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AMD Ryzen 9 9950X3D

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Only 200 9950X3D @ Denver’s Microcenter.

5070Ti - Zotac Amp xtreme - $999.99
5080 - Zotac Amp Extreme - $1,499.99
Stateside prices without Tax
 
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Well no, not really. Instead of 1 8core CCX, there is 2 8core CCXs spaced about 1cm apart. Heat density increases in such a situation. So the temps being only about 10C apart is rather remarkable.


Even accounting for that, it's still remarkable that the 9800X3D and the 9950X3D are only a few degrees apart.
That 1cm apart is enough to improve thermal density a lot in such constrained space.
Even so, it's also 2x more area for a ~42% TDP increase (120 to 170W), heat density still goes down.
 
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Test Setup doesn't elaborate on the settings used for PBO Max that I could find.

I would like to understand this more because "what if" CO was applied without increasing power limits?
Would not applying more power still help in getting better boost clocks (or general performance) in that scenario without increasing heat?

( probably off topic question - daily lunch time musings )
Also what if PBO & CO were only applied in a way to match core clocks with each other instead of trying to maximize each core's frequency potential.
Does that help smooth out potential game play issues.

(edit -- back to the topic) I found the PBO settings here although (just my personal opinion) I think the overclock settings should be under Test Setup.

There are two PBO overclocking settings that I am curious about how it was decided.
  1. "Then, I removed all the power and current limits"
To my knowledge removing all power limits has never really be the smart way to use PBO because it ends up creating more heat defeating the ability to maximize performance. Typically what I have seen here in the past on these forums is a careful balancing act between the power limits is used to reach the best performance with PBO.
  • "I also set +200 MHz with a scalar of x10"
I've never known increasing scalar to help much. How is was this value determined when deciding to use it in the testing?
 
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That 1cm apart is enough to improve thermal density a lot in such constrained space.
That depends on the cooler. I'm not disputing that the heat density won't be spread out, only that there will be a significant increase of it in the limit space under an IHS of the same size.
 
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The CPU looks great but its way too expensive.
$700 for a 16core top tier CPU? Seriously? IF that's too expensive to you, stay with an older platform. This is effectively AMD's "Extreme Edition" CPU at $300 lower than Intel had been charging for nearly 20 years, and at higher over-all performance.
 
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Benchmark Scores RIP Ryzen 9 5950x, ASRock X570 Taichi (v1.06), 128GB Micron DDR4-3200 ECC UDIMM (18ASF4G72AZ-3G2F1)
Well no, not really. Instead of 1 8core CCX, there is 2 8core CCXs spaced about 1cm apart. Heat density increases in such a situation. So the temps being only about 10C apart is rather remarkable.


Even accounting for that, it's still remarkable that the 9800X3D and the 9950X3D are only a few degrees apart.
I suspect it's an indicator that you can increase the 9800X3D efficiency even more (with minimal performance losses) by decreasing the power limit closer to 130W. But like you said before binning may also come into play. I wonder if disabling the 2nd CCD and readjusting the power limit to match 9800X3D would prove 9950X3D has better binned cores?
 
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