I would actually like to see your source about this.
Industry and technical analysts all are in a pretty nice agreement that Intel's 10nm is in the same group with TSMC/Samsung 7nm. Similarly Intel's 7nm in the same group with TSMC/Samsung 5nm.
Mobile chips are from a different variation of manufacturing process. 90% of theoretical density is rather normal for that.
High performance chips come with a much lower density, from all manufacturers.
You are right about Intel not having real implementation with max density in a product . On the other hand, I have no idea what in their product portfolio would not be using the high performance variation. IIRC Intel has said their 10nm has two high performance variations with 80 MTr/mm2 and 65 MTr/mm2.
At the same time, I cannot think of anything from Samsung's 7nm that would be on high performance variation. The main use so far are the mobile SoCs. Can you think of something Samsung has manufactured?
Edit:
Apparently Intel did have a kind of product with high density in the 10nm failure times. i3-8121U had 100.8 MTr/mm2:
Intel 10 nm Logic Process Analysis (Cannon Lake) | TechInsights