AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

In advance of Supercomputing '22 in Dallas, Intel Corporation has introduced the Intel Max Series product family with two leading-edge products for high performance computing (HPC) and artificial intelligence (AI): Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and Intel Data Center GPU Max Series (code-named Ponte Vecchio). The new products will power the upcoming Aurora supercomputer at Argonne National Laboratory, with updates on its deployment shared today.

The Xeon Max CPU is the first and only x86-based processor with high bandwidth memory, accelerating many HPC workloads without the need for code changes. The Max Series GPU is Intel's highest density processor, packing over 100 billion transistors into a 47-tile package with up to 128 gigabytes (GB) of high bandwidth memory. The oneAPI open software ecosystem provides a single programming environment for both new processors. Intel's 2023 oneAPI and AI tools will deliver capabilities to enable the Intel Max Series products' advanced features.

Intel's Xeon Scalable "Sapphire Rapids" processor may have a tough time getting to market, as leaked benchmarks suggest that even its premium HPC models with on-package HBM2E memory are outperformed by AMD's older-generation "Zen 3" EPYC processors. The 64-core/128-thread EPYC "Milan-X" processor based on older "Zen 3" microarchitecture with 3D Vertical Cache (3DV cache) chiplets, allegedly outperforms 52-core/104-thread Xeon Platinum 8472C and 60-core/120-thread Xeon Platinum 8490H "Sapphire Rapids" engineering samples in CPU-Z Bench and V-ray tests that scale across cores. These benchmark scores were compared with those of the EPYC "Milan-X" by Tom's Hardware, in which they well woefully short of the AMD chips.

EK Fluid Works, a high-performance workstation manufacturer, is expanding its Compute Series with a rackmount liquid-cooled GPU server, the X7000-RM. The EK Fluid Works Compute Series X7000-RM is tailor-made for high-compute density applications such as machine learning, artificial intelligence, rendering farms, and scientific compute simulations.

What separates the X7000-RM from similar GPU server solutions is EK's renowned liquid cooling and high compute density. It offers 175% more GPU computational power than air-cooled servers of similar size while maintaining 100% of its performance output no matter the intensity or duration of the task. The standard X7000-RM 5U chassis can be equipped with an AMD EPYC Milan-X 64 Core CPU, up to 2 TB of DDR4 RAM, and up to seven NVIDIA A100 80 GB GPUs for the ultimate heavy-duty GPU computational power. Intel Xeon Scalable single and dual socket solutions are also possible, but such configurations are limited to a maximum of five GPUs.

AMD is looking to expand its Socket AM4 Ryzen 5000X3D processor lineup, according to Greymon55, a reliable source with AMD rumors. The current Ryzen 7 5800X3D 8-core processor was well received by the tech-press for its 3D Vertical Cache innovation that significantly improved gaming performance, putting it in the same league as Intel's fastest 12th Gen Core "Alder Lake" processors, despite being based on the older "Zen 3" microarchitecture. AMD uses the same 8-core 3DV Cache chiplet (CCD) in its EPYC "Milan-X" enterprise processors. This lineup could see an expansion, with announcements expected in July.

If true, it could see the introduction of SKUs such as the Ryzen 5 5600X3D, Ryzen 9 5900X3D, or perhaps even the 5950X3D, with the latter two featuring a mind-boggling 200 MB of Total Cache (L2+L3). This would provide a tempting upgrade path to everyone with a Socket AM4 platform, now that AMD has extended official "Zen 3" support to even the oldest AMD 300-series chipset motherboards. There is yet another rumor that predicts AMD could develop certain "Zen 4" SKUs on the AM4 package, which sees a "Zen 4" CCD paired with a current-gen cIOD that has DDR4 and PCIe Gen 4 connectivity. Regardless of which rumor is true, AMD's support for AM4 isn't ending anytime soon.

Someone with access to an AMD Ryzen 7 5800X3D processor sample posted some of the first Geekbench 5 performance numbers for the chip, where it ends up 9% faster than the Ryzen 7 5800X, on average. AMD claimed that the 5800X3D is "the world's fastest gaming processor," with the 3D Vertical Cache (3D V-cache) technology offering gaming performance uplifts over the 5800X akin to a new generation, despite being based on the same "Zen 3" microarchitecture, and lower clock speeds. The Ryzen 7 5800X3D is shown posting scores of 1633 points 1T and 11250 points nT in one run; and 1637/11198 points in the other; when paired with 32 GB of dual-channel DDR4-3200 memory.

