...and as documented by the past three Intel node reductions, no tangible performance is gained with die shrinks below ~32Nm. The die shrink is primarily for lower power consumption, increased transistor density and lower unit costs. That's why AMD is in no hurry to rush to smaller node sizes.
AMD is doing a very good job on their APU designs. Carrizo should make a lot of people very happy. AMD is scheduled to officially release these chippies in Q2 of '15. They are actually in production now.
For those not up top speed on die shrink sizes, there is almost zero performance gain now that we are below 32Nm. The biggest gains in die shrink are lower power and higher transistor density, which reduce CPU/APU costs. With AMD's advanced power management on Carrizo, power consumption is reduced even further than in prior low power APU models.
Carrizo APUs will be available in both mobile and desktop versions with mobile models being released first.