Intel is preparing to unveil its cutting-edge Xeon 6 series server CPUs, known as Granite Rapids and Sierra Forest. These forthcoming processors are set to deliver a significant boost in performance, foreshadowing a new era of computing power, albeit with a trade-off in increased power consumption. Two days ago, Yuuki_Ans posted information about the Beechnut City validation platform. Today, he updated the X thread with more information that Intel is significantly boosting core counts across its new Xeon 6 lineup. The flagship Xeon 6 6980P is a behemoth, packing 128 cores with a blistering 500 Watt Thermal Design Power (TDP) rating. In fact, Intel is equipping five of its Xeon 6 CPUs with a sky-high 500 W TDP, including the top four Granite Rapids parts and even the flagship Sierra Forest SKU, which is composed entirely of efficiency cores. This marks a substantial increase from Intel's previous Xeon Scalable processors, which maxed out at 350-385 Watts.

The trade-off for this performance boost is a dramatic rise in power consumption. By nearly doubling the TDP ceiling, Intel can double the core count from 64 to 128 cores on its Granite Rapids CPUs, vastly improving its multi-core capabilities. However, this focus on raw performance over power efficiency means server manufacturers must redesign their cooling solutions to accommodate Intel's flagship 500 W parts adequately. Failure to do so could lead to potential thermal throttling issues. Intel's next-gen Xeon CPU architectures are shaping up to be one of the most considerable generational leaps in recent memory. Still, they come with a trade-off in power consumption that vendors and data centers will need to address. Densely packing thousands of these 500-Watt SKUs will lead to new power and thermal challenges, and we wait to see future data center projects utilizing them.

Intel's next-generation Xeon 6 processors, codenamed Granite Rapids and Sierra Forest, are poised to shake up the CPU market with its cutting-edge architecture and features. Hardware leaker YuuKi_AnS has provided the first glimpse of Intel's upcoming platform, revealing images of the vibrant red-colored validation platform dubbed Beechnut City. Beechnut City serves as a crucial testing ground for the forthcoming Xeon 6 series, which will comprise both the Granite Rapids (P-Core architecture) and Sierra Forest (E-Core architecture) processors. Although not intended for commercial release, this validation platform is designed to rigorously test and validate the new CPUs. The dual-socket LGA-4710 platform boasts the capability to support up to two Sierra Forest or Granite Rapids CPUs simultaneously, promising a significant performance boost for data centers and other high-performance computing applications.

According to YuuKi_AnS's leaks, the Xeon 6 series may feature SKU names such as Xeon 6 6900E/P (Platinum), Xeon 6 6700E/P (Gold), Xeon 6 6500P (Silver), and Xeon 6 6300P (Bronze). One of the platform's standout features is its support for 32 DIMMs in 16-channel memory system, similar to the previously discussed Avenue City platform, which can accommodate up to 24 DDR5-6400 DIMMs in 12-channel memory. The Sierra Forest variant with 144 cores is expected to launch in the first half of this year, while the 288-core variant is slated for release in the second half. Notably, the Xeon 6 series will mark a significant shift in Intel's CPU lineup, as it will be the first CPU series to feature only Efficient cores, akin to AMD's Zen Dense cores (such as Bergamo). This move aligns with Intel's strategy to cater to the growing demand for high-performance computing and data center applications, where energy efficiency and performance are essential.There is also a picture of server configuration of Avenue City was pictured a while ago, thanks to the previous leak of Yuuki_Ans, which can be seen below in addition to Beechnut City platform.

During the Vision 2024 event, Intel announced that its upcoming Xeon processors will be branded under the new "Xeon 6" moniker. This rebranding effort aims to simplify the company's product stack and align with the recent changes made to its consumer CPU naming scheme. In contrast to the previous "x Generation Xeon Scalable", the new branding aims to simplify the product family. The highly anticipated Sierra Forest and Granite Ridge chips will be the first processors to bear the Xeon 6 branding, and they are set to launch in the coming months. Intel has confirmed that Sierra Forest, designed entirely with efficiency cores (E-cores), remains on track for release this quarter. Supermicro has already announced early availability and remote testing programs for these chips. Intel's Sierra Forest is set to deliver a substantial leap in performance. According to the company, it will offer a 2.4X improvement in performance per watt and a staggering 2.7X better performance per rack compared to the previous generation. This means that 72 Sierra Forest server racks will provide the same performance as 200 racks equipped with older second-gen Xeon CPUs, leading to significant power savings and a boost in overall efficiency for data centers upgrading their system.

Intel has also teased an exciting feature in its forthcoming Granite Ridge processors-support for the MXFP4 data format. This new precision format, backed by the Open Compute Project (OCP) and major industry players like NVIDIA, AMD, and Arm, promises to revolutionize performance. It could reduce next-token latency by up to 6.5X compared to fourth-gen Xeons using FP16. Additionally, Intel stated that Granite Ridge will be capable of running 70 billion parameter Llama-2 models, a capability that could open up new possibilities in data processing. Intel claims that 70 billion 4-bit models run entirely on Xeon in just 86 milliseconds. While Sierra Forest is slated for this quarter, Intel has not provided a specific launch timeline for Granite Ridge, stating only that it will arrive "soon after" its E-core counterpart. The Xeon 6 branding aims to simplify the product stack and clarify customer performance tiers as the company gears up for these major releases.

At the Intel Vision 2024 customer and partner conference, Intel introduced the Intel Gaudi 3 accelerator to bring performance, openness and choice to enterprise generative AI (GenAI), and unveiled a suite of new open scalable systems, next-gen products and strategic collaborations to accelerate GenAI adoption. With only 10% of enterprises successfully moving GenAI projects into production last year, Intel's latest offerings address the challenges businesses face in scaling AI initiatives.

"Innovation is advancing at an unprecedented pace, all enabled by silicon - and every company is quickly becoming an AI company," said Intel CEO Pat Gelsinger. "Intel is bringing AI everywhere across the enterprise, from the PC to the data center to the edge. Our latest Gaudi, Xeon and Core Ultra platforms are delivering a cohesive set of flexible solutions tailored to meet the changing needs of our customers and partners and capitalize on the immense opportunities ahead."

A CPU-Z screenshot has been shared by YuuKi_AnS—the image contains details about an alleged next-gen Intel Xeon Scalable processor engineering sample (ES). The hardware tipster noted in (yesterday's post) that an error had occurred in the application's identification of this chunk of prototype silicon. CPU-Z v2.09 has recognized the basics—an Intel Granite Rapids-SP processor that is specced with 80 cores, 2.5 GHz max frequency, a whopping 672 MB of L3 cache, and a max. TDP rating of 350 W. The counting of 320 threads seems to be CPU-Z's big mistake here—previous Granite Rapids-related leaks have not revealed Team Blue's Hyper-Threading technology producing such impressive numbers.

The alleged prototype status of this Xeon chip is very apparent in CPU-Z's tracking of single and multi-core performance—the benchmark results are really off the mark, when compared to finalized current-gen scores (produced by rival silicon). Team Blue's next-gen Xeon series is likely positioned to catch up with AMD EPYC's deployment of large core counts—"Granite Rapids" has been linked to the Intel 3 foundry node, reports from last month suggest that XCC-type processors could be configured with "counts going up to 56-core/112-threads." Micron is prepping next-gen "Tall Form Factor" memory modules, designed with future enterprise processor platforms in mind—including Intel's Xeon Scalable "Granite Rapids" family. Industry watchdogs posit that Team Blue will be launching this series in the coming months.

GIGABYTE Technology and Giga Computing, a subsidiary of GIGABYTE and an industry leader in enterprise solutions, will showcase their solutions at the GIGABYTE booth #1224 at NVIDIA GTC, a global AI developer conference running through March 21. This event will offer GIGABYTE the chance to connect with its valued partners and customers, and together explore what the future in computing holds.

