Apple today introduced the new iPad mini, supercharged by the A17 Pro chip and Apple Intelligence, the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. With a beloved ultraportable design, the new iPad mini is available in four gorgeous finishes, including a new blue and purple, and features the brilliant 8.3-inch Liquid Retina display. A17 Pro delivers a huge performance boost for even the most demanding tasks, with a faster CPU and GPU, a 2x faster Neural Engine than the previous-generation iPad mini, and support for Apple Intelligence. The versatility and advanced capabilities of the new iPad mini are taken to a whole new level with support for Apple Pencil Pro, opening up entirely new ways to be even more productive and creative. The 12MP wide back camera supports Smart HDR 4 for natural-looking photos with increased dynamic range, and uses machine learning to detect and scan documents right in the Camera app.

The new iPad mini features all-day battery life and brand-new experiences with iPadOS 18. Starting at just $499 with 128 GB—double the storage of the previous generation—the new iPad mini delivers incredible value and the full iPad experience in an ultraportable design. Customers can pre-order the new iPad mini today, with availability beginning Wednesday, October 23.

TSMC's 2 nm-class foundry node, dubbed N2, will enter mass production only in 2025, a report by the Financial Times says. The premier Taiwan-based foundry has been reportedly showcasing TSMC N2 to its biggest customer for advanced nodes, Apple. The node will likely power Apple's in-house silicon that drives the iPhone 17 Pro and Pro Max devices that are slated for 2025. This implies that the current 3 nm class nodes from TSMC will continue to power Apple silicon into 2024 and its iPhone 16 Pro/Pro Max.

The current Apple A17 Pro and M3 chips powering the iPhone 15 Pro/Max and the H2-2023 Macs are based on TSMC's N3 node, with a 183 MTr/mm² transistor density. TSMC has four other 3 nm-class nodes, with the N3E node that just entered mass production to offer a jump to 215.6 MTr/mm², and its 2024 successor, the N3P, pushing transistor densities further up to 224 MTr/mm². TSMC's first 2 nm-class node, the N2, offers a jump to around 259 MTr/mm², which makes the N3P a nice halfway point for Apple between the N3 and N2, for its 2024 silicon.

AMD FidelityFX Super Resolution (FSR) is an open-source resolution upscaling technology that takes lower-resolution input and uses super-resolution temporal upscaling technology, frame generation using AMD Fluid Motion Frames (AFMF) technology, and built-in latency reduction technology to provide greater-resolution output images from lower-resolution settings. While the technology is open-source, it battles in market share with NVIDIA and the company's Deep Learning Super Sampling (DLSS). However, in the mobile space, there hasn't been much talk about implementing upscaling technology up until now. According to a popular leaker @Tech_Reve on X/Twitter, we have information that AMD is collaborating with Samsung and Qualcomm to standardize on upscaling technology implementations in mobile SoCs.

Not only does the leak imply that the AMD FSR technology will be used in Samsung's upcoming Exynos SoC, but some AMD ray tracing will be present as well. The leaker has mentioned Qualcomm, which means that future iterations of Snapdragon are up to adopt the FSR algorithmic approach to resolution upscaling. We will see how and when, but with mobile games growing in size and demand, FSR could come in handy to provide mobile gamers with a better experience. Primarily, this targets Android devices, which Qualcomm supplies, where Apple's iPhone recently announced MetalFX Upscaling technology with an A17 Pro chip.

An Apple "iPhone16,1" was put through the Geekbench 6.2 gauntlet earlier this week—according to database info this pre-retail sample was running a build of iOS 17.0 (currently in preview) and its logic board goes under the "D83AP" moniker. It is interesting to see a unit hitting the test phase only a day after the unveiling of Apple's iPhone 15 Pro and Max models—the freshly benched candidate seems to house an A17 Pro system-on-chip. The American tech giant has set lofty goals for said flagship SoC, since it is "the industry's first 3-nanometer chip. Continuing Apple's leadership in smartphone silicon, A17 Pro brings improvements to the entire chip, including the biggest GPU redesign in Apple's history. The new CPU is up to 10 percent faster with microarchitectural and design improvements, and the Neural Engine is now up to 2x faster."

