QNAP Systems, Inc. today launched the new PCIe JBOD storage enclosure TL-R2400PES-RP, featuring PCIe Gen 3 x8, and providing up to 64 Gb/s data transfer. Following the release of 12 and 16-bay models of the TL-Rx00PES-RP PCIe JBOD series, QNAP extends the series lineup by introducing the 24-bay 4U rackmount TL-R2400PES-RP model. Users can expand existing NAS storage volumes to petabyte-class by connecting multiple TL-Rx00PES-RP series JBODs, without requiring RAID-rebuilding on the host NAS. The TL-Rx00PES-RP series uses SATA drives, allowing businesses to choose from a wide range of enterprise hard drives. This series is ideal for businesses who want to archive/back up virtualization applications, surveillance recordings, multimedia, and other large data.

The TL-Rx00PES-RP series power on/off is linked with the host NAS, which helps reduce hardware management tasks for IT staff. Storage expansion cards QXP-3X8PES (PCIe Gen 3 x8) or the QXP-3X4PES (PCIe Gen 3 x4) are required for the NAS to scale up using TL-Rx00PES-RP series expansion enclosures.

TerraMaster today introduced the D2-320 2-bay RAID enclosure. Just to be sure, this isn't a NAS server, but a USB-based RAID enclosure that you can directly connect to your PC, or a NAS server that will recognize it as a USB mass-storage device. The D2-320 is a generational upgrade over the D2-310. While the original D2-310 features a 5 Gbps USB 3.1 Gen 1 host interface, the new D2-320 ups the host interface bandwidth to 10 Gbps, using USB 3.2 Gen 2. This increases the maximum transfer speed to 1,075 MB/s, up from 410 MB/s on the D2-310. The actual transfer speeds will depend on the storage devices installed. The maximum volume size has also been increased to 44 TB from the previous 22 TB.

You get two 3.5-inch drive bays with SATA 6 Gbps interfaces, which you can use for HDDs, or SSDs, and access them as JBODs, where the mass-storage device mounts each disk and its separate volumes; or arrays, with the enclosure supporting RAID 0 and RAID 1. File systems supported include NTFS, APFS (MacOS), EXT4, exFAT, and FAT32. You toggle the RAID modes manually on the device, using a flat-head screwdriver. The device draws power from a power brick, and features a USB-C cable (type-A adapter included). A single 80 mm fan keeps the drives cool. Available now, the TerraMaster D2-320 is priced around $150.

Cooler Master has showcased a wide variety of new case designs, as well refreshed versions of enthusiast favorites at CES 2024—the NR200P Vision was given special placement on a purple lit podium. This striking revisement of CM's original NR200P model presents itself as a futuristic concept—a crowd of attendees was drawn to this compact spectacle. Cooler Master states that NR200P Vision's feature set would normally be reserved for high-end or studio-level enclosures, but they have worked on integrating these into a space-saving profile. Support for 240 and 280 mm liquid coolers is mentioned on their interactive tablet display, as well as a provision for large GPUs (356 mm long, 160 mm high) via a vertical mounting system. An extra holder will be included to keep everything firmly in place. TPU staffers noticed that the Vision was fitted with wood (effect?) feet, suggesting that some style notes have been taken from Fractal Design's book.

The NR200P Vision features vented steel construction and striking tempered glass side panels—Cooler Master claims that this headliner has the performance to match its good looks. The Taiwanese hardware manufacturer made some room at their booth for another NR200-series refresh—a NR200P V2 model was presented in black or white options. Past feedback has been taken onboard; the chassis design team has made sure to update the front I/O panel with a much requested USB 3.2 Gen 2x2 Type C port (offering up to 20 Gb/s transfer speeds). It seems that the NR200P Vision has received the same front-facing connectivity treatment.

Thermaltake continued its unveiling of new CTE C-series chassis models at CES 2024—TPU staff took a closer look at the C200 the other day. This is a dual-chamber ITX chassis available in black or "Snow" white; it utilizes Thermaltake's Centralized Thermal Efficiency (CTE) Form Factor design. According to the C200 spec sheet, PC builders can customize the interior with (up to) 6 x 120 mm case fans, there is also enough room for a single 280 mm AIO radiator.

