Monday, November 8th 2021
AMD Accelerated Data Center Event Live Blog
AMD held its Accelerated Data Center Keynote address by CEO Dr Lisa Su today. The company made some big announcements for the enterprise space in this first major series of announcements by AMD after Intel's launch of its Alder Lake 12th Gen Core processors that set the tone for what's to come from Intel in the enterprise space (Xeon "Sapphire Rapids"). First up is the EPYC "Milan-X" line of server processors leveraging 3D Infinity Cache memory, a tripling in L3 cache amount, which the company claims significantly improves performance of memory-intensive applications. This should also give you an idea if any upcoming Ryzen desktop processor based on the refreshed chiplet could live up to its claim of "up to 15% gaming performance boost." The next-generation Instinct MI200 series GPU compute accelerators are equally important as they bring the CDNA2 compute architecture to market, establishing competition to NVIDIA's A-series Tensor Core processors, and Intel's upcoming "Ponte Vecchio" Xe-HPC accelerators.15:59 UTC: It's time to get the show on the road, as CEO Dr Lisa Su takes center-stage.16:02 UTC: AMD categorizes the four workloads dominating datacenters today.16:04 UTC: New cores, new packaging tech, new CPUs and GPUs16:05 UTC: New EPYC processor reveal, all new socket
16:06 UTC: Meta joins AMD EPYC cloud computing ecosystem
16:06 UTC: Looks like a new socket for sure16:07 UTC: Chiplets with 3D Infinity Cache confirmed16:08 UTC: TSMC 3D chipset technology leveraged for 3D Infinity Cache16:09 UTC: AMD Milan-X EPYC, existing socket, with up to 64 cores, but a mammoth 804 MB cache per socket16:10 UTC: Fully compatible with SP3 platforms with a UEFI update,
16:11 UTC: First view of 3D V cache on AMD EPYC16:12 UTC: Technical computing the focus of this processor. Memory intensive applications.16:12 UTC: 96 MB L3 cache per chiplet reduces memory subsystem latencies significantly16:13 UTC: EDA verification load 66% faster than competing Intel solution16:15 UTC:16:15 UTC: 3D V cache impacts a broad set of compute applications16:16 UTC: Azure to debut "Milan-X" processor-powered instances.16:18 UTC: Q1-2022 general availability of Milan-X16:20 UTC: We now move on to CDNA2 compute processors.
16:20 UTC: Instinct MI200. 20% faster and 4.9x faster HPC performance than "competition."16:22 UTC: 58 billion transistors, TSMC 6 nm, 220 compute units, 128 GB HBM2E memory16:23 UTC: Two form-factors MI200 comes in.16:23 UTC: AMD just beat Intel to multi-die GPUs, since Intel canned Xe-HP16:24 UTC: Performance claims:16:25 UTC: 3.2 TB/s memory bandwidth.
16:26 UTC: More competitive performance claims16:28 UTC: Debuting 3rd Gen Infinity Fabric, 800 GB/s aggregate bandwidth, and memory coherenceUpdate 16:29 UTC: First picture of Oakridge National Labs Frontier, first exascale supercomputer:16:34 UTC: Genoa, is Zen 4-based, built on 5 nm, AMD claims that Genoa will be the "highest performance processor for gen-purpose compute"16:35 UTC: Up to 96 cores, PCIe Gen 5, CXL, DDR5 memory
16:36 UTC: Zen4c is optimized for scale-out cloud performance, "Bergamo" EPYC processor with 128 cores, same I/O as "Genoa"16:37 UTC: Updated roadmap16:38 UTC: And that's a wrap. A spritely series of major updates that should shake things up in the Intel camp. The core count increase to 96~128, along with the expected generational IPC increase, and next-gen I/O could be AMD's play against the Xeon "Sapphire Rapids." Thanks for joining us.
16:06 UTC: Meta joins AMD EPYC cloud computing ecosystem
16:06 UTC: Looks like a new socket for sure16:07 UTC: Chiplets with 3D Infinity Cache confirmed16:08 UTC: TSMC 3D chipset technology leveraged for 3D Infinity Cache16:09 UTC: AMD Milan-X EPYC, existing socket, with up to 64 cores, but a mammoth 804 MB cache per socket16:10 UTC: Fully compatible with SP3 platforms with a UEFI update,
16:11 UTC: First view of 3D V cache on AMD EPYC16:12 UTC: Technical computing the focus of this processor. Memory intensive applications.16:12 UTC: 96 MB L3 cache per chiplet reduces memory subsystem latencies significantly16:13 UTC: EDA verification load 66% faster than competing Intel solution16:15 UTC:16:15 UTC: 3D V cache impacts a broad set of compute applications16:16 UTC: Azure to debut "Milan-X" processor-powered instances.16:18 UTC: Q1-2022 general availability of Milan-X16:20 UTC: We now move on to CDNA2 compute processors.
16:20 UTC: Instinct MI200. 20% faster and 4.9x faster HPC performance than "competition."16:22 UTC: 58 billion transistors, TSMC 6 nm, 220 compute units, 128 GB HBM2E memory16:23 UTC: Two form-factors MI200 comes in.16:23 UTC: AMD just beat Intel to multi-die GPUs, since Intel canned Xe-HP16:24 UTC: Performance claims:16:25 UTC: 3.2 TB/s memory bandwidth.
16:26 UTC: More competitive performance claims16:28 UTC: Debuting 3rd Gen Infinity Fabric, 800 GB/s aggregate bandwidth, and memory coherenceUpdate 16:29 UTC: First picture of Oakridge National Labs Frontier, first exascale supercomputer:16:34 UTC: Genoa, is Zen 4-based, built on 5 nm, AMD claims that Genoa will be the "highest performance processor for gen-purpose compute"16:35 UTC: Up to 96 cores, PCIe Gen 5, CXL, DDR5 memory
16:36 UTC: Zen4c is optimized for scale-out cloud performance, "Bergamo" EPYC processor with 128 cores, same I/O as "Genoa"16:37 UTC: Updated roadmap16:38 UTC: And that's a wrap. A spritely series of major updates that should shake things up in the Intel camp. The core count increase to 96~128, along with the expected generational IPC increase, and next-gen I/O could be AMD's play against the Xeon "Sapphire Rapids." Thanks for joining us.
15 Comments on AMD Accelerated Data Center Event Live Blog
Wow. And the presentation isn't even over yet...
Even then: Zen3 is a ring-bus (infinity fabric) around a ring-bus (on-die "local" ringbus). Since ringbus works so well, we might just get a ring-bus inside a ring-bus inside a ring-bus.
I remember being excited for 128MB system RAM on windows 95
I forget exactly when the memory scan disappeared. Fortunately, today's memory bandwidth has also exploded, so a memory scan of ~50GB could be accomplished in just 1 or 2 seconds these days.
At no point in time was it called that. It was called 3D V-cache.
You are confusing it with the RDNA2 card technology.