Tech news sites have pored over the leaked unit's Geekbench 6.2 scores—its A17 Pro chipset (TSMC N3) surpasses the previous generation A16 Bionic (TSMC N4) by 10% in single-core stakes. Apple revealed this performance uplift during this week's iPhone "Wonderlust" event, so the result is not at all surprising. The multi-score improvement is a mere ~3%, suggesting that only minor tweaks have been made to the underlying microarchitecture. The A17 Pro beats Qualcomm's Snapdragon 8 Gen 2 in both categories—2914 vs. 2050 (SC) and 7199 vs. 5405 (MC) respectively. Spring time leaks indicated that the "A17 Bionic" was able to keep up with high-end Intel and AMD desktop CPUs in terms of single-core performance—the latest Geekbench 6.2 entry semi-confirms those claims. The A17 Pro's single-threaded performance is within 10% of Intel Core i9-13900K and Ryzen 9 7950X processors. Naturally, Apple's plucky mobile chip cannot put up a fight in the multi-core arena, additionally Tom's Hardware notes another catch: "A17 Pro operates at 3.75 GHz, according to the benchmark, whereas its mighty competitors work at about 5.80 GHz and 6.0 GHz, respectively."

Apple today debuted iPhone 15 Pro and iPhone 15 Pro Max, designed with aerospace-grade titanium that's strong yet lightweight to deliver Apple's lightest Pro models ever. The new design also features contoured edges and a customizable Action button, allowing users to personalize their iPhone experience. Powerful camera upgrades enable the equivalent of seven pro lenses with incredible image quality, including a more advanced 48MP Main camera system that now supports the new super-high-resolution 24MP default, the next generation of portraits with Focus and Depth Control, improvements to Night mode and Smart HDR, and an all-new 5x Telephoto camera exclusively on iPhone 15 Pro Max. A17 Pro unlocks next-level gaming experiences and pro performance. The new USB‑C connector is supercharged with USB 3 speeds—up to 20x faster than USB 2—and together with new video formats, enables powerful pro workflows that were not possible before. And with the addition of Roadside Assistance via satellite, the iPhone 15 Pro lineup builds on Apple's innovative satellite infrastructure to connect users to help if they have car trouble while off the grid.

iPhone 15 Pro and iPhone 15 Pro Max will be available in four stunning new finishes, including black titanium, white titanium, blue titanium, and natural titanium. Pre-orders begin Friday, September 15, with availability beginning Friday, September 22.

Samsung's unannounced Exynos 2400 mobile chipset has been linked to the upcoming Galaxy S24 smartphone family, but internet tipsters have speculated that the in-house SoC will be reserved for the baseline model only. The more expensive Plus and Ultra variants could be the main targets for flagship smartphone fetishists - it is possible that Qualcomm's upper echelon Snapdragon 8 Gen 3 chipset is set to feature within these premium devices. Samsung's Exynos processors are not considered to be fan favorites, but industry insiders reckon that the latest performance figures indicate that Samsung's up-and-comer has the potential to turn some heads. Exact specifications for the Exynos 2400 are not public knowledge - one of the tipsters suggests that a 10-core layout has been settled on by Samsung, as well as a recent bump up in GPU core count - from 6 to 12. The company's own 4 nm SF4P process is the apparent choice set for production line.

A leaker has posted benchmark scores generated by an unknown device that was running an Exynos 2400 SoC - the Geekbench 5 results indicate an average single-core score of 1530 with a peak of 1711. The multi-core average score is shown to be 6210, and the highest number achieved is 6967. Therefore the Exynos 2400 is 31% percent faster (in multi-core performance) than the refreshed Snapdragon 8 Gen 2 variant currently found in Galaxy S23 Ultra smartphones, but the divide between the two in terms of single-core performance is not so great. The 2400 manages to outpace (by 30%) Apple's present generation Bionic A16's average multi-core score, although the latter beats the presumed engineering sample's single-core result by 20%. The Exynos 2400 will face a new lineup of rival mobile processors in 2024 - namely Apple's next generation Bionic A17 and Qualcomm's Snapdragon 8 Gen 3, so it is difficult to extrapolate today's leaked figures into a future scenario.

