AMD today announced that it will webcast a special product showcase taking place at the AMD GPU '14 Tech Day event Wednesday, Sept. 25, 2013 at 3 p.m. EDT.
A real-time video webcast of the showcase can be accessed on the Investor Relations homepage. A replay of the webcast can be accessed approximately one hour after the conclusion of the live event and will be available for 30 days after the event. Additionally, viewers may access the webcast on the AMD Gaming Facebook page and AMD'sYouTube channel. A replay of the webcast can be accessed on AMD's YouTube channel.

AMD's two low-cost socket FM2 APUs based on the 32 nm "Richland" silicon, the A8-6500T, and A10-6700T, began selling in the US. The two are priced at $108.59 and $155.91 a piece, respectively. Their biggest feature is the 45W TDP, compared to 65W on regular SKUs, and 100W on the factory-unlocked ones. Both are quad-core parts. The A8-6500T features CPU clock speeds of 2.10 GHz, with 3.10 GHz TurboCore speeds, Radeon HD 8550D integrated graphics with 256 stream processors, and 4 MB of L2 cache; whereas the A10-6700T features 2.50 GHz CPU clocks, with 3.50 GHz TurboCore speeds, Radeon HD 8650D integrated graphics with 384 stream processors, and 4 MB of L2 cache.

The world's leading motherboard brand ASRock announced today its latest overclocking competition with HWBOT "ASRock FM2 A10 OC COMPETITION," which will be separated into two benchmarks: CPU-Z and 3DMark11 Performance. The participants will be competing for the highest CPU-Z and 3DMark11 Performance score submissions to HWBOT.

The contest starts from September 23rd and runs until October 21st, it is open to all overclockers with ASRock FM2 or FM2+ series motherboards and AMD A10 series APUs. The total prize is worth more than USD $10,000 dollars and the final champion of each benchmark will be awarded with a top prize worth $2,800 dollars value. Any entry that breaks the world record will be awarded with an additional USD $1, 000 cash prize. With the grand prize and the sponsorship from AMD, PowerColor, ADATA, and Thermaltake, ASRock FM2 A10 OC COMPETITION will be the most attractive OC event for worldwide overclocking enthusiasts.

At this year's IBC (International Broadcasting Convention), AMD is collaborating with outstanding industry leaders -- Adobe, Autodesk, Blackmagic Design, Dell, Fusion-io, and Supermicro -- to showcase video production workflows with a variety of 4K sources using AMD FirePro professional graphics. These demonstrations feature compute- and graphics-intensive animation, display, and content creation supported by a host of creative hardware and software collaborations.

AMD is pleased to showcase ground breaking demonstrations at IBC 2013 powered by AMD FirePro graphics:

• First public showing of real-time 4K color correction with Blackmagic DaVinci Resolve 10 and Supermicro with multiple GPU support;
• First implementation of edge blending, image warping, and color correction with Scalable Display solution based on AMD FirePro DOPP (Display Output Post-Processing) feature;
• New Direct Graphics-Memory Access features for low-latency SDI input or output directly from AMD FirePro W-series graphics;
• New Dell mobile workstation lineup with AMD FirePro graphics;
• 4K color calibration, 2D / 3D video effects and post production using OpenCL in Adobe Premiere Pro CC;
• Integrated stereo camera within Autodesk 3ds Max with support for Active Stereo;
• OpenCL-accelerated Bullet Physics extension for Autodesk Maya 2014.

TechPowerUp announced the latest update to GPU-Z, the popular graphics hardware information, monitoring and diagnostics utility. Version 0.7.3 brings in a few major changes, keeping in mind plans by AMD and NVIDIA to update their product stacks, a little later this year. We've added preliminary support for Radeon R7 240, R7 250, R7 260X, R9 270, R9 270X, R9 290, and R9 290X. On the NVIDIA front, we've added support for GeForce GT 625, GT 645, GT 755M, GT 745M, GTX 760M, GTX 765M, GTX 770M, Quadro K1100M, and K5100M. Support was also added for AMD Radeon HD 7600G, HD 8250, HD 8330, HD 8470G, HD 8570, HD 8570G, and E6460; FirePro W7000, and W600. GPU-Z 0.7.3 brings improved support for GeForce GTX 780 graphics cards with CHiL CHL8318 voltage controllers, and GeForce cards in general, with NCP4206 controllers.DOWNLOAD: TechPowerUp GPU-Z 0.7.3 | TechPowerUp GPU-Z 0.7.3 ASUS ROG-themed

The complete change-log follows.