The showcased black CTE C200 was configured with an array of Thermaltake SWAFAN EX14 ARGB fans, TOUGHLIQUID Ultra 280 All-In-One Liquid Cooler and a TOUGHPOWER GF3 ARGB 850 W PSU. The contained build included an Intel Core i5-13500 CPU, Thermaltake TOUGHRAM XG RGB D5 DDR5 memory, and an ASUS TUF Gaming GeForce RTX 4070 12 GB graphics card.

Other World Computing www.OWC.com -- the leading end-to-end ecosystem solution provider of computer hardware, accessories, and software for both consumers and professionals - today introduced the Express 1M2, the first USB4 drive and fastest single blade NVMe OWC has ever offered.

Exceptional Speed, Ultimate Flexibility
The OWC Express 1M2 was purposefully built to maximize the performance capabilities of today's and tomorrow's USB4-equipped Macs and PCs. It offers photo and video professionals, DITs, and prosumers/performance enthusiasts real-world speeds up to 3151 MB/s. It also offers versatile compatibility to work with millions of existing Thunderbolt and USB-C machines and devices.

InWin Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, has introduced the first ever fully modular case, the ModFree PC chassis. Fully interchangeable and expandable, it allows PC enthusiasts to freely transform the design, layout, and structure to meet their exact needs and preferences in hardware and cooling. InWin offers a Base Edition preset featuring Mod-I and Mod-II modules along with three InWin Jupiter AJ140 ARGB case fans. The Deluxe Edition preset comes with Mod-I, Mod-II, and two Mod-III modules, and four Jupiter AJ140 fans too.

ModFree: An Easy, Sustainable System
The ModFree ecosystem is designed around toolless interlocking clips that allow users to easily swap modules around. Unlike conventional chassis, ModFree uses an inverted motherboard design that allows users to showcase their hardware from the left side of the desk instead of competing for space with the mouse pad on the right. Investing in this ecosystem ensures an upgrade to add more cooling or more space is just a module away, which also helps to reduce the environmental impact considering you would no longer need to build an entire new system anytime you need to upgrade. ModFree offers a 3D interactive assembly guide with easy-to-follow demonstrations and ideas for how to use each module. Users can also experiment with designs directly in the app.

We're excited to announce that Xbox Series X Console Wraps are launching this year, and pre-orders have already started. We know gamers want to be able to customize their consoles and show support for their favorite games, and we are delivering an option that's more affordable and more sustainable than purchasing a special edition or limited edition console. With the launch of Series X Console Wraps, you can customize the console you already have. There are three striking designs to choose from - complete your Starfield setup with a Starfield design that pairs perfectly with the recently released Starfield Controller and Headset, and we are also launching two camo colors to choose from, Arctic Camo and Mineral Camo.

The wraps were designed specifically for Series X and have a custom, precision fit. Every detail was taken into consideration to ensure your console performance is preserved- vents are all clear, and small feet were added to the bottom of the wraps to ensure air can flow freely through the console. Made with solid core panels that are layered with high-tech fabric finishes, the wraps are folded around your console and secured with a hook and loop enclosure. The interior of the wraps are printed with silicone designs that keep the wrap in place.

SolidRun has announced the world's first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun's Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.

Kolink has brought back one of their fan-favourite PC cases, this time with fancy improvements. Meet the Kolink Inspire K2 Plus! Whilst many features remain the same - if it ain't broke, don't fix it, amiright? - there are a number of ease-of-use upgrades integrated within the design. Plus, an aesthetic glow-up. We all love a glow-up. If your Micro-ATX case is looking a bit shabby or you're itching to start a new build, stick around and see how this classic Kolink chassis has been improved. There may even be some surprise cables, too!

What's New
The Kolink Inspire K2 Plus builds on the much-loved design of its predecessor. There are subtle and more obvious changes that have been made to the chassis. The internals have been improved to facilitate better component support. Enjoy superior accommodation for your high-end hardware and integrated radiator mounts. New features have even been added. Unlike the original K2, this version sports a dedicated PSU chamber to help maintain temperatures and keep the interior looking clutter-free.

The Framework Laptop 16 is extremely rigid and durable, while also being surprisingly light and thin through use of a combination of magnesium alloy and machined aluminium parts for the enclosure. The laptop is under 18 mm thick, which is unusually slim for a 16" high-performance, upgradeable system. If you choose to add discrete graphics using a Graphics Module, the back section of the laptop extends to just under 21 mm thick, enabling much higher thermal capacity for the GPU. This is a substantially more mechanically complex product than the Framework Laptop 13, with a larger screen size, higher performance parameters, and two new module systems with the Input Modules and Expansion Bay. With all of that, we've still achieved a clean, minimal industrial design, with no externally visible fasteners.

