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- Nov 4, 2005
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System Name | Compy 386 |
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Processor | 7800X3D |
Motherboard | Asus |
Cooling | Air for now..... |
Memory | 64 GB DDR5 6400Mhz |
Video Card(s) | 7900XTX 310 Merc |
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Audio Device(s) | ATI HDMI |
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Keyboard | Razer |
Software | A lot. |
Benchmark Scores | Its fast. Enough. |
So you either read the article and disagree with it but don't have the intelligence to give a reason, or you didn't read the article and just wanted to be pedantic for what turned out to be your mistake in reading comprehension. Gotcha. I guess I'm the best kind of troll, the one that discusses the actual post and gives evidence as to why Intel may not use solder even if it has better thermal performance.
So all the solder used in high temp (not the paltry less than 220F chips interface) that works fine should crack out, right?
Except it doesn't. The TIM vs Solder is a choice in cost, and in performance limiting. Intel can tell if a chip has been overclocked and deem it unwarrantiable if they use TIM as the thermal conductivity limits maximum clocks. Solder would allow users to clock higher with more voltage easier and damage chips and they wouldn't be able to tell.
Solder is the superior choice, which is why it's used on every other part of the board including VRMs and FETs.
Lastly, suggesting that Intel uses Solder for longevity and AMD would have issues is so uninformed that it doesn't even warrant a response beyond this, testing small BGA at 100C shows modern solders don't start to fail until 16000 heat cycles, and that would be the mode of failure for Intel or AMD as they require that solder between the silicon die and substrate, regardless of thermal interface material, except if kept cooler, meaning a cooler running chip will last longer than the BGA will. All else being equal, solder is superior.
https://www.google.com/url?sa=t&sou...gg0MAI&usg=AFQjCNE4pEFh03aXZ_d71bj6wjaGKMH0fg
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