AMD today announced that its collaboration with Adobe has reached a new milestone in the drive to deliver faster and more sophisticated professional video workflows. The two companies' leadership in OpenCL acceleration means that video and film professionals, as well as enthusiasts, can take full advantage of the massively parallel compute power of AMD APUs, Radeon graphics, and AMD FirePro professional graphics in their everyday and more compute-intense workloads.

New breakthrough features and efficient workflows announced by Adobe for Adobe Premiere Pro CC, Adobe SpeedGrade CC, and Adobe Media Encoder CC exploit AMD App Acceleration via OpenCL and deliver streamlined, leading edge support for Blackmagic Design and Vision Research Phantom cameras.

TUL Corporation, a leading manufacturer of AMD graphic cards, collaborated with our thermal partner and successfully develop the patent thermal solution, the "Double Blades". The "Double Blades" derived from its fan outlook, this exclusive design adds an extra fan blade attaches to the original one; the extra fan can absorb airflow into the centre, and increase up to 20% airflow compared to the traditional thermal design, even can prevent the dust depositing at the bearings and the bottom of fan, prolonging the life cycle of the thermal, also video card.

AMD (NYSE: AMD) today announced a new addition to its 2013 Elite Mobility processor family, expanding the options available for anyone seeking crystal-clear HD entertainment, power efficiency, and accelerated performance in small screen touch notebooks, tablets, and hybrids. The AMD Elite Quad-Core A4-1350 accelerated processor is the second quad-core accelerated processing pnit (APU) in this category, with an estimated average power at or below 3 watts for many common use cases. The new APU is expected to begin shipping to customers in October, 2013. Other AMD Elite Mobility APUs are available in systems today, including the HP Pavilion11 TouchSmart and the Acer Aspire V5.

"Following the tremendous reception from customers to the launch of our 2013 Elite Mobility APUs, we are excited to strengthen our portfolio with the addition of the A4-1350," said Bernd Lienhard, corporate vice president, AMD Client Business Unit. "With quad-core performance, AMD Radeon HD graphics and long battery life, the A4-1350 is an ideal solution for new form factors like hybrid and convertible PCs."

AMD (NYSE: AMD) today announced the AMD FirePro M4100 professional graphics, on mobile workstations such as the HP ZBook 14 giving outstanding OpenCL performance powered by award-winning AMD Graphics Core Next (GCN) architecture. The new thin and light mobile workstation with an optional touch screen interface is ideal for product development, mechanical computer-aided design (CAD) and engineering, as well as for artists, video editors, photographers and designers -- a wide set of users of professional applications who require true mobility.

"Together, AMD and HP offer workstation users industry-leading technologies in a portable design that deliver users next-generation, powerful mobile graphics processors for exceptional workstation performance," said David Cummings, senior director and general manager, Professional Graphics at AMD. "Designed for the enhancements of Windows 8, the new HP mobile workstation combines with AMD FirePro M4100 to deliver superb workstation functionality on the go."

AMD (NYSE: AMD) today disclosed its roadmap for the fast-growing embedded computing market, as it becomes the first company to offer both ARM and x86 processor solutions for low-power and high-performance embedded compute designs. The new lineup includes two best-in-class x86 accelerated processing units (APUs) and central processing units (CPUs), a first look at a high-performance ARM system-on-chip (SoC) and a new family of discrete AMD Embedded Radeon graphics processing units (GPUs) expected to launch in 2014. These additions provide the embedded industry's engineering community with more choices to match their exact design needs, and are designed to offer improvements in performance-per-watt and performance-per-dollar. Together with the recent launch of the award-winning AMD Embedded G-Series SoC family that set a superior bar for performance-per-watt low-power multicore APUs, these latest additions to the embedded product roadmap further signify a strategic push by AMD to focus on the high-growth embedded market.

Since the very first DirectX 10-ready graphics cards by AMD, we've been used to the "Radeon HD xyz0" nomenclature, in which "x" denoted generation, "y" market segment, and "z" variant. That all is about to change with the company's Volcanic Islands GPU family, which will be unveiled (at least to the press), later this month. Using the same "x, y, z" variables as mentioned before, the new nomenclature could look like "Radeon Ry xz i" (where the new variable "i" could denote special features).

