- Joined
- Oct 9, 2007
- Messages
- 47,235 (7.55/day)
- Location
- Hyderabad, India
System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
GPU buyers can breathe a huge sigh of relief that AMD isn't fixated with next-generation game consoles, and that its late-2013 launch of its next GPU generation is with good reason. The company is building a new GPU micro-architecture from the ground up. Codenamed "Volcanic Islands," with members codenamed after famous islands along the Pacific Ring of Fire, the new GPU family sees AMD rearranging component-hierarchy within the GPU, in a big way.
Over the past three GPU generations that used VLIW5, VLIW4, and Graphics CoreNext SIMD architectures, the component hierarchy was essentially untouched. According to an early block-diagram of one of the GPUs in the series, codenamed "Hawaii," AMD will designate parallel and serial computing units. Serial cores based on either of the two architectures AMD is licensed to use (x86 and ARM), could handle part of the graphics processing load. The stream processors of today make up the GPU's parallel processing machinery.
We can't make out text in the rather blurry block-diagram, but are rather convinced that if it's authentic, then AMD is making some big changes. Another reason for AMD's delay could be silicon fab process. "Tahiti" as implemented on Radeon HD 7970 GHz Edition, already poses high thermal envelope. AMD doesn't want the 28 nm process to restrict its next-generation architecture development, and is holding out till the 20 nm process is in place at TSMC. The fab set Q4 as its tentative bulk manufacturing date for the process.
The source that leaked the block-diagram also posted specifications of the chip that's codenamed "Hawaii," which appears to be the flagship part.
View at TechPowerUp Main Site
Over the past three GPU generations that used VLIW5, VLIW4, and Graphics CoreNext SIMD architectures, the component hierarchy was essentially untouched. According to an early block-diagram of one of the GPUs in the series, codenamed "Hawaii," AMD will designate parallel and serial computing units. Serial cores based on either of the two architectures AMD is licensed to use (x86 and ARM), could handle part of the graphics processing load. The stream processors of today make up the GPU's parallel processing machinery.
We can't make out text in the rather blurry block-diagram, but are rather convinced that if it's authentic, then AMD is making some big changes. Another reason for AMD's delay could be silicon fab process. "Tahiti" as implemented on Radeon HD 7970 GHz Edition, already poses high thermal envelope. AMD doesn't want the 28 nm process to restrict its next-generation architecture development, and is holding out till the 20 nm process is in place at TSMC. The fab set Q4 as its tentative bulk manufacturing date for the process.
The source that leaked the block-diagram also posted specifications of the chip that's codenamed "Hawaii," which appears to be the flagship part.
- 20 nm silicon fab process
- 4096 stream processors
- 16 serial processor cores
- 4 geometry engines
- 256 TMUs
- 64 ROPs
- 512-bit GDDR5 memory interface
View at TechPowerUp Main Site
Last edited: