- CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of two new 14" Chromebooks for enterprise: the CTL Chromebook Plus Enterprise PX141G Series and the CTL Chromebook Enterprise PX141E Series. Featuring an included Chrome Enterprise Upgrade license, these new Chromebooks offer professionals the speed, power, and connectivity they need for daily on-the-go productivity. Easy ChromeOS device manageability combined with CTL's life cycle services reduces the burden on IT departments.

"With an included Chrome Enterprise Upgrade license, these Chromebooks can be deployed instantly to serve in any number of enterprise applications, such as retail, healthcare, and front-line workers, for example. As a leader in the ChromeOS space, we know our customers will appreciate the design, performance, and, in the Chromebook Plus model, the enhanced AI and cybersecurity capabilities of this next-generation device," said Jason Mendenhall, CEO of CTL.

PNY announced today the newest additions to its Flash Drive assortment, the PRO Elite V3 USB 3.2 Gen 2 and Attaché X USB 3.2 Flash Drives. PRO Elite V3 USB 3.2 Gen 2 Flash Drives advance file management to the next level, boasting extreme speeds of up to 1,000 MB/s read and up to 800 MB/s write, with storage capacities ranging from 256 GB - 1 TB, while the Attaché X brings a sleek and modern design with boosted performance for mainstream users

Exceptional Performance Storage Solution
PNY's new PRO Elite V3 brings a new level of speed and reliability to its high-performance USB product assortment. Exceptional performance improvements boost maximum speeds up to 1,000 MB/s read and up to 800 MB/s write, achieving speeds 265x faster than standard USB 2.0 flash drives. Experience the elevated performance of the PRO Elite V3's USB 3.2 Gen 2 flash drive technology to enhance workflows with demanding applications. PRO Elite V3 was designed to be an invaluable asset for content creators, professionals, designers, and gamers who need to store, access, and transfer critical, high-density files such as movies, professional high-resolution photos, video gaming data, and full HD & 4K videos at incredible speeds.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.

Apple today announced iPhone 16 and iPhone 16 Plus, built for Apple Intelligence, the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. The iPhone 16 lineup also introduces Camera Control, which brings new ways to capture memories, and will help users quickly access visual intelligence to learn about objects or places around them faster than ever before. The powerful camera system features a 48MP Fusion camera with a 2x Telephoto option, giving users two cameras in one, while a new Ultra Wide camera enables macro photography. Next-generation Photographic Styles help users personalize their images, and spatial photo and video capture allows users to relive life's precious memories with remarkable depth on Apple Vision Pro. The new A18 chip delivers a huge leap in performance and efficiency, enabling demanding AAA games, as well as a big boost in battery life.

iPhone 16 and iPhone 16 Plus will be available in five bold colors: black, white, pink, teal, and ultramarine. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

Apple today introduced iPhone 16 Pro and iPhone 16 Pro Max, featuring Apple Intelligence, larger display sizes, new creative capabilities with innovative pro camera features, stunning graphics for immersive gaming, and more—all powered by the A18 Pro chip. With Apple Intelligence, powerful Apple-built generative models come to iPhone in the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. Camera Control unlocks a fast, intuitive way to tap into visual intelligence and easily interact with the advanced camera system. Featuring a new 48MP Fusion camera with a faster quad-pixel sensor that enables 4K120 FPS video recording in Dolby Vision, these new Pro models achieve the highest resolution and frame-rate combination ever available on iPhone. Additional advancements include a new 48MP Ultra Wide camera for higher-resolution photography, including macro; a 5x Telephoto camera on both Pro models; and studio-quality mics to record more true-to-life audio. The durable titanium design is strong yet lightweight, with larger display sizes, the thinnest borders on any Apple product, and a huge leap in battery life—with iPhone 16 Pro Max offering the best battery life on iPhone ever.

iPhone 16 Pro and iPhone 16 Pro Max will be available in four stunning finishes: black titanium, natural titanium, white titanium, and desert titanium. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of the new CTL Chromebook PX141E Series. This series equips educators, staff, and students with the powerful performance and connectivity they need for all-day productivity. Easy ChromeOS device manageability combined with CTL's lifecycle services reduces the burden on IT departments.

"We are excited to refresh our product line with the next-generation 14" Chromebook. As the new powerhouse performer in our Chromebook lineup, we know our education and enterprise customers will appreciate the upgraded power, Wi-Fi, memory, and storage to support all day teaching and learning, while new conveniences such as the webcam privacy shutter and additional USB-A port enhance useability," said Erik Stromquist, CEO of CTL.