An example of this new nomenclature could be, say, Radeon R9 280 X, where "9" denotes the high-end market segment, currently held by Radeon HD 7900 series, "2" indicating generation, and "80" denoting variant. "XT" (full-spec) chips could get the "80" marking, and "Pro" (partial-spec) chips could get the "60" or "70" marking, but it isn't fixed, and could even be "50" and "40" for lower-end parts. At this point, we can't even speculate what the "i" (special feature) could denote. For mobile parts, the letter "M" could be prefixed to the "xz" component of the model number (example: Radeon R9 M380 X). Validations for graphics cards running early drivers with this naming scheme, have been showing up on our GPU-Z Validation database for days now, and our analysis is our best understanding of their naming strings. Capiche? Can't blame you.

Alas! We've all been through this before, through the everlasting pain and beset by the agony of waiting forever and ever. Beneath years of tears and doubt, it takes patience to wait for that special silver lining, and so is the long anticipated AMD FM2+ series. Although the new FM2+ "Kaveri" APUs will not be available until next year, AMD fans can still get the latest ASRock FM2+ motherboards that also support FM2 APUs first right now, and then wait for the upcoming FM2+ APUs, but don't hold your breath.

ASRock's first FM2+ motherboard, FM2A88X Extreme6+ is based on AMD's most high end A88X chipset, and as aforementioned, the socket will support both FM2+ and FM2 APUs. Major improvements for this next generation AMD motherboard includes support for PCIe Gen 3.0 with FM2+ APUs, Quad Monitor from the onboard DVI, D-Sub, HDMI, DisplayPort connectors, Dual channel DDR3 DIMMs that can reach up to 2600+MHz. And then there's also AMD Radeon HD 8000/7000 Series graphics with DX11.1, Japan made premium gold capacitors, Digi Power and 8+2 power phase design.

AMD has now made available a new Catalyst driver, the 13.10 version for Windows 7, Windows 8 and Windows 8.1. This driver comes with a beta tag and supports the Radeon HD 7000, HD 6000 and HD 5000 Series cards. There's also a mobile version of 13.10 which supports the Mobility Radeon HD 8000M, HD 7000M, HD 6000M and HD 5000M cards. Download links are just below.

• AMD Catalyst 13.10 Beta
• AMD Mobility Catalyst 13.10 Beta

AMD and Trustonic today announced a strategic collaboration to embed the Trustonic Trusted Execution Environment (TEE), t-base, into AMD Accelerated Processing Units (APU) and Central Processing Units (CPU) for PCs, tablets, and other processor markets. With best-in-class security, AMD APUs and CPUs will unlock a range of secure new capabilities for end users including fast, safe payments to access to more content, and Bring Your Own Device to work support scenarios. This will be accomplished by providing developers with access to hardware root-of-trust based-security to enable a wide range of innovative services.

The AMD and Trustonic collaboration drives alignment between the experiences and services demanded by fast-evolving mobile and performance computing ecosystems. It will

• deliver real development platforms to support industry bodies working to drive interoperability across trusted computer platforms - such as GlobalPlatform and Trusted Computing Group;
• offer device vendors integrated, hardware based security by providing the means to integrate traditional security solutions such as the TCG Trusted Platform Module (TPM) functionality crypto libraries and isolation at low cost and with greater performance; and
• provide users the capabilities offered by t-base, enabling advanced services and experiences to be installed, activated and personalised, on demand by the user.

EK Water Blocks, Ljubljana based premium water cooling gear manufacturer, is proud to introduce the newest addition to EK-SF3D line of liquid nitrogen evaporation coolers for extreme overclocking - the AMD mounting mechanism. EK-SF3D Inflection Point EVO - Mounting AMD is a universal AMD AMx/FMx socket mounting mechanism for EK-SF3D Inflection Point EVO CPU evaporation cooler. This item allows the EK-SF3D Inflection Point EVO to be used on majority of AMD socket based overclocking motherboards.

The product is made from precisely machined POM Acetal to fit past the nearby socket components. Backplate is made from 3mm thick stainless steel plate. This product also features plastic standoffs which prevents excessive compression of insulation material as well as warping of the motherboard. Enclosed heater can be used on the backside of the motherboard's socket in order to warm-up the nearby VRM capacitors for higher stability during benchmark stress tests. The product comes complete with pre-cut self-adhesive thermal insulation sheets and is readily available for purchase through EK Webshop and and Partner Reseller Network.

