I would use a top down style heat sink for this application honestly.
My preferred at all times.
Side firing coolers may completely miss heat sensitive components that manufacturers cluster around CPU sockets. This is a problem often overlooked by water blocks too. Another problem with side firing coolers, at least IMO, is they can cause unwanted turbulence and/or disrupt the desired front to back (or bottom to top) flow if air through a case - depending on the direction they fire.
Sadly, proper case cooling is too often overlooked. The CPU cooler is important, but the CPU cooler need only toss the CPU's heat into that case air flow. Without a good flow of cool air through the case, the heated air will not be properly exhausted out - no matter how good the CPU cooler is.
@Macro Device - nothing you said in your last two replies changes anything I said in my previous comment. Contrary to what you seem to imply, not everyone overclocks their systems.
I note the OP did not say he was planning on doing any, let alone more than moderate overclocking.
But more importantly, it is misleading to criticize hardware that is NOT marketed to support such extremes. Adding "Gaming" to a product's name is just gimmicky marketing hype.
I note this is not an expensive, high-end board.
@AtiAmd - how about giving us some more insight about your system and your intended use. Right now, all we can do is speculate. Please fill out your
TPU System Specs and tell us your plans with this system. If you are not planning on doing any extreme overclocking, and if your case cooling is set up properly to provide a decent flow of cool air through the case, then you should not need to worry about whether or not your VRMs have heatsinks on them or not.