Conflicting reports are flying around about Apple's next generation MacBook Air lineup, mostly surrounding suggestions of a firm release date or debut reveal at WWDC 2023. 9to5Mac claims that its insider sources have pointed to a new range of M3 chipset powered MacBook Air extra thin laptops offered up in two different screen sizes: 13-inch and 15-inch. An insider claimed last month that Apple's upcoming laptop lineup was in an advanced stage of production, and was far along enough to warrant an "imminent" launch window. A Taiwanese publication has presented new evidence this week, and it posits that Apple could drop M3 chipset-based laptops from announcement presentations organized for this year's Worldwide Developers Conference, which is set to take place from June 5 to 9.

According to the financial section of Taiwan's UDN news site, Apple's key decision makers could be in favor of fielding laptops based on its current generation M2 SoC, instead of an entry-level M3-based range, due to delays and changes in priority for the N3B node at TSMC foundries. This is seen as an odd move given reports from earlier this month of Apple requesting a reduction in factory output for its M2 chips, following a slump in demand. Apple could be changing its strategy with regards to the alleged surplus of M2 silicon - the article theorizes that the company will spend more time fitting the older generation chipsets into a new range of laptops and desktop computers. An M3-based product line could be delayed into late 2023, and it is alleged that TSMC has been instructed to concentrate mostly on manufacturing Apple's Bionix A17 mobile chipset via the cutting edge 3 nm FinFet technology process (N3B) - earmarked to debut on the iPhone 15 Pro in autumn 2023.

A technology tipster has been dropping multiple tidbits this week about Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset - this follows a leak (from a different source, going back to mid-April) about the next generation Adreno 750 GPU getting tuned up for a battle against Apple's Bionic A17 in terms of graphics benchmarks. The latest leak points to the GPU being clocked at 900 MHz, rather than the rumored higher figure of 1.0 GHz speed (garnered from tests at Qualcomm's labs). The focus has now turned to the next generation flagship Snapdragon's CPU aspect, with information emerging about core clock speeds and multiple cluster configurations.

Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.

An online tipster, posting on the Chinese blog site Weibo, has let slip that Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset is touted to pack some hefty graphical capabilities. The suggested Adreno "750" smartphone and tablet GPU is touted to offer a 50% increase over the present generation Adreno 740 - as featured on the recently released and cutting-edge Snapdragon 8 Gen 2 chipset. The current generation top-of-the-range Snapdragon is no slouch when it comes to graphics benchmarks, where it outperforms Apple's prime contender - the Bionic A16 SoC.

The Snapdragon 8 Gen 3 SoC is expected to launch in the last quarter of 2023, but details of the flagship devices that it will power are non-existent at the time of writing. The tipster suggests that Qualcomm has decided to remain on TSMC's 4 nm process for its next generation mobile chipset - perhaps an all too safe decision when you consider that Apple has upped the stakes with the approach of its Bionic A17 SoC. It has been reported that the Cupertino, California-based company has chosen to fabricate via TSMC's 3 nm process, although the Taiwanese foundry is said to be struggling with its N3 production line. The engineers at Qualcomm's San Diego headquarters are alleged to be experimenting with increased clock speeds running on the next gen Adreno GPU - as high as 1.0 GHz - in order to eke out as much performance as possible, in anticipation of besting the Bionic A17 in graphics benchmarks. The tipster theorizes that Qualcomm will still have a hard time matching Apple in terms of pure CPU throughput, so the consolation prize will lie with a superior GPU getting rigged onto the Snapdragon 8 Gen 3.

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter. The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to ongoing problems with FinFET limitations.

The leakers have recently revealed more up-to-date A17 Bionic's Geekbench 6 scores, with single thread performance at 3019, and multi-thread at 7860. Various publications have been hyping the mobile SoC's single thread performance as matching that of desktop CPUs from Intel and AMD, more specifically 13th-gen Core i7 and 'high-end' Ryzen models. Naturally the A17 Bionic cannot compete with these CPUs in terms of multi-thread performance.