The GIGABYTE booth will focus on GIGABYTE's enterprise products that demonstrate AI training and inference delivered by versatile computing platforms based on NVIDIA solutions, as well as direct liquid cooling (DLC) for improved compute density and energy efficiency. Also not to be missed at the NVIDIA booth is the MGX Pavilion, which features a rack of GIGABYTE servers for the NVIDIA GH200 Grace Hopper Superchip architecture.

MAINGEAR, a leading provider of high-performance custom PC systems, and Phison, a global leader in NAND controllers and storage solutions, today unveiled groundbreaking MAINGEAR PRO AI workstations with Phison's aiDAPTIV+ technology. Specifically engineered to democratize Large Language Model (LLM) development and training for small and medium-sized businesses (SMBs), these ultra-powerful workstations incorporate aiDAPTIV+ technology to deliver supercomputer LLM training capabilities at a fraction of the cost of traditional AI training servers.

As the demand for large-scale generative AI models continues to surge and their complexity increases, the potential for LLMs also expands. However, this rapid advancement in LLM AI technology has led to a notable boost in hardware requirements, making model training cost-prohibitive and inaccessible for many small to medium businesses.

MiTAC Computing Technology, a subsidiary of MiTAC Holdings Corp., proudly reveals its groundbreaking suite of server solutions that deliver unsurpassed capabilities with the 5th Gen Intel Xeon Scalable Processors. MiTAC introduces its cutting-edge signature platforms that seamlessly integrate the Intel Data Center GPUs, both Intel Max Series and Intel Flex Series, an unparalleled leap in computing performance is unleashed targeting HPC and AI applications.

MiTAC Announce its Full Array of Platforms Supporting the latest 5th Gen Intel Xeon Scalable Processors
Last year, Intel transitioned the right to manufacture and sell products based on Intel Data Center Solution Group designs to MiTAC. MiTAC confidently announces a transformative upgrade to its product offerings, unveiling advanced platforms that epitomize the future of computing. Featured with up to 64 cores, expanded shared cache, increased UPI and DDR5 support, the latest 5th Gen Intel Xeon Scalable Processors deliver remarkable performance per watt gains across various workloads. MiTAC's Intel Server M50FCP Family and Intel Server D50DNP Family fully support the latest 5th Gen Intel Xeon Scalable Processors, made possible through a quick BIOS update and easy technical resource revisions which provide unsurpassed performance to diverse computing environments.

Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

To answer network operators' demands for energy-efficient scaling, Intel Corporation disclosed two major updates to drive footprint, power and total cost of ownership (TCO) savings across 5G core networks: the preview of its Intel Xeon next-gen processors, code-named Sierra Forest, with up to 288 Efficient-cores (E-cores), and the commercial availability of the Intel Infrastructure Power Manager (IPM) software for 5G core.

"Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out. With the majority of 5G core networks deployed on Intel Xeon processors today, Intel is uniquely positioned to address these efficiency challenges. By introducing new Efficient-cores to our roadmap and with the commercial adoption of our Intel Infrastructure Power Manager software, service providers can slash TCO while achieving unmatched performance and power savings across their networks," said Alex Quach, Intel vice president and general manager of Wireline and Core Network Division. Energy consumption and reduction of the infrastructure footprint remain top challenges that network operators face in building out their wireless 5G core network.

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel Core Ultra processors and the AI PC, and more. In an era where technological advancements are integral to staying competitive, Intel is delivering products and solutions for its customers, partners and expansive ecosystem to capitalize on the emerging opportunities of artificial intelligence and built-in automation, to improve total cost of ownership (TCO) and operational efficiency, and to deliver new innovations and services.

Across today's announcements, Intel is focused on empowering the industry to further modernize and monetize 5G, edge and enterprise infrastructures and investments, and to take advantage of bringing AI Everywhere. For more than a decade, and alongside Intel's customers and partners, the company has been transforming today's network infrastructure from fixed-function to a software-defined platform and driving success at the edge with more than 90,000 real-world deployments.

The JEDEC Board of Directors presented its prestigious 2024 Distinguished Executive Leadership Award to Intel CEO, Pat Gelsinger, in a ceremony held at Intel's offices in Santa Clara, CA earlier this month. This award stands as JEDEC's highest honor and recognizes the most distinguished senior executives in the electronics industry who promote and support the advancement of JEDEC standards.

"Throughout Pat Gelsinger's distinguished career, he has consistently championed the development of open standards, as evidenced by Intel's contributions in this domain. Under his leadership, Intel has made a tremendous impact on many groundbreaking memory and IO technologies in JEDEC," said Mian Quddus, JEDEC Board of Directors Chairman. He added, "JEDEC is grateful for his invaluable support and that of the Intel team."

Feast your eyes on the first pictures of an Intel "Granite Rapids" Xeon processor wafer, courtesy of Andreas Schilling with HardwareLuxx.de. This is Intel's first commercial silicon built on the new Intel 3 foundry node, which is expected to be the company's final silicon fabrication node to implement FinFET technology; before the company switches to Nanosheets with the next-generation Intel 20A. Intel 3 offers transistor densities and performance competitive to TSMC N3 series, and Samsung 3GA series nodes.

The wafer contains square 30-core tiles, two of which make up a "Granite Rapids-XCC" processor, with CPU core counts going up to 56-core/112-threads (two cores left unused per tile for harvesting). Each of the 30 cores on the tile is a "Redwood Cove" P-core. In comparison, the current "Emerald Rapids" Xeon processor uses "Raptor Cove" cores, and is built on the Intel 7 foundry node. Intel is planning to overcome the CPU core-count deficit to AMD EPYC, including the upcoming EPYC "Turin" Zen 5 processors with their rumored 128-core/256-thread counts, by implementing several on-silicon fixed-function accelerators that speed up popular kinds of server workloads. The "Redwood Cove" core is expected to be Intel's first IA core to implement AVX10 and APX.

Pat Gelsinger—CEO of Intel Corporation—happily revealed late last month, during an earnings call: "Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." The former is positioned as the natural successor to Team Blue's many-times-delayed Xeon "Sierra Forest" (all E-Core) processor family. Intel's second generation E-core Xeon "Clearwater Forest" design is expected to launch in 2025, with a deployment of "Darkmont" efficiency-oriented cores. Official product roadmaps and patch notes have revealed basic "Clearwater Forest" information, but we have not seen many leaks. Bionic_Squash has a history of releasing strictly internal Intel presentation slides—Meteor Lake (MTL-S) desktop SKUs were uncovered last April.

Their latest discovery does not include any photo or documented evidence—Bionic_Squash's concise social media post stated: "Clearwater Forest uses 3D stacking with hybrid bonding." This claim points to the possible deployment of Foveros Direct advanced packaging—this technology was expected to be ready at some point within the second half of 2023, although a mid-December technology showcase implied that things were behind schedule. The fanciest "Clearwater Forest" Xeon processors could arrive with a maximum total of 288 E-core count (and 288 threads)—according to Wccftech analysis: "The CPU package is going to consist of a base tile on top of the interposer which is connected through a high-speed I/O, EMIB, and the cores will be sitting on the topmost layer...Foveros Direct technology will allow direct copper-to-copper bonding, enabling low resistance interconnects and around 10-micron bump pitches. Intel itself states that Foveros Direct will blur the boundary between where the wafer ends and the package begins."

A collaboration including Intel, Dell Technologies, Nvidia and the Ohio Supercomputer Center (OSC), today introduces Cardinal, a cutting-edge high-performance computing (HPC) cluster. Purpose-built to meet the increasing demand for HPC resources in Ohio across research, education and industry innovation, particularly in artificial intelligence (AI).

AI and machine learning are integral tools in scientific, engineering and biomedical fields for solving complex research inquiries. As these technologies continue to demonstrate efficacy, academic domains such as agricultural sciences, architecture and social studies are embracing their potential. Cardinal is equipped with the hardware capable of meeting the demands of expanding AI workloads. In both capabilities and capacity, the new cluster will be a substantial upgrade from the system it will replace, the Owens Cluster launched in 2016.