ASRock unveiled its first socket FM2+ motherboards, ready for the upcoming A-Series "Kaveri" APUs, and backwards-compatible with A-Series "Richland" and "Trinity" ones. Among the most notable of ASRock's FM2+ products are the FM2A88X-Extreme6+ and the FM2A88M-Extreme4+. The former is a feature-rich ATX form-factor offering, while the latter isn't too far behind with its feature-set, albeit in the micro-ATX form-factor. The FM2A88X-Extreme6+ features a 10-phase VRM to power the APU socket, which is wired to four DDR3 DIMM slots, and two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). A third PCI-Express x16 is electrical gen 2.0 x4, and wired to the A88X FCH. Two each of PCI-Express 2.0 x1, and legacy PCI make for the rest of the expansion.

Storage connectivity on the FM2A88X-Extreme6+ includes seven SATA 6 Gb/s ports, and one eSATA 6 Gb/s. Display connectivity includes dual-link DVI, DisplayPort 1.2, and possibly HDMI 2.0. 8-channel HD audio with optical SPDIF output, gigabit Ethernet, and six USB 3.0 ports. Moving on, the FM2A88M-Extreme4+ features a simpler 6-phase VRM for the APU socket, which is wired to four DDR3 DIMM slots, and a single PCI-Express 3.0 x16. The other long slot is electrical gen 2.0 x4. One each of PCI-Express 2.0 x1 and legacy PCI make for the rest of its expansion. Display connectivity includes dual-link DVI, D-Sub, and HDMI (2.0?). Four USB 3.0 ports, 8-channel HD audio, and gigabit Ethernet make for the rest of it.

ASUS today announced that its existing 990FX-based motherboards all support the new flagship AMD FX-9000 Series processors at memory speeds up to 2400 MHz, without the need for a BIOS update.

The ASUS Crosshair V Formula-Z, Sabertooth 990FX R2.0 and M5A99FX Pro R2.0 motherboards all feature AM3+ Socket with full support for AMD's extreme-performance FX-9370 and FX-9590 processors. With eight-cores and unlocked clock speeds up to 5 GHz, the FX-9000 Series requires incredible amounts of power and generates considerable heat - AMD recommends a 1200 W power supply and liquid processor cooling.

BIOSTAR is preparing a series of motherboards based on the new AMD FM2+ socket design. This is a revision of current FM2 APUs, both FM2+ & FM2 APUs can work on any FM2+ motherboard, chipsets include A88X, A78 and A55; however, FM2+ APUs cannot work on existing FM2 motherboards due to different pin sockets ( A85X, A75, A55 chipsets).

In other words, the new AMD socket FM2+ motherboards will retain backwards compatibility with previous generation Socket FM2 APUs. BIOSTAR's new line of FM2+ APU motherboards is a great choice for users who wish to reserve the opportunity for future upgrades while taking advantage of AMD's new FM2+ infrastructure. The new BIOSTAR FM2+ socket boards are backwards compatible with the older generation APUs and are already in production. These boards will proudly show off BIOSTAR's in-house technology, such as audio, power regulation upgrades and more?

AMD today announced a double win at the International Public Relations Association's 2013 Golden World Awards. AMD was named winner in two categories for its PR campaign conceived for the launch of the AMD Radeon HD 7990 graphics card.

"These wins at the 2013 Golden World Awards underscore the AMD commitment to excellence in all aspects of business, from our technology products to our marketing and communications," said John Taylor, corporate vice president, Global Communications, AMD. "Just as AMD pioneers new possibilities in the realm of technology, we constantly innovate in the marketing and communications realm to more effectively and efficiently communicate with key stakeholders and the millions of people who use AMD products."

AMD today announced its collaboration with Mixamo on the launch of Face Plus, an advanced real-time motion capture and 3D facial animation technology for the Unity game engine (v4.3). Mixamo, an AMD Ventures portfolio company, provides online 3D animation service for game developers.

Mixamo's Face Plus plug-in for Unity is designed to enable developers to capture their facial expressions through standard webcams and transfer them in real time onto a 3D character using technology powered by AMD A-Series APUs and GPUs. This real-time capture and animation capability is made possible by offloading Mixamo's innovative and complex algorithms from the CPU onto AMD's industry-leading GPU technology.

MSI is excited to announce that it has just launched the all-new AE220 21.5" touch control entertainment system equipped with AMD's latest Kabini APU platform. The design seeks to use the MSI 21.5" All-in-One PC as the spearhead of a new classic in AIO PC design that retains the best traditional features while continuing to set the trend in high-tech innovation. The MSI AE220 has a transparent bezel that helps the computer's appearance aside the conventional cold and sterile feeling about high-tech. The compact design blends seamlessly into designer interiors and enhances the overall look of style and sophistication.

