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Here's the first picture of AMD Socket SP5, the huge new CPU socket the company is building its next-generation EPYC "Genoa" enterprise processors around. "Genoa" will be AMD's first server products to implement the new "Zen 4" CPU cores, and next-gen I/O, including DDR5 memory and PCI-Express Gen 5. SP5, much like its predecessor SP3, is a land-grid array (LGA) socket, and has 6,096 pins.
The vast pin-count enables power to support CPU core-counts of up to 96 on the EPYC "Genoa," and up to 128 on the EPYC "Bergamo" cloud processor; a 12-channel DDR5 memory interface (24 sub-channels); and up to 128 PCI-Express 5.0 lanes. The socket's retention mechanism and processor installation procedure appears similar to that of the SP3, although the thermal requirements of SP5 will be entirely new, with processors expected to ship with TDP as high as 400 W, compared to 280 W on the current-generation EPYC "Milan." AMD is expected to debut EPYC "Genoa" in the second half of 2022.
View at TechPowerUp Main Site | Source
The vast pin-count enables power to support CPU core-counts of up to 96 on the EPYC "Genoa," and up to 128 on the EPYC "Bergamo" cloud processor; a 12-channel DDR5 memory interface (24 sub-channels); and up to 128 PCI-Express 5.0 lanes. The socket's retention mechanism and processor installation procedure appears similar to that of the SP3, although the thermal requirements of SP5 will be entirely new, with processors expected to ship with TDP as high as 400 W, compared to 280 W on the current-generation EPYC "Milan." AMD is expected to debut EPYC "Genoa" in the second half of 2022.
View at TechPowerUp Main Site | Source