GIGABYTE, a global leader in high-performance computing solutions, collaborates with industry partner Xenon at SupercomputingAsia 2024, held at the Sydney International Convention and Exhibition Centre from February 19 to 22. This collaboration showcases cutting-edge technologies, offering diverse solutions that redefine the high-performance computing landscape.

GIGABYTE's Highlights at SCA 2024
At booth 19, GIGABYTE presents the G593-SD0, our flagship AI server, and the industry's first Nvidia-certified HGX H100 8-GPU Server. Equipped with 4th/5th Gen Intel Xeon Scalable Processors, it incorporates GIGABYTE's thermal design, ensuring optimal performance within its density-optimized 5U server chassis, pushing the boundaries of AI computing. Additionally, GIGABYTE introduces the 2U 4-node H263-S62 server, designed for 4th Gen Intel Xeon Scalable Processors and now upgraded to the latest 5th Gen, tailored for hybrid and private cloud applications. It features a DLC (Direct Liquid Cooling) solution to efficiently manage heat generated by high-performance computing. Also on display is the newly released W773-W80 workstation, supporting the latest NVIDIA RTX 6000 Ada and catering to CAD, DME, research, data and image analysis, and SMB private cloud applications. At SCA 2024, explore our offerings, including rackmount servers and motherboards, reflecting GIGABYTE's commitment to innovative and reliable solutions. This offers a valuable opportunity to discuss your IT infrastructure requirements with our sales and consulting teams, supported by GIGABYTE and Xenon in Australia.

According to a Bloomberg report, Intel is seeking to raise at least $2 billion in equity funding from investors for expanding its fabrication facility in Leixlip, Ireland, known as Fab 34. The chipmaker has hired an advisor to find potential investors interested in providing capital for the project. Fab 34 is currently Intel's only chip plant in Europe that uses cutting-edge extreme ultraviolet (EUV) lithography. It produces processors on the Intel 4 process node, including compute tiles for Meteor Lake client CPUs and expected future Xeon data center chips. While $2 billion alone cannot finance the construction of an entirely new fab today, it can support meaningful expansion or upgrades of existing capacity. Intel likely aims to grow Fab 34's output and/or transition it to more advanced 3 nm-class technologies like Intel 3, Intel 20A, or Intel 18A.

Expanding production aligns with Intel's needs for its own products and its Intel Foundry Services business, providing contract manufacturing. Intel previously secured a $15 billion investment from Brookfield Infrastructure for its Arizona fabs in exchange for a 49% stake, demonstrating the company's willingness to partner to raise capital for manufacturing projects. The Brookfield deal also set a precedent of using outside financing to supplement Intel's own spending budget. It provided $15 billion in effectively free cash flow Intel can redirect to other priorities like new fabs without increasing debt. Intel's latest fundraising efforts for the Ireland site follow a similar equity investment model that leverages outside capital to support its manufacturing expansion plans. Acquiring High-NA EUV machinery for manufacturing is costly, as these machines can reach up to $380 million alone.

GIGABYTE Technology, an IT pioneer whose focus is to advance global industries through cloud and AI computing systems, is coming to MWC 2024 with its next-generation servers empowering telcos, cloud service providers, enterprises, and SMBs to swiftly harness the value of 5G and AI. Featured is a cutting-edge AI server boasting AMD Instinct MI300X 8-GPU, and a comprehensive AI/HPC server series supporting the latest chip technology from AMD, Intel, and NVIDIA. The showcase will also feature integrated green computing solutions excelling in heat dissipation and energy reduction.

Continuing the booth theme "Future of COMPUTING", GIGABYTE's presentation will cover servers for AI/HPC, RAN and Core networks, modular edge platforms, all-in-one green computing solutions, and AI-powered self-driving technology. The exhibits will demonstrate how industries extend AI applications from cloud to edge and terminal devices through 5G connectivity, expanding future opportunities with faster time to market and sustainable operations. The showcase spans from February 26th to 29th at Booth #5F60, Hall 5, Fira Gran Via, Barcelona.

Intel has begun rolling out software binaries compiled with support for upcoming Advanced Performance Extensions (APX) and Advanced Vector Extensions 10 (AVX10) instruction set extensions in their Clear Linux distribution, ahead of any processors officially supporting these capabilities launching. Clear Linux is focusing first on optimized APX and AVX10 versions of foundational software libraries like glibc and Python. This builds on Clear Linux's existing support for optimized x86-64-v2, v3, and v4 code paths, leveraging the latest microarchitectural features of each Intel CPU generation. The rationale is to prepare Clear Linux to fully leverage the performance potential of next-generation Intel Xeon server processors, code-named Granite Rapids, expected to launch later this year.

Granite Rapids will introduce AVX10.1/512 instructions as well as the new APX capabilities, which are currently not well documented implementation wise. By rolling out APX/AVX10 support in software now, Clear Linux aims to have an optimized ecosystem ready when the new processors officially ship. Initially, APX and AVX10 support is being added using the existing GCC compiler. Still, Clear Linux notes they will transition to using the upcoming GCC 14 release with more mature support for these instruction sets. The goal is to eventually have many Clear Linux packages compiled with APX/AVX10 code paths to maximize performance on future Intel CPUs. This continues Clear Linux's strategy of leveraging Intel's latest hardware capabilities in software.

According to Financial Times, a regional court in Düsseldorf, Germany, created a significant setback for Intel on Wednesday, issuing an injunction prohibiting sales of some of its processors due to allegations they infringe on a patent held by R2 Semiconductor. R2, a technology firm based in Palo Alto, California, accused Intel of violating its patent related to processor voltage regulation. The ruling applies to Intel's 10th, 11th, and 12th generation Core processors, known as Ice Lake, Tiger Lake, and Alder Lake, as well as its Ice Lake Xeon server SKUs. Newer processors generations (13th, 14th, etc.) don't infringe the patent. Even though Intel noted that it plans to appeal the decision, the ramifications could extend beyond the company itself. Industry experts warn the court order could lead to a sweeping ban on products containing the disputed Intel chips, including laptops and pre-built PCs from major manufacturers like HP and Dell. R2 has waged an ongoing legal fight across multiple jurisdictions to defend its intellectual property.

After initially filing suit against Intel in the United States, R2 shifted its efforts to Germany and other European countries after its patent was invalidated stateside. Intel strongly denied R2's patent infringement claims, alleging the company's entire business model relies on extracting legal settlements through serial litigation. Intel believes the injunction serves only R2's financial interests while harming consumers, businesses, and the economy. The two firms traded barbs in official statements about the case. R2's CEO, David Fisher, rebuffed Intel's characterization of his company, saying it has only targeted Intel for infringement of its clear IP rights. As the war of words continues, the practical impact of the German court's decision remains uncertain, pending Intel's appeal. However, the preliminary injunction demonstrates the massive financial consequences at stake in battles over technological patents.

It turns out that the 60-core Xeon W9-3595X leak from last week is part of a 14-SKU mid-lifecycle refresh of the Xeon W LGA4677 series targeting the workstation and HEDT markets. The underlying microarchitecture and silicon at the heart of these is "Sapphire Rapids Refresh," it's essentially the same as "Sapphire Rapids," but with CPU core-count increases across the SKUs. If you recall, the "Sapphire Rapids" MCM has a maximum core-count of 60-core/120-thread which is maxed out in Xeon Scalable server processors, but only hit up to 56-core/112-thread with the original W3400 and W2400 series HEDT/workstation chips. This unused 4-core headroom, combined with increases in clock speeds, is how Intel plans to create these 14 SKUs across the new W3500 and W2500 product lines.