We've done this through careful design work, architecting the system to be made of two core mechanical parts: a molded magnesium alloy Bottom Cover and a CNC aluminium Top Cover. Both of these are items we make in collaboration with one of the most advanced enclosure manufacturers in the world, Catcher Technology. We fabricate the parts at Catcher's massive, highly-automated facility in Tainan, Taiwan, where there are vast fields of molding and milling machines.

Gamdias has diversified its PC case product range with multiple new models introduced at this year's Computex. Their headline "prime lifestyle" E-ATX enclosure is the dual chamber NESO P1 full-tower case - its unique trapezoidal shape was certainly eye-catching and the two glass panels provide a panoramic view of interior-mounted hardware. A modular pedestal system grants horizontal and vertical orientations "seamlessly while leveraging solid airflow and stability. A new case orientation provides a fresher look and unlocks an entirely new building experience." Gamdias states that the NESO P1's dimensions are (L x W x H) 490 x 310 x 495 mm.

A one-touch button mechanism makes it simple and straightforward to access the case interior for builds, upgrades and maintenance. The NESO P1 features fully perforated mesh panels that allow for optimum airflow routes, these can be configured to adjust intake and exhaust functionality depending on case orientation. Gamdias has thoughtfully added 8x8 rotatable PCIe slots and created an interior space with plenty of room (up to 426 mm) which accommodates for the flexible installation of horizontal and vertical GPUs, including the largest examples from the GeForce RTX 40-series.

AZZA, a leading manufacturer and provider of computer cases, power supplies, and PC components, presents new show-stopping cases and unveils a community project at Computex 2023. Starting off with the Sanctum 810, a spacious square glass enclosure with powerful airflow capabilities, and the Mesa 811 a stunning, asymmetrical clear-cut showpiece with individually removable glass and aluminium sheets.

The showcase also includes the Neo 500, a new mid-tower case with subtle front fans inside a chic mesh front panel, and Augment 510, a sturdy, premium aluminium enclosure encompassing mesh front and top panels. AZZA will officially unveil Design Beyond Limits, a community project that invites creatives to collaborate on creating a new case design. AZZA will be at Nangang Exhibition Hall 1, 4F booth no. L0401a from May 30th to June 2nd, 2023.

After a three year hiatus, In Win Development Inc. (InWin), will rejoin COMPUTEX 2023 in full force. This year, InWin will showcase its growing range of high performance AIO cooling solutions, professional-grade cooling fans, new ATX 3.0 power supplies, updates to its iBuildiShare initiative, and exciting collaborative products with some of the PC industry's top brands.

Chilling New Products
See InWin's latest MR and TR series AIO liquid coolers that can really take the heat, chilling even the hottest chips down to the core. Cooling enthusiasts are in for a treat with the introduction of the new InWin Neptune fan series that's destined to cool the hottest of hardware!

Apricorn, the leading manufacturer of software-free, 256-bit AES XTS hardware-encrypted USB drives, today announced the release of the USB 10Gbs Aegis NVX. Employing proprietary architecture, The Aegis NVX is the first Apricorn encrypted device to feature an NVMe SSD inside. Initial capacity offerings will be 500 GB, 1 TB, and 2 TB, with a price range of $339.00 - $739.00 MSRP.

The NVX was conceived to address the immediate protection of raw data delivered directly from its source at high speeds, such as high-definition video cameras with the capability to write to an external SSD via USB C or HDMI. The NVX's high-speed read/write capabilities at 1,000 MB/s are sought after in the fields of military intelligence, digital forensics, filmmaking and healthcare where write speeds over 600 Mb/s are critical.

Cooler Master introduces Oracle Air, the inaugural product of its innovative storage enclosure line, designed to complement the modern digital experience. Leveraging state-of-the-art NVMe M.2 technology, this elegant aluminium SSD enclosure, delivers blazing-fast, effortlessly scalable, and portable storage solutions tailored for gaming enthusiasts and digital nomads alike. When one's daily routine entails traversing various locations while igniting innovative concepts and crafting artistic creations on the fly, reliable data storage becomes essential for safeguarding those invaluable moments.