According to the leaked listing posted on X by user @Orlak29_, reports suggest that Pro versions of the AMD Ryzen 7 AI and Ryzen 9 AI are in the pipeline, with a potential game-changer in the form of the high-end "Strix Halo" model. The standout feature of the Strix Halo is its rumored support for up to 128 GB of RAM, a significant leap from AMD's current offerings. This massive memory capacity could prove valuable for AI workloads and data-intensive applications, potentially positioning AMD better against offerings from Intel and Qualcomm. Leaked diagrams hint at a unique design for the Strix Halo, featuring a chiplet layout reminiscent of a graphics card. The processor is reportedly surrounded by memory on three sides, enabling the massive 128 GB capacity.

While this top-tier model is expected to carry a premium price, it could find a ready market among professionals and enthusiasts demanding both raw processing power and extensive memory resources. On the performance front, rumors suggest the Strix Halo will boast up to 16 Zen 5 cores and a GPU with 40 Compute Units based on RDNA 3.5 architecture. This combination might rival the performance of high-end mobile GPUs like the RTX 4060 or even the RTX 4070 for laptops.
As with previous generations, AMD is expected to release Pro versions of these processors with additional features like ECC memory support.

Today Lenovo introduced the Lenovo Tab Plus, an entertainment tablet that delivers an outstanding sonar experience with Eight JBL speakers with Hi-fi matrix structure tuned by Dolby Atmos. Designed for music lovers, the 11.5-inch tablet complements its premium sound with a 2K display for vivid visuals and an adjustable stand for optimal enjoyment from every angle.

"Tablets have evolved to meet the needs of people transitioning between work, study and play, offering a balanced combination of mobility and performance," said Tony Chen, vice president of Tablets, Intelligent Devices Group, Lenovo. "As the tablet market recovers, customers can expect increased Lenovo product differentiation through features that address their specific demands. The Lenovo Tab Plus is a prime example of a well-rounded tablet that delivers premium sound for a truly immersive entertainment experience."

AAEON, a leading provider of Computer-on-Modules, has today announced the NanoCOM-RAP, a COM Express Type 10 CPU Module powered by 13th Generation Intel Core processors. Available in SKUs ranging from the Intel Processor U300E to the Intel Core i7-1365UE CPU, the NanoCOM-RAP offers up to 10 cores, 12 threads, and high maximum turbo frequency across both its performance and efficient cores.

It is clear from the combination of high CPU performance and relatively low power consumption of its processor selection that the NanoCOM-RAP is catered towards customers that require a small, flexible, and scalable solution. This is particularly apparent in AAEON's investment into the module's memory and storage, where it has upgraded on the LPDDR4 offered by the NanoCOM-RAP's predecessor by equipping the board with 16 GB of LPDDR5. As a default, the NanoCOM-RAP offers two SATA drives, while additional expansion in this area can be found via four PCIe slots. 128 GB of onboard NVMe is also available on an optional basis.
Integrated Intel UHD Graphics support dual display outputs via both DDI and eDP outputs with resolutions of up to 3840 x 2160 at 60 Hz. This configuration, along with the module's high definition audio interface lends the NanoCOM-RAP to use in the AI vision space.

ASUS today announced the ASUS Chromebook CR series of laptops, tailored to meet the needs of K-12 students. The ASUS Chromebook CR Series stands out as the ideal companion for students, whether engaged in in-person classroom learning or remote education. The rugged and modular design, featuring replaceable internal parts, guarantees both durability and longevity. With 11.6-inch or 12.2-inch Corning Gorilla Glass touchscreens and a 180° lay-flat or 360°-flippable hinge, the laptops offer flexibility for enriched educational experiences. This design fosters the adventurous mindset of modern students, ensuring an enjoyable and secure learning journey, whether they're engaging in online courses or in-class sessions—ready for every learning journey.

A trusted study partner
For K-12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CR series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning

Apple today announced the redesigned 11-inch and all-new 13-inch iPad Air, supercharged by the M2 chip. Now available in two sizes for the first time, the 11-inch iPad Air is super-portable, and the 13-inch model provides an even larger display for more room to work, learn, and play. Both deliver phenomenal performance and advanced capabilities, making iPad Air more powerful and versatile than ever before. Featuring a faster CPU, GPU, and Neural Engine in M2, the new iPad Air offers even more performance and is an incredibly powerful device for artificial intelligence. The front-facing Ultra Wide 12MP camera with Center Stage is now located along the landscape edge of iPad Air, which is perfect for video calls. It also includes faster Wi-Fi, and cellular models include super-fast 5G, so users can stay connected on the go. With a portable design, all-day battery life, a brilliant Liquid Retina display, and support for Apple Pencil Pro, Apple Pencil (USB-C), and Magic Keyboard, iPad Air empowers users to be even more productive and creative. The new iPad Air is available in new blue and purple finishes, along with starlight and space gray. The 11-inch iPad Air still starts at just $599, and the 13-inch iPad Air is a fantastic value at just $799. Customers can order the new iPad Air today, with availability beginning Wednesday, May 15.