As with the original W3400 and W2400 series; what set the W3500 series chips apart from the W2500 series, is the I/O. The W3500 series gets 8-channel DDR5 memory and 128 PCIe Gen 5 lanes, while the W2500 series chips get 4-channel DDR5 memory and 64 PCIe Gen 5 lanes. As we mentioned, this refresh is all about increasing the CPU core counts at existing price points. The top W9-3595X is a 60-core/120-thread chip, compared to the 56-core/112-thread W9-3495X it's replacing. The new W9-3575X gets a massive 8-core uplift, and is now a 44-core/88-thread processor, compared to the 36-core/72-thread W9-3475X. The W7-3565X is 32-core/64-thread, compared to the 28-core/56-thread W7-3465X.

Intel's upcoming high-end desktop (HEDT) processor lineup for enthusiasts and prosumers is around the corner, and today, we managed to see the flagship SKU - the Xeon W9-3595X. Spotted recently on Geekbench benchmarks, this new chip packs a whopping 60 cores and 120 threads, making it Intel's highest core count HEDT offering yet. The Xeon W9-3595X is based on Intel's advanced Sapphire Rapids architecture, built using the Intel 7 process node. It succeeds the previous flagship 56-core W9-3495X, with four additional cores crammed into the new 350 Watt TDP envelope. Clock speeds have taken a slight hit to accommodate the extra cores, with the maximum turbo frequency lowered from 4.8 GHz on the 3495X to 4.6 GHz on the new 3595X.

However, with more cores, the 3595X should still offer a significant multi-threaded performance uplift for heavily parallel workloads. The Xeon W9-3595X will drop into existing LGA-4677 motherboards, like the ASUS PRO WS 790-ACE, after a BIOS update. It features 112 MB of L3 cache, 120 MB of L2 cache (2 MB per core), and continues Intel's push towards higher core counts for enthusiasts, content creators, and workstation users who need maximum multi-threaded horsepower. Pricing and availability details remain unannounced as of now. But with an appearance on public databases, an official launch of the 60-core HEDT juggernaut seems imminent. These new Sapphire Rapids SKUs will likely have extra AI features, like dedicated AI acceleration engines, in the same manner that server-class SKUs do.

Lenovo (HKSE: 992) (ADR: LNVGY) has today announced that the General Purpose Partition of the MareNostrum 5, a new pre-exascale supercomputer running on Lenovo's HPC infrastructure, has been classified as the top x86 general-purpose cluster on the recently published TOP500 list of the most powerful supercomputers globally.

Officially inaugurated at Barcelona Supercomputing Center on December 21st, MareNostrum 5 has been built for the European High Performance Computing Joint Undertaking (EuroHPC JU). The pre-exascale supercomputer will bolster the EU's mission to provide Europe with the most advanced supercomputing technology and accelerate the capacity for artificial intelligence (AI) research, enabling new scientific advances that will help solve global challenges. It aims to empower a wide range of complex HPC-specific applications, from climate research and engineering to material science and earth sciences, adeptly handling tasks that extend beyond the capabilities of cloud computing.

Intel Corporation today reported fourth-quarter and full-year 2023 financial results. "We delivered strong Q4 results, surpassing expectations for the fourth consecutive quarter with revenue at the higher end of our guidance," said Pat Gelsinger, Intel CEO. "The quarter capped a year of tremendous progress on Intel's transformation, where we consistently drove execution and accelerated innovation, resulting in strong customer momentum for our products. In 2024, we remain relentlessly focused on achieving process and product leadership, continuing to build our external foundry business and at-scale global manufacturing, and executing our mission to bring AI everywhere as we drive long-term value for stakeholders."

David Zinsner, Intel CFO, said, "We continued to drive operational efficiencies in the fourth quarter, and comfortably achieved our commitment to deliver $3 billion in cost savings in 2023. We expect to unlock further efficiencies in 2024 and beyond as we implement our new internal foundry model, which is designed to drive greater transparency and accountability and higher returns on our owners' capital." For the full year, the company generated $11.5 billion in cash from operations and paid dividends of $3.1 billion.