Offering sturdy protection for creative assets during transit, Oracle Air also ensures swift data transmission to make the most of every moment in a busy lifestyle. Designed for effortless integration, users can easily switch between multiple SSDs or expand storage capacity without dealing with screws or tools. With built-in MOLLE compatibility, Oracle Air can be smoothly attached to backpacks and other carrying options, ensuring one's progress stays close at hand while exploring the world.

In Win launches its Foldable POC Mini-ITX Tower - the latest iBuildiShare series case you can shape yourself! In Win Development Inc. (In Win), a leading innovator in PC enthusiast gaming hardware, has introduced its POC Mini-ITX tower PC chassis. POC is the latest addition to In Win's iBuildiShare series. Encouraging the development of dexterity skills both inside and out of a PC.

DIY PC builders of all ages can assemble a Mini-ITX enclosure from this vibrant modular kit by actually bending and shaping each panel. Similar to the art of origami, but using 0.8 mm foldable SECC steel panels instead of paper. This durable, lightweight material can withstand multiple bends. Delivered flat-packed, POC minimizes packaging materials and weight, reducing environmental impact.

ASUS ROG has started selling its RTX 4090 XG Mobile external graphics card in China and Japan this week. Japanese customers are being charged a cool $3000 for the pint-sized powerhouse external GPU, and Chinese buyers are getting a slightly better deal at $2700. It should be noted that this eGPU is the (GN21-X11) mobile variant of the GeForce RTX 4090, and not the full fat desktop version. The newly updated XG Mobile enclosure can only be connected to an ASUS Flow laptop, which limits the scope of compatibility to an already very expensive range of devices. The proprietary connection standard will keep customers in the ASUS ROG mobile hardware ecosystem - but their higher end laptop models can be configured with the very capable GeForce RTX 4070 mobile GPU, so the RTX 4090 XG Mobile seems to appeal to a very small buying niche.

The XG Mobile interface uses the PCIE Gen 3 x8 standard of connection, and the GPU has access to a dedicated 63 GB/s of bandwidth. This beats the Thunderbolt 4 standard of 40 Gb/s, by a 57% margin. The enclosure acts as a docking station - its features include an up to 2.5 Gbit Ethernet, a single HDMI 2.1 port, one DisplayPort 1.4 with G-Sync support and three USB 3.2 Gen 2 ports (3x Type-A + 1x Type-C). ASUS ROG has engineered the docking station/enclosure to be as compact as possible (21.7 cm x 16.5 cm x 3.26 cm), when compared to competing products from other manufacturers. The whole package weighs in at 1.3 kg, which will ensure decent portability for gamers on the move.

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

Patriot Memory showed off its fastest gaming PC storage solutions at the 2023 International CES. The star attraction is an unnamed prototype M.2 PCIe Gen 5 NVMe SSD which features active cooling. This is actually the second Gen 5 SSD we've come across today that has active cooling, signaling that future NVMe SSDs are about to get hot. The ES drive comes in capacities ranging between 1 TB to 4 TB, features a PCI-Express 5.0 x4 interface with NVMe 2.0 protocol, an unknown controller+flash combination, and claimed performance of up to 12 GB/s sequential reads, with up to 10 GB/s sequential writes.

Among the other internal drives shown are the Viper P450, a Gen 4 NVMe drive offering sequential speeds of up to 7 GB/s and up to 6 GB/s writes; and capacities ranging between 512 Gb to 2 TB; a more cost-effective VPR450 drive based on a DRAMless Phison Gen 4 controller offering up to 6 GB/s reads and up to 5 GB/s writes. The Viper VXD is an external SSD enclosure meant for M.2-2280 PCIe SSDs. It offers a USB-C connection, which connects to a Realtek RTL9210B chip that converts a 10 Gbps USB 3.2 Gen 2 uplink to a PCI-Express 3.0 x4 downlink, offering sequential transfer rates of up to 1 GB/s.

InWin has today announced its new Chopin MAX Mini-ITX PC chassis, which offers greater component compatibility and more cooling potential to provide users more powerful small form factor setups than ever in a beautifully designed brushed aluminium enclosure that sits proudly on any desk or furnishing.

Now with 25 percent more heatsink clearance (up to 54 mm), the Chopin MAX supports both AMD and Intel stock CPU coolers on their latest respective platforms. The newly redesigned perforated mesh panel increases the ventilation surface area to enhance the speed of heat dissipation. An included 200 W, 80 PLUS Gold PSU provides excellent power efficiency and minimal noise. The front panel I/O now features a USB 3.2 Gen 2x2 Type-C port capable of 20 Gbps performance, which is four times faster than standard USB 3.0. Despite its smaller size, the Chopin MAX supports two 2.5-inch SSDs situated on a user-friendly installation plate. There's also direct accessibility to the rear of the motherboard tray where some Mini-ITX board designs offer an additional M.2 SSD port.

Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, today announced its next-generation Exos X systems, the advanced storage arrays powered by Seagate's sixth generation controller architecture. The new Exos X systems feature up to twice the performance of the previous generation and enhanced enterprise-class durability. To help protect the stored data, Exos X systems incorporate ADAPT (Advanced Distributed Autonomic Protection Technology) erasure coding solution with Seagate's innovative self-healing storage technology ADR (Autonomous Drive Regeneration).

The Exos X series is a family of petabyte-scale, rack-mounted block storage enclosures that aggregate and virtualize dozens to hundreds of hard drives and SSDs for maximum data resiliency, availability and performance. Exos X systems are ideal as highly available enterprise storage infrastructure for conventional enterprise data centers as well as private clouds.

The Mac Studio is an incredibly compact desktop for its capability, and Sonnet figures a bunch of these can be mounted into rackmount chassis in a production studio. It rolled out a couple of products that can help you do just that. The RackMac Studio is a 3U enclosure that lets you secure up to two Mac Studio units in a rack, and cleanly wire them out, while providing access to their two front type-C ports and card slot. The xMac Studio series does the same, except with room for one Mac Studio unit, with the rest doubling up as a feature-packed storage and connectivity enclosure, taking advantage of the Thunderbolt 4 interface.

The xMac Studio Echo I takes in one Mac Studio unit, and uses its remaining space to provide a PCI-Express x16 riser, with room for a full-length graphics card that's ventilated. The xMac Studio Echo III is similar, but with three PCIe slots—one x16 and two x8, with the expansion slot area being ventilated. The xMac Studio Echo Zero (no module) comes with empty space that you can configure to your needs with custom hardware. Available from October 23, the RackMac Studio is priced at $450. The xMac Studio Echo III is slated for September 25, priced at $1,650, while its sibling, the Echo I, will go for $1,250. The bare Echo (no module), will be up for $550.

Server manufacturer Inventec unveils Mategress, the highest density storage JBOD with 42 SATA drives in a 2U enclosure to meet industry needs while improving efficiency with reduced costs. As demands for storage skyrockets, data centers are facing space and performance concerns in delivering higher quality of service and reliability. Mategress addresses both these issues with its unique high density in a small frame, dramatically reducing the cost for storage centers.

The Inventec Mategress storage server is a standard 2U high rack mount system, supporting 42 3.5" hot-swappable Serial Advanced Technology Attachment (SATA) drives with easy serviceability. It offers a higher maximum storage capacity than other similar products with full redundancy and flexible input/output (I/O) expansibility or expandability.

Iceotope, the global leader in Precision Immersion Cooling, has announced that its chassis-level cooling system is being demonstrated in the Intel Booth at HPE Discover 2022, the prestigious "Edge-to-cloud Conference". Ku:l Data Center is the product of a close collaboration between Iceotope, Intel and HPE and promises a faster path to net zero operations by reducing edge and data center energy use by nearly a third. Once the sole preserve of arcane, high performance computing applications, liquid cooling is increasingly seen as essential technology for reliable and efficient operations of any IT load in any location. There is a pressing concern about sustainability impacts as distributed edge computing environments proliferate to meet the demand for data processing nearer the point of use, as well as growing facility power and cooling consumption driven by AI augmentation and hotter chips.

Working together with Intel and HPE, Iceotope benchmarked the power consumption of a sample IT installation being cooled respectively using air and precision immersion liquid cooling. The results show a substantial advantage in favour of liquid cooling, reducing overall power use across IT and cooling infrastructure.

Sabrent announces DS-UCTB 10-Bay 3.5" SATA Hard Drive Tray-Less Docking Station (USB 3.2 Type-C And Type-A) (DS-UCTB). This Sabrent SATA Hard Drive Tray-Less Docking Station enables you to access 3.5" hard drives, without the frustration of assembling enclosures. By inserting a 3.5" SATA hard drive directly into this docking station, you can quickly access drive contents and transfer files. Transfer data quickly and easily through USB 3.2 at speeds up to 10 Gbps.