"So many users—from students, to content creators, to small businesses, and more—love iPad Air for its performance, portability, and versatility, all at an affordable price. Today, iPad Air gets even better," said Bob Borchers, Apple's vice president of Product Marketing. "We're so excited to introduce the redesigned 11-inch and all-new 13-inch iPad Air, offering two sizes for the first time. With its combination of a brilliant Liquid Retina display, the phenomenal performance of the M2 chip, incredible AI capabilities, and its colorful, portable design with support for new accessories, iPad Air is more powerful and versatile than ever."

Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128 GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1β (1-beta) technology, the 128 GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. Micron's 128 GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along with many others.

Meta has announced the next generation of its Meta Training and Inference Accelerator (MTIA) chip, which is designed to train and infer AI models at scale. The newest MTIA chip is a second-generation design of Meta's custom silicon for AI, and it is being built on TSMC's 5 nm technology. Running at the frequency of 1.35 GHz, the new chip is getting a boost to 90 Watts of TDP per package compared to just 25 Watts for the first-generation design. Basic Linear Algebra Subprograms (BLAS) processing is where the chip shines, and it includes matrix multiplication and vector/SIMD processing. At GEMM matrix processing, each chip can process 708 TeraFLOPS at INT8 (presumably meant FP8 in the spec) with sparsity, 354 TeraFLOPS without, 354 TeraFLOPS at FP16/BF16 with sparsity, and 177 TeraFLOPS without.

Classical vector and processing is a bit slower at 11.06 TeraFLOPS at INT8 (FP8), 5.53 TeraFLOPS at FP16/BF16, and 2.76 TFLOPS single-precision FP32. The MTIA chip is specifically designed to run AI training and inference on Meta's PyTorch AI framework, with an open-source Triton backend that produces compiler code for optimal performance. Meta uses this for all its Llama models, and with Llama3 just around the corner, it could be trained on these chips. To package it into a system, Meta puts two of these chips onto a board and pairs them with 128 GB of LPDDR5 memory. The board is connected via PCIe Gen 5 to a system where 12 boards are stacked densely. This process is repeated six times in a single rack for 72 boards and 144 chips in a single rack for a total of 101.95 PetaFLOPS, assuming linear scaling at INT8 (FP8) precision. Of course, linear scaling is not quite possible in scale-out systems, which could bring it down to under 100 PetaFLOPS per rack.Below, you can see images of the chip floorplan, specifications compared to the prior version, as well as the system.

During the Vision 2024 event, Intel announced its latest Gaudi 3 AI accelerator, promising significant improvements over its predecessor. Intel claims the Gaudi 3 offers up to 70% improvement in training performance, 50% better inference, and 40% better efficiency than Nvidia's H100 processors. The new AI accelerator is presented as a PCIe Gen 5 dual-slot add-in card with a 600 W TDP or an OAM module with 900 W. The PCIe card has the same peak 1,835 TeraFLOPS of FP8 performance as the OAM module despite a 300 W lower TDP. The PCIe version works as a group of four per system, while the OAM HL-325L modules can be run in an eight-accelerator configuration per server. This likely will result in a lower sustained performance, given the lower TDP, but it confirms that the same silicon is used, just finetuned with a lower frequency. Built on TSMC's N5 5 nm node, the AI accelerator features 64 Tensor Cores, delivering double the FP8 and quadruple FP16 performance over the previous generation Gaudi 2.

The Gaudi 3 AI chip comes with 128 GB of HBM2E with 3.7 TB/s of bandwidth and 24 200 Gbps Ethernet NICs, with dual 400 Gbps NICs used for scale-out. All of that is laid out on 10 tiles that make up the Gaudi 3 accelerator, which you can see pictured below. There is 96 MB of SRAM split between two compute tiles, which acts as a low-level cache that bridges data communication between Tensor Cores and HBM memory. Intel also announced support for the new performance-boosting standardized MXFP4 data format and is developing an AI NIC ASIC for Ultra Ethernet Consortium-compliant networking. The Gaudi 3 supports clusters of up to 8192 cards, coming from 1024 nodes comprised of systems with eight accelerators. It is on track for volume production in Q3, offering a cost-effective alternative to NVIDIA accelerators with the additional promise of a more open ecosystem. More information and a deeper dive can be found in the Gaudi 3 Whitepaper.

Samsung Electronics America, the leader in advanced memory technology, today introduced the latest iteration of its EVO Select and EVO Plus microSD cards, designed for mobile devices and handheld gaming consoles. The Samsung EVO Select and EVO Plus microSD cards boast increased transfer speeds of up to 160 MB/s, a 23% increase over their predecessors. They offer a turnkey way for everyday users and gamers to add storage space to their devices for content like games, files, photos, and videos.

"With the mobile and handheld gaming market on the rise, we sought to make data transfers on those devices even faster with these updated EVO Select and EVO Plus lines," said Jose Hernandez, Senior Director of Memory Product Marketing at Samsung. "We also heard the need for more space options like a 1 TB memory card for digital files like games, video footage from phones, cameras and drones, photos, and creative designs. With this addition to the lineup, you can be confident you'll have plenty of space, fast speeds and the durability needed to last for years to come."

Earlier teardowns of 13-inch Apple M3 MacBook Air models revealed a pleasing storage performance upgrade. Popular American e-commerce watchdog, iFixit, has joined in on the fun—CEO Kyle Wiens has confirmed that the 15-inch M3 MacBook Air 256 GB base model also houses two 128 GB flash storage chips. A provisional repairability score of 5 out of 10 has been awarded—this verdict could change once iFixit staffers finish up in-depth investigations into Apple's latest thirteen and fifteen inch ultraslim notebooks. A revised figure might appear online once the site publishes its full how-to-guides.

iFixit's video teardown demonstrates that not much has changed when comparing the new models to Apple's M2 MacBook Air family of products. Tinkerers will face the usual obstacles, mainly dreaded pentalobe screw designs. The team discovered plastic pull-tabs during the removal of M3 MacBook Air batteries—a pleasing alternative to older (headache inducing) adhesive-fastened methods of securing power cells in place. The iFixit team had to deal with many fiddly screws and brackets during excavation efforts—they noted that Apple's interior design does not include any labelling, and the screws are not numbered. Framework's Laptop 16 was cited as a shining example of doing things correctly.

ASUS today announced BIOS updates that enable support for up to 256 GB of memory on its Intel 700 and 600 series motherboards that use DDR5 modules. Such models with four DIMM slots can now support up to 256 GB of memory, while such models with two DIMM slots can now support up to 128 GB. These enhancements significantly improve multitasking potential, ensuring smooth and seamless computing. AMD AM5 motherboards from ASUS do not require a BIOS update to enable support for up to 256 GB of DDR5 memory modules.

The BIOS updates can be accessed on the ASUS support pages for the models listed below.

CTL, a global cloud computing solution leader for education and enterprise, will demonstrate the world's first Chromebook supporting 5G RedCap connectivity powered by, which was the world's first announced commercial release 17 5G RedCap modem RF system. CTL is preparing its Chromebook product lines for the future, where 5G will replace LTE connectivity. With more schools and enterprises standing up private cellular networks for anytime, anywhere connectivity, CTL is at the forefront of bringing built-in 5G connectivity to Chromebook devices.

Erik Stromquist, CTL's CEO, said, "CTL is committed to developing and introducing affordable solutions for the education and enterprise markets. We believe there is a big opportunity to address the digital divide by providing more advanced and affordable private network solutions to extend internet access to every user regardless of location. We are thrilled to collaborate with Qualcomm Technologies in demonstrating 5G next-gen possibilities at this year's Mobile World Congress."

An exclusive report provides an initial tease of MSI's relaunch of MPOWER—a beloved product line of high performance yet wallet friendly motherboards. Wccftech published their Z790MPOWER model coverage only a few hours ago. MSI's final batch of MPOWER-branded boards landed back in 2017, with Z170 and Z270 chipsets (on Intel Socket 1151). Here is Wccftech's statement on the matter: "MSI is marking the return of the MPOWER series with a new and cost-effective Z790 product, the Z790MPOWER. This motherboard may look like a very mainstream design but it has something that only a few high-end motherboards can do and that is support for the best DDR5 memory out there."

They moved onto showcasing the board's feature set: "Starting with the details, the MSI Z790MPOWER motherboard features the LGA 1700/1800 socket & supports 12th, 13th, and 14th Gen CPUs from Intel. It is powered by a 15-Phase VRM design which is provided power through dual 8-pin connectors. There are large heatsinks over the VRMs and the Mini-ATX with a silver and black finish looks great." The usual bits of overclocking terminology adorn Z790MPOWER's various heatsinks—including "Overclock, Frequency, MHz, Voltages and Clock."

