDC backdrop could also let Intel show off the ISV relations it's built with game developers, detailing how certain popular game engines are optimized for Intel.

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, announced today that it is taking rugged computing performance to new heights with its all-new S14I 14-inch semi-rugged laptop. The S14I laptop pushes the boundaries of semi-rugged design and innovation to deliver ultimate mobile computing experiences. The new generation S14I will be available in April and includes the following upgrades: the new Intel Tiger Lake 11th generation processors, the latest NVMe PCIe SSD solution and the Intel Iris Xe MAX graphics or the option of NVIDIA GeForce GTX 1050 discrete graphics.

"Our refreshed S14I laptop takes semi-rugged devices to a whole new level," stated Tom Wang, Durabook Americas president. "This advanced version further enhances the unit's perfect combination of military-grade durability, certified with IP53 and 4-foot drop, field-worker functionality, computer performance, and long battery life of 12 hours. It is the perfect mobile device for today's demanding and diverse working environments with its DynaVue sunlight-readable technology. There is no wonder why the Durabook S14I is the most rugged laptop in its class."

Google and the broader Chrome ecosystem continue to deliver innovative, cloud-first PC experiences with Chromebooks powered by Intel—from use in classrooms to go-anywhere connectivity for work and gaming.

"This past year has reminded us that the PC is an integral part of our lives," said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms. "Intel and Google share a vision for delivering the computing experiences that matter most to people. Together, we have enabled the incredible growth and evolution of the Chrome ecosystem over the last decade to reach amazing levels of capability and performance. We're excited to build on this collaboration as we continue to drive innovation forward." Since the first device was introduced in 2011, an entire ecosystem has evolved and more than 100 million Chromebooks have made their way into the world for students and educators, general consumers and businesses. Over those 10 years, Intel has worked closely with Google and original equipment manufacturers (OEM) to enable more than 100 Intel-based Chromebook designs and drive new areas of innovation.

Cincoze, a professional manufacturer of embedded systems, has announced its new flagship GPU edge computing system, the GP-3000. Its crowning feature is an exclusive GPU Expansion Box that provides expansion for up to two high-end GPU graphics cards and creating a high-performance industrial-grade GPU computer. Brandon Chien, General Manager of Cincoze, stated that "We already know AI will drive innovation and expansion for industrial applications. The GP-3000 is Cincoze's answer for intensive image processing and complex calculations, such as deep machine learning, autonomous driving, automated visual inspection, and mobile monitoring. As our latest flagship model, the GP-3000 multiplies edge computing efficiency, amplifies productivity and reliability, and accelerates AIoT automation."

The GP-3000's extreme computing power starts with an 8th or 9th generation Intel Xeon or Core i3/i5/i7 (Coffee Lake and Coffee Lake-R) CPU, Intel C246 chipset, and supports two sets of DDR4-2666 ECC/non-ECC SO-DIMM up to 64 GB and can support up to two 250 W high-end GPU graphics cards. With a total system power consumption of 720 W, it's easy to meet and exceed high-efficiency application requirements. A precision heat dissipation and cooling design quickly wick away heat, keeping the focus squarely on the breathtaking performance of the GP-3000.

LG Electronics USA announced pricing and availability of the full line of 2021 LG gram laptops at LG-authorized dealers nationwide. Led by the CES 2021 Innovation Award-winning 17-inch LG gram 17, the 2021 line features stylish new designs and productivity-boosting 16:10 aspect ratio screens ideal for both productivity and entertainment.

The diverse lineup includes five exciting new models: LG gram 17 (model 17Z90P), LG gram 16 (model 16Z90P), LG gram 14 (model 14Z90P), LG gram 2-in-1 16 (model 16T90P) and LG gram 2-in-1 14 (model 14T90P) all with 16:10 aspect ratio screens designed around maximizing work efficiency. Offering more screen real estate than the 16:9 displays found on most laptops, the latest LG grams are able to show more information at any one time. The keyboard and touchpad have also been enlarged for extended comfort and efficiency without compromising the portability of these compact devices. The 2021 LG gram lineup also features an expanded range of color options including white, black, silver and green outer shells.

Here are some of the first pictures of the Intel Xe DG1 SDV, taken apart to reveal its rather desolate PCB. The Xe DG1 SDV isn't commercially available, but rather distributed by Intel to ISVs, so they can begin optimizing or developing for the Gen12 Xe graphics architecture. The board features a GPU ASIC that's nearly identical to the Iris Xe MAX mobile discrete GPUs, and four LPDDR4 memory chips making up 8 GB of video memory.

The Xe DG1 GPU is based on the Xe LP graphics architecture, and the silicon is built on the 10 nm SuperFin silicon fabrication node. The chip features 96 execution units (768 unified shaders); and apparently makes do with the 75 W power supplied by the PCI-Express slot. A frugal 2-phase VRM powers the GPU. The GPU uses conventional 4-pin PWM to control the fan, which ventilates a simple aluminium mono-block heatsink. Three DisplayPorts and one HDMI 2.1 make up the output configuration. While you won't be able to buy a Xe DG1 SDV in the market (unless an ISV decides to break their NDA and put one up on eBay), Intel has allowed a small number of board partners to develop custom-design cards. ASUS is ready with one. Igor's Lab has more pictures, a list of benchmark fails, and other interesting commentary in the source link below.