Yeah, there definitely is. I mean, look at something like a Lenovo ThinkStation P920:
That's essentially two enclosed airflow tunnels (CPU+RAM and PSU) with two semi-open tunnels for AICs (enclosed when the side panel is on, but not enclosed between AICs) in between these. Each of which has its own separate airflow path with no heat dumped across component classes - and allows them to cool a dual-CPU workstation with up to four huge accelerators with just three case fans (one small fan in the front for each AIC area, and one larger rear exhaust for the CPU tunnel. What allows Lenovo (and HP, and Dell, and all proper workstation OEMs) to do this is that they have complete control over the case design, motherboard layout, heatsinks, etc. Only the AICs are outside of their control, and are thus left in more open - but still isolated - flow paths.
Doing the same with a DIY PC essentially requires custom fabrication as no two cases are identical, socket positioning varies between motherboards, heatsinks vary wildly in size, etc. But it has
huge potential for improving cooling, instead of the brute-force, highly turbulent ATX-standard induced solution of "take a box, add various fans as desired/needed".