Friday, December 18th 2020
GELID Announces Iceberry Cooling+Case Kit for Raspberry Pi 4
Tech innovator GELID Solutions unveils the latest cooling kit featuring convenient housing and enhanced cooling for Raspberry Pi 4 Microcomputer. The ICEBERRY is a product of GELID Solutions GAMER product line. The ICEBERRY is designed to prevent Raspberry Pi 4 from overheating, boost its performance and eliminate thermal throttling issues. It is well acknowledged that Raspberry Pi TM 4 tends to overheating under high load in case no additional cooling is applied. Temperatures may climb up to 80 °C and higher, which in turn triggers the activation of thermal throttling and leads to considerably degraded performance. The ICEBERRY helps solve that problem.
It comes with an optimized Heatsink-Fan Module boasting the high-airflow 50 mm fan and the slim aluminium heatsink with enlarged footprint that spreads across the surface area of the Raspberry Pi 4 PCB to improve heat dissipation. The specially crafted aluminium case goes to reducing temperatures and accommodates convenient housing for Raspberry Pi 4. The pre-cut GP-Extreme thermal pads cover the heat-generating components - SoC and RAM Memory IC - and tailor a highly efficient thermal interface to transfer heat to the Heatsink-Fan Module. The aluminium case also carries side vents to enhance airflow. All the I/O ports and slots such as USB-C power port, micro-HDMI ports, audio port, USB ports, display slot, and others are easily accessible. Additionally, microSD card access and camera cable passthrough are also provided.The ICEBERRY is RoHS and WEEE conform and carries a 2 year warranty.
"ICEBERRY brings an ultimate cooling solution to the table. It is crafted to fit the Raspberry Pi 4 microcomputer perfectly and helps maintain temperatures within the normal range under any workload or use-case scenario. You can even overclock and raise performance of your Raspberry Pi 4 higher!", said Gebhard Scherrer, Sales Director of GELID Solutions Ltd.
The ICEBERRY is available now and has a MSRP of USD 21.99 or Euro 19.99.
It comes with an optimized Heatsink-Fan Module boasting the high-airflow 50 mm fan and the slim aluminium heatsink with enlarged footprint that spreads across the surface area of the Raspberry Pi 4 PCB to improve heat dissipation. The specially crafted aluminium case goes to reducing temperatures and accommodates convenient housing for Raspberry Pi 4. The pre-cut GP-Extreme thermal pads cover the heat-generating components - SoC and RAM Memory IC - and tailor a highly efficient thermal interface to transfer heat to the Heatsink-Fan Module. The aluminium case also carries side vents to enhance airflow. All the I/O ports and slots such as USB-C power port, micro-HDMI ports, audio port, USB ports, display slot, and others are easily accessible. Additionally, microSD card access and camera cable passthrough are also provided.The ICEBERRY is RoHS and WEEE conform and carries a 2 year warranty.
"ICEBERRY brings an ultimate cooling solution to the table. It is crafted to fit the Raspberry Pi 4 microcomputer perfectly and helps maintain temperatures within the normal range under any workload or use-case scenario. You can even overclock and raise performance of your Raspberry Pi 4 higher!", said Gebhard Scherrer, Sales Director of GELID Solutions Ltd.
The ICEBERRY is available now and has a MSRP of USD 21.99 or Euro 19.99.
22 Comments on GELID Announces Iceberry Cooling+Case Kit for Raspberry Pi 4
Very solid looking and functional. I wonder how the fan performs? Not if you want to OC the RPi4 to 2.0, 2.1 or 2.2ghz. You need active cooling for that.
www.amazon.com/gp/product/B07WG4DW52
www.amazon.ca/product-reviews/B07WG4DW52/ref=acr_dp_hist_1?ie=UTF8&filterByStar=one_star&reviewerType=all_reviews#reviews-filter-bar
Flirc Raspberry Pi 4 Case (Silver)
It was a otherwise good case with an indent at the point of contact with the chip.
I bought it and returned it immediately, and this was not the only case having this issue.
Even if it can work, why would anyone put a dent at the critical heat-sinking location?
Flirc has been my go to pi case since pi3, can OC and it totally silent
See this:
www.amazon.ca/gp/customer-reviews/R1NU02G8DSE04R/ref=cm_cr_arp_d_rvw_ttl?ie=UTF8&ASIN=B07WG4DW52
Not sure how it makes you feel better.
I guess we are speaking a different language.
We can continue when you tune in.
If you don't know how to use the case you reviewed poorly, that is on you. It's as simple as placing the included thermal pad on the surface of the "dent" which is designed to make contact with the top of the IHS of the RPi4. Pressure applied when the case is closed up closes the gap of the "dent" you referred to. Would you care to whine further?
It's as simple as I am to choose between two heatsinks, I guess I won't choose one with a dent, and I thought that was obvious to everybody which is my fault.
You are among those I see who, as fans, failed to recognize product defects and simply kept escorting the manufactures.
This is how manufactures were able to run off and throw more failed products. I guess I have wasted enough time on you.