Chinese company Sipeed has introduced the Lichee Pocket 4A, one of the first handheld gaming devices based on the RISC-V open-source instruction set architecture (ISA). Sipeed positions the device as a retro gaming platform capable of running simple titles via software rendering or GPU acceleration. At its core is Alibaba's T-Head TH1520 processor featuring four 2.50 GHz Xuantie C910 RISC-V general-purpose CPU cores and an unnamed Imagination GPU. The chip was originally aimed at laptop designs. Memory options include 8 GB or 16 GB LPDDR4X RAM and 32 GB or 128 GB of storage. The Lichee Pocket 4A has a 7-inch 1280x800 LCD touchscreen, Wi-Fi/Bluetooth connectivity, and an array of wired ports like USB and Ethernet. It weighs under 500 grams. The device can run Android or Linux distributions like Debian, Ubuntu, and others.

As an early RISC-V gaming entrant, performance expectations should be modest—the focus is retro gaming and small indie titles, not modern AAA games. Specific gaming capabilities remain to be fully tested. However, the release helps showcase RISC-V's potential for consumer electronics and competitive positioning against proprietary ISAs like ARM. Pricing is still undefined, but another Sipeed handheld console retails for around $250 currently. Reception from enthusiasts and developers will demonstrate whether there's a viable market for RISC-V gaming devices. Success could encourage additional hardware experimentation efforts across emerging open architectures. With a 6000 mAh battery, battery life should be decent. Other specifications can be seen in the table below, and the pre-order link is here.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly announces that GIGABYTE DDR5 motherboards deliver breakthrough support for a memory capacity of single DIMM 64 GB with the latest Kingston FURY Renegade DDR5 memory. The 4DIMM model boosts the memory capacity up to 256 GB, while the 2DIMM model has a maximum capacity of up to 128 GB.⁠

With innovative layout design and top-notch components, GIGABYTE motherboards have played a leading role in memory performance. From the Intel 700 and 600 series to the AMD 600 series, GIGABYTE DDR5 motherboards will support a memory capacity of single DIMM 64 GB through BIOS update. The updated BIOS and memory support list will be available on the GIGABYTE official website, coinciding with the launch of the latest Kingston FURY Renegade DDR5 memory. Please stay tuned to the GIGABYTE official website for further information.

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers and IT infrastructure, is thrilled to present a cutting-edge series of servers optimized for the newly launched Intel Xeon E-2400 processors. These servers deliver essential computing power, ensuring a dependable workload for a wide range of enterprise and edge computing applications, all while maintaining an impressive price-to-performance ratio.

"We are thrilled to unveil our latest server product line, which is engineered to deliver unparalleled performance and reliability," said Vincent Wang, sales VP at Giga Computing. "By leveraging the power of the new Intel Xeon E processors, our servers empower businesses to elevate their computational capabilities, enabling them to achieve greater efficiency and productivity. Whether it's for enterprise applications or edge computing tasks, GIGABYTE servers are the cornerstone of innovation in the digital landscape." ⁠

ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC. The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128 GB to 2 TB. 112-layer 3D NAND (BiCS5) 31D series SSDs all support thermal throttling technology, which reduces SSD transmission performance in stages to effectively mitigate the risk of data damage due to overheating. Furthermore, a LDPC ECC error correction mechanism and End-to-End Data Protection technology ensure reliable data transfer and improve data integrity. The 31D series is eminently suitable for POS systems, information kiosks, digital signage, and embedded equipment.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, and IT infrastructure, today announced the GIGABYTE G383-R80 for the AMD Instinct MI300A APU and two GIGABYTE G593 series servers for the AMD Instinct MI300X GPU and AMD EPYC 9004 Series processor. As a testament to the performance of AMD Instinct MI300 Series family of products, the El Capitan supercomputer at Lawrence Livermore National Laboratory uses the MI300A APU to power exascale computing. And these new GIGABYTE servers are the ideal platform to propel discoveries in HPC & AI at exascale.⁠

Marrying of a CPU & GPU: G383-R80
For incredible advancements in HPC there is the GIGABYTE G383-R80 that houses four LGA6096 sockets for MI300A APUs. This chip integrates a CPU that has twenty-four AMD Zen 4 cores with a powerful GPU built with AMD CDNA 3 GPU cores. And the chiplet design shares 128 GB of unified HBM3 memory for impressive performance for large AI models. The G383 server has lots of expansion slots for networking, storage, or other accelerators, with a total of twelve PCIe Gen 5 slots. And in the front of the chassis are eight 2.5" Gen 5 NVMe bays to handle heavy workloads such as real-time big data analytics and latency-sensitive workloads in finance and telecom. ⁠