The MSI AE220 is the first to feature the E2-3000/A4-5000 APU of AMD's Kabini platform. Based on a 28nm producing process, the new APU delivers high performance with a low power consumption of just 15W. AMD Kabini does more than just integrate the GPU and CPU into the same chip; the chipset functions are also integrated to create the industry's first System-on-Chip (SOC) APU processor. The AMD Kabini platform delivers exceptional rendering performance and packs massive power into a 15W processor. The MSI AE220 features the E2-3000/A4-5000 integrated with AMD Radeon HD 8280/8330 Graphics for a big boost in multimedia and 3D performance compared to previous generation. Users can now enjoy the performance and quality of a discrete graphics card without having to purchase one.

AMD reportedly updated its consumer products roadmap for 2014 thru 2015 to account for changes in the industry. The company is expected to unveil its next-generation "Volcanic Islands" GPU family by late-September, 2013. In the first quarter of 2014, the company is expected to unveil its 4th generation entry-level APUs, codenamed "Kabini." Built in ST3 socket for notebooks, and FS1B for desktops, this product family will include dual- and quad-core parts, with TDPs under 25W. Among the quad-core parts are the A4-5350 and A4-5150, and among the dual-core ones is the E1-2650.

"Kabini" will enter mass-production in February 2014, and will be formally announced in the following month. Kabini's early-2014 launch, delayed from late-2013, will have a cascading effect on its successor's launch. "Beema," its successor, will now launch in either late-2014, or early-2015. "Beema" will be based on the same socket types as "Kabini," but will incorporate more HSA technologies.

AMD (NYSE: AMD) today announced that its Singapore subsidiary, Advanced Micro Devices (Singapore) Pte Ltd. (AMD Singapore), has entered into a conditional put-and-call option agreement to sell and lease-back its Singapore facility located at 508 Chai Chee Lane, Singapore 469032 to HSBC Institutional Trust Services (Singapore) Limited, in its capacity as trustee of Sabana Shari'ah Compliant Industrial Real Estate Investment Trust (Sabana REIT).

The transaction is expected to generate proceeds of approximately 59 million Singapore dollars (USD$46 million), net of all fees, which will be reflected in AMD's third quarter 2013 financial statements when reported on Oct. 17, 2013. AMD expects to record a gain of approximately $16 million in the third quarter of 2013. AMD Singapore will continue its operations in a portion of the Singapore facility and has negotiated a 10-year sub-lease agreement with Sabana REIT with extension options to continue those operations. The sub-lease would be effective upon the close of the sale of the property.

HWBot.org blanket-banning benchmark submissions from Windows 8 machines sent ripples across the PC enthusiast community. Overclocker Christian Ney from OCaholic.ch spent some time trying out different combinations of hardware and operating system to check if Windows 8 RTC (realtime-clock) bug affects benchmarks consistently, on all hardware platforms. His findings are interesting, and one can draw the inference that only Intel processor-based machines could be affected by the bug, not AMD-based ones.

Ney observed the Windows 8 RTC bug to affect benchmark results only on Windows 8 machines running Intel LGA1150 "Haswell," LGA1155 "Ivy Bridge," and LGA1155 "Sandy Bridge," and not AMD AM3 and FM2 platforms. The issue didn't surface on any system running the older Windows 7 operating system. With it, it's clear that it's not just Microsoft that has to do some troubleshooting, Intel has to, as well. HWBot.org may have just saved itself time and pointless "bias" debates by blanket-banning Windows 8.

AMD's energy-efficient socket FM2 desktop APU, the A10-6700T, is expected to go on sale later this week. Its selling point is the 45W TDP, with no reduction in core-count, or other components. Based on the 32 nm "Richland" silicon, the A10-6700T features four "Piledriver" x86-64 cores clocked at 2.50 GHz, with TurboCore frequency of 3.50 GHz, and 4 MB of total L2 cache. It features a Radeon HD 8650D graphics core with 384 stream processors, and untouched clock speeds of 760 MHz core, and 844 MHz boost. The chip also features a dual-channel DDR3-2133 MHz integrated memory controller, and a PCI-Express gen 2.0 root complex. The A10-6700T is expected to be priced around $150.