These are 9% faster than a typical 5800X score on this benchmark. AMD's own gaming performance claims see the 5800X3D score a performance uplift above 20% over the 5800X, closing the gap with the Intel Core i9-12900K. The 3D V-cache technology debuted earlier this week with the EPYC "Milan-X" processors, where the additional cache provides huge performance gains for applications with large data-sets. AMD isn't boasting too much about the multi-threaded productivity performance of the 5800X3D because this is ultimately an 8-core/16-thread processor that's bound to lose to the Ryzen 9 5900X/5950X, and the i9-12900K, on account of its lower core-count.

AMD announced the general availability of the world's first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology, formerly codenamed "Milan-X." Built on the "Zen 3" core architecture, these processors expand the 3rd Gen EPYC CPU family and can deliver up to 66 percent performance uplift across a variety of targeted technical computing workloads versus comparable, non-stacked 3rd Gen AMD EPYC processors.

These new processors feature the industry's largest L3 cache delivering the same socket, software compatibility and modern security features as 3rd Gen AMD EPYC CPUs while providing outstanding performance for technical computing workloads such as computational fluid dynamics (CFD), finite element analysis (FEA), electronic design automation (EDA) and structural analysis. These workloads are critical design tools for companies that must model the complexities of the physical world to create simulations that test and validate engineering designs for some of the world's most innovate products.

It will be an unexpectedly busy March for AMD, with the company launching three distinct products across its processor lines. The first one, which we reported earlier this morning, speaks of a late-March availability of the Ryzen 7 5800X3D 8-core/16-thread Socket AM4 processor, which AMD claims offers gaming performance on par with the Core i9-12900K "Alder Lake." It turns out, there are two more surprises.

Apparently the company is ready with Ryzen Threadripper PRO 5000 series workstation processors. Designed for Socket sWRX8 motherboards based on the only chipset option available—the AMD WRX80, these are the first Threadripper products based on the "Zen 3" microarchitecture, and feature 8-channel DDR4 memory, and up to 128 PCI-Express Gen4 lanes for workstation connectivity. Unfortunately, you can't buy one of these in the retail channel, as AMD is making them OEM-only. The first pre-built workstations will arrive as early as next week (March 8). At this point we still don't know if these chips use the newer "Zen 3" CCD with 3D Vertical Cache, or the conventional "Zen 3" CCD with 32 MB planar L3 cache.

Intel's next-generation Xeon processors code-named Sapphire Rapids are on track to hit the market this year. These new processors are supposed to bring a wide array of new and improved features and a chance for Intel to show off its 10 nm SuperFin manufacturing process in the server market. Thanks to the Twitter user YuuKi_AnS, we have some of the first tests run in AIDA64 and Cinebench R15 benchmark suites. Yuuki managed to get ahold of DDR5-enabled Sapphire Rapids Xeon with 48 cores and 96 threads, equipped with a base frequency of 2.3 GHz and boost speeds of 3.3 GHz. The processor tested was an engineering sample with a Q-SPEC designation of "QYFQ" and made for Intel Socket E (LGA-4677). This CPU sample was locked at 270 Watt TDP.

Below, you can see the performance results of this processor, tested in the AIDA64 cache and memory benchmark and Cinebench R15 bench test. There is a comparison between AMD's Milan-X and Xeon Platinum 8380, so the numbers are more in check of what you can expect from the final product.

The AMD Milan-X EPYC 7773X 3D V-Cache is a 64-core, 128-thread server processor with 804 MB of cache that is currently shipping to global data centers. These processors are not yet officially available in retail channels but Chinese content creator kenaide has managed to acquire and test two qualification sample chips on a SuperMicro dual-socket motherboard. The AMD EPYC 7773X is detected as 100-000000504-04 CPU by CPU-Z confirming that it's an engineering sample with clock speeds 100 MHz below the 2.2 GHz and 3.5 GHz base and boost speeds of the official processor.

The processors each feature 32 MB L2, 256 MB L3, and 512 MB of 3D V-Cache for a total of 1608 MB cache in the configuration that was benchmarked with Cinebench R23 and 3DMark. The processors were also "overclocked" to 4.8 GHz using the EPYC Milan/Rome ES/QS Overclocking tool by increasing their power limit to 1500 W from 280 W and boosting the voltage to 1.55 V. This 4.8 GHz clock speed is only a target with the actual speed reached not reported and no benchmarks for the overclocked processors shared.

The Ryzen 3000XT line of processors were the kind of stop-gap products that make people wary of stop-gap products, and AMD plans to remedy this. The new Ryzen 7 5800X3D is an upcoming Socket AM4 processor designed with the singular purpose of matching the Intel Core i9-12900K "Alder Lake" processor at gaming performance, so Intel doesn't have free reign until much later in the year, when AMD debuts "Zen 4" and AM5. It's also a means for AMD to signal consumers as well as investors to the sheer engineering depth the company enjoys these days.

The Ryzen 7 5800X3D isn't a a 5800X with an insane CPU overclock that throws efficiency out of the window. In fact, it has lower clocks! Instead, it leverages a new feature addition AMD did to its existing "Zen 3" microarchitecture, called 3D Vertical Cache. This is basically 64 MB of fast SRAM physically stacked on top of the CPU core die (CCD), giving it 96 MB of last-level cache. The company has already debuted this with its EPYC "Milan-X" enterprise processors, and the Ryzen 7 5800X3D would be the first client-segment product with this CCD.

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

AMD on Monday made several major announcements covering different parts of its enterprise product roadmap. These included the 3rd Gen EPYC "Milan-X" processors with 3D Vertical Cache memory; Instinct MI200 CDNA2 compute accelerators, and announcements related to next-generation "Zen 4" based EPYC "Genoa" and "Bergamo" processors that come with core counts as high as 128. The company's stock rallied up to 12%, closing up 10%, which left many in the tech community scratching their heads. It turns out that the AMD-Meta deal has a profound impact on investors.

Meta, the holding company of Facebook covering all its businesses, aspires to be a major cloud solutions provider on par with Microsoft Azure, AWS, and Google Cloud. The deal could see Meta buying large stocks of AMD processors and compute accelerators to drive its next-gen server infrastructure. Sales of enterprise processors doubled year-over-year for AMD, and EPYC processors now account for 20% of the company's revenues.

AMD held its Accelerated Data Center Keynote address by CEO Dr Lisa Su today. The company made some big announcements for the enterprise space in this first major series of announcements by AMD after Intel's launch of its Alder Lake 12th Gen Core processors that set the tone for what's to come from Intel in the enterprise space (Xeon "Sapphire Rapids"). First up is the EPYC "Milan-X" line of server processors leveraging 3D Infinity Cache memory, a tripling in L3 cache amount, which the company claims significantly improves performance of memory-intensive applications. This should also give you an idea if any upcoming Ryzen desktop processor based on the refreshed chiplet could live up to its claim of "up to 15% gaming performance boost." The next-generation Instinct MI200 series GPU compute accelerators are equally important as they bring the CDNA2 compute architecture to market, establishing competition to NVIDIA's A-series Tensor Core processors, and Intel's upcoming "Ponte Vecchio" Xe-HPC accelerators.

AMD in its Computex 2021 presentation showed off its upcoming "Zen 3" CCD (CPU complex dies) featuring 64 MB of "3D vertical cache" memory on top of the 32 MB L3 cache. The die-on-die stacked contraption, AMD claims, provides an up to 15% gaming performance uplift, as well as significant improvements for enterprise applications that can benefit from the 96 MB of total last-level cache per chiplet. Ahead of the its debut later today in the company's rumored EPYC "Milan-X" enterprise processor reveal, we're learning that AMD could brand 3D Vertical Cache as "3D Infinity Cache."

This came to light when Greymon55, a reliable source with AMD and NVIDIA leaks, used the term "3D IFC," and affirmed it to be "3D Infinity Cache." AMD realized that its GPUs and CPUs have a lot of untapped performance potential with use of large on-die caches that can make up for much of the hardware's memory-management optimization. The RDNA2 family of gaming GPUs feature up to 128 MB of on-die Infinite Cache memory operating at bandwidths as high as 16 Tbps, allowing AMD to stick to narrower 256-bit wide GDDR6 memory interfaces even on its highest-end RX 6900 XT graphics cards. For CCDs, this could mean added cushioning for data transfers between the CPU cores and the centralized memory controllers located in the sIOD (server I/O die) or cIOD (client I/O die in case of Ryzen parts).