- Joined
- May 22, 2024
- Messages
- 408 (2.41/day)
System Name | Kuro |
---|---|
Processor | AMD Ryzen 7 7800X3D@65W |
Motherboard | MSI MAG B650 Tomahawk WiFi |
Cooling | Thermalright Phantom Spirit 120 EVO |
Memory | Corsair DDR5 6000C30 2x48GB (Hynix M)@6000 30-36-36-76 1.36V |
Video Card(s) | PNY XLR8 RTX 4070 Ti SUPER 16G@200W |
Storage | Crucial T500 2TB + WD Blue 8TB |
Case | Lian Li LANCOOL 216 |
Power Supply | MSI MPG A850G |
Software | Ubuntu 24.04 LTS + Windows 10 Home Build 19045 |
Benchmark Scores | 17761 C23 Multi@65W |
Contrarily, this is probably as accurate as it gets: Control every other aspect and test the TIMs alone, without confounding factors such as socket size, IHS thickness, hotspot location, TIM spread, mounting pressure, heatsink type & make, ambient temperature, what the reviewer had for breakfast, and all that.But no processor. The end resulted data is great for the measurement of those two blocks of copper. Neither is a common cpu cooler, and neither is a cpu. If it where a cpu, it would need to be nickel plated copper.
Is this testing actually accurate for the intended uses? At least what we do have is constant pressure. So that's a good thing.
So this thermal paste does X wm/k an hour between those 2 specific pieces of copper. That's what we get from that lab testing.
The question is, would this study be close enough to realistic usage in a PC??
It is not real life because it is not meant to be, real life is too complicated to get a fair and repeatable result. If a make of TIM works well here, it would probably work well in real life, misapplication/bad socket thermals/bad mount/bad cooler notwithstanding.
And the article just came up. He also more or less said it would also double as a grinding compound, and has in fact damaged the testing equipment, due to the forces involved to get it down to the tested thicknesses.Igor's just did a test showing TFX had thermal conductivity similar to PTM7950.
Is that actually the reason it worked well? By making its own scores into the IHS/silicon and the heatink surface, to enhance thermal contact between them and the TIM particles?
Definitely acquired taste, and probably not okay for bare die. Now I know...
Last edited: